JP2010207385A - Living tissue cutting/adhesion apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide living tissue cutting/adhesion apparatus which, when heating and cooling a cutting/adhesion region by using Peltier effect, lowers the lowest temperature in the cooling and reduces time required for lowering the temperature to a desired temperature. <P>SOLUTION: The living tissue cutting/adhesion apparatus comprises: semiconductor parts 2, 3 disposed facing each other; an electrode/heat exchange parts 5, 6 disposed in the respective semiconductor parts; a joint part 4 which is interposed between the semiconductor parts, joints the semiconductor parts, and has heat conductivity; and electrodes 8, 9 respectively disposed in the electrode/heat exchange parts 5, 6. In the joint part 4, the cutting/adhesion region 15 protruding outward from the semiconductor parts 2, 3 are formed. The living tissue cutting/adhesion apparatus further includes: an electrical circuit 10 including a power source 18 for supplying the semiconductor parts 2, 3 with direct current from the electrodes 8, 9 and a converter 20 for switching direction of the current; a heat exchange medium circulation path 11 where water or the like circulates; a pump 28 and a liquid tank 27 placed on the heat exchange medium circulation path 20. The heat exchange medium circulation path 20 adopts a passage passing inside the electrode/heat exchange parts 5, 6. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a structure of an apparatus that uses the Peltier effect for cutting and adhering biological tissues such as human body cells in medical procedures such as surgery.

  When cutting a living tissue such as a human body cell in a medical procedure such as a surgical operation, a surgical device intended to both stop hemostasis due to fever and suppress the thermal effect on the living tissue around the treatment location, For example, as shown in Patent Document 1 and the like, it is already known. The surgical device shown in this Patent Document 1 is a device that heats a treatment site to stop hemostasis and adhere tissue, an action part composed of a scalpel part and a heat absorption part, an energy supply part to the action part, a light source, and this The driving unit is provided with a light guide path for the light beam emitted from the light source to the knife unit, and a housing that houses a part of the action unit and the driving unit.

  In addition, a Peltier module that heats or cools the tip of the needle portion using cooling and heating by the Peltier effect is disclosed by the applicant of the present application as shown in, for example, Patent Document 2 and the like. It is already known. The Peltier module disclosed in Patent Document 2 includes a first semiconductor plate and a second semiconductor plate that are arranged to face each other at a predetermined interval, and the first semiconductor plate and the second semiconductor plate. A junction that interposes between the inner surfaces of the first semiconductor plates and connects one end in the longitudinal direction and one inner end of the second semiconductor plate in the longitudinal direction; and the first semiconductor The plate and the second semiconductor plate are composed of electrodes arranged on the opposite end of the outer surface of the outer surface to the joint portion in the longitudinal direction, and the joint portions include the longitudinal lengths of the first semiconductor plate and the second semiconductor plate. The needle part which protruded along the direction is provided.

JP 2008-17917 A JP 2008-141161 A

  However, in the surgical apparatus shown in Patent Document 1, a light source, a light guide path, and an antireflection layer are required as a mechanism for heating the knife part, and heat absorption is used as a mechanism for quenching the knife part. Part, and must be configured separately for heating and heat dissipation of the female part, so the relative increase in the number of parts, the relative increase in manufacturing cost based on this, and the configuration There is a problem that it causes difficulty in downsizing.

  On the other hand, the Peltier module disclosed in Patent Document 2 can provide both functions of heating and cooling as a Peltier effect in one mechanism, and does not have the above-described problem, but absorbs heat with respect to power consumption. In order to obtain a large amount of heat absorption with a small amount of heat that can be done, a large-capacity power source is required. Even if an attempt is made to cool the cutting / bonding part, as shown in FIGS. The measured temperature of the cutting / bonding part with the power source of 10A or 20A remains at least 0 ° C. and does not become so low.

  Further, in the Peltier module shown in Patent Document 2, even when a 20 A power supply is used, the time required for the cutting / adhesion site to rise from about 30 ° C. to a desired temperature of 200 ° C. is shown in FIG. Thus, the experimental result is 5.6 seconds, but the time required for the cutting / adhesion site to drop from a slightly higher temperature of 200 ° C. to about 30 ° C. is as shown in FIG. The elapsed time is 4.8 seconds, which is relatively long.

  Therefore, the present invention can use the Peltier effect to heat and cool the part for cutting / adhesion, so that the measurement temperature of the part for cutting / adhesion can be relatively lowered during cooling, It is an object of the present invention to provide a biological tissue cutting / adhesion device capable of shortening the time required for the part to fall to a predetermined temperature.

  The biological tissue cutting and adhering device according to the present invention includes a first semiconductor portion and a second semiconductor portion which are arranged to face each other and have different characteristics, and the first and second semiconductors. The first and second electrode / heat exchange sections disposed in each of the sections, and the first semiconductor section and the second section interposed between the first semiconductor section and the second semiconductor section. The first electrode and the second electrode disposed in the first electrode / heat exchange unit and the second electrode / heat exchange unit, respectively. And a cutting / bonding portion projecting outside from the ends of the first semiconductor portion and the second semiconductor portion is formed in the joint portion, and the first semiconductor portion And a current source for supplying a direct current to the second semiconductor portion. An electric circuit, a heat exchange medium circulation path through which the liquid heat exchange medium circulates, a pump arranged on the heat exchange medium circulation path to deliver the liquid heat exchange medium, and the heat exchange medium circulation path And a liquid storage tank for temporarily storing a liquid heat exchange medium, and the heat exchange medium circulation path is provided between the first electrode / heat exchange section and the second electrode / heat exchange section. A route that passes through the interior is taken (claim 1). Here, the first and second semiconductor units function as a heat source for generating heat and / or a heat source for generating cold. The first electrode / heat exchange unit and the second electrode / heat exchange unit dissipate heat by exchanging heat with the heat exchange medium, so that the first electrode / heat exchange unit and the second electrode / heat exchange unit It is possible not only to cool the first and second semiconductor parts in contact with each other, and thus the joint part, but also to absorb heat by heat exchange with the heat exchange medium, and thereby the first electrode / heat exchange part and the second semiconductor part. It is also possible to heat the first and second semiconductor parts that are in contact with the electrode / heat exchange part, and thus the joint part. The liquid heat exchange medium is used for cooling and / or heating the first and second semiconductor parts, and hence the cutting / bonding part. Examples of the liquid heat exchange medium include water. It is done. In addition, the cutting / bonding part may have a blade shape such as a scalpel or knife with a sharp tip, or a needle shape consisting of a thin rod and a pointed tip of the cone. good. In the experiment, current sources of 10A and 20A were used, but the current source is not limited to these amperages.

  As a result, the liquid heat exchange medium passes through the first electrode / heat exchange section and the second electrode / heat exchange section constituting the biological tissue cutting / bonding apparatus, so that the section for cutting / bonding is cooled. In this case, the heat exchange medium having a relatively low temperature is circulated in the heat exchange medium circuit so that the heat exchange with the heat exchange medium can be performed in addition to the cooling by the Peltier effect. Since the second electrode / heat exchange section is cooled, the cooling capacity can be improved. On the other hand, when heating the cutting / bonding part, the heat exchange medium with a relatively high temperature is circulated in the heat exchange medium circulation path, so that the heat exchange with the heat exchange medium can be performed in addition to the Peltier effect. Even in the exchange, the first electrode / heat exchange section and the second electrode / heat exchange section are heated, so that the heating capacity can be improved.

  In the biological tissue cutting / bonding device according to the present invention, the electrical circuit has a current switching means that can freely switch the direction of the current flowing from the current source to the electrode. (Claim 2). The current switching means may be hardware such as a switch or may be software.

  Thus, for example, when the first semiconductor portion is an N-type semiconductor, the second semiconductor is a P-type semiconductor, and the direction of the electric circuit current is made to flow from the first semiconductor portion to the second semiconductor portion. Can cool the object by the endothermic effect of the Peltier effect on the cutting / adhesion site that forms part of the joint, and the current switching means changes the direction of the current in the electric circuit from the second semiconductor part to the first. When the flow is reversed so as to flow through the semiconductor portion, the object can be heated by a heat generation action by the Peltier effect on the cutting / bonding portion forming a part of the joint portion.

  As described above, according to the present invention, the heat exchange medium circulation path through which the liquid heat exchange medium passes through the first electrode / heat exchange section and the second electrode / heat exchange section is provided. When the part is to be cooled, the heat exchange medium having a relatively low temperature is circulated in the heat exchange medium circulation path to exchange heat with the heat exchange medium. Since the electrode / heat exchanging portion is cooled and the cooling capacity thereof is relatively improved as compared with the cooling by the Peltier effect alone, the cooling of the first semiconductor portion and the second semiconductor portion, and hence the junction portion can be further promoted. Since the cutting / adhesion site is further cooled, the cutting / adhesion site can be cooled to a relatively low temperature in a relatively short time. Further, when heating the cutting / bonding part, the heat exchange medium having a relatively high temperature is circulated in the heat exchange medium circulation path, thereby exchanging heat with the heat exchange medium. Since the heat exchanging part and the second electrode / heat exchanging part are heated and the heating capacity thereof is relatively improved as compared with the heating by the Peltier effect alone, the heating of the first semiconductor part and the second semiconductor part and hence the junction part is performed. Since the cutting / adhesion site is further heated, the cutting / adhesion site can be heated to a relatively high temperature in a relatively short time. However, even when the heat exchange medium having a relatively low temperature is circulated in the heat exchange medium circulation path, it is possible to use the Peltier effect to heat the cutting / bonding part to a predetermined temperature. .

  Further, according to the present invention, for example, the first semiconductor part is an N-type semiconductor, the second semiconductor is a P-type semiconductor, and the current direction of the electric circuit flows from the first semiconductor part to the second semiconductor part. In such a case, the object can be cooled by the endothermic effect of the Peltier effect on the cutting / adhesion site that forms a part of the joint, and the current direction of the electric circuit is changed to the second by the current switching means. If the semiconductor part is reversed so that it flows from the semiconductor part to the first semiconductor part, the object can be heated by the heat dissipation action by the Peltier effect with respect to the cutting / bonding part that forms part of the joint part. The biological tissue cutting / adhesion device according to the invention can be used for the purpose of cutting the biological tissue while stopping hemostasis, or for the purpose of cutting the biological tissue while keeping the surrounding cells alive, and to have versatility. Is possible.

FIG. 1 is a schematic view showing an example of a biological tissue cutting / adhesion device according to the present invention. FIG. 1 (a) shows a cutting / adhesion part of the biological tissue cutting / adhesion device same as above, and an electric circuit. FIG. 1B is a view for explaining a modified example of the cutting / bonding part of the biological tissue cutting / bonding apparatus. FIG. 2 is a characteristic diagram showing a temperature change in a cutting / bonding part when the amperage of the current source is 10 A for the biological tissue cutting / bonding apparatus. FIG. 3 is a characteristic line diagram showing a temperature change in the cutting / bonding part when the amperage of the current source is 20 A for the above-described biological tissue cutting / bonding apparatus. FIG. 4 is a characteristic diagram showing the time required for the cutting / bonding part to rise to a predetermined temperature when the amperage of the current source is 20 A for the above-described biological tissue cutting / bonding apparatus. FIG. 5 is a characteristic diagram showing the time required for the cutting / adhesion site to drop to a predetermined temperature when the amperage of the current source is 20 A for the biological tissue cutting / adhesion apparatus described above. FIG. 6 is a characteristic diagram showing a temperature change at a cutting / bonding site when the amperage of the current source is set to 10 A for a biological tissue cutting / bonding apparatus having no conventional heat exchange medium circulation path. FIG. 7 is a characteristic diagram showing a change in temperature at a cutting / bonding site when the amperage of the current source is 20 A for a living tissue cutting / bonding apparatus having no conventional heat exchange medium circulation path. FIG. 8 shows the time required for the cutting / adhesion site to rise to a predetermined temperature when the amperage of the current source is set to 20 A for a biological tissue cutting / adhesion apparatus having no conventional heat exchange medium circuit. It is a characteristic diagram. FIG. 9 shows the time required for the cutting / adhesion site to drop to a predetermined temperature when the current source amperage is 20 A for a biological tissue cutting / adhesion apparatus that does not have a conventional heat exchange medium circuit. It is a characteristic diagram.

  Embodiments of the present invention will be described below with reference to the drawings.

   FIG. 1 shows an example of a biological tissue cutting / adhesion device according to the present invention. The biological tissue cutting / adhesion device includes a semiconductor part 2, a semiconductor part 3, a joining part 4, an electrode and heat. Exchange parts 5 and 6, conductive paste part 7a interposed between semiconductor part 2 and joint part 4, conductive paste part 7b interposed between semiconductor part 3 and joint part 4, semiconductor part 2 and electrode The conductive paste part 7c interposed between the heat exchanger part 5 and the conductive paste part 7d interposed between the semiconductor part 2 and the electrode heat exchanger part 6, and the electrode heat exchanger parts 5 and 6, respectively. The apparatus includes a body tissue cutting / bonding apparatus main body 1 basically constituted by the arranged electrodes 8, 9, an electric circuit 10, and a heat exchange medium circulation path 11.

Among these, the semiconductor part 2 and the semiconductor part 3 which comprise the biological tissue cutting / adhesion apparatus main body 1 are formed of metals (conductors) or semiconductors having mutually different characteristics. For example, N-type Bi ₂ Te ₃ is used for the semiconductor portion ₂ , and P-type Bi _0.5 Sb _1.5 Te ₃ is used for the semiconductor portion 3, for example.

  Further, the electrode and heat exchanging portions 5 and 6 constituting the body tissue cutting / adhesion device main body 1 function as electrodes and a heat radiating means for releasing the heat from the semiconductor portions 2 and 3. In this embodiment, it has a long rectangular parallelepiped shape (plate shape) with a relatively small thickness. Accordingly, the electrode / heat exchanging portions 5 and 6 have substantially rectangular surfaces 5a and 5b or surfaces 6a and 6b that are relatively wide. Further, in this embodiment, the electrode and heat exchange portions 5 and 6 are such that the surfaces 5a and 6a face each other, and the semiconductor portions 2 and 3 and the junction portion 4 described later and the conductive surfaces between the surfaces 5a and 6a. The conductive paste portions 7a to 7d are arranged so as to be spaced apart from each other at a size allowing interposition.

  And between the surfaces 5a and 6a of the electrode and heat exchange portions 5 and 6, a joint portion 8 to be described later is interposed in the vicinity of one end in the longitudinal direction of the surfaces 5a and 6a. Electrodes 8 and 9 to be described later are disposed in the vicinity of the end in the longitudinal direction on the opposite side to the joint 4 of the surfaces 5b and 6b.

  Furthermore, the joint 4 constituting the body tissue cutting / adhesion device main body 1 is formed of a hard material that is excellent in thermal conductivity and has a tip shown in FIG. As described above, the semiconductor portions 2 and 3 and the electrode / heat exchange portions 5 and 6 protrude outward from the end portions in the longitudinal direction, and the protruding tip portion has a sharp tip such as a surgical knife or knife. A cutting / bonding portion 15 having a blade-like shape is formed. However, the shape of the cutting / adhering portion 15 is not limited to the shape shown in FIG. 1A. For example, as shown in FIG. 1B, the thin rod and its tip are conical. It may have a needle shape consisting of a pointed portion.

  Furthermore, a conductive paste portion 7 a is interposed between the bonding portion 4 and the semiconductor portion 2, and a conductive paste portion 7 b is interposed between the bonding portion 4 and the semiconductor portion 3. At the same time, a conductive paste portion 7 c is interposed between the semiconductor portion 2 and the electrode / heat exchange portion 5, and a conductive paste portion 7 d is formed between the semiconductor portion 3 and the electrode / heat exchange portion 6. It is something that intervenes.

  The electrodes 8 and 9 constituting the body tissue cutting / adhering device main body 1 are connected to each other in the longitudinal direction between the surface 5b of the electrode / heat exchanger 5 and the surface 6b of the electrode / heat exchanger 6. 4 is disposed in the vicinity of the end opposite to the end 4. These electrodes 8 and 9 are made of metal. For example, a Cu electrode or the like is used, and is electrically connected to the electric circuit 10 through a current source 18 for supplying a direct current and a wiring 19. The current source 18 may be a storage battery, a generator, a general commercial power source, or the like, but any type can be used as long as a direct current can be supplied.

  In this embodiment, the converter 20 for switching the direction of the current supplied from the current source 18 freely forward and backward is arranged on the electric circuit 10. In this embodiment, the converter 20 includes a wiring portion 21 having a current source 18, wiring portions 22 and 23 that bypass the current source 18, and the wiring portion 21 and the wiring portion 22 or the wiring portion 21 and the wiring portion 23. The switches 24 and 25 that perform switching are configured, but are merely examples, and are not limited to this configuration.

  With such a configuration, even in the biological tissue cutting / bonding device according to the present invention, the semiconductor portion 2 is an N-type semiconductor and the semiconductor portion 3 is a P-type semiconductor. When the direct current flows so as to flow toward the side, a direct current flows from the semiconductor portion 2 to the junction portion 4 and from the junction portion 4 to the semiconductor portion 3. Since the temperature of the cutting / adhesion site 15 constituting the part decreases, the biological tissue cutting / adhesion device can be used for the purpose of cutting the biological tissue while keeping the surrounding cells alive. For example, when the converter 20 is set so that a direct current flows from the current source 18 toward the electrode 5, a direct current flows from the semiconductor unit 3 to the junction 4 and from the junction 4 to the semiconductor unit 2. Therefore, the temperature of the cutting / adhesion site 15 constituting a part of the joint portion 4 is increased by the heat generation action by the Peltier effect, so that the biological tissue cutting / adhesion device is used for the purpose of cutting the biological tissue while hemostasis. Can do.

  By the way, the heat exchange medium circulation path 11 includes a liquid storage tank 27 that can temporarily store a liquid heat exchange medium such as water, a pump 28 that pumps the heat exchange medium from the liquid storage tank 27, and a liquid storage tank. 27 is configured to have a pipe 29 for appropriately connecting the liquid storage tank 27 and the pump 28 so as to circulate the heat exchange medium from the pump 28 to the liquid storage tank 27.

  The pipe 29 penetrates the electrode / heat exchange section 5 along the longitudinal direction from the electrode 8 side toward the cutting / bonding portion 15 side, and then passes through the electrode / heat exchange section 6 in the longitudinal direction. It has a portion penetrating in a direction extending in the opposite direction from the cutting / bonding portion 15 side toward the electrode 9 side along the direction, at least in the electrode / heat exchange portion 5 and the half electrode / heat exchange portion 6 is formed of a material excellent in thermal conductivity. However, instead of passing the pipe 29 through the electrode / heat exchange section 5 and the electrode / heat exchange section 6, through-holes are provided in the electrode / heat exchange section 5 and the electrode / heat exchange section 6. And may be connected.

  The apparatus for cutting and adhering a biological tissue according to the present invention has the heat exchange medium circulation path 11, so that when a liquid heat exchange medium such as water having a relatively low temperature is flowed, Since the electrode / heat exchange parts 5 and 6 are cooled by heat exchange and the heat dissipation capability from the semiconductor parts 2 and 3 is relatively improved, the semiconductor parts 2 and 3 are absorbed and cooled, and cut and bonded accordingly. When the working portion 15 is further cooled and a liquid heat exchange medium such as water having a relatively high temperature is flowed, the electrode and heat exchange sections 5 and 6 are heated by heat exchange with the heat exchange medium, so that the semiconductor Since the heating ability to the parts 2 and 3 is relatively improved, the semiconductor parts 2 and 3 are heated, and the cutting / bonding part 15 is further heated accordingly.

  This is because of the experimental results of the biological tissue cutting / adhesion device according to the present invention shown in FIGS. 2 to 5 and the experimental results of the biological tissue cutting / adhesion device according to Patent Document 2 shown in FIGS. Can also be derived from.

  That is, in the biological tissue cutting / bonding apparatus according to the present invention, the condition that the water in the temperature range of about 0 ° C. to 10 ° C. circulates in the heat exchange medium circulation path 11 and the amperage of the current source 18 are determined. When the temperature change of the cutting / bonding part 15 is measured under the condition of 10A, the cutting / bonding part 15 drops to about −10 ° C. at the lowest temperature as shown in FIG. The result that the maximum temperature rose to 70 ° C. could be obtained.

  In addition, under the condition that water having a temperature in the range of about 0 ° C. to 10 ° C. circulates in the heat exchange medium circulation path 11 and the condition that the amperage of the current source 18 is 20 A, the cutting / bonding part When a temperature change of 15 is measured, as shown in FIG. 3, the cutting / adhering part 15 is lowered to about −25 ° C. at the lowest temperature and rises to 175 ° C. at the highest temperature. I was able to.

  Thereby, under the common condition that the amperage of the current source 18 is 10A, the temperature change shown in FIG. 2 of the cutting / bonding part 15 of the biological tissue cutting / bonding device having the heat exchange medium circulation path 11 according to the present invention is shown. 6 is compared with the temperature change shown in FIG. 6 of the cutting / bonding part 15 of the biological tissue cutting / bonding apparatus according to the conventional example that does not have the heat exchange medium circulation path 11. The minimum temperature of the cutting / bonding portion 15 is significantly lower in the apparatus for cutting.

  Further, under the common condition that the amperage of the current source 18 is 20A, the temperature change shown in FIG. 3 of the cutting / bonding portion 15 of the biological tissue cutting / bonding device according to the present invention having the heat exchange medium circulation path 11 Even when the temperature change shown in FIG. 7 of the cutting / bonding part 15 of the biological tissue cutting / bonding apparatus according to the conventional example not having the heat exchange medium circulation path 11 is compared, The minimum temperature of the cutting / bonding part 15 is significantly lower in the bonding apparatus.

  However, the biological tissue cutting / adhesion device according to the present invention is that the cutting / adhesion site of the conventional biological tissue cutting / adhesion device was not so low when the cutting / adhesion site was cooled. It can be recognized that the problem is solved.

  In addition, the biological tissue cutting / adhesion device according to the present invention has the heat exchange medium circulation path 11 so that water having a temperature in the range of about 0 ° C. to 10 ° C. circulates in the heat exchange medium circulation path 11. The temperature of the cutting / adhesion site 15 rises from the lowest temperature of about −25 ° C. to the highest temperature of about 175 ° C. shown in FIG. When time was measured, as shown in FIG. 4, a result of 6.9 seconds could be obtained.

  In addition, under the condition that water having a temperature in the range of about 0 ° C. to 10 ° C. circulates in the heat exchange medium circulation path 11 and the condition that the amperage of the current source 18 is 20A, this time, When the time for the temperature of the cutting / adhering part 15 to fall from the maximum temperature of about 175 ° C. shown in FIG. 3 to the minimum temperature of about −25 ° C. was measured, it was 3.0 seconds as shown in FIG. I was able to get the results.

  Thereby, under the common condition that the amperage of the current source 18 is 20A, the cutting / bonding portion 15 of the biological tissue cutting / bonding device according to the present invention and the cutting / bonding device 15 of the conventional tissue cutting / bonding device Regarding the bonding site, the time required for the temperature to rise from the lowest temperature to the highest temperature is longer for the biological tissue cutting / bonding device according to the present invention. The time is shorter in the biological tissue cutting / bonding device according to the present invention.

  However, the biological tissue cutting / bonding device according to the present invention is lowered to the desired temperature of the cutting / bonding portion of the conventional tissue cutting / bonding device when the cutting / bonding portion is cooled. It can be recognized that the problem that the time is relatively long is solved.

DESCRIPTION OF SYMBOLS 1 Body body for biological tissue cutting / bonding 2 Semiconductor part (first semiconductor part)
3 Semiconductor part (second semiconductor part)
4 Junction 5 Electrode / Heat Exchanger 6 Electrode / Heat Exchanger 8 Electrode (First Electrode)
9 electrode (second electrode)
DESCRIPTION OF SYMBOLS 10 Electrical circuit 11 Heat exchange medium circuit 15 Cutting | disconnection and adhesion | attachment part 18 Current source 19 Wiring 20 Converter (current switching means)
21 Wiring part 22 Wiring part 23 Wiring part 24 Switch 25 Switch 27 Storage tank 28 Pump 29 Piping

Claims (2)

A first semiconductor portion and a second semiconductor portion made of materials that are arranged to face each other and have different characteristics, and the first and second semiconductor portions arranged in each of the first and second semiconductor portions. Thermal conductivity is obtained by joining the first semiconductor part and the second semiconductor part by interposing between the electrode / heat exchange part and the first semiconductor part and the second semiconductor part. And at least a first electrode and a second electrode disposed in the first electrode / heat exchange unit and the second electrode / heat exchange unit, respectively. A cutting / adhesion site protruding outward from the ends of the first semiconductor portion and the second semiconductor portion is formed,
An electric circuit having a current source for supplying a direct current to the first semiconductor part and the second semiconductor part; a heat exchange medium circulation path through which a liquid heat exchange medium circulates; and on the heat exchange medium circulation path And a pump for delivering the liquid heat exchange medium, and a liquid storage tank that is disposed on the heat exchange medium circulation path and temporarily stores the liquid heat exchange medium,
The biological tissue cutting / adhering apparatus is characterized in that the heat exchange medium circulation path has a path passing through the first electrode / heat exchange section and the second electrode / heat exchange section. . 2. The biological tissue cutting / adhesion device according to claim 1, wherein the electric circuit includes a current switching unit that can freely switch a direction of a current flowing from the current source to the electrode.

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