JP2010203786A - Two-dimensional image detector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a two-dimensional image detector for efficiently cooling the whole, while cooling heat generating sources preponderantly. <P>SOLUTION: This FPD 15 includes a photoconductive film 18, a bias electrode layer 19, a TFT substrate 20, a control board 21 located under the TFT substrate 20, heat sinks 22, a casing 25, and an exhaust fan 26. The heat sinks 22 are composed of first contact parts 31 which touch a power source 27 and electric elements 28 provided on the control board 21; second contact parts 32 which touch the bottom plate 25b of the casing 25; and bent parts 33 which smoothly connect the first and second contact parts 31 and 32, and become convex along the direction A of air drawn/sent by the exhaust fan 26. The bent parts 33 drag in the air drawn/sent by the exhaust fan 26 and blow the air against the first contact parts 31. In the connecting portions of the individual heat sinks 22, openings to work as air passages are formed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a two-dimensional image detection apparatus having a configuration in which a substrate provided with an electrical element and an imaging unit are connected to supply fluid and cool the electrical element.

  2. Description of the Related Art Conventionally, as a two-dimensional image detection apparatus, in radiography intended for medical diagnosis, industrial examination, etc., a charge is generated upon irradiation of radiation that has passed through the subject, and the charge is accumulated. Various radiological image detection apparatuses for recording radiographic images have been proposed and put into practical use. Furthermore, in recent years, FPDs (flat panel detectors) that convert X-rays that have passed through a subject into electrical signals in real time have become widespread as radiation image detection apparatuses.

  A radiation image detection apparatus such as an FPD is provided with a radiation conversion layer that converts radiation into electric charge, a circuit board that is provided with a readout circuit such as a TFT array that reads out the electric charge converted by the radiation conversion layer, and a drive circuit for driving the readout circuit. A control board is provided. The control board is provided with a plurality of electric elements such as a power source, a semiconductor integrated circuit such as an ASIC, and an A / D converter.

  The electric element generates heat when driven. The radiation conversion layer is made of a material that is easily affected by temperature changes, such as amorphous selenium. For this reason, when the temperature in the radiation image detection apparatus rises due to the heat from the control board, the physical properties of the radiation conversion layer change and the accuracy of converting radiation into charges decreases, or noise in the electrical signal read by the readout circuit There has been a problem that the image quality deteriorates due to the mixing.

  Therefore, in the radiological image detection apparatus described in Patent Document 1, heat generated by a heat source such as a DC / DC converter or an amplifier is conducted to a casing through a conductive member such as a gel and a heat radiating plate, and is externally provided. In addition to dissipating heat, the air around the heat dissipating fins attached to the heat dissipating plate is cooled by being discharged to the outside by an exhaust fan.

JP 2007-256176 A

  In the radiation image detection apparatus, as described above, a number of electrical elements that serve as heat sources are provided at various locations on the control board. For this reason, it is of course necessary to intensively cool the heat source, but at the same time, it is also required to efficiently cool the entire apparatus. In particular, the radiation image detection device has a relatively large area, and the space between the control board, which is a supply space for cooling fluid such as air, and the housing is as narrow as about 10 mm. Therefore, the heat generation source is intensively cooled and the entire device is cooled. It is requested to do.

  However, in the configuration described in Patent Document 1, the emphasis is on intensively cooling the heat generation source, and cooling of the entire apparatus is not so much considered. For example, of the air sent into the radiation image detection apparatus by the exhaust fan, the air that directly hits the electric element that is the heat source contributes to the cooling effect, but is discharged outside the apparatus without directly hitting the electric element. Since air naturally does not contribute to cooling, cooling efficiency is poor.

  In view of the above problems, an object of the present invention is to provide a two-dimensional image detection apparatus capable of efficiently cooling the entire heat source while intensively cooling a heat generation source.

  The two-dimensional image detection apparatus according to the present invention includes an imaging unit, a substrate, a fluid supply unit, a fluid passage, and a heat dissipation member.

  The imaging unit acquires a two-dimensional image. The substrate is provided with an electric element for driving the imaging unit on a surface opposite to the imaging unit. The fluid supply means cools the electric element by supplying a fluid to the surface of the substrate on which the electric element is provided. The fluid passage allows the fluid to pass through.

  The heat dissipation member includes a first contact portion that contacts the electric element, and a bent portion. The bent portion extends from the first contact portion and is convex along the supply direction. The fluid is wound on a surface of the bent portion facing the upstream side in the supply direction and applied to the first contact portion.

  The substrate and the heat dissipation member are housed in a housing. In this case, the heat dissipation member has a second contact portion. The second contact portion is in contact with the surface of the housing that faces the surface of the substrate on which the electrical element is provided.

  A plurality of the electric elements and the heat radiating members are arranged along the supply direction or a direction orthogonal to the supply direction.

  When a plurality of the electric elements and the heat radiating member are arranged along a direction orthogonal to the supply direction, the heat radiating member is connected in a direction orthogonal to the supply direction, and the fluid passage is formed in the connection portion. An opening is formed. In addition, when the said heat radiating member is scattered one by one without being connected, the clearance gap between each heat radiating member comprises the said fluid channel | path.

  When a plurality of the electric elements and the heat radiating members are arranged along the supply direction, the opening is formed so that the opening area gradually decreases from the upstream side to the downstream side in the supply direction. Yes.

  When a plurality of the electric elements and the heat radiating members are arranged along the supply direction, the electric elements and the heat radiating members are arranged in a staggered manner that are staggered in a direction orthogonal to the supply direction.

  When the substrate is disposed along the vertical direction, the fluid supply means is disposed such that the supply direction is opposite to the vertical direction. Further, the electric element and the heat radiating member are arranged to be shifted upward.

  Furthermore, when the board | substrate is arrange | positioned along the direction orthogonal to a perpendicular direction, a spacer is distribute | arranged between the said board | substrates and the said fluid is supplied to the space formed of the said spacer by the said fluid supply means.

  The casing is provided with an intake hole and an exhaust hole for the fluid, and the holes are arranged on the same line.

  The electric element includes a power source that supplies power to the photographing unit, and the power source is arranged to be shifted to the upstream side in the supply direction.

  The fluid supply means is a fan that supplies air as the fluid.

  The imaging unit is a radiation detection unit that detects radiation transmitted through the subject and outputs a charge corresponding to the detected radiation. The radiation detection unit includes a conversion layer that converts radiation directly into electric charges.

  According to the present invention, the first contact portion that contacts the electric element, and the heat dissipating member including the bent portion that extends from the first contact portion and is convex along the fluid supply direction are provided. The fluid is entrained in the part and applied to the first contact part to cool the electric element, and the fluid is passed through the fluid passage from the upstream side to the downstream side in the supply direction to cool the whole. However, the whole can be efficiently cooled.

It is explanatory drawing which shows the structure of a X-ray imaging system. It is sectional drawing which shows the structure of a flat panel detector. It is a bottom side perspective view of a control board. It is a bottom view of a control board. It is a bottom view which shows the example which has arrange | positioned the electrical element in zigzag form. It is a bottom view which shows the example which has arrange | positioned the electrical element to the upper side. It is sectional drawing which shows the example which opens a space with a spacer between a TFT substrate and a control board, and supplies air to space.

  As shown in FIG. 1, the X-ray imaging system 10 is a system that irradiates a subject H with X-rays and images the state of the subject H inside the X-ray source 11, X-ray imaging. It comprises a device 12, a processor device 13 and the like. The X-ray imaging apparatus 12 includes an X-ray imaging table 14 and an FPD 15 as a two-dimensional image detection apparatus.

  The X-ray source 11 is an X-ray tube that generates X-rays by accelerating electrons from a cathode filament to a target such as tungsten or molybdenum. The X-ray quality and dose of X-rays exposed from the X-ray source 11 are adjusted by adjusting the current (tube current) and acceleration voltage (tube voltage) that flow through the cathode. It is adjusted appropriately according to the site.

  The X-ray source 11 is installed on the ceiling of the X-ray imaging room by a support arm (not shown). The support arm supports the X-ray source 11 so as to be movable up, down, left and right around the FPD 15 and can be rotated within a predetermined angle so that the X-ray source 11 can change the direction in which the X-ray is exposed. The source 11 is supported. As a result, the X-ray source 11 can emit X-rays toward an arbitrary part of the subject H lying on the X-ray imaging table 14. Further, the X-ray source 11 is provided so as to be manually movable, and when the X-ray imaging table 14 is moved up and down, the X-ray source 11 is moved up and down while keeping a constant distance from the FPD 15.

  The processor device 13 comprehensively controls the operation of the X-ray imaging system 10. For example, the processor device 13 receives an input from the operation unit 16 including a keyboard and a mouse, and adjusts the tube current and tube voltage of the X-ray source 11 to thereby adjust the X-rays emitted from the X-ray source 11. Adjust radiation quality and dose. Further, an image subjected to various image processing is generated based on the imaging signal output from the FPD 15 and displayed on the monitor 17.

  The FPD 15 is a direct conversion type flat panel detector that converts incident X-rays directly into electric charges without converting them into visible light. The FPD 15 is horizontal with the imaging surface facing upward (the direction in which the X-ray source 11 is located). The X-ray imaging table 14 is arranged on the back surface of the X-ray imaging table 14 so as to be movable in the longitudinal direction of the X-ray imaging table 14 (in the horizontal direction in FIG. 1). Then, it is moved to a position where X-rays from the X-ray source 11 can be received efficiently. The FPD 15 has an area enough to cover the entire chest of the subject H.

  As shown in FIG. 2, the FPD 15 includes a photoconductive film 18 as a conversion layer that converts X-rays into electric charges, and a bias electrode layer 19 that is laminated on the photoconductive film 18 and is transparent to X-rays. A TFT substrate 20 that is stacked under the photoconductive film 18, reads out and outputs the charges converted by the photoconductive film 18 for each pixel, a control substrate 21 positioned under the TFT substrate 20, and a heat sink 22. The base plate 23, the heat insulating layer 24 positioned between the TFT substrate 20 and the base plate 23, a casing 25 that houses them, and an exhaust fan 26 that exhausts the air inside the casing 25 to the outside. Become. The photoconductive film 18 corresponds to the photographing unit of claim 1, and the control substrate 21 corresponds to the substrate.

  The photoconductive film 18 is made of, for example, amorphous selenium or cadmium telluride, and generates charges according to the quality and dose of X-rays upon incidence of X-rays. A TFT array is formed on the TFT substrate 20, and a pixel electrode (not shown) is provided on the upper surface. A bias voltage is applied between the bias electrode layer 19 and the pixel electrode, an electric field is generated in the photoconductive film 18 due to the bias voltage, and charges generated in the photoconductive film 18 are collected in the pixel electrode. The pixel electrode constitutes an electrode above the capacitor that accumulates the collected charges. The pixel electrode is connected to the TFT array, and the electric charge accumulated in the capacitor is read out through the TFT array.

  The control substrate 21 is connected to the TFT substrate 20 by wiring (not shown), and a power source 27 and various electric elements 28 are provided on the bottom surface 21a opposite to the side facing the TFT substrate 20. The electrical element 28 converts a semiconductor integrated circuit such as an ASIC that controls the operation of the FPD 15 such as supplying power generated from the power source 27 to the TFT array, or converts charges read from the TFT array into digital imaging signals. An A / D converter that outputs to the processor unit 13 is included. The power supply 27 is provided near one end edge 21 b of the control board 21, and the electric elements 28 other than the power supply 27 are provided at a position closer to the other end edge 21 c than the power supply 27. As shown in FIG. 3, in the present embodiment, the electric elements 28 are provided so as to be arranged along the air blowing direction A by the exhaust fan 26 and the direction orthogonal to the blowing direction A.

  The casing 25 has a box shape that is low in the vertical direction, and is made of, for example, magnesium whose surface is coated with a resin. A carbon plate 29 that transmits X-rays is fitted in the top plate 25a of the housing 25 located on the imaging surface side that detects X-rays in accordance with the pixel range of the TFT array. For example, all of the casing 25 may be integrally formed with a carbon plate. A base plate 23 is fixed inside the casing 25 in parallel with the top plate 25a, and a bias electrode layer 19, a photoconductive film 18 and a TFT substrate 20 are stacked and fixed on the upper surface side of the base plate 23, and on the lower surface side. The control board 21 is fixed via the spacer 30.

  The bottom plate 25 b of the housing 25, that is, the surface opposite to the imaging surface side is formed in parallel with the control board 21. The bottom plate 25b is formed with an intake hole 25c penetrating into the housing 25. The intake hole 25 c is formed on one end edge 21 b side of the control board 21. An exhaust hole 25e is formed in the side plate 25d located on the opposite side of the intake hole 25c and facing the other end edge 21c of the control board 21 in the side portion of the housing 25. The intake holes 25 c and the exhaust holes 25 e are formed so that the longitudinal direction perpendicular to the paper surface matches the width dimension of the control board 21.

  The exhaust fan 26 is adjacent to the exhaust hole 25e and is fixed to the side plate 25d. As the exhaust fan 26, for example, a well-known cross-flow fan having a size matching the longitudinal dimension of the exhaust hole 25e is used, and is orthogonal to the direction from the intake hole 25c toward the exhaust hole 25e. A rotation axis is arranged in a direction parallel to the longitudinal direction of the hole 25e. As a result, the exhaust fan 26 sucks air between the bottom surface 21a of the control board 21 and the bottom plate 25b of the housing 25 (for example, at an interval of 10 mm) from the intake holes 25c substantially parallel to the control board 21, and from the exhaust holes 25e. Air is discharged out of the housing 25. The exhaust fan 26 is not limited to a cross flow fan, and for example, a plurality of axial fans may be arranged in a line in the longitudinal direction of the exhaust hole 25e.

  The heat sink 22 is formed of a metal such as aluminum or copper having high thermal conductivity, for example. The heat sink 22 includes a first contact portion 31 that contacts a power source 27 or an electrical element 28 such as a semiconductor integrated circuit or an A / D converter, a second contact portion 32 that contacts a bottom plate 25 b of the housing 25, and a first contact portion 31. The second contact portions 31 and 32 are smoothly connected to each other, and the bent portion 33 is convex along the air blowing direction A by the exhaust fan 26. The first and second contact portions 31 and 32 are formed to have substantially the same size as the power source 27 and the electric element 28. The bending portion 33 winds the air flowing by the exhaust fan 26 on the inner surface 33a facing the upstream side in the blowing direction A. The air entrained by the bending portion 33 is blown to the first contact portion 31.

  As shown in FIG. 3 and FIG. 4, the heat sinks 22 are arranged at a plurality of locations according to the positions of the power source 27 and the electric element 28, and among these, the heat sinks 22 positioned along the direction orthogonal to the blowing direction A Are connected, and the heat sinks 22 are arranged in parallel along the air blowing direction A.

  In the heat sink 22, an opening 34 is formed between the bent portions 33 adjacent to each other in a direction orthogonal to the air blowing direction A (a connecting portion of the heat sinks 22). The opening 34 is arranged along the air blowing direction A and has a large opening area on the upstream side (the side where the intake holes 25c are present) in the air blowing direction A, and from the upstream side to the downstream side (the side where the exhaust holes 25e are present). It is formed so as to gradually become smaller. Thereby, the air which passed the opening part 34 of the upstream flows efficiently downstream. In addition, as the shape of the opening part 34, what is necessary is just a shape with sufficient efficiency for allowing air to pass through, such as the square of this example, or a circle.

  When the X-ray imaging apparatus 12 having the above configuration is used, the power supply 27 and the semiconductor integrated circuit generate heat due to the power supply and drive control to the TFT array, and the charges read from the TFT array are converted into digital imaging signals in real time. The output A / D converter also generates heat. The heat generated by the power source 27 and the electric element 28 is transferred to the first contact portion 31 of the heat sink 22, and the heat transferred to the first contact portion 31 is second contacted via the bent portion 33. The heat is radiated to the outside from the bottom plate 25b of the housing 25 in contact with the second contact portion 32. The inside of the housing 25 can be cooled by the amount of heat generated by the power source 27 and the electric element 28 being radiated to the outside through the heat sink 22 and the bottom plate 25b of the housing 25.

  Further, the exhaust fan 26 rotates, and the air in the housing 25 is blown from the intake hole 25c side toward the exhaust hole 25e side. The air blown in the blowing direction A by the exhaust fan 26 may pass through the bottom surface 21 a side of the control board 21, or may pass through the bottom plate 25 b side of the housing 25. The former is directly sprayed on the power source 27 and the electric element 28 or the first contact portion 31. The latter is entrained by the bent portion 33 of the heat sink 22 and sprayed to the first contact portion 31. Thereby, the blown air is used without waste, the first contact portion 31 is efficiently cooled, and the heat dissipation effect of the power source 27 and the electric element 28 can be enhanced. Air that passes through the opening 34 without being blown to the heat sink 22 is discharged from the exhaust hole 25e to the outside of the housing 25 while cooling the heat sink 22 on the downstream side.

  Further, since the power supply 27 that generates the most heat in the control board 21 is arranged upstream in the air blowing direction A, fresh air immediately after intake from the intake holes 25c, that is, before the temperature rises, corresponds to the power supply 27. Sprayed onto the heat sink 22. Thereby, heat sources such as the power source 27 and the electric element 28 can be intensively cooled, and the entire control board 21 can be efficiently cooled.

  Since the heat sinks 22 positioned along the direction orthogonal to the blowing direction A are connected and integrated, the heat sink 22 can be easily attached. Since the opening area of the opening 34 is gradually reduced from the upstream side to the downstream side in the air blowing direction A, more fresh air from the intake holes 25c can be supplied to the downstream side.

  The heat sinks 22 positioned along the direction orthogonal to the air blowing direction A may be scattered one by one without being connected. In this case, the gap between the heat sinks 22 forms an air passage.

  The FPD 15 has an area that covers the entire chest of the subject H and is relatively large. Further, the space between the control board 21 and the housing 25 which is an air supply space is as narrow as about 10 mm. Furthermore, amorphous selenium or the like used as the photoconductive film 18 is easily affected by temperature changes, and this deteriorates the image quality. For this reason, it is particularly useful if the heat sources such as the power source 27 and the electric element 28 can be intensively cooled as described above and the entire control board 21 can be efficiently cooled.

  Further, since the heat sink 22 has a simple configuration including the first and second contact portions 31 and 32 and the bent portion 33, the heat sink 22 can be disposed in a narrow space between the control board 21 and the housing 25.

  In the above embodiment, the various electric elements are arranged in the blowing direction A and the direction orthogonal thereto, and the heat sink 22 is also arranged in line with the blowing direction A and the direction orthogonal thereto. The present invention is not limited to this, and as shown in FIG. 5, the positions of the electric elements 28 are alternately arranged in a staggered manner in the direction orthogonal to the air blowing direction A, and the heat sink 22 is also arranged accordingly. You may arrange in a staggered pattern.

  By doing so, the positions of the openings 34 formed in the connecting portions of the heat sinks 22 are also staggered, so that the air that has passed through the upstream openings 34 is efficiently supplied to the bent portions 33 of the heat sinks 22 on the downstream side. Well sprayed. Even if the electric elements 28 and the heat sinks 22 are arranged in a staggered manner in this way, the air that has passed through the opening 34 flows downstream as in the above embodiment. In addition to the configuration in which the heat sinks 22 are arranged in a staggered manner, a configuration in which the opening area of the opening 34 is gradually reduced from the upstream side toward the downstream side may be employed.

  In the above embodiment, an X-ray imaging apparatus for lying position imaging in which the FPD 15 is arranged horizontally with respect to the floor surface is illustrated, but the present invention is not limited to this, and the FPD 15 is arranged in the vertical direction. You may apply for standing position photography arranged along. In this case, the control board 21 is disposed in parallel with the vertical direction. And the ventilation direction A shown in FIG. 4 is orthogonal to a perpendicular direction. That is, the bent portion 33 of the connected heat sink 22 is arranged along the vertical direction. Accordingly, the warm air blown to the bent portion 33 rises along the bent portion 33 of the heat sink 22 connected using the chimney effect, so that the warm air stays in the vicinity of the electric element. Can be effectively prevented.

  In addition, in the case of standing position photography, instead of or in addition to the configuration in which the heat sink 22 is arranged along the vertical direction, the exhaust fan 26 is arranged at the upper portion as shown by the dotted line in FIG. The direction may be opposite to the direction. If it carries out like this, the hot air which accumulates on the upper part can be discharged | emitted efficiently, and when implemented with the structure which arrange | positions the heat sink 22 along a perpendicular direction, a chimney effect can be heightened further.

  Further, instead of or in addition to these configurations, as schematically shown in FIG. 6 (the heat sink 22 is omitted), the power source 27 and the electric element 28 may be arranged on the upper side. As a result, the air heated by the power source 27 and the electric element 28 serving as a heat generation source can be immediately discharged from the upper exhaust hole 25e without staying around the control board 21, and the entire FPD 15 can be efficiently used. It can cool well.

  When the FPD 15 is disposed in a horizontal position with respect to the floor surface, as shown in FIG. 7, by increasing the size of the spacer 41 disposed between the base plate 23 and the control board 21, The control substrate 21, the photoconductive film 18 and the TFT substrate 20 are arranged at intervals. Air is also supplied to the space 42 formed by the spacers 41. Other configurations of the photoconductive film 18, the bias electrode layer 19, the TFT substrate 20, the base plate 23, the heat insulating layer 24, the housing 25, and the exhaust fan 26 are the same as those in the above embodiment, and are provided on the control substrate 21. Since the configuration of the power source 27, the electric element 28, and the heat sink 22 is the same, description thereof will be omitted.

  In the case of lying down photography, heat from the control board 21 is easily transmitted to the upper TFT substrate 20 and the photoconductive film 18 due to the structure, but with the above configuration, the control board 21 is efficiently blown by the exhaust fan 26. While being able to cool, it becomes difficult to transmit heat to the photoconductive film 18 more. Moreover, the heat insulation effect by the air layer of the space 42 can also contribute to the improvement of cooling efficiency.

  In the above embodiment, the intake hole 25c is provided in the bottom plate 25b of the housing 25 and the exhaust hole 25e is formed in the side plate 25d. However, the intake hole 25c is located at the same position as the exhaust hole 25e on the side plate facing the side plate 25d. It is preferable to arrange the intake holes 25c and the exhaust holes 25e on the same line by forming them. If the intake holes 25c and the exhaust holes 25e are arranged on the same line, the flow of air becomes straight, and the cooling efficiency can be further improved.

  Each example described in paragraphs [0053] to [0057] can provide a certain cooling effect by itself. For this reason, it is preferable to carry out with or without the heat sink 22.

  In the above embodiment, the exhaust fan 26 is exemplified as the fluid supply means, but a blower fan may be used. In addition to air, the fluid may be a refrigerant or a liquid such as water. When the fluid is a liquid, an insulating layer is interposed between the heat sink 22 and the control board 21, and the liquid is supplied into a space formed by the insulating layer and the housing 25 by a pump or the like.

  In the above embodiment, the power source, the ASIC, and the A / D converter are exemplified as the electric elements. However, the present invention is not limited to this, and an amplifier or a DC / DC converter that amplifies an electric signal is used. Any electrical element that serves as a heat source may be used.

  In the above embodiment, a direct conversion FPD is taken as an example, but an indirect conversion method in which X-rays are converted into visible light by a scintillator may be used. Moreover, in the said embodiment, although FPD incorporated in the X-ray imaging device is mentioned as an example of a two-dimensional image detection apparatus, this invention is not limited to this, For example, what detects other radiation, radiation It can also be applied to an apparatus that converts light other than the above into an image.

15 FPD
DESCRIPTION OF SYMBOLS 18 Photoconductive film 20 TFT substrate 21 Control board 22 Heat sink 25 Case 25c Intake hole 25e Exhaust hole 26 Exhaust fan 27 Power supply 28 Electric element 31 1st contact part 32 2nd contact part 33 Curved part 41 Spacer

Claims (14)

An imaging unit for acquiring a two-dimensional image;
A substrate provided with an electric element for driving the imaging unit on a surface opposite to the imaging unit;
Fluid supply means for supplying a fluid to the surface of the substrate on which the electrical element is provided to cool the electrical element;
A fluid passage for passing the fluid;
A first contact portion that contacts the electric element, and a curved portion that extends from the first contact portion and that protrudes along the fluid supply direction, and faces the upstream side of the supply direction A two-dimensional image detection apparatus comprising: a heat radiating member comprising a bent portion that is wound around the fluid and applied to the first contact portion. The substrate and the heat dissipation member are housed in a housing,
2. The two-dimensional image detection apparatus according to claim 1, wherein the heat radiating member has a second contact portion in contact with a surface of the housing that faces a surface of the substrate on which the electric element is provided.   The two-dimensional image detection apparatus according to claim 1, wherein a plurality of the electric elements and the heat radiating member are arranged along the supply direction or a direction orthogonal to the supply direction.   When a plurality of the electric elements and the heat radiating member are arranged along a direction orthogonal to the supply direction, the heat radiating member is connected in a direction orthogonal to the supply direction, and the fluid passage is formed in the connection portion. The two-dimensional image detection apparatus according to claim 3, wherein an opening is formed.   When a plurality of the electric elements and the heat radiating members are arranged along the supply direction, the opening is formed so that the opening area gradually decreases from the upstream side to the downstream side in the supply direction. The two-dimensional image detection apparatus according to claim 4, wherein:   When a plurality of the electric elements and the heat dissipating members are arranged along the supply direction, the electric elements and the heat dissipating members are arranged in a staggered manner staggered in a direction orthogonal to the supply direction. The two-dimensional image detection apparatus according to claim 3, wherein:   The fluid supply means is disposed so that the supply direction is opposite to the vertical direction when the substrate is disposed along the vertical direction. The two-dimensional image detection apparatus described.   The two-dimensional image detection apparatus according to claim 7, wherein, when the substrate is arranged along a vertical direction, the electric element and the heat dissipation member are arranged to be shifted upward.   When the board | substrate is arrange | positioned along the direction orthogonal to a perpendicular direction, a spacer is distribute | arranged between the said board | substrates, The said fluid is supplied to the space formed of the said spacer by the said fluid supply means, It is characterized by the above-mentioned. Item 7. The two-dimensional image detection device according to any one of items 1 to 6.   The two-dimensional image detection apparatus according to claim 2, wherein the casing is provided with an intake hole and an exhaust hole for the fluid, and the holes are arranged on the same line. The electrical element includes a power source that supplies power to the imaging unit,
The two-dimensional image detection apparatus according to claim 1, wherein the power source is arranged to be shifted to the upstream side in the supply direction.   12. The two-dimensional image detection apparatus according to claim 1, wherein the fluid supply means is a fan that supplies air as the fluid.   The two-dimensional image detection apparatus according to claim 1, wherein the imaging unit is a radiation detection unit that detects radiation transmitted through a subject and outputs a charge corresponding to the detected radiation.   The two-dimensional image detection apparatus according to claim 13, wherein the radiation detection unit includes a conversion layer that directly converts radiation into electric charges.

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