JP2008141161A - Peltier module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a peltier module which can perform regional cooling of cells, a chromosome, mitochondria, cell walls and so on which comprise a cell. <P>SOLUTION: The peltier module 1 of this invention comprises a first and a second semiconductor plates 10 and 20 placed oppositely, a joint part 30 which joins an inner side of an end of the first semiconductor plate 10 to that of the second semiconductor plate 20, and electrodes 12, 13, 22 and 23 placed on an outer side of the other end of the first semiconductor plate 10 and that of the second semiconductor plate 20, respectively, and a projected needle 32 is prepared in the joint part 30. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a Peltier module (heating / cooling element) using the Peltier effect, and further relates to an optimum application of the Peltier module.

Conventionally, as a Peltier element having a cooling effect (expressing), one using a Bi ₂ Te ₃ (bismuth-tellurium) -based material has been known (for example, see Patent Document 1). Theoretically, a cooling effect is expected to appear, but it has not reached a practical level.
Such cooling and heating by the Peltier effect is performed by joining two p-type and n-type conductors or semiconductor plates through the joints, and flowing currents in opposite directions to the joints. And the other end side.
However, when a material other than a bismuth-tellurium-based material is used, even if a current is passed in any direction, both the joint side end and the other end are in a heated state, which is caused by the Peltier effect. It was difficult to develop a cooling state. This is considered to be due to the fact that when the n-type and p-type semiconductors are joined, the resistance value of the electrical resistance at the joined portion increases.
Therefore, the present inventors have already proposed a Peltier module that can exhibit a Peltier effect, in particular, a cooling effect even when a material other than a conventional bismuth-tellurium-based material is used (Patent). Reference 2).
JP-A-10-308538 Japanese Patent Application No. 2006-137189

  In Patent Document 2, a metal is sandwiched between two semiconductor plates as a joint, and it has been found that local cooling is possible by changing the shape of the metal.

  An object of the present invention is to provide a Peltier module capable of local cooling of cells, chromosomes, mitochondria, cell walls, etc. constituting the cells.

The Peltier module according to the first aspect of the present invention includes a first semiconductor plate and a second semiconductor plate arranged to face each other, an inner surface on one end side of the first semiconductor plate, and one end of the second semiconductor plate. A joint that connects the inner surface of the first semiconductor plate, and an electrode disposed on the outer surface on the other end side of the first semiconductor plate and an outer surface on the other end side of the second semiconductor plate, Further, a protruding needle part is provided.
A Peltier module according to a second aspect of the present invention is a Peltier module using a pair of Peltier elements in which a P-type semiconductor and an N-type semiconductor are continuously connected, and includes a first heat exchange plate of one of the Peltier elements. When a joining portion is provided to connect to the second heat exchange plate of the other Peltier element and the first heat exchange plate is used as a cooling surface, the second heat exchange plate is also used as a cooling surface, and the first heat exchange is performed. When the plate is used as a heat radiating surface, the second heat exchange plate is also used as a heat radiating surface, and a protruding needle portion is provided at the joint.
According to a third aspect of the present invention, in the Peltier module according to the first or second aspect, a thin metal wire having a diameter of several microns is used as the needle portion.
According to a fourth aspect of the present invention, in the Peltier module according to the first or second aspect, a cantilever is used as the needle portion.
According to a fifth aspect of the present invention, in the Peltier module according to the third aspect, the present invention is used as a local cooling or heating of a cell tissue.
The present invention according to claim 6 is characterized in that, in the Peltier module according to claim 4, it is used as local cooling or heating of chromosomes, mitochondria, and cell walls constituting cells.
According to a seventh aspect of the present invention, in the Peltier module according to the first or second aspect, the present invention is used as a control for separation and collection of fine particles.
The present invention according to claim 8 is characterized in that, in the Peltier module according to claim 1 or 2, the flow or vibration of a solid, liquid, or gas is controlled.
According to a ninth aspect of the present invention, in the Peltier module according to the first or second aspect, the gas passing therethrough is formed by forming a hollow portion in the needle portion and allowing gas or liquid to pass through the hollow portion. Alternatively, the flow of the liquid is controlled.
According to a tenth aspect of the present invention, in the Peltier module according to the first or second aspect, by cooling the needle portion, a substance in contact with the tip of the needle portion is attached, and the needle portion is heated. Thus, the substance attached to the tip of the needle part is separated.
The present invention according to claim 11 is the Peltier module according to claim 1 or 2, wherein a heat pipe is used for the joining portion, and the needle portion is provided at an end of the heat pipe. .
According to a twelfth aspect of the present invention, in the Peltier module according to the first aspect, each of the electrodes is configured by a heat pipe, and one end of the one heat pipe is an outer surface on the other end side of the first semiconductor plate. And the other end of the heat pipe is disposed on the outer surface of the second semiconductor plate on the other end side.
According to a thirteenth aspect of the present invention, in the Peltier module according to the twelfth aspect, a heat radiating fin is provided at the other end of the one heat pipe and the other end of the other heat pipe.

  According to the present invention, it is possible to provide a Peltier module that is extremely efficient and excellent in controllability because it can be cooled or heated electronically.

The Peltier module according to the first embodiment of the present invention includes a first semiconductor plate and a second semiconductor plate arranged to face each other, an inner surface on one end side of the first semiconductor plate, and one end of the second semiconductor plate. A joint for connecting the inner surface of the first semiconductor plate, and an electrode disposed on the outer surface on the other end side of the first semiconductor plate and an outer surface on the other end side of the second semiconductor plate, respectively. A needle portion is provided. According to the present embodiment, local cooling and heating can be realized by providing the protruding needle portion.
The Peltier module according to the second embodiment of the present invention is provided with a joint for connecting the first heat exchange plate of one Peltier element and the second heat exchange plate of the other Peltier element, When the cooling surface is used, the second heat exchange plate is also used as the cooling surface. When the first heat exchange plate is used as the heat dissipation surface, the second heat exchange plate is also used as the heat dissipation surface. A part is provided. According to the present embodiment, the first heat exchange plate and the second heat exchange plate are joined via the joint portion, and the needle portion protruded from the joint portion is provided, so that local cooling or Heating can be realized.
In the third embodiment of the present invention, in the Peltier module according to the first or second embodiment, a thin metal wire having a diameter of several microns is used as a needle portion. According to the present embodiment, it is possible to heat and cool fine particles and cells.
The fourth embodiment of the present invention uses a cantilever as a needle part in the Peltier module according to the first or second embodiment. According to the present embodiment, it is possible to cool or heat an object of several nm level.
The fifth embodiment of the present invention is used as local cooling or heating of a cell tissue in the Peltier module according to the third embodiment. According to this embodiment, one cell can be cooled or heated independently.
In the Peltier module according to the fourth embodiment, the sixth embodiment of the present invention is used as local cooling or heating of chromosomes, mitochondria, and cell walls constituting cells. According to this embodiment, specific cells or constituent substances can be cooled and stored or killed, or heated and stored or killed.
The seventh embodiment of the present invention is used for controlling separation and collection of fine particles in the Peltier module according to the first or second embodiment. According to the present embodiment, the movement of the fine particles can be controlled by cooling or heating, and the fine particles can be aggregated during cooling, and the fine particles can be dissipated during heating.
The eighth embodiment of the present invention controls the flow and vibration of a solid, liquid, or gas in the Peltier module according to the first or second embodiment. According to the present embodiment, a solid, liquid, or gas flow or vibration is obtained by locally contacting the tip of the needle of the Peltier module in a place where a solid, liquid, or gas flow or vibration exists. Can be controlled.
In the ninth embodiment of the present invention, in the Peltier module according to the first or second embodiment, the hollow portion is formed in the needle portion, and the gas or liquid passing therethrough is allowed to pass through the hollow portion. It controls the flow of liquid. According to this embodiment, the flow of gas or liquid can be controlled.
In the tenth embodiment of the present invention, in the Peltier module according to the first or second embodiment, by cooling the needle portion, the substance in contact with the tip of the needle portion is adhered and the needle portion is heated. Thus, the substance attached to the tip of the needle part is released. According to this embodiment, it can be used as tweezers.
In an eleventh embodiment of the present invention, in the Peltier module according to the first or second embodiment, a heat pipe is used as a joining portion, and a needle portion is provided at an end portion of the heat pipe. According to this Embodiment, a local cooling effect and a heating effect can be heightened by providing a needle part via a heat pipe.
According to a twelfth embodiment of the present invention, in the Peltier module according to the first embodiment, each electrode is constituted by a heat pipe, and one end of one heat pipe is an outer surface on the other end side of the first semiconductor plate. And one end of the other heat pipe is disposed on the outer surface on the other end side of the second semiconductor plate. According to the present embodiment, by using the heat pipe itself as an electrode, water cooling is not required, and it can be used as a mobile type Peltier module.
In the Peltier module according to the twelfth embodiment, a thirteenth embodiment of the present invention is provided with heat radiation fins on the other end of one heat pipe and the other end of the other heat pipe. According to the present embodiment, the cooling capacity can be increased by the heat dissipating fins.

Hereinafter, a Peltier module according to an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a top view of a Peltier module according to the present embodiment, FIG. 2 is a side view thereof, and FIG. 3 is a front view thereof.
As shown in FIGS. 1 to 3, the Peltier module 1 includes a first semiconductor plate (for example, n-type Bi ₂ Te ₃ ) 10 and a second semiconductor plate (for example, p) that are arranged so that their main surfaces face each other. Type Bi _0.5 Sb _1.5 Te ₃ ) 20. The inner surface on one end side of the first semiconductor plate 10 and the inner surface on one end side of the second semiconductor plate 20 are connected by a joint portion 30. Further, an electrode (for example, Cu electrode) 13 is disposed on the outer surface on the other end side of the first semiconductor plate 10, and an electrode (for example, Cu electrode) 23 is disposed on the outer surface on the other end side of the second semiconductor plate 20. Is arranged.
Insulating layers 11 and 21 are provided on the inner surfaces of the first semiconductor plate 10 and the second semiconductor plate 20 at portions where the electrodes 12 and 22 are not provided. As described above, the insulating layers 11 and 21 effectively insulate the first semiconductor plate 10 and the second semiconductor plate 20 from portions other than the joint portion 30 (that is, portions where the electrodes 12 and 22 do not exist). Therefore, the distance between the electrodes 12 and 22 and the electrodes 13 and 23, that is, the lengths in the longitudinal direction of the first semiconductor plate 10 and the second semiconductor plate 20 (the lengths on the diagonal lines) are set. It can be used effectively. Thereby, the Peltier effect, in particular, the cooling effect can be efficiently extracted (expressed).

The junction 30 includes an electrode 12 provided on the first semiconductor plate 10, an electrode 22 provided on the second semiconductor plate 20, a conductive paste layer 31 provided between the electrode 12 and the electrode 22, It is comprised from the needle part 32 protruded from the adhesive paste layer 31. FIG. Here, the needle portion 32 is preferably a fine metal wire made of nickel, copper, or stainless steel having a tip diameter of about several tens of microns.
In the Peltier module 1 of the present embodiment, the first semiconductor plate 10 and the second semiconductor plate 20 can be bonded to one end side in the longitudinal direction via the bonding portion 30 including the electrodes 12 and 22. Therefore, the electrical resistance of the Peltier module 1 as a whole can be reduced. Thereby, the Peltier module 1 which can suppress the heat_generation | fever by the electrical resistance in the vicinity of the junction part 30 as much as possible, and can express the cooling effect sufficient for practical use can be provided.
Furthermore, by providing the needle part 32 protruding from the conductive paste layer 31, local cooling and heating can be realized.

  Further, in the joint portion 30 of the present embodiment, these electrodes 12 and 22 are joined via a conductive paste layer 31 such as, for example, dotite (“Dotite” is a registered trademark; the same applies hereinafter). The electrodes 12 and 22 of the first semiconductor plate 10 and the second semiconductor plate 20 can be easily and reliably joined while suppressing an increase in electrical resistance at 30. In place of the conductive paste layer 31, a metal Ga layer or a low melting point alloy may be used. Even in this case, the same effect as that of the conductive paste layer 31 can be obtained.

  Although not shown, a copper plate is bonded to the electrodes 13 and 23 via a conductive paste layer. Thus, by using a copper plate, the electrical resistance resulting from joining etc. can be reduced rather than the case where a copper wire, a gold wire, etc. are used, for example. Thereby, the cooling effect by the Peltier effect can be taken out (expressed) more effectively. Here, as in the case of the joint portion 30, in order to join the copper plate to the electrodes 13 and 23, a metal Ga layer may be used instead of the conductive paste layer.

Next, another embodiment of the present invention will be described.
FIG. 4 shows a cantilever 40 used as one form of the needle portion 32. The cantilever 40 is used for an electron force microscope (AFM) application, a semi-contact mode measurement, and a lithography application, and the end of the cantilever 40 protrudes with a radius of curvature of 10 nm to 60 nm at the tip. A portion 41 is provided. In addition, the protrusion part 41 can also make the curvature radius in a front-end | tip 1-3 nm by growing a carbon crystal and manufacturing.
Such a cantilever 40 is provided by being embedded or bonded to the conductive paste layer 31 instead of the needle portion 32 described in the above embodiment.

The experimental results according to this example are shown in FIGS.
N-type Bi ₂ Te ₃ was used as the first semiconductor plate 10, p-type Bi _0.5 Sb _1.5 Te ₃ was used as the second semiconductor plate 20, and Cu was used as the electrodes 12, 13, 22, and 23. As the needle part 32, a copper fine wire having a tip diameter of 50 microns and a cantilever having a tip diameter of 10 nm (manufactured by Olympus (product number OMCL-AC240TM-B2)) were used.
FIG. 5 is a characteristic diagram showing the relationship between the current and the tip temperature of the fine metal wire, FIG. 6 is a characteristic diagram showing the relationship between the current and the tip temperature difference between the metal fine wire (atmosphere temperature and the temperature difference between the needles), and FIG. FIG. 8 is a characteristic diagram showing the relationship between the current and the cantilever tip temperature difference (atmosphere temperature and cantilever temperature difference).
As shown in the figure, even when using a thin metal wire or a cantilever, it can be cooled down to nearly minus 5 degrees, and a temperature difference exceeding 35 degrees can be obtained even in the difference from the ambient temperature. did it.
FIG. 9 is a characteristic diagram showing the weight of a substance due to a change in current. When the current was about 8 amps, a weight of about 10 mg could be deposited, and when the current was about 9 amps, a weight of about 30 mg could be deposited.

Hereinafter, a Peltier module according to another embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 10 is a side view of the Peltier module according to this embodiment.
As shown in the figure, the Peltier module 2 uses a pair of Peltier elements 50A and 50B in which P-type semiconductors 51A and 51B and N-type semiconductors 52A and 52B are continuously connected. In the Peltier element 50A, a P-type semiconductor 51A and an N-type semiconductor 52A are continuously connected between two heat exchange plates (a heat radiating plate 53A and a cooling plate 54A). A predetermined voltage is applied to the P-type semiconductor 51A disposed at one end and the N-type semiconductor 52A disposed at the other end. The Peltier element 50B has a P-type semiconductor 51B and an N-type semiconductor 52B connected in series between two heat exchange plates (heat radiation plate 53B and cooling plate 54B). A predetermined voltage is applied to the P-type semiconductor 51B disposed at one end and the N-type semiconductor 52B disposed at the other end. Here, the heat exchange plate (the heat radiating plate 53A, the cooling plate 54A, the heat radiating plate 53B, and the cooling plate 54B) is made of a material having high electrical resistance and high thermal conductivity, such as AlN (aluminum nitride) or SiC ( Silicon carbide) is suitable, and Al ₂ O ₃ (sapphire, alumina) can also be used.
The inner surface of the first heat exchange plate (cooling plate) 54A of the Peltier element 50A and the inner surface of the second heat exchange plate (cooling plate) 54B of the Peltier element 50B are connected by the joint portion 30.

The joint portion 30 can be formed of, for example, a conductive paste layer or a high thermal conductive grease, as in the above embodiment, and a protruding needle portion 32 is provided at the end of the connection portion 30. Here, the needle portion 32 is preferably a fine metal wire made of nickel, copper, or stainless steel having a tip diameter of about several tens of microns.
In the Peltier module 2 of the present embodiment, the first heat exchange plate (cooling plate) 54A and the second heat exchange plate (cooling plate) 54B are joined via the joint 30 and protruded from the joint 30. By providing the needle portion 32, local cooling and heating can be realized.
Further, in the joint portion 30 of the present embodiment, the first heat exchange plate (cooling plate) 54A is obtained by using a conductive paste layer such as, for example, dotite (“Dotite” is a registered trademark; the same applies hereinafter) or a high thermal conductive grease. And the second heat exchange plate (cooling plate) 54B can be joined easily and reliably. Note that a metal Ga layer or a low melting point alloy may be used instead of the conductive paste layer. Even in this case, the same effect as the conductive paste layer can be obtained.
Note that the cantilever 40 shown in FIG. 4 can be used as one form of the needle portion 32 in the present embodiment.

Hereinafter, a Peltier module according to another embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 11 is a side view of the Peltier module according to this embodiment. In addition, the same code | symbol is attached | subjected to the same member as the Example shown in FIGS. 1-3, and description is abbreviate | omitted.
As shown in the figure, the Peltier module 3 uses heat pipes as the electrode 13A and the electrode 23A.
One end of the electrode 13A composed of a heat pipe is disposed on the outer surface on the other end side of the first semiconductor plate 10, and one end of the electrode 23A composed of a heat pipe is the other end side of the second semiconductor plate 20 It is arranged on the outer surface.
Further, a heat radiating fin 13B is provided at the other end of the electrode 13A, and a heat radiating fin 23B is provided at the other end of the electrode 23A. Note that a metal Ga layer may be used instead of the conductive paste layer.
By using the heat pipe itself as the electrodes 13A and 23A as in the present embodiment, water cooling is not required and the heat pipe can be used as a mobile Peltier module.

Hereinafter, a Peltier module according to another embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 12 is a side view of the Peltier module according to this embodiment. In addition, the same code | symbol is attached | subjected to the same member as the Example shown in FIGS. 1-3, and description is abbreviate | omitted.
As shown in the figure, the Peltier module 4 is provided with a heat pipe 51 at the joint 30. Therefore, the junction 30 includes the electrode 12 provided on the first semiconductor plate 10, the electrode 22 provided on the second semiconductor plate 20, the heat pipe 51 provided between the electrode 12 and the electrode 22, The needle portion 32 is connected to the heat pipe 51 via the conductive paste layer 31. Although not shown, the electrode 12 and the heat pipe 51 and the electrode 22 and the heat pipe 51 are also joined by the conductive paste layer.
The local cooling effect and the heating effect can be enhanced by providing the needle part 32 through the heat pipe 51 as in the present embodiment.

Hereinafter, a Peltier module according to another embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 13 is a side view of the Peltier module according to this embodiment. The same members as those in the embodiment shown in FIG.
As shown in the figure, the Peltier module 5 uses a heat pipe 51 as the joining portion 30. Although not shown, a conductive paste layer or between the first heat exchange plate (cooling plate) 54A and the heat pipe 51 and between the second heat exchange plate (cooling plate) 54B and the heat pipe 51, or Joined with high thermal grease.
The needle portion 32 is connected to the heat pipe 51 through the conductive paste layer 31.
The local cooling effect and the heating effect can be enhanced by providing the needle part 32 through the heat pipe 51 as in the present embodiment.

The use of the Peltier module according to this embodiment will be described below.
First, the Peltier module according to the present embodiment can be used for local cooling or heating of cellular tissue.
Since the normal cell size is several microns, one cell can be cooled or heated independently by setting the tip size of the needle part of the Peltier module according to this embodiment to the same size as the cell size. Switching between cooling and heating can be easily performed by reversing the direction of the current flowing through the Peltier module.
Furthermore, if the tip size of the needle part of the Peltier module is about 10 nm like a cantilever, the chromosome, mitochondria, cell wall, etc. constituting the cell can be cooled or heated independently.
By the above method, specific cells or constituent substances can be cooled and stored or killed, or heated and stored or killed.
Further, the Peltier module according to the present embodiment can be used for controlling separation and collection of fine particles.

By inserting the tip of the needle part of the Peltier module according to this embodiment into the surface or inside of the liquid in which the fine particles are present and cooling or heating, the movement of the fine particles can be controlled. The fine particles gather during cooling and dissipate during heating.
Further, the Peltier module according to the present embodiment can be used for local control of the flow.
That is, the flow or vibration of a solid, liquid, or gas can be controlled by locally contacting the tip of the needle of the Peltier module in a place where the flow or vibration of a solid, liquid, or gas exists. .
Further, the Peltier module according to the present embodiment can be used for gas control by forming a hollow portion in the needle portion.
That is, the flow of the passing gas or liquid can be controlled by making the needle part into a pipe shape and allowing the gas or liquid to pass through the hollow part.
Further, the Peltier module according to the present embodiment can be used as tweezers.
That is, by cooling the tip of the needle part of the Peltier module, the substance that contacts the tip of the needle part is attached, while by heating the tip of the needle part, the substance attached to the tip of the needle part can be released, Available as tweezers.
Moreover, the Peltier module according to the present embodiment can be used for cell culture.
That is, by cooling or heating the tip of the needle portion of the Peltier module, one cell can be cultured, and further, a thermal change of a local tissue in the cell can be observed.

As mentioned above, although the manufacturing method of the Peltier module 1 and the Peltier module 1 of this invention was demonstrated based on the illustrated Example, this invention is not limited to this. Each part which comprises the Peltier module 1 of this invention can be substituted with the thing of the arbitrary structures which can exhibit the same function. Moreover, arbitrary components may be added to the Peltier module 1 of the present invention.
Further, in the present embodiment, the description has been given using n-type Bi ₂ Te ₃ and p-type Bi _0.5 Sb _1.5 Te _{3 obtained} by dividing a plate having a substantially square shape into two, but the Peltier module of the present invention is used. 1 and the manufacturing method of the Peltier module 1 are not limited to these, and the Peltier effect, in particular, the cooling effect can be taken out (expressed) efficiently without increasing the electrical resistance value of the entire Peltier module. Any shape may be used.

  The Peltier module according to the present invention is suitable for cooling or heating a minute object.

Top view of a Peltier module according to one embodiment of the present invention. Side view Front view The principal part perspective view of the cantilever used as one form of the needle part of the Peltier module by other Examples of this invention The characteristic figure which shows the relation between the electric current by the experimental result of this example and the tip temperature of the thin metal wire The characteristic figure which shows the relationship between the electric current by the experimental result of a present Example, and the tip temperature difference of a metal fine wire Characteristic diagram showing the relationship between current and cantilever tip temperature according to experimental results of this example The characteristic figure which shows the relation between the electric current by the experimental result of this example and the tip temperature difference of the cantilever The characteristic diagram which shows the weight of the substance by the change of the current by the experimental result of this example Side view of a Peltier module according to another embodiment of the invention Side view of a Peltier module according to another embodiment of the invention Side view of a Peltier module according to another embodiment of the invention Side view of a Peltier module according to another embodiment of the invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Peltier module 10 1st semiconductor plate 20 2nd semiconductor plate 11, 21 Insulating layer 12, 22 Electrode 13, 23 Electrode 30 Joint part 31 Conductive paste layer 32 Needle part 40 Cantilever

Claims (13)

A first semiconductor plate and a second semiconductor plate arranged opposite to each other;
A joint for connecting an inner surface on one end side of the first semiconductor plate and an inner surface on one end side of the second semiconductor plate;
An outer surface on the other end side of the first semiconductor plate and an electrode disposed on the outer surface on the other end side of the second semiconductor plate,
A Peltier module characterized in that a protruding needle part is provided at the joint part. A Peltier module using a pair of Peltier elements in which a P-type semiconductor and an N-type semiconductor are connected in series,
When the first heat exchange plate of one of the Peltier elements is connected to the second heat exchange plate of the other Peltier element and the first heat exchange plate is used as a cooling surface, the second heat When the exchange plate is also a cooling surface, and the first heat exchange plate is a heat dissipation surface, the second heat exchange plate is also used as a heat dissipation surface,
A Peltier module characterized in that a protruding needle part is provided at the joint part.   The Peltier module according to claim 1 or 2, wherein a thin metal wire having a diameter of several microns is used as the needle portion.   The Peltier module according to claim 1, wherein a cantilever is used as the needle portion.   The Peltier module according to claim 3, wherein the Peltier module is used for local cooling or heating of a cell tissue.   The Peltier module according to claim 4, wherein the Peltier module is used for local cooling or heating of chromosomes, mitochondria, and cell walls constituting cells.   The Peltier module according to claim 1 or 2, wherein the Peltier module is used for controlling separation and collection of fine particles.   The Peltier module according to claim 1 or 2, wherein the flow or vibration of a solid, liquid, or gas is controlled.   3. The flow of the gas or the liquid passing therethrough is controlled by forming a hollow portion in the needle portion and allowing a gas or liquid to pass through the cavity portion. Peltier module.   The material that contacts the tip of the needle is attached by cooling the needle, and the substance attached to the tip of the needle is released by heating the needle. The Peltier module according to claim 2.   The Peltier module according to claim 1 or 2, wherein a heat pipe is used for the joining portion, and the needle portion is provided at an end of the heat pipe.   Each of the electrodes is composed of a heat pipe, one end of the heat pipe is disposed on the outer surface of the other end side of the first semiconductor plate, and the other end of the heat pipe is disposed on the second semiconductor plate. The Peltier module according to claim 1, wherein the Peltier module is disposed on an outer surface on the other end side.   The Peltier module according to claim 12, wherein heat dissipating fins are provided at the other end of the one heat pipe and the other end of the other heat pipe.

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