JP2010186963A - Thermoelectric module and thermoelectric device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoelectric module which has excellent thermal conductivity and excellent reliability, and to provide a thermoelectric device using the thermoelectric module. <P>SOLUTION: The thermoelectric module has a P-type thermoelectric element 21, an N-type thermoelectric element 22, a first electrode plate 23, a second electrode plate 24, a first coating film 25, a second coating film 26, an element holder 27, and a seal material 28. The first coating film 25 is formed on the first electrode plate 23, and the second coating film 26 is provided on the second electrode plate 26. Thus, the thermoelectric module, which has the excellent thermal conductivity and excellent reliability, is provided by using the coating films as insulating plates formed on the electrodes. The thermoelectric device uses the thermoelectric module. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a thermoelectric module including a thermoelectric element and a thermoelectric device using the same.

  Conventionally, a thermoelectric element using a thermoelectric effect has been used as, for example, a local cooling device in a device. The thermoelectric element generates a temperature gradient such that, for example, an electric current is passed through a thermoelectric material to generate a heat flow, one end is cooled, and the other end is heated. Since such a temperature gradient can generate a heat flow, it is possible to remove heat well from the object to be cooled. As such a thermoelectric element, a P-type thermoelectric element and an N-type thermoelectric element are known. For example, as shown in Patent Document 1, a configuration in which a P-type thermoelectric element and an N-type thermoelectric element are alternately arranged is also known. ing.

  A conventional thermoelectric module 100 is shown in FIG. The thermoelectric module 100 includes a P-type thermoelectric element 121, an N-type thermoelectric element 122, a first electrode plate 123, a second electrode plate 124, and heat conducting members 125 and 126. The heat conducting members 125 and 126 insulate the thermoelectric elements. Conventionally, as the heat conducting members (insulating plates) 125 and 126, plate-like members such as ceramics and plate-like members made of plastic having insulation properties have been used.

JP 2003-231825 A

  By the way, although it is preferable to form the heat conductive member as shown in FIG. 3 thin from the viewpoint of the efficiency of heat conduction, there is a limit to reducing the thickness from the viewpoint of mechanical strength and the like. From that, it had to use a very thick thing.

  Moreover, it may be damaged by stress due to an offset load or the like, or a mechanical impact, and there is a problem in terms of reliability.

  This invention is made | formed in view of the said situation, Comprising: It aims at providing the thermoelectric module provided with favorable thermal conductivity and favorable reliability, and a thermoelectric apparatus using the same.

In order to achieve the above object, the thermoelectric element according to the first aspect of the present invention is:
At least one thermoelectric element;
An electrode provided on the thermoelectric element;
And a coating film formed from an insulating material so as to cover the electrode.

  A plurality of the thermoelectric elements may be provided, and may further include a holding unit that holds the plurality of thermoelectric elements.

  The coating film may be provided so as to cover only the electrode.

  The coating film may include at least one of ceramic and alumina.

The thermoelectric element comprises a P-type thermoelectric element and an N-type thermoelectric element,
The P-type thermoelectric element and the N-type thermoelectric element may be alternately connected via the electrode.

In order to achieve the above object, the thermoelectric device according to the second aspect of the present invention provides:
A thermoelectric module according to a first aspect;
And a portion to be cooled that is cooled by the thermoelectric module.

  You may further provide at least any one of a heat sink and a fan.

  ADVANTAGE OF THE INVENTION According to this invention, by using a coating film as an insulating board formed on an electrode, a thermoelectric module provided with favorable thermal conductivity and favorable reliability, and a thermoelectric apparatus using the same can be provided.

It is a figure which shows the structural example of the thermoelectric apparatus which concerns on embodiment. It is a figure which shows the structural example of a thermoelectric module. It is a figure which shows the conventional thermoelectric module.

  A thermoelectric module and a thermoelectric device using the same according to an embodiment of the present invention will be described with reference to the drawings.

  A thermoelectric device 10 according to an embodiment is shown in FIG. A thermoelectric module 20 of the thermoelectric device 10 is shown in FIG. As shown in FIG. 1, the thermoelectric device 10 includes a thermoelectric module 20, a cooled part 11, a heat absorbing member 12, a heat sink 13, a fan 14, and a controller 15. In the thermoelectric device 10 of the present embodiment, heat generated from the cooled part 11 is removed by the thermoelectric module 20 or the like.

  As shown in FIGS. 1 and 2, the thermoelectric module 20 includes a P-type thermoelectric element 21, an N-type thermoelectric element 22, a first electrode plate 23, a second electrode plate 24, and a first coating film. 25, a second coating film 26, an element holder 27, and a sealing material 28.

  The P-type thermoelectric element 21 is made of a P-type thermoelectric material such as B4C / B9C. One end (for example, the lower end shown in FIG. 2) of the P-type thermoelectric element 21 is connected to the first electrode plate 23, and the other end (for example, the upper end shown in FIG. 2) is connected to the second electrode plate 24. ing.

  The N-type thermoelectric element 22 is made of an N-type thermoelectric material such as SiGe / Si. One end (for example, the lower end shown in FIG. 2) of the N-type thermoelectric element 22 is connected to the second electrode plate 24, and the other end (for example, the upper end shown in FIG. 2) is connected to the first electrode plate 23. ing.

  In the present embodiment, the P-type thermoelectric elements 21 and the N-type thermoelectric elements 22 are alternately arranged and are connected by the first electrode plate 23 and the second electrode plate 24, respectively. Specifically, one end of the P-type thermoelectric element 21 is connected to one end of the adjacent N-type thermoelectric element 22 via the first electrode plate 23, and the other end of the P-type thermoelectric element 21 is connected to another adjacent one. The other end of the N-type thermoelectric element 22 is connected via the second electrode plate 24. When a current is passed through the P-type thermoelectric element 21 and the N-type thermoelectric element 22 connected in series in this way, an endothermic phenomenon occurs in the region where the first electrode plate 23 is provided, and the second electrode plate In the region where 24 is provided, a heat generation phenomenon occurs. Due to this phenomenon, a temperature gradient is generated, and heat can be transferred from the low temperature side (first electrode plate 23 side) to the high temperature side (second electrode plate 24 side).

  The first electrode plate 23 is made of a conductive material, and is installed at one end of the P-type thermoelectric element 21 and one end of the N-type thermoelectric element 22 (for example, the lower end shown in FIG. 2). The P-type thermoelectric element 21 and the N-type thermoelectric element 22 are electrically connected by the first electrode plate 23. A first coating film 25 is formed on the first electrode plate 23. In this embodiment, since the to-be-cooled part 11 is cooled by the thermoelectric module 20, the first electrode plate 23 is on the high temperature side (heat generation side).

  The second electrode plate 24 is made of a conductive material, and is installed at the other end of the P-type thermoelectric element 21 and the other end of the N-type thermoelectric element 22 (for example, the upper end shown in FIG. 2). The P-type thermoelectric element 21 and the N-type thermoelectric element 22 are electrically connected by the second electrode plate 24. A second coating film 26 is formed on the second electrode plate 24. While the first electrode plate 23 is on the high temperature side, the second electrode plate 24 is on the low temperature side (cooling side).

  The first coating film 25 is a film mainly composed of an insulating material, such as ceramic or alumina, and is formed on the first electrode plate 23. The first coating film 25 is formed by applying a paint in which ceramic, alumina, or the like is mixed in a predetermined solvent.

  Similar to the first coating film 25, the second coating film 26 is a film mainly composed of an insulating material, for example, ceramic, alumina, etc., and is formed on the second electrode plate 24. The second coating film 26 is formed by coating.

  In the present embodiment, the first coating film 25 and the second coating film 26 are formed by applying a paint mainly composed of an insulating material such as ceramic or alumina. Accordingly, unlike the conventional configuration using a plate made of plastic or the like, it can be formed thin and the thermal conductivity can be increased. For example, conventionally, the heat conductive sheet used as the heat conductive members 125 and 126 shown in FIG. 3 has a thickness of about 0.2 mm to 0.5 mm, and the ceramic plate has a thickness of about 0.2 mm to 1.0 mm. It was the cause of lowering thermal conductivity. On the other hand, in this invention, since it is a coating film and is thickness of about 20 micrometers-100 micrometers, thermal conductivity can be improved.

  Further, the first coating film 25 and the second coating film 26 are formed only on the first electrode plate 23 and the second electrode plate 24, respectively. Thereby, unlike the heat conductive member installed over several electrode plates as shown in FIG. 3, it is possible to improve mechanical impact strength. In addition, since the coating film is formed for each electrode plate in this way, the coating film itself can be formed thin as long as the insulating property is maintained.

  The element holder 27 is formed of an insulating material, and for example, the planar shape is formed in a comb shape or the like. The element holder 27 is provided between the P-type thermoelectric element 21 and the N-type thermoelectric element 22 and holds the P-type thermoelectric element 21 and the N-type thermoelectric element 22. In the present embodiment, as described above, the coating film is not formed over the plurality of electrode plates, and the coating film is formed for each electrode plate. Therefore, by providing the element holder 27, the P-type thermoelectric element 21 is provided. And the N-type thermoelectric element 22 can be prevented from contacting each other and the thermoelectric elements can be insulated from each other.

  The sealing material 28 is made of an insulating resin or the like, and is formed in the peripheral region of the thermoelectric module 20.

  The part to be cooled 11 is one that removes the generated heat well by being cooled by the thermoelectric module 20 or the like, and is, for example, a CPU (Central Processing Unit) of a computer. A heat absorbing member 12 is provided at one end of the cooled portion 11.

  The heat absorbing member 12 is a plate-like member formed from a material having high thermal conductivity, such as copper or aluminum. The heat absorbing member 12 is provided between the cooled part 11 and the thermoelectric module 20, and transfers heat generated from the cooled part 11 to the thermoelectric module 20.

  The heat sink 13 is made of a material having high thermal conductivity, such as copper or aluminum, and includes a plurality of fins. The heat sink 13 has a function of lowering the temperature by dissipating the heat of the thermoelectric module 20.

  The fan 14 is provided to face the fins of the heat sink 13. By increasing the contact area of air to the heat sink 13 by the fan 14, the heat absorption effect and the heat dissipation effect of the P-type thermoelectric element 21 and the N-type thermoelectric element 22 can be enhanced.

  The control unit 15 includes a predetermined control device, and controls the amount of current that flows through the P-type thermoelectric element 21 and the N-type thermoelectric element 22 in the thermoelectric module 20.

  In the thermoelectric device 10 of the present embodiment, the first coating film 25 and the second coating film 26 in the thermoelectric module 20 are formed by applying a paint mainly composed of ceramic, alumina, or the like. Thereby, unlike the structure using plate-shaped members, such as a plastic, a film | membrane can be formed thinly and it becomes possible to improve thermal conductivity. Further, the first coating film 25 and the second coating film 26 are formed only on the first electrode plate 23 and the second electrode plate 24, respectively. This makes it possible to improve the mechanical impact resistance unlike a configuration in which a single heat conduction plate is provided across a plurality of electrode plates. Further, in the present embodiment, by providing the element holder 27, it is possible to satisfactorily insulate the thermoelectric elements, and it is possible to further improve the mechanical impact resistance. Thus, according to this embodiment, by using a coating film as an insulating plate formed on an electrode, a thermoelectric module having good thermal conductivity and good reliability and a thermoelectric device using the same are provided. Can do.

The present invention is not limited to the above-described embodiments, and various modifications and applications are possible.
For example, in the above-described embodiment, a configuration in which the P-type thermoelectric elements 21 and the N-type thermoelectric elements 22 are alternately arranged and the respective thermoelectric elements are connected by the first electrode plate 23 and the second electrode plate 24 is an example. However, the present invention is not limited to this, and only the P-type thermoelectric element 21 or the N-type thermoelectric element 22 may be used, or a configuration in which any one of the thermoelectric elements is provided may be used.

  Furthermore, in the above-described embodiment, the configuration in which the heat sink and the fan are provided in order to cool the thermoelectric module 20 has been described as an example. However, the configuration is not limited thereto, and only one of them may be used. Further, it is possible to perform cooling by a cooling means other than a heat sink, a fan or the like.

  Moreover, although the embodiment mentioned above gave and demonstrated the structure which cools the to-be-cooled part 11 with the thermoelectric module 20, it is not restricted to this. For example, it is possible to heat an object provided at a position corresponding to the part to be cooled by flowing an electric current in the reverse direction. Furthermore, although the Peltier effect is used in the thermoelectric module of the present embodiment, the present invention is not limited to this, and the Seebeck effect may be used. For example, a thermoelectromotive force may be generated in the thermoelectric module by heating one end of the thermoelectric module and cooling the other end (or a temperature lower than the one end).

DESCRIPTION OF SYMBOLS 10 Thermoelectric device 11 Cooled part 12 Heat absorption member 13 Heat sink 14 Fan 15 Control part 20 Thermoelectric module 21 P-type thermoelectric element 22 N-type thermoelectric element 23 1st electrode plate 24 2nd electrode plate 25 1st coating film 26 1st 2 coating film 27 element holder 28 sealing material

Claims (7)

At least one thermoelectric element;
An electrode provided on the thermoelectric element;
A thermoelectric module comprising: a coating film formed of an insulating material so as to cover the electrode.   The thermoelectric module according to claim 1, further comprising a holding unit that holds a plurality of the thermoelectric elements and holds the plurality of thermoelectric elements.   The thermoelectric module according to claim 1, wherein the coating film is provided so as to cover only the electrode.   The thermoelectric module according to claim 1, wherein the coating film includes at least one of ceramic and alumina. The thermoelectric element comprises a P-type thermoelectric element and an N-type thermoelectric element,
The thermoelectric module according to any one of claims 1 to 4, wherein the P-type thermoelectric element and the N-type thermoelectric element are alternately connected via the electrode. The thermoelectric module according to any one of claims 1 to 5,
A thermoelectric device comprising: a portion to be cooled that is cooled by the thermoelectric module.   The thermoelectric device according to claim 6, further comprising at least one of a heat sink and a fan.

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