JP2010189505A5 - - Google Patents
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- JP2010189505A5 JP2010189505A5 JP2009033801A JP2009033801A JP2010189505A5 JP 2010189505 A5 JP2010189505 A5 JP 2010189505A5 JP 2009033801 A JP2009033801 A JP 2009033801A JP 2009033801 A JP2009033801 A JP 2009033801A JP 2010189505 A5 JP2010189505 A5 JP 2010189505A5
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- filler
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- thermal conductivity
- parts
- resin composition
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Description
従来、熱伝導性にすぐれた熱可塑性樹脂組成物を得るにあたっては、高い熱伝導率を有する充填剤を添加する方法が一般的であるが、例えば樹脂100重量部に対して、1000重量部以上の充填剤(熱伝導性粒子)を用いる場合には、樹脂組成物の粘度が高くなりすぎてしまい、加工性が悪化するといった問題があった(特許文献１〜３参照)。 Conventionally, in order to obtain a thermoplastic resin composition having excellent thermal conductivity, a method of adding a filler having high thermal conductivity is generally used. For example, 1000 parts by weight or more with respect to 100 parts by weight of the resin In the case of using this filler (thermally conductive particles), there is a problem that the viscosity of the resin composition becomes too high and the processability deteriorates (see Patent Documents 1 to 3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009033801A JP5391718B2 (en) | 2009-02-17 | 2009-02-17 | Thermally conductive emulsion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009033801A JP5391718B2 (en) | 2009-02-17 | 2009-02-17 | Thermally conductive emulsion |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010189505A JP2010189505A (en) | 2010-09-02 |
| JP2010189505A5 true JP2010189505A5 (en) | 2012-05-24 |
| JP5391718B2 JP5391718B2 (en) | 2014-01-15 |
Family
ID=42815881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009033801A Active JP5391718B2 (en) | 2009-02-17 | 2009-02-17 | Thermally conductive emulsion |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5391718B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105143370A (en) * | 2013-04-26 | 2015-12-09 | 捷恩智株式会社 | Aqueous coating material, heat-dissipating member, metallic part, and electronic device |
| CN105899613A (en) * | 2014-01-08 | 2016-08-24 | 捷恩智株式会社 | Resin composition for heat-conductive sheet, heat-conductive sheet, resin-coated metal, and electronic device |
| JP2017088809A (en) * | 2015-11-16 | 2017-05-25 | 住友精化株式会社 | Aqueous dispersion liquid for forming heat dissipation coating film, heat dissipation coating film, and heat dissipation sheet |
| KR102176691B1 (en) * | 2017-08-09 | 2020-11-09 | 주식회사 엘지화학 | Thermoconductive high internal phase emulsion and heat dissipative composite using the same |
| JP2022054128A (en) * | 2020-09-25 | 2022-04-06 | 三菱鉛筆株式会社 | Composite particle material |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262862A (en) * | 1984-06-08 | 1985-12-26 | Unitika Chem Kk | Composition containing inorganic pigment dispersed therein |
| JP2002270741A (en) * | 2001-03-12 | 2002-09-20 | Nitto Shinko Kk | Heat radiating sheet and method for sticking electronic component to the heat radiating sheet |
| JP2003160768A (en) * | 2001-11-28 | 2003-06-06 | Dainippon Ink & Chem Inc | Thermoconductive flame-retardant pressure-sensitive adhesive tape |
| JP3928943B2 (en) * | 2002-07-03 | 2007-06-13 | 信越化学工業株式会社 | Heat dissipating member, manufacturing method thereof and laying method thereof |
| JP2005146166A (en) * | 2003-11-18 | 2005-06-09 | Denki Kagaku Kogyo Kk | Thermoconductive adhesive composition, thermoconductive sheet and thermoconductive laminated sheet |
| JP2005203735A (en) * | 2003-12-16 | 2005-07-28 | Fuji Polymer Industries Co Ltd | Thermally conductive composite sheet |
| JP4629475B2 (en) * | 2005-03-30 | 2011-02-09 | 株式会社カネカ | Composition for heat dissipation sheet and heat dissipation sheet obtained by curing the composition |
| JP2006328352A (en) * | 2005-04-28 | 2006-12-07 | Idemitsu Kosan Co Ltd | Insulating thermally-conductive resin composition, molded product, and method for producing the same |
| DE102005054904A1 (en) * | 2005-11-17 | 2007-05-24 | Wacker Polymer Systems Gmbh & Co. Kg | Process for the preparation of polyvinyl alcohol-stabilized latexes |
| JP5023489B2 (en) * | 2005-12-20 | 2012-09-12 | 横浜ゴム株式会社 | Water-based adhesive composition |
| JP5176878B2 (en) * | 2008-11-04 | 2013-04-03 | 横浜ゴム株式会社 | Thermally conductive emulsion |
-
2009
- 2009-02-17 JP JP2009033801A patent/JP5391718B2/en active Active
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