JP2010208226A - Method for manufacturing liquid ejection head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid ejection head which can improve yield. <P>SOLUTION: In the method for manufacturing a liquid ejection head, a first head chip 21A, which includes a first actuator plate 30A having a plurality of first grooves 35 arranged side by side to communicate with a first ejection hole array capable of ejecting a liquid and a first cover plate 31A formed with a first liquid introducing hole 31a for supplying a liquid to each of the first grooves, and at least one second head chip 21B, which includes a second actuator plate 30B having a plurality of second grooves 35 arranged side by side to communicate with a second ejection hole array capable of ejecting a liquid and a second cover plate 31B formed with a second liquid introducing hole 31b for supplying a liquid to each of the second grooves, are laminated, and a plurality of ejection holes are provided. The method include a process for forming a through hole 39 which allows the first liquid introducing hole and the second liquid introducing hole to communicate with each other, and the through hole is formed by sand blast machining. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a liquid ejecting head that ejects liquid from a liquid ejecting port to record an image or a character on a recording medium.

  In general, a liquid jet recording apparatus, for example, an ink jet printer that performs various types of printing, includes a transport device that transports a recording medium, and a liquid jet head that jets a liquid such as ink (hereinafter referred to as an ink jet head). . An ink jet head includes a nozzle body having a nozzle row composed of a plurality of nozzle holes, a plurality of pressure generation chambers communicating with the nozzle holes, an ink supply system that supplies ink to the pressure generation chambers, and an adjacent pressure generation chamber. A piezoelectric actuator disposed, and pressurizes the pressure generating chamber by driving the piezoelectric actuator, and ejects ink from the nozzle in the pressure generating chamber so that characters and images can be recorded on the recording medium. It has become.

  In recent years, there has been a demand for an inkjet head that can handle high-resolution print data, and an inkjet head provided with a plurality of nozzle rows has been proposed. In this type of inkjet head, a plurality of head chips corresponding to the nozzle rows are arranged. However, when supplying ink to a plurality of head chips, it is necessary to provide an ink supply channel to each head chip, and the space of the inkjet head cannot be effectively used.

  Therefore, in order to supply ink to a plurality of head chips using a single supply channel, a method of providing a through hole in the head chip and supplying ink from the through hole to each head chip is proposed. (For example, see Patent Documents 1 and 2).

JP 2007-50687 A JP 2008-207351 A

  Conventionally, however, an electric drill is used to form a through hole in a head chip in a manufacturing process of an inkjet head employing the above-described method. For this reason, dust generated by drilling clogs the ink supply flow path and the nozzle plate, causing a reduction in yield.

  In addition, since the head chip is made of hard ceramic or the like, drilling to form a through hole in the head chip has a problem with durability even with a high-hardness drill. There is a problem in terms. Furthermore, drilling is a processing method in which cutting is performed by the rotational energy of the drill. However, there is a possibility that the mechanical structure (ink discharge structure) of the thin actuator wafer may be destroyed by the moment accompanying the rotational energy.

  SUMMARY An advantage of some aspects of the invention is that it provides a method of manufacturing a liquid jet head capable of improving the yield.

The present invention provides the following means in order to solve the above problems.
A method of manufacturing a liquid ejecting head according to the present invention includes a first actuator plate having a plurality of first grooves arranged in parallel to communicate with a first ejection hole array capable of ejecting liquid, and each of the first grooves. A first cover plate provided with a first liquid introduction hole for supplying a liquid; and a plurality of second heads arranged in parallel in communication with a second ejection hole array capable of ejecting the liquid. At least one second head chip comprising: a second actuator plate having a groove; and a second cover plate having a second liquid introduction hole for supplying a liquid to each of the second grooves. In the method of manufacturing a liquid jet head that is stacked and has a plurality of jet hole arrays, the liquid jet head includes a step of forming a through hole that communicates between the first liquid introduction hole and the second liquid introduction hole. Shaped by sandblasting It is characterized by being.

  In the method of manufacturing the liquid jet head according to the present invention, the through hole communicating between the first liquid introduction hole and the second liquid introduction hole is formed by sandblasting, so that dust such as cutting waste is generated during the through hole machining. Occurrence can be suppressed. Therefore, the yield in the assembly process of the liquid jet head can be improved. In addition, by forming the through hole by sandblasting, the processing accuracy of the through hole can be improved, so that the liquid can be reliably circulated from the first liquid introduction hole to the second liquid introduction hole. The occurrence of ejection failure can be suppressed.

  The method of manufacturing a liquid jet head according to the present invention includes the step of forming the through hole in the first actuator plate, the step of forming the through hole in the first cover plate, and the through hole in the second actuator plate. A step of forming a hole and a step of forming the through hole in the second cover plate, the first actuator plate, the first cover plate, the second actuator plate, and the second cover plate The method includes a step of bonding the first actuator plate, the first cover plate, the second actuator plate, and the second cover plate after forming each of the through holes.

  In the method of manufacturing the liquid jet head according to the present invention, since the plates are bonded together after the through holes are formed in each plate by sandblasting, the processing accuracy of the through holes formed in each plate can be improved. it can. Further, when a defect such as poor accuracy occurs in a through hole of a certain plate, it can be manufactured by replacing only that plate. Therefore, it is possible to suppress the generation of waste in the assembly process of the liquid ejecting head and to improve the yield.

  The method of manufacturing a liquid jet head according to the present invention includes a step of processing the first groove or the second groove after the step of forming the through hole in the first actuator plate or the second actuator plate. In the step of forming the through hole, a positioning alignment mark for processing the first groove or the second groove is formed by sandblasting.

  In the method for manufacturing a liquid jet head according to the present invention, a positioning alignment mark for processing the first groove or the second groove can be accurately formed by sandblasting. Therefore, since the first groove or the second groove can be formed at a desired position with high accuracy, the yield in the assembly process of the liquid ejecting head can be improved.

  According to the method for manufacturing a liquid jet head according to the present invention, since the through-hole communicating between the first liquid introduction hole and the second liquid introduction hole is formed by sandblasting, dust such as cutting waste is produced during the through-hole machining. Can be suppressed. Therefore, the yield in the assembly process of the liquid jet head can be improved.

1 is a perspective view of an ink jet printer according to an embodiment of the present invention. 1 is a perspective view of an inkjet head in an embodiment of the present invention. It is a schematic structure sectional view of an ink jet head in an embodiment of the present invention. It is a perspective view of a head chip in an embodiment of the present invention. FIG. 5 is an enlarged view of the head chip shown in FIG. 4, and is an enlarged view in a state where an actuator plate and a cover plate are disassembled. FIG. 5 is a cross-sectional view of the head chip shown in FIG. 4, showing a positional relationship between a groove and a nozzle hole. It is a flowchart which shows the manufacturing method of the head chip in embodiment of this invention.

  An embodiment of a liquid jet head according to the present invention will be described with reference to FIGS. In this embodiment, as an example of a liquid ejecting head, an ink jet head capable of ejecting ink W will be described as an example, and an ink jet printer equipped with the ink jet head will be described.

  As shown in FIG. 1, the ink jet printer 1 according to the present embodiment includes a plurality of ink jet heads (liquid ejecting heads) 2 that eject ink W and recording paper (recording medium) P in a predetermined transport direction L1. Conveying means 3 for conveying, and moving means 4 for reciprocating a plurality of inkjet heads 2 in an orthogonal direction L2 orthogonal to the conveying direction L1 are provided.

  That is, the ink jet printer 1 moves the ink jet head 2 in the orthogonal direction L2 orthogonal to the transport direction L1 while transporting the recording paper P in the transport direction L1, thereby recording characters and images on the recording paper P. Type of printer. In the present embodiment, an example in which four inkjet heads 2 that eject inks W of different colors (for example, black, cyan, magenta, and yellow) are provided is illustrated. These four inkjet heads 2 have the same configuration. These four inkjet heads 2 are mounted on a carriage 6 incorporated in a substantially rectangular parallelepiped housing 5.

  The carriage 6 includes a flat base 6a on which a plurality of inkjet heads 2 are placed, and a wall portion 6b that rises vertically from the base 6a, and is arranged along the orthogonal direction L2. The pair of guide rails 7 and 7 are supported so as to be reciprocally movable. In addition, the carriage 6 is connected to a conveyor belt 9 wound around a pair of pulleys 8 and 8 while being supported by guide rails 7 and 7. One pulley 8 a of the pair of pulleys 8, 8 is connected to the output shaft of the motor 10 and is rotated by receiving a rotational driving force from the motor 10. As a result, the carriage 6 can reciprocate in the orthogonal direction L2. That is, the pair of guide rails 7 and 7, the pair of pulleys 8 and 8, the transport belt 9 and the motor 10 function as the moving unit 4.

  In addition, a pair of carry-in rollers 15 and a pair of transport rollers 16 are arranged in parallel in the housing 5 along the same orthogonal direction L2 as the pair of guide rails 7 and 7. The pair of carry-in rollers 15 are provided on the back side of the housing 5, and the pair of transport rollers 16 are provided on the front side of the housing 5. The pair of carry-in rollers 15 and the pair of transport rollers 16 are rotated with the recording paper P sandwiched between them by a motor (not shown). As a result, the recording paper P can be transported along the transport direction L1 from the back side to the front side of the housing 5. That is, the pair of carry-in rollers 15 and the pair of transport rollers 16 function as the transport unit 3.

  A supply tube 60 is connected to the inkjet head 2, and the supply tube 60 is connected to an ink tank 41 incorporated in the housing 5. As a result, different colors of ink W stored in the ink tank 41 are supplied to the four inkjet heads 2, respectively. The ink tank 41 is filled with ink of each color, and the ink tank 41 is placed at a position that does not obstruct the movement of the carriage 6 in the L2 direction and the movement of the recording paper P, and applies a negative pressure to the ink jet head 2. It is provided at a position lower than the nozzle opening of the head 2 by a predetermined amount.

  Further, the ink jet printer 1 is equipped with a service station 11 that performs a cleaning operation of the ink jet head 2. In the service station 11, a so-called initial filling operation is performed in which the nozzle W is filled with ink W when the inkjet head 2 is attached for the first time. Also, a so-called cleaning operation for removing dust and ink droplets adhering to the surface of the inkjet head 2 and recovering nozzle clogging is performed at a predetermined timing such as at the start and before the start of printing, or at an arbitrary timing.

Next, the inkjet head 2 will be described.
As shown in FIGS. 2 and 3, each inkjet head 2 includes a rectangular fixed plate 20 attached to a base 6 a of the carriage 6 via screws (not shown), and a head chip fixed to the upper surface of the fixed plate 20. 21, supply means 22 for supplying ink W to an ink introduction hole 31a (see FIG. 3) described later of the head chip 21, control means 23 for applying a drive voltage to a drive electrode 37 (see FIG. 5) described later, It is mainly equipped with.

  A rectangular base plate 24 made of aluminum or the like is fixed on the upper surface of the fixing plate 20 in a vertically rising state, and a flow path for supplying ink W to the ink introduction hole 31a of the head chip 21. The flow path member 22a in which 22e is formed is fixed. Above the flow path member 22a, a pressure buffer 22b having a storage chamber 22d for storing the ink W therein is disposed in a state of being supported by the base plate 24. The pressure buffer 22b and the flow path member 22a are connected via an ink connecting tube 22c. A supply tube 60 to which the ink W is supplied is attached to the upper part of the pressure buffer 22b.

  When the ink W is supplied to the pressure buffer 22b via the supply tube 60, the ink jet head 2 configured as described above is temporarily stored in the storage chamber 22d in the pressure buffer 22b. The pressure buffer 22b supplies a predetermined amount of the stored ink W to the ink introduction hole 31a of the head chip 21 via the ink connection tube 22c and the flow path 22e. That is, the flow path member 22a, the pressure buffer 22b, and the ink connecting tube 22c function as the supply unit 22.

  An IC substrate 26 on which a drive circuit 25 such as an integrated circuit for driving the head chip 21 is mounted is fixed to the base plate 24. The drive circuit 25 and the drive electrodes 37 (37A, 37B) of the head chip 21 are electrically connected via a flexible substrate 27 (27A, 27B) on which a plurality of lead electrodes 27 (27a, 27b) are printed and wired. It is connected. Then, the drive circuit 25 applies a drive voltage to a drive electrode 37 (described later) via the flexible substrate 27 to cause the ink W to be ejected. That is, the drive circuit 25 and the flexible substrate 27 function as the control unit 23.

Next, the head chip 21 will be described.
As shown in FIG. 4, the head chip 21 mainly includes an actuator plate 30, a cover plate 31, a support plate 32, and a nozzle plate 33. Each plate member is bonded and fixed with an adhesive (not shown).

  The actuator plate 30 is a rectangular plate in a plan view formed from a piezoelectric material such as PZT (lead zirconate titanate). In the present embodiment, a pair (two) of actuator plates 30 are provided. A plurality of grooves 35 extending in the length direction (arrow X direction) are formed on the surface of each of the pair of actuator plates 30A and 30B at a constant interval in the width direction (arrow Y direction). That is, the plurality of groove portions 35 are separated from each other by the side walls 36 (see FIG. 5). Further, the pair of actuator plates 30A and 30B are arranged in a state where the back surfaces are bonded together by an adhesive or the like. In the state where the actuator plates 30A and 30B are joined, the groove portions 35 formed in each are arranged alternately in a staggered manner in the lateral width direction (arrow Y direction) (see FIG. 6).

  As shown in FIG. 5, the plurality of groove portions 35 are formed so as to open to the front end face side of the actuator plate 30 and are formed so that the depth gradually decreases toward the rear end face. The rear end surface side of the groove 35 is sealed by a sealing means (not shown). The plurality of grooves 35 function as channels filled with the ink W.

  As shown in FIGS. 5 and 6, the drive electrode 37 is formed on the side surface of the side wall 36 by evaporating aluminum or the like over the length direction. The drive electrode 37 extends to the rear end face side of the actuator plate 30 where the depth becomes shallow in each groove portion 35, and a drive voltage is individually applied from the control means 23 shown in FIG. Here, in the present embodiment, the lead electrode 27a of the flexible substrate 27A is electrically connected to the drive electrode 37A of the actuator plate 30A so as to be fitted into each groove portion 35 having a shallow depth, thereby driving the actuator plate 30B. The lead electrode 27b of the flexible substrate 27B is electrically connected to the electrode 37B so as to be fitted into each groove portion 35 having a shallow depth.

  The drive electrode 37 (37A, 37B) increases the pressure in the groove portion 35 by deforming the side wall 36 by the piezoelectric thickness sliding effect when a drive voltage is applied, and the filled ink W is supplied into the groove portion 35. It works to discharge from. The drive electrode 37A of the actuator plate 30A and the drive electrode 37B connected to the actuator plate 30B are configured to be separately controllable.

  Returning to FIG. 4, the cover plates 31 (31 </ b> A, 31 </ b> B) are respectively superimposed on the upper surfaces of the actuator plates 30 (30 </ b> A, 30 </ b> B) with a part of the plurality of groove portions 35 exposed. In addition, the cover plate 31 is formed with ink introduction holes 31a and 31b to which the ink W is supplied over the width direction. With this configuration, the plurality of groove portions 35 can be filled with ink W. Further, through holes 39 communicating between the ink introduction holes 31a and the ink introduction holes 31b are formed in the cover plate 31 (31A, 31B) and the actuator plate 30 (30A, 30B), respectively. With this configuration, the ink W supplied from the supply unit 22 to the ink introduction hole 31a passes through the through hole 39 and is also supplied to the ink introduction hole 31b. The actuator plate 30A and the cover plate 31A constitute a first head chip 21A, and the actuator plate 30B and the cover plate 31B constitute a second head chip 21B.

  The support plate 32 supports the actuator plate 30 (30A, 30B) and the cover plate 31 (31A, 31B) that are overlaid, and also supports the nozzle plate 33 at the same time. A fitting hole 32a is formed in the support plate 32 in the width direction, and the plates 30 and 31 are placed in a state where the overlapped actuator plate 30 and cover plate 31 are fitted in the fitting hole 32a. I support it. At this time, the end surface of the support plate 32 is combined with the front end surfaces of the plates 30 and 31 so as to be flush with each other.

  The nozzle plate 33 is bonded and fixed to the end surfaces of the support plate 32 and the front end surfaces of both plates 30 and 31 with an adhesive (not shown).

  The nozzle plate 33 is a sheet-like plate made of a film material such as polyimide having a thickness of about 50 μm, for example. The nozzle plate 33 has one surface that is an adhesive surface that is bonded to the actuator plate 30, the cover plate 31, and the support plate 32, and the other surface that is opposed to the recording paper P (surface 33b). It has become. The surface 33b is coated with a water-repellent film having water repellency for preventing adhesion of the ink W and the like.

In addition, a plurality of nozzle holes 33 a are formed in the nozzle plate 33 at the same interval as the pitch of the plurality of groove portions 35 in the lateral width direction (Y direction). At this time, the nozzle holes 33a are arranged in a state of being shifted by a predetermined distance N1 in the vertical width direction (Z direction) of the nozzle plate 33 perpendicular to the horizontal width direction with respect to the adjacent nozzle holes 33a. That is, the nozzle hole 33a is formed corresponding to the groove portion 35 formed in the actuator plates 30A and 30B.
More specifically, the plurality of nozzle holes 33a are alternately formed in a staggered pattern in the horizontal width direction, and two rows are arranged in parallel with a predetermined distance N1 in the vertical width direction. It has become. That is, two nozzle rows 38 are formed. In addition, each nozzle hole 33 a is formed so that its center is located on the horizontal center axis of each groove 35. By configuring in this way, it is possible to configure the inkjet head 2 compatible with high resolution printing.

  Moreover, each nozzle hole 33a is formed in a circular shape so that the outer contour line draws a circle. In addition, as shown in FIG. 4, the inlet diameter D1 on the bonding surface side (the diameter of the outer contour line of the nozzle hole 33a) is larger than the outlet diameter D2 on the surface 33b side, and has a tapered section. The nozzle hole 33a is formed using an excimer laser device or the like.

(Head chip manufacturing method)
Next, a method for manufacturing the head chip 21 of the present embodiment will be described with reference to the flowchart of FIG.
First, a cover plate manufacturing process is performed to manufacture a pair of cover plates 31A and 31B (S10). Specifically, resist lamination is first performed on a cover plate wafer (S11). Subsequently, the resist is exposed to light and developed to remove the resist corresponding to the through holes 39, the ink introduction holes 31a and 31b, and the alignment marks (alignment marks) used in the sandblasting process in the next process ( S12). Then, sandblasting is performed on the wafer that has been aligned using the alignment mark to form through holes 39 and ink introduction holes 31a and 31b, and a plurality of cover plates 31A and 31B are respectively formed on the wafer (S13). . The wafer has such a size that a plurality of cover plates 31A and 31B are formed. In addition, the wafers on which the pair of cover plates 31A and 31B are respectively formed may be manufactured simultaneously or separately. Moreover, as conditions for sandblasting, for example, the pressure is set to 0.2 MPa, and the number 600 of alumina is used for the abrasive grains.

  Next, an actuator plate manufacturing process is performed to manufacture a pair of actuator plates 30A and 30B (S20). Specifically, first, resist lamination is performed on the actuator plate wafer (S21). Subsequently, the resist is exposed and developed, and the resist is removed from the portion corresponding to the through hole 39 and the first alignment mark (alignment mark) when the next step of sandblasting is performed (S22). Then, sand blasting is performed on the wafer aligned using the first alignment mark to form the second alignment mark when performing the through hole 39 and groove processing in the next process (S23).

  Next, resist lamination is performed on the wafer (S24), the resist is exposed and developed (S25), and the resist corresponding to the drive electrodes 37A and 37B (groove 35) is removed to form an electrode pattern. To do. After the electrode pattern is formed, a groove 35 is formed using a dicing saw on the wafer aligned using the second alignment mark (S26). After the groove portion 35 is formed, aluminum is vapor-deposited from a predetermined oblique direction on the surface of the wafer on which the groove portion 35 is formed to form drive electrodes 37A and 37B, respectively (S27). Then, the resist remaining on the surface of the wafer is lifted off, and a plurality of actuator plates 30A and 30B are respectively produced on the wafer (S28). Note that the wafer has a size on which a plurality of actuator plates are formed. Further, the wafers on which the pair of actuator plates 30A and 30B are respectively formed may be manufactured simultaneously or separately. Moreover, as conditions for sandblasting, for example, the pressure is set to 0.2 MPa, and the number 600 of alumina is used for the abrasive grains.

After a pair of cover plates 31A and 31B and a pair of actuator plates 30A and 30B are formed on each wafer, the wafers are then bonded together.
First, the wafer on which the cover plate 31A is formed and the wafer on which the actuator plate 30A is formed are bonded to form a plurality of first head chips 21A, and the wafer on which the cover plate 31B is formed and the actuator plate 30B are formed. A plurality of second head chips 21B are formed by bonding the formed wafer (S30). At this time, the alignment mark formed as described above is used for bonding at a position where the through hole 39 communicates.

  Next, the pair of wafers formed with a plurality of first head chips 21A and the pair of wafers formed with a plurality of second head chips 21B are further bonded together (S40). In addition, it bonds together in the position where the through-hole 39 connects using an alignment mark similarly to S30.

After the bonding of the wafers is completed, the wafer is cut and separated into individual head chips 21 (S50).
Parylene (paraxylene-based polymer) is entirely deposited on the separated head chip 21 to form a protective film (S60). Finally, ashing is performed to manufacture the head chip 21 (S70).

According to this embodiment, when manufacturing the head chip 21 of the inkjet head 2 having a plurality of nozzle rows 38, the ink W supplied to one ink introduction hole 31a is guided to the other ink introduction hole 31b. Since the through-hole 39 is formed by sandblasting, it is possible to suppress the generation of dust such as cutting waste that has occurred during conventional drilling when the through-hole 39 is processed. Therefore, the yield in the assembly process of the inkjet head 2 can be improved.
In addition, since the through hole 39 is formed by sandblasting, the processing accuracy of the through hole 39 can be improved, so that the ink W can be reliably circulated from one ink introduction hole 31a to the other ink introduction hole 31b. And the occurrence of defective ejection of the ink W can be suppressed.

    Further, since the plates 30A, 30B, 31A, 31B are formed after the through holes 39 are formed, the plates 30A, 30B, 31A, 31B are bonded to each other, so that the through holes formed in the plates 30A, 30B, 31A, 31B are formed. The processing accuracy of the hole 39 can be improved. Further, when a defect such as poor accuracy occurs in a through hole 39 of a certain plate, the head chip 21 can be manufactured by replacing only that plate. Therefore, it is possible to suppress the generation of useless materials in the assembly process of the ink jet head 2 and to improve the yield.

  Further, when forming the through holes 39 in the actuator plates 30A and 30B, the alignment marks for positioning for processing the grooves 35 are simultaneously formed by sandblasting, so that the alignment marks can be formed with high accuracy. it can. Therefore, since the groove part 35 can be formed at a desired position with high accuracy, the yield in the assembly process of the inkjet head 2 can be improved.

The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, in the above embodiment, the through holes 39 are formed in the respective plates 30A, 30B, 31A, 31B, and then the plates 30A, 30B, 31A, 31B are bonded together. , 31B may be bonded together, and a through hole 39 penetrating all the plates may be formed. By comprising in this way, the through-hole 39 can be formed in all the plates by one through-hole formation process.

  In the above-described embodiment, the case of an inkjet head in which two sets of head chips each including an actuator plate and a cover plate are used and two nozzle hole arrays are formed has been described. Even if it is the formed inkjet head, the same effect can be acquired if a head chip is manufactured with the said manufacturing method.

In the above embodiment, the ink jet recording apparatus 1 has been described as an example of the liquid jet recording apparatus, but is not limited to a printer. For example, it may be a fax machine or an on-demand printing machine.
In the above embodiment, the suction filling method using the service station 11 shown in FIG. 1 has been shown for the initial filling operation of the ink W, but a pressure pump is disposed on the supply tube 60 as another filling method. However, a pressure filling method in which the ink W is pressurized from the ink tank 41 side toward the inkjet head 2 side may be employed.
In the above embodiment, the actuator plate 30 provided with electrodes is provided as the actuator for ejecting the ink W. However, the present invention is not limited to this configuration. For example, an electrothermal conversion element may be used to generate bubbles in a chamber filled with the ink W, and the ink W may be ejected by the pressure.
Further, in the above embodiment, the ink introduction holes 31a and 31b are formed along the direction in which the respective groove portions 35 are provided, and the ink W is filled into the respective groove portions 35 from the ink introduction holes 31a and 31b. It is not limited to. For example, even if the ink introduction holes 31a and 31b are not communicated with all the groove portions 35, slit-shaped grooves are provided in the cover plates 31A and 31B, and the slits are formed so as to be half the pitch of the groove portions 35. Good. That is, the slit may correspond to every other groove portion 35 and the ink W may be filled only in the groove portion 35 corresponding to the slit. By adopting this form, even if the conductive ink W is used, the electrodes are not short-circuited via the ink W, and a wide variety of inks W can be used for printing.
Moreover, in the said embodiment, as shown in FIG. 6, although the nozzle hole 33a and the groove part 35 showed the form by which the horizontal width direction (arrow Y direction) was alternately arranged in the zigzag form, it was limited to this. Instead, the nozzle holes of the nozzle hole row may be formed at the same position in the Y direction.

  21A ... First head chip 21B ... Second head chip 30A ... Actuator plate (first actuator plate) 30B ... Actuator plate (second actuator plate) 31A ... Cover plate (first cover plate) 31B ... Cover plate (second cover) Plate) 31a ... Ink introduction hole (first liquid introduction hole) 31b ... Ink introduction hole (second liquid introduction hole) 35 ... Groove (first groove, second groove) 38a ... Nozzle hole row (first ejection hole row) 38b ... Nozzle hole row (second ejection hole row) 39 ... Through hole W ... Ink (liquid)

Claims (3)

A first actuator plate having a plurality of first grooves arranged in parallel to a first ejection hole array capable of ejecting liquid, and a first liquid introduction hole for supplying the liquid to each of the first grooves are formed. A first head chip comprising a first cover plate;
A second actuator plate having a plurality of second grooves connected in parallel to a second ejection hole array capable of ejecting liquid, and a second liquid introduction hole for supplying the liquid to each of the second grooves are formed. In the method of manufacturing a liquid jet head having at least one second head chip provided with a second cover plate, and having a plurality of jet hole arrays,
Forming a through hole communicating between the first liquid introduction hole and the second liquid introduction hole;
A method of manufacturing a liquid jet head, wherein the through hole is formed by sandblasting. Forming the through hole in the first actuator plate;
Forming the through hole in the first cover plate;
Forming the through hole in the second actuator plate;
Forming the through hole in the second cover plate,
After forming the through holes in the first actuator plate, the first cover plate, the second actuator plate, and the second cover plate, respectively, the first actuator plate, the first cover plate, and the second actuator plate The method of manufacturing a liquid jet head according to claim 1, further comprising a step of bonding the second cover plate. After the step of forming the through hole in the first actuator plate or the second actuator plate, the step of processing the first groove or the second groove,
The step of forming the through hole includes a step of forming an alignment mark for positioning for processing the first groove or the second groove by sandblasting. A method for manufacturing the liquid jet head according to 1 or 2.

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