JP2010186777A - Method of manufacturing electric circuit substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electric circuit substrate, in which a connector can be precisely positioned. <P>SOLUTION: The method of manufacturing the electric circuit substrate includes the steps of: preparing the substrate having a plurality of pads provided on an upper surface, and the connector having a body and a plurality of leads provided on a rear surface of the body; arranging the connector on the upper surface of the substrate, so that the plurality of leads are arranged on the plurality of corresponding pads with bonding materials interposed; and bonding the plurality of leads to the plurality of corresponding pads by heating and fusing the bonding materials. In the step of bonding them, the connector is positioned at a target position by making a connector-side positioning part abut on a substrate-side positioning part through self-alignment effect. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electric circuit board, and more particularly to a method for manufacturing an electric circuit board that can accurately position a connector.

  When a connector is surface-mounted on an electric circuit board, conventionally, a lead provided on the back surface of the connector is provided on the electric circuit board after inserting the connector positioning pins into the positioning holes provided on the electric circuit board. In other words, a bonding method using a bonding material has been used (see, for example, Patent Document 1).

JP 2006-310567 A

  In this conventional method, when the positioning pin of the connector comes to the center of the positioning hole provided in the electric circuit board, the position of the positioning pin and the positioning hole is set so that the connector is arranged at the target position on the electric circuit board. Was stipulated. In addition, in order to prevent interference between the positioning pin and the positioning hole due to the accumulation of the dimensional tolerances of the diameter, position and pitch of the positioning pin and the positioning hole, it is necessary to make the positioning hole diameter larger than the positioning pin. . For this reason, when the connector is disposed at a target position on the electric circuit board, a gap is generated between the positioning pin and the side wall of the positioning hole around the entire periphery.

  Further, when the lead on the connector side is joined to the pad on the electric circuit board side using the joining material, the joining material is heated and melted, so that the surface tension due to the heated and melted joining material acts on the lead. For this reason, when the connector is mounted at the target position, the surface tension acts on the lead, so that the positioning pin of the connector freely moves in the gap between the side wall of the positioning hole. As a result, there has been a problem that the positioning pin is displaced from the center of the positioning hole, and the connector is accordingly displaced from the target position.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method of manufacturing an electric circuit board that can accurately position a connector.

According to a first aspect of the present invention, there is provided a method of manufacturing an electric circuit board including a board and a connector provided on the upper surface of the board, wherein the connector is used for fitting fitting parts. A step of preparing the substrate having a plurality of pads provided on an upper surface and the connector having a main body portion and a plurality of leads provided on a back surface of the main body portion, and the plurality of leads correspond to each other. A step of disposing the connector on the top surface of the substrate such that the connector is disposed on the plurality of pads via a bonding material; and the plurality of leads corresponding to the plurality of pads by heating and melting the bonding material, respectively. A step of providing a board-side positioning portion on the substrate, a connector-side positioning portion on the connector, and in the step of arranging, Each de, without contact with the corresponding said pads adjacent to the pad, arranged from the center of the corresponding pad at a position shifted in a first direction within the substrate parallel to an upper plane,
In the bonding step, the connector is moved in the plane parallel to the upper surface of the substrate by a self-alignment effect of moving the plurality of leads to the center side of the corresponding plurality of pads by heating and melting the bonding material. The connector is positioned at a target position by moving in a second direction opposite to the direction 1 and applying the connector side positioning portion to the board side positioning portion.

  A method for manufacturing an electric circuit board according to a second invention comprises a board and a connector provided on the upper surface of the board, and the connector is a method for manufacturing an electric circuit board used for fitting fitting parts, A step of preparing the substrate having a plurality of pads provided on an upper surface and the connector having a main body portion and a plurality of leads provided on a back surface of the main body portion; A step of arranging the connector on the upper surface of the substrate such that the connector is arranged on a plurality of pads via a bonding material; and bonding the plurality of leads to the corresponding pads by heating and melting the bonding material. In the step of providing a board-side positioning portion on the substrate, providing a connector-side positioning portion on the connector, and joining the connectors. The connector is positioned at a target position by pressing the connector in a specific direction in a plane parallel to the upper surface of the substrate in a heated and melted state, and hitting the connector side positioning portion against the substrate side positioning portion. It is a feature.

  According to a third aspect of the present invention, there is provided a method of manufacturing an electric circuit board comprising: a board and a plurality of connectors provided on the upper surface of the board; and the plurality of connectors for fitting together a plurality of fitting portions of fitting parts, respectively. A method of manufacturing an electric circuit board to be used, wherein the plurality of connectors each having the board having a plurality of pads provided on an upper surface, and the body part and a plurality of leads provided on the back surface of the body part. The plurality of connectors are disposed on the upper surface of the substrate so that the plurality of leads respectively possessed by the plurality of connectors are respectively disposed on the corresponding pads via a bonding material. Corresponding to the step and the plurality of fitting portions of the fitting component, or the portions corresponding to the plurality of fitting portions of the simulated component having the same shape as the fitting component. In a state of fitted respectively to the number of the connector and is characterized in that it comprises a step of joining each of the plurality of pads corresponding to said plurality of leads by heating and melting of the bonding material.

  According to the present invention, the connector can be accurately positioned.

FIG. 3 is a process diagram illustrating a method for manufacturing the electric circuit board according to the first embodiment. FIG. 3 is a process diagram illustrating a method for manufacturing the electric circuit board according to the first embodiment. FIG. 3 is a process diagram illustrating a method for manufacturing the electric circuit board according to the first embodiment. FIG. 3 is a process diagram illustrating a method for manufacturing the electric circuit board according to the first embodiment. FIG. 3 is a process diagram illustrating a method for manufacturing the electric circuit board according to the first embodiment. FIG. 3 is a process diagram illustrating a method for manufacturing the electric circuit board according to the first embodiment. It is a perspective view which shows the fitting component of the electric circuit board manufactured by the method which concerns on Embodiment 1, and the electronic device connected to it. FIG. 8 is a plan view corresponding to FIG. 7. It is process drawing which shows the characteristics of the manufacturing method of the electric circuit board | substrate which concerns on a 1st comparative example. It is process drawing which shows the characteristics of the manufacturing method of the electric circuit board | substrate which concerns on a 1st comparative example. It is sectional drawing parallel to the board | substrate upper surface which shows the state which the positioning pin of the connector which concerns on a 2nd comparative example contacted the side wall of the positioning hole. FIG. 6 is a process diagram showing a method for manufacturing an electric circuit board according to Embodiment 2. FIG. 6 is a process diagram showing a method for manufacturing an electric circuit board according to Embodiment 2. FIG. 6 is a process diagram showing a method for manufacturing an electric circuit board according to Embodiment 2. FIG. 6 is a process diagram showing a method for manufacturing an electric circuit board according to Embodiment 2. FIG. 10 is a plan view showing a state in which a connector is positioned by a stopper according to a modification of the second embodiment. FIG. 10 is a plan view showing a state in which a connector is positioned by a stopper according to a modification of the second embodiment. FIG. 10 is a plan view showing a state in which a connector is positioned by a stopper according to a modification of the second embodiment. FIG. 10 is a plan view showing a state in which a connector is positioned by a stopper according to a modification of the second embodiment. FIG. 6 is a process diagram showing a method for manufacturing an electric circuit board according to Embodiment 3. FIG. 10 is a process diagram showing a method for manufacturing an electric circuit board according to a fourth embodiment. FIG. 9 is a process diagram showing a method for manufacturing an electric circuit board according to a fifth embodiment.

Embodiment 1 FIG.
A method for manufacturing the electric circuit board according to the first embodiment will be described. 1 to 6 are process diagrams showing the method of manufacturing the electric circuit board according to the first embodiment. 3 is a cross-sectional view taken along the line AA ′ of FIG. FIG. 5 is a cross-sectional view taken along the line BB ′ of FIG.

  First, as shown in FIG. 1, two connectors 12 are prepared for fitting two fitting portions of a substrate 10 and a fitting component (not shown). A plurality of pads 14 are provided on the upper surface of the substrate 10. The substrate 10 is provided with four positioning holes 16. A plurality of leads 20 and two positioning pins 22 are provided on the back surface of the main body portion 18 of each connector 12. The positioning pin 22 has a smaller inner diameter than the positioning hole 16. Then, when each positioning pin 22 provided on the connector 12 is applied to the side wall at a predetermined position in the corresponding positioning hole 16, the board 10 and the board 10 are arranged so that each connector 12 comes to a target position on the board 10. Two connectors 12 are designed.

  Next, as shown in FIGS. 2 and 3, the two connectors 12 are arranged on the upper surface of the substrate 10. At this time, the plurality of leads 20 respectively possessed by the two connectors 12 are respectively arranged on the corresponding pads 14 via the solder (joining material) 24. The plurality of leads 20 are arranged so as to be largely shifted in the direction a from the center of the corresponding pad 14 in a plane parallel to the upper surface of the substrate 10 without contacting the pad 14 adjacent to the corresponding pad 14. Further, the positioning pins 22 of the two connectors 12 are inserted into the corresponding positioning holes 16. At this time, the two connectors 12 greatly deviate in the direction a from the target position indicated by the broken line frame in FIG.

  Next, as shown in FIGS. 4 and 5, the plurality of leads 20 are joined to the corresponding plurality of pads 14 by heating and melting the solder 24, respectively. At this time, the surface tension of the heated and melted solder 24 acts on the lead 20, thereby producing a self-alignment effect in which the lead 20 moves to the center side of the corresponding pad 14. Then, the two connectors 12 are respectively moved in the b direction opposite to the a direction by the self-alignment effect. Then, the positioning pins 22 of the respective connectors 12 are brought into contact with the side walls 26 at the predetermined positions in the corresponding positioning holes 16. FIG. 6 is a cross-sectional view parallel to the upper surface of the substrate showing a state where the positioning pins according to the first embodiment are applied to the side walls of the positioning holes. The cross sections of the positioning holes 16 and the positioning pins 22 parallel to the top surface of the substrate 10 are both circular. The positioning pin 22 is applied to the side wall 26 at one point. In this way, each connector 12 is stopped at the target position.

  When the connector is stopped, the lead 20 is slightly displaced in the a direction from the center side of the corresponding pad 14. For this reason, the surface tension of the solder 24 heated and melted in the b direction remains on the lead 20. In this state, the solder 24 is hardened. Thus, an electric circuit board is manufactured.

  FIG. 7 is a perspective view showing an electric circuit board manufactured by the method according to the first embodiment and a fitting part of an electronic device connected to the electric circuit board. FIG. 8 is a plan view corresponding to FIG.

  The two connectors 12 are each provided with a fitting port 28. By fitting the two fitting portions 32 of the fitting component 30 of the electronic device (not shown) into the fitting ports 28 of the two connectors 12, the electronic device and the electric circuit board 10 are electrically connected. . Here, the width of the two fitting portions 32 of the fitting component 30 is 13.20 mm, respectively, whereas the width of the fitting port 28 of each connector 12 is 13.40 mm. That is, the allowable deviation width when fitting each fitting portion 32 to the corresponding fitting port 28 is only 0.1 mm per side.

  Below, the effect of Embodiment 1 is demonstrated, comparing with a 1st comparative example. 9 and 10 are process diagrams showing characteristics of the method of manufacturing the electric circuit board according to the first comparative example. 10 is a cross-sectional view taken along the line CC ′ of FIG.

  The board 34 and the two connectors 36 according to the first comparative example are designed so that the connector 36 comes to the target position when each positioning pin 22 is located at the center in the corresponding positioning hole 16. For this reason, as shown in FIGS. 9 and 10, when each lead 20 is joined to the corresponding pad 14, each positioning pin 22 freely moves within the clearance of the corresponding positioning hole 16 by the self-alignment effect. To do. As a result, the positioning pins 22 of the two connectors 36 are displaced from the centers in the corresponding positioning holes 16. In this case, the two connectors 36 are displaced from the target positions indicated by the broken line frames in FIG.

  Accordingly, it is difficult to accurately fit both the two fitting portions 32 of the fitting component 30 to the corresponding fitting ports 28 without shifting the fitting parts 32 by more than the allowable deviation width described above. For this reason, the fitting component 30 cannot be accurately fitted to the connector 36, and a problem arises in the reliability of electrical connection between the fitting component 30 and the connector 36.

  Further, if a single connector having two fitting openings 28 is prepared, the problem caused by the displacement of the connector does not occur in the first place, and it is easy to accurately fit the fitting component 30 having the two fitting portions 32. is there. However, to prepare such a connector, an initial investment in a mold or the like is newly required.

  On the other hand, in the first embodiment, the two connectors 12 are respectively moved in the b direction by the self-alignment effect, and the positioning pins 22 of the respective connectors 12 are placed on the side walls 26 at the predetermined positions in the corresponding positioning holes 16. I guess. Thereby, each connector 12 is stopped at the target position. For this reason, each connector 12 can be positioned accurately. Accordingly, the two fitting portions 32 of the fitting component 30 can be accurately fitted to the two fitting ports 28, respectively, despite the above-described allowable deviation width. This eliminates the need for a new initial investment in a mold or the like.

  Subsequently, the effect of the first embodiment will be described in comparison with the second comparative example. FIG. 11 is a cross-sectional view parallel to the upper surface of the substrate showing a state in which the positioning pins of the connector according to the second comparative example are in contact with the side wall of the positioning hole. The cross section of the positioning pin 38 parallel to the upper surface of the substrate 10 is rectangular.

  Accordingly, when the connector 12 is moved in the direction b for positioning and the positioning pin 38 is brought into contact with the side wall 26 of the positioning hole 16, only one of the first corner 40 and the second corner 42 may hit. , Both may win. Further, the first corner 40 and the second corner 42 hit the side wall 26 at a position in a direction different from the b direction that is the moving direction from the center of the positioning pin 22. For this reason, it is difficult to smoothly move the positioning pin 22 to the position where the connector is accurately positioned.

  On the other hand, in the first embodiment, the cross section of the positioning pin 22 parallel to the upper surface of the substrate 10 is circular. For this reason, when the connector 12 is moved in the direction b, the positioning pin 22 is an outer peripheral surface 44 having a circular cross section and contacts the side wall 26 having a circular cross section. For this reason, the positioning pin 22 can be smoothly moved to the position where the connector 12 is accurately positioned. Therefore, the connector 12 can be accurately positioned at the target position.

  In the first embodiment, the two connectors 12 are positioned, but the number of connectors 12 to be positioned may not be two. The number of connectors 12 to be positioned can be selected so as to correspond to the number of fitting portions 32 of the fitting component 30. For example, if there is one fitting portion 32, one connector 12 may be positioned, and if there are three fitting portions 32, three connectors 12 may be positioned. Regardless of the number of connectors 12 to be positioned, the effect of accurately positioning the connectors 12 at the target position can be obtained. The same applies to other embodiments.

  In the first embodiment, the lead 20 is joined to the pad 14 by heating and melting the solder 24, but a conductive adhesive may be used instead of the solder 24. Even if a conductive adhesive is used, the same effect can be obtained because a self-alignment effect is produced. The same applies to other embodiments.

Embodiment 2. FIG.
A method for manufacturing an electric circuit board according to the second embodiment will be described. 12 to 15 are process diagrams showing the method of manufacturing the electric circuit board according to the second embodiment. 13 is a cross-sectional view taken along the line AA ′ of FIG. 15 is a cross-sectional view taken along the line BB ′ of FIG.

  First, a substrate 48 provided with a stopper 46 and two connectors 50 are prepared. Then, when the main body portion 18 of the connector 50 is brought into contact with the corresponding stopper 46 at a predetermined position in a plane parallel to the upper surface of the board 48, the board 48 and the two connectors are arranged so that each connector 50 comes to the target position. 50 is designed.

  Next, as shown in FIGS. 12 and 13, the two connectors 50 are arranged on the upper surface of the substrate 48. At this time, the plurality of leads 20 respectively possessed by the two connectors 50 are respectively disposed on the corresponding pads 14 via the solder (joining material) 24. Each of the plurality of leads 20 is arranged so as to be largely shifted in the a direction within a plane parallel to the upper surface of the substrate 48 from the corresponding pad 14 without contacting the pad 14 adjacent to the corresponding pad 14. At this time, the two connectors 50 are greatly displaced in the direction a from the target position indicated by the broken line frame in FIG.

  Next, as shown in FIGS. 14 and 15, the plurality of leads 20 are bonded to the corresponding plurality of pads 14 by heating and melting the solder 24, respectively. At this time, the surface tension of the heated and melted solder 24 acts on the lead 20, thereby producing a self-alignment effect in which the lead 20 moves to the center side of the corresponding pad 14. Then, due to the self-alignment effect, the two connectors 50 are respectively moved in the b direction opposite to the a direction. Then, the main body portion 18 of each connector 50 is brought into contact with the stopper 46 at the above-described predetermined position in a plane parallel to the upper surface of the substrate 48. In this way, each connector 50 is stopped at the target position. In this state, the solder 24 is hardened. Thus, an electric circuit board can be manufactured.

  In the second embodiment, the two connectors 50 are respectively moved in the b direction by the self-alignment effect, and the main body portion 18 of each connector 50 is applied to the stopper 46 at the predetermined position described above. Thereby, each connector 50 is stopped at the target position. For this reason, each connector 50 can be positioned accurately. Therefore, as in the first embodiment, the two fitting portions 32 of the fitting component 30 can be accurately fitted into the two fitting ports 28, respectively.

  16 to 19 are plan views showing a state in which the connector is positioned by the stopper according to the modification of the second embodiment. The stopper is not limited to the stopper 46 described above as long as it can be stopped by applying the moved connector 50.

  As the stopper 52 and the stopper 54 shown in FIGS. 16 and 17, respectively, as the stopper, those provided so as to be in contact with the longitudinal side of the main body portion 18 of the connector 50 can be applied. When such a stopper is applied, the connector 50 is moved in the c direction and stopped by hitting the stopper.

  Further, as shown in FIG. 16, a stopper 52 that contacts the side of the main body 18 of the connector 50 in a long range may be applied, and as shown in FIG. 17, two positions on the side of the main body 18 of the connector 50 may be applied. You may apply the two stoppers 54 which hit respectively.

  Further, like the stopper 56 and the stopper 58 shown in FIG. 18 and FIG. 19, those provided so as to be in contact with both the short side and the long side of the connector 50 can be applied. When such a stopper is applied, the connector 50 is moved in the d direction and stopped by hitting the stopper. In this case, since the stopper is applied to the connector 50 from two directions, the rotation of the connector 50 can be prevented. The connector 50 can be positioned more accurately. The above modifications can also be applied to other embodiments.

Embodiment 3 FIG.
A method for manufacturing an electric circuit board according to Embodiment 3 will be described. FIG. 20 is a process diagram showing the method of manufacturing the electric circuit board according to the third embodiment.

  First, two connectors 60 are prepared for fitting the board 10 and the two fitting portions 32 of the fitting component 30 respectively. Then, when each positioning pin 22 provided on the connector 60 is applied to the side wall 26 at a predetermined position in the corresponding positioning hole 16 provided on the substrate 10, each connector 60 comes to the target position. The substrate 10 and the two connectors 60 are designed.

  Next, as shown in FIG. 20, in a state where the solder 24 is heated and melted, the connector 60 is pressed by the spring 62 in the direction c in a plane parallel to the upper surface of the substrate 10. Thereby, the positioning pin 22 of each connector 60 is applied to the side wall 26 at the predetermined position in the corresponding positioning hole 16. Thereby, each connector 60 is stopped at the target position. In this state, the solder 24 is hardened. Thus, an electric circuit board is manufactured.

  In the third embodiment, each connector 60 is pressed by a spring 62 so that the positioning pin 22 of each connector 60 is applied to the side wall 26 at the predetermined position in the corresponding positioning hole 16. Thereby, each connector 60 is forced to stop at the target position and positioned. Therefore, the two connectors 60 can be accurately positioned at the target position.

  In the third embodiment, the connector 60 is stopped by applying the positioning pin 22 to the side wall 26 of the positioning hole 16. In Embodiment 3, it is not restricted to this, You may use the stopper 52 in order to stop the connector 60. FIG. In this case, the main body portions 18 of the two connectors 60 are pressed against the corresponding stoppers 52 by being pressed by the springs 62, and the respective connectors 60 are stopped at the target positions. Thereby, similarly, the two connectors 60 can be accurately positioned at the target position. The same applies to other embodiments.

  In the third embodiment, the lead 20 is bonded to the pad 14 by heating and melting the solder 24, but a conductive adhesive may be used instead of the solder 24. Similar effects can be obtained. The same applies to other embodiments.

Embodiment 4 FIG.
A method for manufacturing an electric circuit board according to the fourth embodiment will be described focusing on differences from the third embodiment. FIG. 21 is a process diagram showing the method for manufacturing the electric circuit board according to the fourth embodiment.

  Unlike the third embodiment, the connector 60 is pressed by the block 64 while the solder 24 is heated and melted. Accordingly, the positioning pins 22 of the respective connectors 60 are brought into contact with the side walls 26 of the corresponding positioning holes 16 to stop the respective connectors 60 at the target positions. In this state, the solder 24 is hardened. Thus, an electric circuit board is manufactured.

  In the fourth embodiment, each connector 60 is pressed by the block 64 so that the positioning pin 22 of each connector 60 is brought into contact with the side wall 26 at the predetermined position described in the third embodiment in the corresponding positioning hole 16. . Thereby, each connector 60 is stopped at the target position. In this state, the solder 24 is hardened. Thus, an electric circuit board is manufactured. Therefore, similarly to the third embodiment, the two connectors 60 can be accurately positioned at the target position.

Embodiment 5 FIG.
A method for manufacturing an electric circuit board according to Embodiment 5 will be described. FIG. 22 is a process diagram showing the method of manufacturing the electric circuit board according to the fifth embodiment.

  First, two connectors 66 for fitting the board 10 and the two fitting portions 32 of the fitting component 30 are prepared. A plurality of pads 14 are provided on the upper surface of the substrate 10. A plurality of leads 20 are provided on the back surface of the main body 18 of each connector 66. Then, the two connectors 66 are arranged on the upper surface of the substrate 10. At this time, the plurality of leads 20 respectively possessed by the two connectors 66 are respectively arranged on the corresponding pads 14 via the solder 24.

  Next, as shown in FIG. 22, the connector 66 is heated and melted by the solder 24 in a state where the two fitting portions 32 of the fitting component 30 are fitted in the fitting ports 28 of the two corresponding connectors 66. The plurality of leads 20 on the back surface of the substrate 10 are bonded to the corresponding pads 14 on the upper surface of the substrate 10. In this state, the solder 24 is hardened. Thus, an electric circuit board is manufactured.

  In the fifth embodiment, the two connectors 66 are joined to the substrate 10 in a state of being fitted to the two fitting portions 32 of the fitting component 30. As a result, the two connectors 66 can be accurately positioned at target positions where the two connectors 66 can be accurately fitted to the two fitting portions 32 of the fitting component 30.

  In the fifth embodiment, the two connectors 66 are joined in a state of being fitted to the two fitting portions 32 of the fitting component 30, but the simulation component having the same shape as the fitting component 30 has 2 You may join in the state fitted to the part corresponding to the one fitting part 32. FIG. Similar effects can be obtained.

10, 34, 48, 54 Substrate 12, 36, 50, 60, 66 Connector 14 Pad 16 Positioning hole 18 Body portion 20 Lead 22, 38 Positioning pin 24 Solder (joining material)
26 Side wall 28 Fitting port 30 Fitting part 32 Fitting part 46, 52, 54, 56, 58 Stopper 62 Spring 64 Block

Claims (7)

A board and a connector provided on the upper surface of the board, wherein the connector is a method of manufacturing an electric circuit board used for fitting fitting parts,
Preparing the substrate having a plurality of pads provided on the upper surface, and the connector having a main body portion and a plurality of leads provided on the back surface of the main body portion;
Disposing the connector on the top surface of the substrate such that the plurality of leads are respectively disposed on the corresponding pads via a bonding material;
Bonding the plurality of leads to the corresponding pads by heating and melting the bonding material,
With
A substrate side positioning part is provided on the substrate,
A connector side positioning portion is provided in the connector,
In the placing step, each of the plurality of leads is shifted from the center of the corresponding pad in a first direction within a plane parallel to the upper surface of the substrate without being brought into contact with the pad adjacent to the corresponding pad. Placed at
In the bonding step, the connector is moved in the plane parallel to the substrate upper surface by a self-alignment effect of moving the plurality of leads to the center side of the corresponding plurality of pads by heating and melting the bonding material. A method of manufacturing an electric circuit board, wherein the connector is positioned at a target position by moving in a second direction opposite to the direction 1 and applying the connector side positioning part to the board side positioning part. . A board and a connector provided on the upper surface of the board, wherein the connector is a method of manufacturing an electric circuit board used for fitting fitting parts,
Preparing the substrate having a plurality of pads provided on the upper surface, and the connector having a main body portion and a plurality of leads provided on the back surface of the main body portion;
Disposing the connector on the top surface of the substrate such that the plurality of leads are respectively disposed on the corresponding pads via a bonding material;
Bonding the plurality of leads to the corresponding pads by heating and melting the bonding material,
With
A substrate side positioning part is provided on the substrate,
A connector side positioning portion is provided in the connector,
In the bonding step, in a state where the bonding material is heated and melted, the connector is pressed in a specific direction in a plane parallel to the upper surface of the substrate, and the connector side positioning portion is applied to the substrate side positioning portion, An electrical circuit board manufacturing method comprising positioning the connector at a target position. The substrate side positioning portion is a side wall of a hole provided in the substrate,
The connector side positioning portion is a pin provided on the back surface and having a smaller inner diameter than the hole,
In the placing step, the pin is inserted into the hole,
The method for manufacturing an electric circuit board according to claim 1, wherein, in the joining step, the pin is applied to a side wall of the hole.   4. The method of manufacturing an electric circuit board according to claim 3, wherein a cross section of the hole parallel to the top surface of the substrate is circular, and a cross section of the pin parallel to the top surface of the substrate is circular. The substrate side positioning portion is a stopper provided on the upper surface of the substrate,
The connector side positioning part is the main body part,
The method for manufacturing an electric circuit board according to claim 1, wherein in the bonding step, the main body portion is applied to the stopper. The fitting component has a plurality of fitting portions,
In the step of preparing the board and the connector, as the board, a board having a plurality of board-side positioning parts is prepared as the board-side positioning part, and a plurality of fitting parts are respectively fitted as the connectors. Prepare the connector,
In the step of arranging, the plurality of connectors are arranged so that the plurality of leads of the plurality of connectors are arranged on the plurality of pads corresponding to the plurality of leads, respectively.
6. The electricity according to claim 1, wherein, in the joining step, the connector-side positioning portions provided in each of the plurality of connectors are applied to the corresponding board-side positioning portions. A method of manufacturing a circuit board. A board and a plurality of connectors provided on the top surface of the board, wherein the plurality of connectors is a method of manufacturing an electric circuit board used for fitting together a plurality of fitting portions of fitting parts,
Preparing the substrate having a plurality of pads provided on the upper surface, and the plurality of connectors each having a main body portion and a plurality of leads provided on the back surface of the main body portion;
Disposing the plurality of connectors on the top surface of the substrate such that the plurality of leads included in the plurality of connectors are respectively disposed on the corresponding pads via a bonding material;
A state in which the plurality of fitting portions of the fitting component or portions corresponding to the plurality of fitting portions of the simulated component having the same shape as the fitting component are respectively fitted to the corresponding plurality of connectors. And bonding the plurality of leads to the corresponding pads by heating and melting the bonding material, and
A method of manufacturing an electric circuit board, comprising:

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