JP2010194555A - Laser machining apparatus and laser machining method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser machining technology capable of simultaneously carrying out machining to a surface of a workpiece and machining to the side end surface thereof. <P>SOLUTION: A laser machining apparatus 10 includes: a galvanic unit 12 storing galvanic mirror devices 32, 34 for swingably reflecting laser beam LB emitted from a laser oscillator 14 and reciprocally irradiating the laser beam to the outer edge of the surface of the workpiece 22 with a predetermined width; reflective members 42 of the side end surface mounted on the galvanic unit 12; and a galvanic unit moving mechanism 18 allowing the position of the galvanic unit 12 to be relatively moved to the workpiece 22. The reflective members 42 of the side end surface include respective reflective mirrors 48 which reflect the laser beam LB deviated to the outside from the surface of the workpiece 22 by the action of the galvanic mirror devices 32, 34 to the side end surface 25 of the workpiece 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laser processing technique, and in particular, a laser processing apparatus that realizes laser irradiation to a side end surface of a workpiece by using a laser beam irradiated so as to protrude outward from the workpiece surface when the workpiece surface is irradiated with a laser beam. And a laser processing method.

  A flat beam surface is irradiated with a laser beam in a predetermined pattern to remove a thin film formed on the workpiece. As an example, FIG. 5 irradiates the surface of a work 22 having a conductive thin film 26 deposited on the surface of a rectangular insulating substrate with a laser beam LB, and removes the thin film 26 deposited on the outer edge 23. The processing method is shown.

  Specifically, as shown in FIG. 5A, the laser beam LB emitted from the laser oscillator is reciprocated in small increments using a galvano mirror, and an oblique irradiation line of the laser beam LB is formed on the outer edge 23 of the work 22. At the same time, the outer edge 23 of the workpiece 22 is exposed in a frame shape as shown in FIG. 5B by moving the galvano mirror itself at a predetermined speed in the XY direction using a robot arm or an XY gantry device. To do.

  By the way, in the process of depositing and forming the thin film 26 on the surface of the insulating substrate, the conductive material adheres to the side end face and the thin film 26 is often partially formed. Since LB is irradiated onto the surface of the workpiece 22 from above, the thin film 26 attached to the side end face 25 is left as it is, as shown in FIG.

Therefore, conventionally, after the work of removing the thin film 26 on the surface of the work 22 has been completed, the work of removing the thin film 26 on the side end face 25 may be performed by etching. In many cases, the thin film 26 on the end face 25 was left without being removed.
As shown in Patent Document 1, since a technique for repairing cracks by irradiating a side end surface of a workpiece with a laser beam is known, this is applied to remove the thin film 26 on the side end surface 25 by laser irradiation. Of course, this is also possible, but in this case as well, it is necessary to perform the processing on the side end face 25 as a separate process after the processing on the surface is completed, and the complexity of the work process is inevitable.
JP2007-245235

  The present invention has been devised to solve the above-described problems of the prior art, and provides a laser processing technique capable of executing processing on a side end surface simultaneously with processing on the surface of a workpiece. It is aimed.

  In order to achieve the above object, a laser processing apparatus according to claim 1 is a galvanometer that oscillates and reflects a laser beam emitted from a laser oscillator, and reciprocally irradiates the laser beam with a predetermined width on an outer edge portion of a work surface. A laser processing apparatus provided with a galvano unit that houses a mirror device, a side end surface reflection member attached to the galvano unit, and a galvano unit moving mechanism that moves the position of the galvano unit relative to the workpiece. The side end surface reflecting member includes a reflecting mirror that reflects the laser beam deflected outward from the workpiece surface by the operation of the galvanometer mirror device to the side end surface of the workpiece.

  The laser processing apparatus according to claim 2 is based on the laser processing apparatus according to claim 1, and further, a plurality of side end surface reflecting members corresponding to each side of the workpiece are attached to the galvano unit. Each side end surface reflecting member is equipped with a mechanism to move the position up and down, and when irradiating a laser beam along one side of the workpiece, the reflecting mirror of the side end surface reflecting member corresponding to the other side is raised. And a control means for preventing contact with the workpiece surface.

  The laser processing apparatus according to claim 3 is based on the laser processing apparatus according to claim 1 or 2, and is further synchronized with the movement of the plurality of clampers that hold each side of the workpiece and the galvano unit. It is characterized in that a control mechanism is provided that retracts the clamper in a position in conflict with the side end surface reflecting member in advance and returns it to the original position after the galvano unit has passed.

  According to a fourth aspect of the present invention, in the laser processing method, the laser beam emitted from the laser oscillator is oscillated and reflected by the galvanometer mirror device, and reciprocally radiates the outer edge portion of the workpiece surface with a predetermined width, and the position of the galvanometer mirror device. In a machining method that continuously irradiates a laser beam along the outer edge of the workpiece surface by moving the workpiece relative to the workpiece, the reciprocating width of the laser beam is set larger than the machining width of the outer edge of the workpiece surface. The laser beam deflected to the outside from the workpiece surface is reflected to the side end surface of the workpiece by a reflecting mirror that moves in synchronization with the galvanometer mirror device, thereby processing the outer edge of the workpiece surface and the side end surface of the workpiece. It is characterized by simultaneously performing the machining on.

  According to the laser processing apparatus and the laser processing method according to the present invention, when the laser beam is reciprocally irradiated to the outer edge portion of the workpiece surface using the galvanomirror device, the outer edge portion that requires processing of the reciprocal width of the laser beam. By setting the width to be larger than the original width of the workpiece, the laser beam is deliberately protruded from the workpiece surface and reflected toward the side edge of the workpiece by the reflecting mirror, thereby processing the outer edge of the workpiece surface. Then, it becomes possible to perform processing on the side end face of the workpiece in the same process.

FIG. 1 is a schematic diagram showing a basic configuration of a laser processing apparatus 10 according to the present invention, which includes a galvano unit 12, a laser oscillator 14, a control unit 16, and a galvano unit moving mechanism 18.
A workpiece 22 is placed on a table 20 provided below the galvano unit 12. The work 22 is formed by attaching a conductive thin film 26 to at least a part of the surface of the insulating substrate 24 and the side end face.

The galvano unit 12 includes a rectangular parallelepiped casing 30, and a first galvanometer mirror device 32 and a second galvanometer mirror device 34 disposed inside the casing 30.
An opening 36 is formed on the lower surface of the casing 30, and an fθ lens 38 is fitted in the opening 36.

  On one side of the casing 30, an opening 40 for laser light guide is provided. The laser beam LB emitted from the laser oscillator 14 is guided into the casing 30 from the opening 40 via a transmission optical system (not shown), and each of the first galvanometer mirror device 32 and the second galvanometer mirror device 34. After being deflected to a predetermined angle by the reflection mirrors 32 a and 34 a, the light enters the fθ lens 38 and is condensed and irradiated onto the work 22.

  The first galvanometer mirror device 32 and the second galvanometer mirror device 34 can rotate the angles of the reflection mirrors 32a and 34a within a certain range by driving the servo motors 32b and 34b, respectively. By displacing, the irradiation position of the laser beam LB can be moved in the XY directions.

A side end surface reflecting member 42 is provided on the outer surface of the casing 30. The side end surface reflecting member 42 includes a fixed rod 44, an extendable rod 46, and a reflecting mirror 48.
The upper part of the telescopic rod 46 is housed in the fixed rod 44 and is connected to a drive shaft of a solenoid (not shown) provided in the fixed rod 44. As a result, the amount of protrusion of the telescopic rod 46 from the fixed rod 44 changes according to the driving of the solenoid, and the total length of the side end surface reflecting member 42 is variable.

The reflection mirror 48 is connected to a rotary shaft 50 attached to the lower end of the telescopic rod 46, and the rotation of the rotary shaft 50 can adjust the angle within a certain range.
The upper part of the fixed rod 44 is joined to the outer surface of the casing 30.

  In FIG. 1, only three side end surface reflecting members 42 are drawn for convenience of illustration, but actually, as shown in FIG. 2, the side end surface reflecting members 42 are provided on the four outer surfaces of the casing 30. It has been.

The galvano unit moving mechanism 18 means devices having a function of moving the galvano unit 12 itself relative to the workpiece 22 in the XY direction. Specifically, an articulated robot arm attached to the galvano unit 12 or An XY gantry device equipped with a galvano unit 12 is applicable.
Alternatively, the galvano unit moving mechanism 18 is configured by a combination of a uniaxial reciprocating device that reciprocates the galvano unit 12 side in the X direction and a uniaxial reciprocating device that reciprocates the table 20 side in the Y direction. May be.

The control unit 16 includes an NC device (Numerical Control Unit), and has a function of generating a control signal according to a control program prepared in advance and outputting the control signal to the laser oscillator 14, the galvano unit 12, and the galvano unit moving mechanism 18.
Below, the control content by the control part 16 is illustrated.
(1) Laser oscillator 14 ON / OFF, output level, oscillation mode (PW / pulse)
(2) Moving / turning / stopping the galvo unit 12 by the galvo unit moving mechanism 18
(3) Drive of the servo motors 32b and 34b of the first galvanometer mirror device 32 and the second galvanometer mirror device 34 (oscillation of the reflection mirrors 32a and 34a)
(4) Solenoid drive on each side end reflection member 42 (adjustment of the amount of protrusion of the telescopic rod 46)

Hereinafter, a processing method using the laser processing apparatus 12 will be described.
First, as shown in FIG. 2, the galvano unit 12 is disposed above the surface of the workpiece 22. In the figure, the galvano unit 12 is arranged at the lower right end of the workpiece 22.

  Here, when the laser beam LB is emitted from the laser oscillator 14 and guided into the galvano unit 12 from the opening 40, the reflection mirrors 32a and 34a of the first galvanometer mirror device 32 and the second galvanometer mirror device 34 are predetermined. The laser beam LB is reciprocated by continuously oscillating in the angle range of. At the same time, the operation of the galvano unit moving mechanism 18 causes the galvano unit 12 to move upward along the right side of the workpiece 22, and as a result, the right side of the workpiece 22 is irradiated with the laser beam LB obliquely in a zigzag manner. Will be removed.

At this time, as shown in FIG. 1, the telescopic rod 46 of the side end surface reflecting member 42 attached to the first outer surface A of the galvano unit 12 is expanded and contracted by the side end surface reflecting member 42 attached to the other outer surface. The protrusion amount is increased as compared with the rod 46, and the reflection mirror 48 is extended to the vicinity of the side end face 25 on the right side of the workpiece 22.
In addition, the reciprocating width of the laser beam LB that is swung to the left and right by the galvanometer mirror devices 32 and 34 is also expanded compared to the case where only the outer edge 23 of the surface of the workpiece 22 is machined. Irradiates so as to protrude outward from the right side of 22.
The protruding laser beam LB is reflected by the reflection mirror 48 and is incident on the side end face 25 of the workpiece 22. As a result, the removal process of the thin film 26 on the side end face 25 is realized in the same process as the removal process of the thin film 26 on the surface of the work 22.

  In order to effectively realize the process of removing the thin film 26 from the side end face 25 of the workpiece 22, the setting of the protrusion amount of the telescopic rod 46 of the side end face reflecting member 42 and the angle of the reflecting mirror 48 are important points. For this reason, trial and error are repeated in advance to obtain the optimum protrusion amount and angle.

When the galvano unit 12 reaches the upper right end of the workpiece 22, the movement direction is changed to the left by the operation of the galvano unit moving mechanism 18. As a result, the galvano unit 12 moves to the left along the upper side of the workpiece 22, and the thin film 26 removal process is continued.
In this case, the reciprocating direction of the laser beam LB by the galvanometer mirror devices 32 and 34 is also changed 90 degrees to the left. The telescopic rod 46 of the side end surface reflecting member 42 attached to the second outer surface B of the galvano unit 12 is extended so that the laser beam LB irradiated so as to protrude outward is directed toward the side end surface 25 of the workpiece 22. reflect. At this time, in order to avoid that the reflecting mirror 48 of the other side end surface reflecting member 42 comes into contact with the surface of the workpiece 22, these telescopic rods 46 are housed deeply in the fixed rod 44, and the overall length is shortened.

Next, when the galvano unit 12 reaches the upper left end of the workpiece 22, the movement direction is changed downward by the operation of the galvano unit moving mechanism 18. As a result, the galvano unit 12 moves downward along the left side of the workpiece 22, and the thin film 26 removal process is continued.
At this time, the direction of reciprocal movement of the laser beam LB by the galvanometer mirror devices 32 and 34 is also changed 90 degrees to the left. Then, the telescopic rod 46 of the side end surface reflecting member 42 attached to the third outer surface C of the galvano unit 12 is extended, and the laser beam LB irradiated so as to protrude outward is directed toward the side end surface 25 of the workpiece 22. reflect. Also in this case, in order to avoid the reflection mirror 48 of the other side end surface reflection member 42 from coming into contact with the surface of the workpiece 22, these telescopic rods 46 are housed deeply in the fixed rod 44, and the overall length is shortened. .

Next, when the galvano unit 12 reaches the lower left end of the workpiece 22, the movement direction is changed to the right by the operation of the galvano unit moving mechanism 18. As a result, the galvano unit 12 moves to the right along the lower side of the workpiece 22, and the thin film 26 removal process is continued.
At this time, the direction of reciprocal movement of the laser beam LB by the galvanometer mirror devices 32 and 34 is also changed 90 degrees to the left. The telescopic rod 46 of the side end surface reflecting member 42 attached to the fourth outer surface D of the galvano unit 12 is extended so that the laser beam LB irradiated so as to protrude outward is directed toward the side end surface 25 of the workpiece 22. reflect. Also in this case, in order to avoid the reflection mirror 48 of the other side end surface reflection member 42 from coming into contact with the surface of the workpiece 22, these telescopic rods 46 are housed deeply in the fixed rod 44, and the overall length is shortened. .

  As described above, the operation of the galvano unit moving mechanism 18 causes the galvano unit 12 to move along the four sides of the workpiece 22 and to continue the irradiation of the laser beam LB. The thin film 26 covering the outer edge portion 23 is removed in a frame shape, and at the same time, the thin film 26 adhering to each side end face 25 can be removed cleanly.

In the above embodiment, the laser processing apparatus 10 is used for removing the thin film 26 formed on the insulating substrate 24. However, the present invention is not limited to this, Needless to say, it can be applied to processing purposes.
In the above, an example in which a total of four side end surface reflecting members 42 are provided in the galvano unit 12 has been shown. However, if the galvano unit 12 includes at least one side end surface reflecting member 42, the present invention can be realized. it can.

FIG. 4 shows an example in which a system in which each side of the work 22 is pressed and sandwiched by a plurality of clampers 52 that can expand and contract to fix the work 22 is shown.
The base end portion of each clamper 52 is inserted into the opening of the storage portion 54 and connected to a drive shaft of a solenoid (not shown). When the solenoid is driven in response to the control signal from the control unit 16, the expansion / contraction operation of the clamper 52 is individually controlled.
Specifically, in response to the movement of the galvano unit 12, the clamper 52 that obstructs the processing is sequentially released into the storage portion 54, and returns to its original position when the galvano unit 12 is sufficiently far away. The timing is controlled.
As a result, it is possible to prevent the reflecting mirror 48 of the side end surface reflecting member 42 from coming into contact with the clamper 52 in advance.

It is a schematic diagram which shows the basic composition of the laser processing apparatus which concerns on this invention. It is a top view which shows the process sequence with respect to a workpiece | work. It is a perspective view which shows the processing result with respect to a workpiece | work. It is a top view which shows the example which fixes each edge | side of a workpiece | work with a some clamper. It is explanatory drawing which shows the conventional processing method with respect to the surface outer edge part of a workpiece | work. It is a perspective view which shows the conventional process result with respect to a workpiece | work.

10 Laser processing equipment
12 Galvano unit
14 Laser oscillator
16 Control unit
18 Galvano unit moving mechanism
20 tables
22 Workpiece
23 Outer edge
24 Insulating substrate
25 Side edge of workpiece
26 Thin film
30 casing
32 First galvanometer mirror device
32a reflection mirror
32b servo motor
34 Second galvanometer mirror device
34a Reflective mirror
34b Servo motor
36 opening
38 fθ lens
40 Opening for laser light guide
42 Side end face reflection member
44 Fixed rod
46 Telescopic rod
48 Reflective mirror
50 axis of rotation
52 Clamper
54 compartment
LB laser beam

Claims (4)

A galvano unit that houses a galvano mirror device that oscillates and reflects the laser beam emitted from the laser oscillator and irradiates the laser beam back and forth with a predetermined width on the outer edge of the work surface;
A side end surface reflecting member attached to the galvano unit;
A laser processing apparatus provided with a galvano unit moving mechanism for moving the position of the galvano unit relative to the workpiece,
The laser processing apparatus, wherein the side end surface reflecting member includes a reflecting mirror that reflects the laser beam deflected outward from the workpiece surface by the operation of the galvanometer mirror device to the side end surface of the workpiece. The galvano unit is provided with a plurality of side end surface reflecting members corresponding to the sides of the workpiece,
Each side end surface reflecting member includes a mechanism for moving the position of the reflecting mirror up and down,
When irradiating a laser beam along one side of the workpiece, a control means for raising the reflection mirror of the side end surface reflecting member corresponding to the other side to prevent contact with the workpiece surface is provided. The laser processing apparatus according to claim 1. A plurality of clampers holding each side of the workpiece;
Synchronously with the movement of the galvano unit, a control mechanism for retracting the clamper in a position in contact with the side end reflection member in advance and returning the clamper to the original position after passing through the galvano unit is provided. The laser processing apparatus according to claim 1 or 2. The laser beam emitted from the laser oscillator is oscillated and reflected by the galvanometer mirror device, and the outer edge of the workpiece surface is reciprocated with a predetermined width, and the position of the galvanometer mirror device is moved relative to the workpiece. In the processing method of continuously irradiating a laser beam along the outer edge of the workpiece surface,
The reciprocal width of the laser beam is set larger than the machining width of the outer edge of the workpiece surface, and the laser beam deflected outward from the workpiece surface is moved to the workpiece side by a reflecting mirror that moves in synchronization with the galvanometer mirror device. A laser processing method characterized by reflecting on an end surface and simultaneously performing processing on an outer edge portion of the workpiece surface and processing on a side end surface of the workpiece.

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