JP2010187268A - Glass package, piezoelectric vibrator, method for marking glass package, and oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a glass package which can be marked without taking time, and to provide a piezoelectric vibrator, a method for marking the glass package, and an oscillator. <P>SOLUTION: In a glass package 2, 3 made of a glass material, polarized glass is arranged at least on a part of the glass package 2, 3 and the polarized glass portion is irradiated with laser light. An incident direction of the laser light is set so that the laser light may be applied for irradiation from a direction approximately orthogonal to the face of the polarized glass, and a polarization direction of the laser light is approximately orthogonal to the polarization direction of the polarized glass. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a glass package, a piezoelectric vibrator, a glass package marking method, and an oscillator.

  2. Description of the Related Art In recent years, cellular phones and personal digital assistants use piezoelectric vibrators that use quartz as a time source, a timing source such as a control signal, and a reference signal source. Various piezoelectric vibrators of this type are known, and one of them is a surface-mount type piezoelectric vibrator. 2. Description of the Related Art A surface-mount type piezoelectric vibrator is generally known that has a two-layer structure type in which a piezoelectric vibrating piece is joined between a base substrate and a lid substrate from above and below. In this case, the piezoelectric vibrating piece is accommodated in a cavity (sealed chamber) formed between the base substrate and the lid substrate.

  In general, piezoelectric vibrators packaged with a base substrate and a lid substrate are marked on the surface of the package so that the product type, product number, date of manufacture, etc. can be easily recognized. (For example, see Patent Document 1).

JP 2007-201290 A

By the way, the base substrate and the lid substrate (components of the package) of the conventional piezoelectric vibrator are mainly made of resin or ceramic as in Patent Document 1, but recently a glass material is used. Glass packages are increasingly being adopted.
However, when a glass package is used, when laser light is irradiated to display a marking on the surface of the package, the laser light is transmitted through the glass package to the piezoelectric vibrating reed disposed in the cavity, and electrical characteristics such as frequency characteristics are applied. There is a problem that the characteristics are affected. For this reason, the surface of the glass package is subjected to a plating process, and laser marking is applied to the surface for marking. Therefore, when a glass package is employed, there is a problem that the marking process takes time.

  Accordingly, the present invention has been made in view of the above circumstances, and an object thereof is to provide a glass package, a piezoelectric vibrator, a glass package marking method, and an oscillator that can be marked without taking time and effort. To do.

In order to solve the above problems, the present invention provides the following means.
The glass package according to the present invention is configured such that, in a glass package made of a glass material, a polarizing glass is disposed at least in part, and the polarization direction of the polarizing glass and the polarization direction of the laser light are substantially orthogonal to each other. It is a feature.

  With this configuration, even when the polarizing glass is irradiated with the laser light, the laser light is transmitted into the glass package by setting the polarization direction of the laser light to be substantially orthogonal to the polarizing direction of the polarizing glass. There is no. Therefore, the laser beam can be irradiated without affecting the inside of the glass package. That is, it is possible to mark the glass package at high speed and at low cost without taking time and effort.

The glass package according to the present invention is characterized in that a marking by laser irradiation is applied to the surface of the polarizing glass.
With this configuration, information such as the product type, product number, and date of manufacture can be easily confirmed for each glass package, and the management efficiency of the product can be improved.

In addition, a piezoelectric vibrator according to the present invention includes the glass package described above and a piezoelectric vibrating piece housed in a cavity formed inside the glass package.
According to the piezoelectric vibrator according to the present invention, since a glass package with marking is used without trouble, information such as the product type, product number, and date of manufacture can be easily obtained for each piezoelectric vibrator. The product management efficiency of the piezoelectric vibrator can be improved.

  The glass package marking method according to the present invention is a glass package marking method in which a polarizing glass is disposed on at least a part of a glass package made of a glass material, and the laser light is irradiated to the polarizing glass portion. In this case, the incident direction of the laser light is set so as to irradiate from a direction substantially orthogonal to the surface of the polarizing glass, and the polarization direction of the laser light is substantially orthogonal to the polarization direction of the polarizing glass, It has the process of marking on the surface of a glass package.

  According to the marking method of the glass package which concerns on this invention, polarizing glass is distribute | arranged to at least one part of a glass package, and a laser beam is irradiated to the part of the said polarizing glass. At that time, the incident direction of the laser beam is set so as to irradiate from a direction substantially orthogonal to the plane of the polarizing glass, and the polarization direction of the laser beam is set to be approximately orthogonal to the polarization direction of the polarizing glass. Since the surface of the package can be marked, the glass package can be marked at a high speed and at a low cost without much effort.

  An oscillator according to the present invention is characterized in that the piezoelectric vibrator described above is electrically connected to an integrated circuit as an oscillator.

  In the oscillator according to the present invention, since the piezoelectric vibrator with the marking on the glass package and improved product management efficiency is used, the product management efficiency of the oscillator can be improved, and the product quality is stabilized. An oscillator can be provided.

  According to the glass package of the present invention, the laser light is transmitted into the glass package by setting the polarization direction of the laser light so as to be substantially orthogonal to the polarization direction of the polarization glass even when the polarization glass is irradiated with the laser light. There is nothing to do. Therefore, the laser beam can be irradiated without affecting the inside of the glass package. That is, it is possible to mark the glass package at high speed and at low cost without taking time and effort.

1 is an external perspective view of a piezoelectric vibrator in an embodiment of the present invention. It is sectional drawing which follows the AA line of FIG. FIG. 2 is an internal configuration diagram of the piezoelectric vibrator shown in FIG. 1, and is a view of a piezoelectric vibrating piece viewed from above with a lid substrate removed. It is a disassembled perspective view of the piezoelectric vibrator in the embodiment of the present invention. It is a flowchart which shows the flow at the time of manufacturing the piezoelectric vibrator in embodiment of this invention. FIG. 6 is a diagram illustrating a process for manufacturing a piezoelectric vibrator according to the flowchart illustrated in FIG. 5, and is a diagram illustrating a state in which a plurality of recesses are formed in a lid substrate wafer that is a base of a lid substrate. FIG. 6 is a diagram illustrating a process for manufacturing a piezoelectric vibrator according to the flowchart illustrated in FIG. 5, and is a diagram illustrating a state in which a bonding film and a routing electrode are patterned on the upper surface of a base substrate wafer. It is the elements on larger scale (perspective view) of FIG. FIG. 6 is a diagram illustrating a process for manufacturing a piezoelectric vibrator according to the flowchart illustrated in FIG. 5, in which the base substrate wafer and the lid substrate wafer are anodically bonded in a state where the piezoelectric vibrating piece is accommodated in the cavity. FIG. FIG. 6 is a diagram showing a step in manufacturing the piezoelectric vibrator along the flowchart shown in FIG. 5, and is a perspective view showing a state where laser marking is performed on the surface of the piezoelectric vibrator. It is a block diagram which shows the oscillator in embodiment of this invention.

Next, an embodiment of a piezoelectric vibrator according to the present invention will be described with reference to FIGS.
As shown in FIGS. 1 to 4, the piezoelectric vibrator 1 is formed in a box shape in which a base substrate 2 and a lid substrate 3 are laminated in two layers, and a piezoelectric element is formed in a cavity portion 16 formed inside. This is a surface-mount type piezoelectric vibrator in which the resonator element 4 is accommodated.
In FIG. 4, through electrodes 13 and 14 and through holes 24 and 25, which will be described later, are omitted for easy understanding of the drawing.

The piezoelectric vibrating piece 4 is an AT-cut type vibrating piece formed of a quartz piezoelectric material, and vibrates when a predetermined voltage is applied.
The piezoelectric vibrating reed 4 includes a quartz plate 17 processed into a plate having a substantially rectangular shape in plan view and a uniform thickness, a pair of excitation electrodes 5 and 6 disposed at positions facing both surfaces of the quartz plate 17, There are lead electrodes 19 and 20 electrically connected to the excitation electrodes 5 and 6, and mount electrodes 7 and 8 electrically connected to the lead electrodes 19 and 20. The mount electrode 7 is electrically connected to the side electrode 15 of the crystal plate 17 and is electrically connected to the mount electrode 7 formed on the surface on which the excitation electrode 6 is formed.

  Excitation electrodes 5 and 6, extraction electrodes 19 and 20, mount electrodes 7 and 8, and side electrode 15 are, for example, chromium (Cr), nickel (Ni), gold (Au), aluminum (Al), titanium (Ti), and the like. The conductive film is formed of a laminated film formed by combining some of these conductive films.

  The thus configured piezoelectric vibrating reed 4 is bump-bonded to the upper surface of the base substrate 2 using bumps 11 and 12 such as gold. More specifically, a pair of mount electrodes 7 and 8 are bump-bonded to bumps 11 and 12 formed on routing electrodes 9 and 10 (described later) patterned on the upper surface of the base substrate 2, respectively. Yes. As a result, the piezoelectric vibrating reed 4 is supported in a floating state by the thickness of the bumps 11 and 12 from the upper surface of the base substrate 2, and the mount electrodes 7 and 8 and the routing electrodes 9 and 10 are electrically connected to each other. Connected.

The lid substrate 3 is an insulating substrate formed of a glass material, for example, a polarizing glass in which a polarizing film S is embedded in soda lime glass, and the piezoelectric vibrating reed 4 is accommodated on the bonding surface side to which the base substrate 2 is bonded. A rectangular recess (cavity) 16 is formed. The recess 16 is a cavity recess 16 that becomes a cavity 16 that accommodates the piezoelectric vibrating reed 4 when the base substrate 2 and the lid substrate 3 are overlapped. The lid substrate 3 is anodically bonded to the base substrate 2 with the recess 16 facing the base substrate 2 side.
Here, the lid substrate 3 can shield light such as a laser irradiated on the surface 31 from the vertical direction. That is, the laser beam irradiated from the vertical direction on the surface 31 does not pass through the cavity 16, and the piezoelectric vibrating piece 4 disposed in the cavity 16 changes its electrical characteristics due to the influence of the laser beam. There is no.

  The base substrate 2 is a transparent insulating substrate made of a glass material, for example, soda lime glass, and is formed in a substantially plate shape with a size that can be superimposed on the lid substrate 3.

  In addition, a pair of through holes (through holes) 24 and 25 penetrating the base substrate 2 are formed in the base substrate 2. One ends of the through holes 24 and 25 are formed so as to face the cavity 16. Specifically, one through hole 24 is positioned on the mount electrodes 7 and 8 side of the mounted piezoelectric vibrating piece 4, and the other through hole 25 is on the opposite side of the piezoelectric vibrating piece 4 from the mount electrodes 7 and 8 side. It is formed to be located. The through holes 24 and 25 are penetrated in a substantially cylindrical shape so as to be parallel to the thickness direction of the base substrate 2. The through holes 24 and 25 may be formed in a tapered shape that gradually decreases or increases in diameter toward the lower surface of the base substrate 2, for example.

  In the pair of through holes 24 and 25, a pair of through electrodes 13 and 14 formed so as to fill the through holes 24 and 25 are formed. The through-electrodes 13 and 14 close the through-holes 24 and 25 to maintain airtightness in the cavity 16, and play a role of conducting the external electrodes 21 and 22, which will be described later, and the electrodes 9 and 10. Yes. Further, the gaps between the through holes 24 and 25 and the through electrodes 13 and 14 are completely closed using a glass frit material (not shown) having a thermal expansion coefficient substantially the same as that of the glass material of the base substrate 2. .

  On the upper surface side of the base substrate 2 (the bonding surface side to which the lid substrate 3 is bonded), a bonding film 23 for anodic bonding and a pair of lead-out electrodes 9 and 10 are formed of a conductive material (for example, aluminum, silicon, etc.). Are patterned. Among these, the bonding film 23 is formed along the periphery of the base substrate 2 so as to surround the periphery of the recess 16 formed in the lid substrate 3.

  The pair of lead-out electrodes 9, 10 electrically connect one of the pair of through-electrodes 13, 14 and the one mount electrode 7 of the piezoelectric vibrating reed 4, and The piezoelectric vibrating piece 4 is patterned so as to be electrically connected to the other mount electrode 8. Specifically, one lead-out electrode 9 is formed immediately above one through electrode 13 so as to be positioned on the mount electrodes 7 and 8 side of the piezoelectric vibrating piece 4. The other routing electrode 10 is routed along the piezoelectric vibrating reed 4 from a position adjacent to the one routing electrode 9 to the side facing the penetration electrode 13 on the base substrate 2, and then the other penetration electrode 14. It is formed so that it may be located just above.

  Bumps 11 and 12 are formed on the pair of routing electrodes 9 and 10, and the piezoelectric vibrating reed 4 is mounted using the bumps 11 and 12. As a result, one mount electrode 7 of the piezoelectric vibrating reed 4 is electrically connected to one through electrode 13 through one routing electrode 9, and the other mount electrode 8 is passed through the other routing electrode 10 to the other penetration electrode. The electrode 14 is electrically connected.

  In addition, external electrodes 21 and 22 that are electrically connected to the pair of through electrodes 13 and 14 are formed on the lower surface of the base substrate 2. That is, one external electrode 21 is electrically connected to the first excitation electrode 5 of the piezoelectric vibrating reed 4 through one through electrode 13 and one routing electrode 9. The other external electrode 22 is electrically connected to the second excitation electrode 6 of the piezoelectric vibrating reed 4 via the other through electrode 14 and the other routing electrode 10.

  When the piezoelectric vibrator 1 configured as described above is operated, a predetermined drive voltage is applied to the external electrodes 21 and 22 formed on the base substrate 2. As a result, a current can be passed through the excitation electrode including the first excitation electrode 5 and the second excitation electrode 6 of the piezoelectric vibrating piece 4 and can be vibrated at a predetermined frequency. The vibration can be used as a control signal timing source, a reference signal source, or the like.

  Next, a manufacturing method for manufacturing a plurality of piezoelectric vibrators 1 at a time using the base substrate wafer 40 and the lid substrate wafer 50 will be described with reference to the flowchart shown in FIG.

  First, the piezoelectric vibrating reed manufacturing step is performed to manufacture the piezoelectric vibrating reed 4 shown in FIGS. 2 to 4 (S10). Specifically, a quartz Lambert rough is first sliced at a predetermined angle to obtain a wafer having a constant thickness. Subsequently, the wafer is lapped and rough processed, and then mirror polishing such as polishing is performed to obtain a wafer having a constant thickness. Subsequently, after appropriate processing such as cleaning is performed on the wafer, a metal film is formed and patterned by photolithography, and the excitation electrodes 5 and 6, the extraction electrodes 19 and 20, and the mount electrode 7 are formed. , 8 and the side electrode 15 are formed. Thereby, a plurality of piezoelectric vibrating reeds 4 are produced.

  Next, a first wafer manufacturing process is performed in which the lid substrate wafer 50 to be the lid substrate 3 later is manufactured up to the state immediately before anodic bonding (S20). First, a soda-lime glass in which the polarizing film S is embedded is polished to a predetermined thickness and washed, and then, as shown in FIG. A wafer 50 is formed (S21). Next, a recess forming step is performed in which a plurality of cavity recesses 16 are formed in the matrix direction by etching or the like on the bonding surface of the lid substrate wafer 50 (S22). At this point, the first wafer manufacturing process is completed. In addition, when forming the recessed part 16, it processes so that the polarizing film S may not be exposed.

  Next, at the same time as or before or after the above process, a second wafer manufacturing process is performed in which the base substrate wafer 40 to be the base substrate 2 is manufactured up to the state immediately before anodic bonding (S30). First, after polishing and cleaning soda-lime glass to a predetermined thickness, a disk-shaped base substrate wafer 40 is formed by removing the outermost processed layer by etching or the like (S31). Next, a through electrode forming step for forming a plurality of pairs of through electrodes 13 and 14 on the base substrate wafer 40 is performed (S32).

Next, a conductive material is patterned on the upper surface of the base substrate wafer 40, and as shown in FIGS. 7 and 8, a bonding film forming step for forming the bonding film 23 is performed (S33), and each pair of through electrodes A routing electrode forming step for forming a plurality of routing electrodes 9 and 10 electrically connected to 13 and 14 respectively is performed (S34). In addition, the dotted line M shown in FIGS. 7 and 8 illustrates a cutting line that is cut in a cutting process to be performed later.
In particular, the through electrodes 13 and 14 are substantially flush with the upper surface of the base substrate wafer 40 as described above. Therefore, the routing electrodes 9 and 10 patterned on the upper surface of the base substrate wafer 40 are in close contact with the through electrodes 13 and 14 without generating a gap therebetween. Thereby, the electrical connection between one routing electrode 9 and one through electrode 13 and the electrical conductivity between the other routing electrode 10 and the other through electrode 14 can be ensured. At this point, the second wafer manufacturing process is completed.

  By the way, in FIG. 5, it is set as the process order which performs the routing electrode formation process (S34) after the bonding film formation process (S33). On the contrary, after the routing electrode formation process (S34), the bonding film formation is performed. The step (S33) may be performed, or both steps may be performed simultaneously. Regardless of the order of steps, the same effects can be obtained. Therefore, the process order may be changed as necessary.

  Next, a mounting process is performed in which the produced plurality of piezoelectric vibrating reeds 4 are joined to the upper surface of the base substrate wafer 40 via the routing electrodes 9 and 10, respectively (S40). First, bumps 11 and 12 are formed on the pair of routing electrodes 9 and 10 using gold wires, respectively.

  Then, after the base portion (mount electrodes 7 and 8) of the piezoelectric vibrating piece 4 is placed on the bumps 11 and 12, the piezoelectric vibrating piece 4 is pressed against the bumps 11 and 12 while heating the bumps 11 and 12 to a predetermined temperature. As a result, the piezoelectric vibrating reed 4 is mechanically supported by the bumps 11 and 12, and the mount electrodes 7 and 8 and the routing electrodes 9 and 10 are electrically connected. When the mount electrode 7 of the crystal plate 17 is bump-bonded on the bump 11 and the mount electrode 8 of the crystal plate 17 is bump-bonded on the bump 12, the crystal plate 17 is held in parallel with the base substrate 2. Will be supported. As a result, the piezoelectric vibrating reed 4 is supported in a state of floating from the upper surface of the base substrate wafer 40. At this time, the pair of excitation electrodes 5 and 6 of the piezoelectric vibrating reed 4 are in conduction with the pair of through electrodes 13 and 14, respectively.

  After the mounting of the piezoelectric vibrating reed 4 is completed, an overlaying step of overlaying the lid substrate wafer 50 on the base substrate wafer 40 is performed (S50). Specifically, both wafers 40 and 50 are aligned at the correct position while using a reference mark (not shown) as an index. As a result, the mounted piezoelectric vibrating reed 4 is housed in the cavity 16 surrounded by the wafers 40 and 50.

  After the superposition process, the two superposed wafers 40 and 50 are put into an anodic bonding apparatus (not shown), and a bonding process is performed in which a predetermined voltage is applied in a predetermined temperature atmosphere to perform anodic bonding (S60). Specifically, a predetermined voltage is applied between the bonding film 23 and the lid substrate wafer 50. As a result, an electrochemical reaction occurs at the interface between the bonding film 23 and the lid substrate wafer 50, and the two are firmly bonded and anodically bonded. Accordingly, the piezoelectric vibrating reed 4 can be sealed in the cavity 16, and the wafer body 60 shown in FIG. 9 in which the base substrate wafer 40 and the lid substrate wafer 50 are bonded can be obtained. In FIG. 9, in order to make the drawing easy to see, a state in which the wafer body 60 is disassembled is illustrated, and the bonding film 23 is not illustrated from the base substrate wafer 40. In addition, the dotted line M shown in FIG. 9 has shown the cutting line cut | disconnected by the cutting process performed later.

  By the way, when anodic bonding is performed, the through holes 24 and 25 formed in the base substrate wafer 40 are completely closed by the through electrodes 13 and 14, so that the airtightness in the cavity C is reduced. Will not be damaged through.

Then, after the above-described anodic bonding is completed, a conductive material is patterned on the lower surface of the base substrate wafer 40 so that the pair of external electrodes 21 and 22 electrically connected to the pair of through electrodes 13 and 14 respectively. A plurality of external electrode forming steps are formed (S70). By this step, the piezoelectric vibrating reed 4 sealed in the cavity 16 can be operated using the external electrodes 21 and 22.
In particular, when this step is performed, the through electrodes 13 and 14 are substantially flush with the lower surface of the base substrate wafer 40 as in the formation of the routing electrodes 9 and 10, so that the patterning is performed. The external electrodes 21 and 22 are in close contact with the through electrodes 13 and 14 without generating a gap or the like therebetween. Thereby, the continuity between the external electrodes 21 and 22 and the through electrodes 13 and 14 can be ensured.

  Next, a cutting process of cutting the bonded wafer body 60 along the cutting line M shown in FIG. 9 into pieces is performed (S80). As a result, the piezoelectric vibrating reed 4 is sealed in the cavity 16 formed between the base substrate 2 and the lid substrate 3 that are anodically bonded to each other, and the two-layer structure surface mount type piezoelectric vibration shown in FIG. A plurality of children 1 can be manufactured at a time.

  Thereafter, an internal electrical characteristic inspection is performed (S90). That is, the resonance frequency, resonance resistance value, drive level characteristic (excitation power dependence of resonance frequency and resonance resistance value), etc. of the piezoelectric vibrating reed 4 are measured and checked. Also check the insulation resistance characteristics. Then, an external appearance inspection of the piezoelectric vibrator 1 is performed to check dimensions and quality.

  The electrical property inspection and the appearance inspection are completed, and finally marking is performed on the piezoelectric vibrator 1 that has passed the inspection (S100). As shown in FIG. 10, the marking 70 irradiates the surface 31 of the lid substrate 3 with a laser beam from the vertical direction to laser-mark the product type, product number, date of manufacture, and the like. At this time, the polarizing film S is embedded in the lid substrate 3. The incident direction of the laser beam to be irradiated is set so as to irradiate from a direction substantially orthogonal to the surface of the polarizing film S, and the polarization direction of the irradiated laser light is approximately orthogonal to the polarization direction of the polarizing film S. The laser light is not transmitted into the cavity 16. That is, the piezoelectric vibrating piece 4 is not irradiated with laser light, and the electrical characteristics of the piezoelectric vibrating piece 4 are not affected. When the marking 70 on the piezoelectric vibrator 1 is completed, the manufacture of the piezoelectric vibrator 1 is finished.

  According to the present embodiment, the polarizing film S is embedded in the lid substrate 3, the polarization direction of the laser light is set so as to be substantially orthogonal to the polarization direction of the polarizing film S, and the laser light is not transmitted into the cavity 16. The surface 31 of the lid substrate 3 can be irradiated with laser light without affecting the inside of the cavity 16. That is, the marking 70 can be applied to the surface 31 of the lid substrate 3 at a high speed and at a low cost without any trouble.

  Thus, by marking 70 on the surface 31 of the lid substrate 3, information such as the product type, product number, and date of manufacture can be easily confirmed for each piezoelectric vibrator 1, and product management efficiency Can be improved.

(Oscillator)
Next, an embodiment of an oscillator according to the present invention will be described with reference to FIG.
As shown in FIG. 11, the oscillator 100 according to the present embodiment is configured such that the piezoelectric vibrator 1 is an oscillator electrically connected to the integrated circuit 101. The oscillator 100 includes a substrate 103 on which an electronic component 102 such as a capacitor is mounted. On the substrate 103, the integrated circuit 101 for the oscillator is mounted, and the piezoelectric vibrator 1 is mounted in the vicinity of the integrated circuit 101. The electronic component 102, the integrated circuit 101, and the piezoelectric vibrator 1 are electrically connected by a wiring pattern (not shown). Each component is molded with a resin (not shown).

In the oscillator 100 configured as described above, when a voltage is applied to the piezoelectric vibrator 1, the piezoelectric vibrating piece 4 in the piezoelectric vibrator 1 vibrates. This vibration is converted into an electric signal by the piezoelectric characteristics of the piezoelectric vibrating piece 4 and input to the integrated circuit 101 as an electric signal. The input electrical signal is subjected to various processes by the integrated circuit 101 and is output as a frequency signal. Thereby, the piezoelectric vibrator 1 functions as an oscillator.
Further, by selectively setting the configuration of the integrated circuit 101, for example, an RTC (real-time clock) module or the like according to a request, the operation date and time of the device and the external device in addition to a single-function oscillator for a clock, etc. A function for controlling the time, providing a time, a calendar, and the like can be added.

  As described above, according to the oscillator 100 of the present embodiment, by using the piezoelectric vibrator 1 in which information such as the product type, product number, and date of manufacture is marked on the surface 31 of the lid substrate 3, the oscillator 100 product management efficiency can be improved.

In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, in the above embodiment, a piezoelectric vibrating piece using an AT vibrating piece (thickness sliding vibrating piece) has been described as an example. However, the piezoelectric vibrating piece using a tuning fork type piezoelectric vibrating piece may be used. .

In the above embodiment, the base substrate and the lid substrate are anodically bonded via the bonding film, but the present invention is not limited to anodic bonding. However, anodic bonding is preferable because both substrates can be bonded firmly.
Moreover, in the said embodiment, although the piezoelectric vibrating piece was bump-bonded, it is not limited to bump bonding. For example, the piezoelectric vibrating piece may be bonded with a conductive adhesive. However, by bonding the bumps, the piezoelectric vibrating piece can be lifted from the upper surface of the base substrate, and a minimum vibration gap necessary for vibration can be secured naturally. Therefore, it is preferable to perform bump bonding.
Furthermore, in the above embodiment, the description has been made using the configuration in which the polarizing film is embedded in the lid substrate. Good. Further, the polarization treatment may be performed not on the lid substrate side but on the base substrate side.

  DESCRIPTION OF SYMBOLS 1 ... Piezoelectric vibrator 2 ... Base board | substrate (glass package) 3 ... Lid board | substrate (glass package) 4 ... Piezoelectric vibrating piece 16 ... Cavity 31 ... Surface of lid board | substrate (surface of polarizing glass) 70 ... Marking

Claims (5)

In a glass package made of glass material,
A glass package characterized in that polarizing glass is disposed at least in part, and the polarizing direction of the polarizing glass and the polarizing direction of the laser light are substantially orthogonal.   The glass package according to claim 1, wherein a marking by laser irradiation is applied to a surface of the polarizing glass. The glass package according to claim 1 or 2,
A piezoelectric vibrator comprising: a piezoelectric vibrating piece housed in a cavity formed inside the glass package. A glass package marking method in which polarizing glass is arranged on at least a part of a glass package made of a glass material,
When irradiating the portion of the polarizing glass with laser light, the incident direction of the laser light is set so as to irradiate from a direction substantially perpendicular to the surface of the polarizing glass, and the polarization direction of the laser light is the polarization direction of the polarizing glass. A method for marking a glass package, comprising a step of marking the surface of the glass package so as to be substantially orthogonal to the surface.   An oscillator comprising the piezoelectric vibrator according to claim 3 electrically connected to an integrated circuit as an oscillator.

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