JP2010200982A - Flexible sensor module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible module with a power generator, having favorable productivity. <P>SOLUTION: This flexible sensor module includes a flexible wiring board 8a and a printed circuit board 8b mounted thereon and having rigidity for solving the problem. A sensor 5a is mounted to the lower surface side of the flexible wiring board 8a. The flexible wiring board 8a includes a connecting area 11a connected to the printed circuit board 8b and a free enabling area 11b formed adjacent to the connecting area 11a, in which the flexible wiring board 8a is provided to be free from the printed circuit board 8b by putting the printed circuit board 8b and the flexible wiring board 8a in the non-connecting state. Since the sensor 5a is mounted in the free enabling area 11b, it can be easily mounted, and the sensor 5a is firmly brought into contact with a measuring object. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a flexible sensor module that is mounted on a measurement target and detects information on the measurement target.

  Hereinafter, a conventional sensor module will be described. The conventional flexible sensor module has a configuration in which an antenna, a battery, a signal processing circuit, and a temperature sensor are mounted on a single-sided flexible substrate, and these are covered with a protective film.

  The flexible sensor module configured as described above is directly attached to the human body, for example, with a thickener, and the signal processing circuit converts the body temperature signal detected by the temperature sensor into a transmission signal, and via the antenna. This is sent to an external monitoring device. These temperature sensors and signal processing circuits are driven by a power supply voltage supplied from a battery.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-9-201338

  However, in the conventional flexible sensor module, a signal processing circuit and a temperature sensor are configured on a flexible substrate. That is, it is necessary to mount these components on a flexible substrate, but it is difficult to mount on a general-purpose mounting machine or the like, resulting in poor productivity.

  Accordingly, the present invention solves this problem, and an object of the present invention is to provide a flexible sensor module that can be easily mounted by a general-purpose mounting machine or the like and has good productivity.

  In order to achieve this object, a flexible printed circuit board and a printed circuit board mounted on the flexible printed circuit board and having rigidity are provided, and the sensor is mounted on the lower surface side of the flexible printed circuit board. The flexible wiring board is provided with a connection region connected to the printed circuit board and at least a releasable region provided between the connection region and one outer peripheral end of the flexible wiring substrate. The area is detachable from the printed circuit board, and the sensor is attached to the detachable area. Thereby, the initial purpose can be achieved.

  As described above, according to the present invention, the flexible wiring board includes a flexible printed circuit board mounted on the flexible wiring board and having rigidity, and a plurality of electronic components mounted on the upper surface of the printed circuit board. A flexible sensor module that is directly attached to a measurement target and detects the information on the measurement target, wherein the sensor is the flexible sensor module. Mounted on the lower surface side of the wiring board, the flexible wiring board has a connection area connected to the printed circuit board and at least a free space provided between the connection area and one outer peripheral edge of the flexible wiring board. The detachable area is releasable from the printed circuit board, and the sensor is The free area is a flexible sensor module fitted.

  Accordingly, when the sensor is mounted on the lower surface of the flexible wiring board, the structure is such that the flexible wiring board and the printed board are overlapped at the position where the sensor is mounted, so that the rigidity is increased. Therefore, the sensor can be mounted in the same way as if it is mounted on a rigid substrate, and can be easily mounted by a general-purpose mounting machine or the like. Therefore, a flexible sensor module with very good productivity can be realized.

  In addition, since the sensor is mounted in a detachable region on the flexible wiring board, the flexible sensor module can be firmly attached to the mounting target regardless of the shape or movement of the mounting target. Therefore, in the case where an interval is provided between the sensor and the measurement object, the change in the interval can be reduced. Further, when the sensor is brought into contact with the measurement object, the sensor can be reliably brought into contact with the measurement object. Thereby, it can detect with a sufficient precision. Furthermore, when the mounting target is a human body, it is possible to reduce a sense of incongruity with the mounting of the flexible sensor module and to reduce an obstacle to action.

(Embodiment 1)
Hereinafter, the flexible sensor module (hereinafter referred to as sensor module 1) in the present embodiment will be described in detail with reference to the drawings. FIG. 1 is a side sectional view of a sensor module in the present embodiment, and FIG. 2 is a bottom view of the same. The sensor module 1 according to the present embodiment is mounted on a measurement target, detects prescribed information, and transmits the detected information to a parent device (not shown). Therefore, the sensor module 1 is configured to be mounted on a measurement target by a mounting member. In the sensor module 1 according to the present embodiment, the thickener 3 is formed on the side (the lower surface side in FIG. 1) facing the measurement object of the sensor module 1 as a mounting member. The mounting member is not limited to this, and may be, for example, a resin sheet that is larger than the sensor module 1 and has the thickener 3 applied to the lower surface side. In this case, the resin sheet is affixed to the object to be measured from above the sensor module 1.

  Here, the measurement target in the sensor module 1 of the present embodiment is a human body, and is affixed to the human body to detect various human body information. Therefore, when directly attaching to a human body or clothes, a release paper (not shown) provided in advance on the surface of the thickener 3 is peeled off, and the sensor module 1 is attached with the thickener 3. For example, if the skin is weak and the skin is not easily affixed to the human body or clothes, such as a rash caused by a thickener, the release paper is not peeled off (or the sensor module 1 without the thickener 3 is prepared in advance. ) A belt-shaped (or string-shaped) mounting tool is mounted on the sensor module 1, and the sensor module 1 is mounted on the measurement target using the mounting tool.

  FIG. 3 is a circuit block diagram of the sensor module 1 in the present embodiment. Then, the circuit of the sensor module 1 in this Embodiment is demonstrated in detail using FIG. The sensor module 1 includes a signal processing unit 5, a power generation block 6 that supplies a power supply voltage to the signal processing unit 5, and an antenna 7 connected to an output (or input / output or input) of the signal processing unit 5. Have. Here, the signal processing unit 5 includes a sensor 5a for detecting human body information, a signal processing circuit 5b for converting information detected by the sensor into a transmission signal, and the sensor 5a and the signal processing circuit 5b. And a drive circuit 5c for drive control.

  The sensor 5a in the present embodiment is a temperature sensor that measures the body temperature of the human body, but is not limited to this, and may be a sensor that detects other biological information such as a pulse or an action. Further, in the present embodiment, the human body information is detected by being attached to the human body, but the present invention is not limited to this, and other than the human body may be the measurement target. In this case, a sensor for detecting various information is appropriately provided according to each measurement object.

  Next, the structure of the sensor module 1 in this Embodiment is demonstrated using FIG. 1, FIG. The board 8 is formed of a flexible wiring board 8a and a rigid printed board 8b. In the present embodiment, a glass substrate epoxy resin-based printed circuit board 8b is mounted on the vicinity of both ends of the flexible wiring board 8a. With this configuration, the flexible region 9 of the flexible wiring substrate 8a alone and the rigid region 10 in which the printed circuit board 8b is mounted on the flexible wiring substrate 8a are formed on the substrate 8.

  A part of the rigid region 10 has a connection region 11a to which the flexible wiring board 8a and the printed board 8b are connected. In the connection region 11a, the flexible wiring board 8a and the printed board 8b are connected by a conductive member such as solder or a conductive adhesive. In the rigid region 10, a detachable region 11b is formed in a region adjacent to the connection region 11a. In the detachable region 11b, the printed board 8b and the flexible wiring board 8a are not connected and can be separated. Specifically, the whole is not connected to the printed circuit board 8b in the width direction (vertical direction in FIG. 2) of the flexible wiring board 8a and the printed circuit board 8b. As a result, the detachable region 11b of the flexible wiring board 8a can be freely released from the printed board 8b.

  And the signal processing part 5 is formed in the rigid area | region 10 comprised in this way. In the present embodiment, the semiconductor element 12 and the electronic component 13 constituting the signal processing circuit 5b, the drive circuit 5c, and the like are mounted on the upper surface side of the printed board 8b. The sensor 5a is mounted on the lower surface side of the flexible wiring board 8a. Here, the semiconductor element 12 is a so-called bare chip, and is flip-chip mounted on the printed circuit board 8b. On the other hand, the electronic component 13 and the sensor 5a are attached by cream solder, conductive adhesive, or the like.

  In this embodiment, the semiconductor element 12 is mounted on the printed circuit board 8b by an anisotropic conductive film (so-called ACF), which is an anisotropic conductive paste, non-conductive film, non-conductive. Connection by paste or the like may be used. Thus, since the signal processing circuit 5b and the drive circuit 5c are formed on the printed circuit board 8b which is the rigid region 10, the electronic component 13 and the semiconductor element 12 can be easily mounted with a general-purpose mounting machine or the like. Therefore, the sensor module 1 with very good productivity can be realized. Further, since the semiconductor element 12 is flip-chip mounted on the rigid region 10, the semiconductor element 12 can be firmly pressed against the printed circuit board 8b. Therefore, the reliability of the connection between the semiconductor element 12 and the printed board 8b can be increased.

  On the other hand, the power generation block 6 and the antenna 7 are formed in the flexible region 9. In the present embodiment, since a printed antenna is used as the antenna 7, it is formed on the flexible wiring board 8a. However, when an air core coil or the like is used for the antenna 7, it is also mounted on the printed circuit board 8b.

  Next, the power generation block 6 will be described in detail. The power generation block 6 in the present embodiment is a dye-sensitized solar cell, and is formed on the flexible region 9 in the flexible wiring board 8a. A pattern made of copper foil is wired on at least the upper surface of the flexible wiring substrate 8a, and one electrode (not shown) of the solar cell is formed of the copper foil at the substantially central portion of the flexible region 9. And the other electrode 14 of a solar cell is arrange | positioned above the flexible area | region 9 in the flexible wiring board 8a. The connection between the other electrode 14 and the flexible wiring board 8a is made by the spacer 15, and the hole 15a provided in the spacer 15 is filled with the electrolytic solution. That is, the electrolytic solution is surrounded by the flexible wiring board 8a, the spacer 15, and the electrode 14, and is completely sealed.

  At this time, in order not to lose the flexibility of the power supply block 6, a flexible base material such as PET is also used for the spacer 15 and the electrode 14. Thus, since the dye-sensitized solar cell is easily formed of a flexible material, it is easy to realize the sensor module 1 having flexibility. Further, the dye-sensitized solar cell is generally easy in structure and manufacture, and can realize a low-cost sensor module 1. In the present embodiment, the power generation block 6 is a dye-sensitized solar cell, but this may be, for example, a silicon amorphous solar cell or a fuel cell as long as it is a flexible power generation means.

  With the above configuration, the sensor 5a is mounted on the rigid body region. That is, in the process of mounting the sensor 5a on the flexible wiring board 8a, the sensor 5a is mounted on the rigid body region. That is, in this mounting process, at the place where the sensor 5a is mounted, the flexible wiring board 8a is overlaid on the rigid printed board 8b. Thereby, the printed circuit board 8b acts as a receiver, and the sensor 5a can be mounted as if it is mounted on a hard board. Therefore, since the sensor 5a can be easily mounted with a general-purpose mounting machine, the sensor module 1 with very good productivity can be realized.

  The sensor 5a is mounted on the lower surface of the flexible wiring board 8a in the rigid region 10 (the surface of the sensor module 1 attached to the human body). Therefore, since the sensor 5a can be directly brought into contact with a measurement object such as skin, detection with high accuracy is possible.

  Furthermore, since the detachable region 11b is formed in the flexible wiring board 8a, when the sensor module 1 is affixed to the object to be inspected, the flexible wiring board 8a is released from the printed board 8b and is in a state along the measuring object. It will be pasted. Since the sensor 5a is attached to the detachable region 11b, even if the shape of the attachment location of the sensor module 1 is curved and the locality radius is small, the sensor 5a is reliably brought into contact with the surface of the measurement object. Can be made.

  That is, when the sensor 5a is mounted, the rigid printed board 8b serves as a receiver for the flexible wiring board 8a. When the sensor 5a is attached to the measuring object, it is released from the flexible wiring board 8a attached to the measuring object. Thus, the mounting of the sensor module 1 (contact of the sensor 5a) can be prevented.

  Further, the portion of the sensor 5a that contacts the skin is not coated with the thickener 3 and is formed as a non-forming portion 3a of the thickener 3, so that the sensor 5a can be directly brought into contact with a measurement object such as skin. Therefore, accurate detection is possible.

  In addition, since a dye-sensitized solar cell is provided, it is not necessary to separately attach or replace the battery, or to supply power by a wired cable or the like. In addition, since the dye-sensitized solar cell is formed on the flexible region 9 of the flexible wiring board 8a, the sensor module 1 is securely attached regardless of the shape or movement of the place where the sensor module 1 is attached. be able to. Accordingly, a change in the distance between the sensor 5a and the measurement target is small, or the measurement can be performed while reliably contacting the measurement target, so that accurate detection can be performed. Furthermore, since the power generation block 6 is formed in the flexible region 9, it is possible to reduce the sense of discomfort with the mounting of the sensor module 1 and to reduce the hindrance to the action.

  In the present embodiment, a mounting tool fixing portion to which the mounting tool is attached is formed in the vicinity of the end of the rigid region 10. Thereby, since the mounting tool fixing part is provided in the rigid region 10, it is difficult for the mounting part of the mounting tool to be broken, and the sensor module 1 can be securely mounted for a long time.

  In the present embodiment, the rigid regions 10 are provided on both sides of the flexible region 9, and the mounting fixture fixing portions are formed in the vicinity of both ends of both the rigid regions 10. In the present embodiment, one mounting tool fixing portion is provided at a position where the printed board 8b protrudes from the flexible wiring board 8a. And the other mounting fixture fixing | fixed part is formed in each edge part vicinity of the printed circuit board 8b and the flexible wiring board 8a.

  And the mounting fixture fixing | fixed part in this Embodiment is the hole 16a which penetrated one printed circuit board 8b, the hole 16b which penetrated the other printed circuit board 8b, the flexible wiring board 8a in the releasable area | region 11b, the thickener 3, and It is a hole 16c that penetrates the release paper. Then, by attaching one of the wearing tools to the hole 16a and attaching the other to only the hole 16b (or only 16c, or both the holes 16b and 16c), it can be attached to a part such as an arm using a band or a string. Can do. At this time, since the hole 16a and the hole 16b are provided in the rigid region 10, even if a band or a string is attached, the hole 16a and the hole 16b are not easily cracked, and the sensor module 1 can be firmly attached. it can. Further, when the mounting tool is fixed to the holes 16a and 16c, since the hole 16c is provided in the detachable region 11b of the flexible wiring board 8a, it can be attached along the shape of the measurement object, and its movement Can follow well. Therefore, since the sensor 5a can be reliably brought into contact with the measurement object regardless of the shape and movement of the measurement object, detection with very high accuracy can be performed.

  The form of the mounting tool and the mounting tool fixing part is not limited to the present embodiment, and for example, a T-shaped cut may be provided from the end of the printed circuit board 8b instead of the hole 16. Alternatively, when a holding tool such as a clip is provided on the mounting tool side, the mounting tool fixing portion is formed with a region where the electronic component 13 or the semiconductor element 12 is not mounted because it is sandwiched between the holding tools. . Here, although the power generation block 6 is formed in the present embodiment, it may be used for a sensor module that does not have such a flexible region 9. In this case, the connection region 11a and the detachable region 11b are provided as in the present embodiment. The mounting fixture fixing portion is provided in the rigid region 10 on the side where the electronic component 13 is mounted (right side in FIG. 2).

  In the present embodiment, the rigid regions 10 are provided on both sides of the flexible region 9. However, when the electronic component 13 or the semiconductor element 12 is mounted on only one rigid region 10, the rigid region 10 is It is good also as only one side by which the electronic component 13 is mounted. In this case, a mounting fixture fixing portion is formed near the end of the flexible region 9 (left side of the flexible wiring board 8a in FIG. 1). In this case, since the rigid region 10 becomes small, it is possible to reduce a sense of discomfort when a person wears it. In addition, even when wearing with a band or string is unnecessary, the rigid region 10 on one side (left side of the flexible region 9 in FIG. 1) may be deleted.

  Furthermore, the flexible region 9 may be formed so as to surround both sides of the rigid region 10, the four directions, or the rigid region 10. In this case, three or more rigid regions 10 are provided. In such a case, the mounting fixture fixing portion is formed at least for the most rigid region 10. Of course, in this case as well, as described above, a mounting fixture fixing portion may be formed on the flexible region 9.

  In addition, in the present embodiment, a narrow portion 17 is provided between the flexible region 9 and the rigid region 10. The width of the narrow portion 17 is narrower than the width of the flexible region 9 and the width of the rigid region 10. Note that the narrow portion 17 in the present embodiment is formed by providing a slit 17a (cut) at the boundary between the flexible wiring board 8a in the flexible region 9 and the printed board 8b. Thereby, since the connection between the flexible region 9 and the rigid region 10 is connected by the narrow portion 17, the deformation of the flexible region 9 is hardly inhibited. Therefore, the sensor module 1 can be firmly attached to the measurement target. In the present embodiment, the slit 17a is provided only on one side of the flexible region 9, but it may be provided on both sides. In addition, the rigid region 10 may be provided in the four directions of the flexible region 9. In any case, the portion where the flexible region 9 and the rigid region 10 are connected is the narrow portion 17.

  Furthermore, although the slit 17a is formed on the flexible region 9 side in the present embodiment, it may be formed on the rigid region 10 side. In this case, since the printed circuit board 8b is formed also in the narrow portion 17, the stress applied to the wiring pattern or the like wired on the narrow portion 17 can be reduced. Therefore, the wiring pattern is not easily cut at the narrow portion 17 and the highly reliable sensor module 1 can be realized.

  The sensor module according to the present invention has an effect of good productivity and is useful when used for a sensor module having flexibility.

Side sectional view of flexible sensor module in the present embodiment Same bottom view Same as above, circuit block diagram

5a sensor 5b signal processing circuit 8a flexible wiring board 8b printed circuit board 11a connection area 11b releasable area 12 semiconductor element 13 electronic component

Claims (6)

A flexible printed circuit board, a printed circuit board mounted on the flexible printed circuit board and having rigidity, a signal processing circuit including a plurality of electronic components mounted on the upper surface of the printed circuit board, and the signal processing circuit A flexible sensor module that directly attaches to a measurement object and detects the information of the measurement object, wherein the sensor is attached to a lower surface side of the flexible wiring board, The flexible wiring board is formed adjacent to the connection area connected to the printed circuit board and the connection area, and the flexible wiring board is disconnected from the printed circuit board and the flexible wiring board. And a releasable area provided releasably from the printed circuit board. The flexible sensor module mounted to the releasable region. The flexible sensor module according to claim 1, wherein a thickening agent is applied to a lower surface of the flexible wiring substrate, and the thickening agent is directly attached to a measurement target. The flexible sensor module according to claim 2, wherein a non-forming portion of the thickener is formed below the sensor. The flexible sensor module according to claim 3, wherein a tip of the sensor protrudes from the thickener. In a flexible sensor module having a plurality of mounting tool fixing portions, the mounting tools being attached to the mounting tool fixing portion, and mounted on a measurement object, at least one of the mounting tool fixing portions is the detachable region. The flexible sensor module according to claim 1, wherein the flexible sensor module is provided. In a flexible sensor module that has a plurality of mounting tool fixing portions, the mounting tools are mounted on the mounting tool fixing portion, and is mounted on a measurement target, at least one of the mounting tool fixing portions is in the printed circuit board. The flexible sensor module according to claim 1 provided in a releasable field.

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