JP2010182938A - Substrate device for medium, and medium - Google Patents

Substrate device for medium, and medium Download PDF

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Publication number
JP2010182938A
JP2010182938A JP2009026261A JP2009026261A JP2010182938A JP 2010182938 A JP2010182938 A JP 2010182938A JP 2009026261 A JP2009026261 A JP 2009026261A JP 2009026261 A JP2009026261 A JP 2009026261A JP 2010182938 A JP2010182938 A JP 2010182938A
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lsi
substrate
mounting area
connection terminal
medium
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Japanese (ja)
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Yuji Tsuchimoto
祐二 土元
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Toshiba Corp
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Toshiba Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To improve the yield in a manufacturing process by preventing an LSI from cracking and to improve the reliability. <P>SOLUTION: A substrate device for a medium includes a substrate 1 having an LSI mounting area 21, a land 3 formed on the LSI mounting area 21 of the substrate 1, and a projection portion 22 which is molded projecting integrally with the LSI mounting area 21 of the substrate 1 and receives an LSI 2 when a bump of the LSI is pressed against the land 3 when the LSI is mounted. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、例えば、無線式の媒体用基板装置及び媒体に係わり、特に、ＩＳＩを実装する基板構造に関する。   The present invention relates to, for example, a wireless medium substrate device and medium, and more particularly to a substrate structure on which ISI is mounted.

無線カードや無線冊子などの無線媒体は基板を備え、基板はアンテナパターンを形成するとともに、ＬＳＩを実装するための実装エリヤを有し、この実装エリアにランド（アンテナ接続端子部）を形成している。ランドはリードを介してアンテナパターンに接続されている。   A wireless medium such as a wireless card or a wireless booklet includes a substrate, and the substrate has an antenna pattern and a mounting area for mounting an LSI, and a land (antenna connection terminal portion) is formed in this mounting area. Yes. The land is connected to the antenna pattern through a lead.

ＬＳＩはその端子に例えば金製のバンプを形成し、このバンプを基板上のランドに導電接着剤を介してフリップチップ実装されて電気的に接続される。これにより、ＬＳＩがランド、リードを介してアンテナパターンに接続されて回路を形成し、非接触で外部とのデータ通信が可能となる。   For example, a gold bump is formed on a terminal of the LSI, and the bump is flip-chip mounted on a land on the substrate via a conductive adhesive to be electrically connected. As a result, the LSI is connected to the antenna pattern via the lands and leads to form a circuit, and data communication with the outside is possible without contact.

ところで、ＬＳＩの実装に際しては、バンプがランドから浮いた状態で実装されるとバンプとランドの接触が不安定となることがあるため、ＬＳＩはＬＳＩ吸着実装ヘッドによりある荷重にて平面的に押し付けながら実装される。   By the way, when mounting an LSI, if the bump is mounted in a state of floating from the land, the contact between the bump and the land may become unstable. Therefore, the LSI is pressed flatly with a certain load by the LSI suction mounting head. While implemented.

さらに、ＬＳＩの上方より熱プレスヘッドによりＬＳＩを加熱、加圧することにより、導電接着剤を硬化させてバンプとランドの電気的接続をより確実なものにしている（例えば、特許文献１参照。）。
特開平９−２６０５３４号公報 Furthermore, by heating and pressurizing the LSI from above the LSI with a hot press head, the conductive adhesive is cured to make the electrical connection between the bump and the land more reliable (see, for example, Patent Document 1). .
JP 9-260534 A

しかしながら、従来においては、ＬＳＩのフリップチップ実装時にＬＳＩのバンプがランドに押し付けられると、バンプに荷重が集中し、ＬＳＩの特にバンプ近辺にクラックが発生する虞があった。クラックが発生すると、ＬＳＩが電気的特性に不具合を生じることとなり、製造工程時の歩留まりの悪化、信頼性の低下につながっていた。   However, conventionally, when the LSI bumps are pressed against the land during flip chip mounting of the LSI, the load is concentrated on the bumps, and there is a possibility that cracks may occur in the LSI, particularly in the vicinity of the bumps. When a crack occurs, the LSI has a defect in electrical characteristics, leading to a deterioration in yield and a decrease in reliability during the manufacturing process.

また、近年、無線カードおよび無線冊子は小型化、薄型化の傾向にあり、ＬＳＩは今後さらに薄型化に向かっていくことが推測されるが、この場合には、より一層クラックが発生し易くなり、電気的特性の不具合品の発生が見込まれるという問題があった。   In recent years, wireless cards and booklets have been trending toward miniaturization and thinning, and it is speculated that LSIs will continue to become thinner in the future. In this case, however, cracks are more likely to occur. There is a problem that a defective product with electrical characteristics is expected to be generated.

本発明は上記事情に着目してなされたもので、その目的とするところは、ＬＳＩに対するクラックの発生を防止でき、製造工程時の歩留まりの向上、及び信頼性の向上を可能とする媒体用基板装置及び媒体を提供することにある。   The present invention has been made paying attention to the above circumstances, and its object is to prevent the occurrence of cracks in the LSI, improve the yield in the manufacturing process, and improve the reliability of the medium substrate. It is to provide an apparatus and a medium.

上記課題を解決するため、請求項１記載の発明は、ＬＳＩ実装エリアを有する基板と、この基板の前記ＬＳＩ実装エリア上に形成された端子部と、前記基板の前記ＬＳＩ実装エリアに一体的に突出成形され、ＬＳＩの実装時にそのバンプが接続端子部に圧接される際に前記ＬＳＩを受ける突出部とを具備することを特徴とする。   In order to solve the above-mentioned problem, the invention described in claim 1 is a substrate having an LSI mounting area, a terminal portion formed on the LSI mounting area of the substrate, and the LSI mounting area of the substrate. And a protruding portion that receives the LSI when the bump is pressed against the connection terminal when the LSI is mounted.

請求項６記載の発明は、アンテナを形成するとともに、ＬＳＩ実装エリアを有する基板と、この基板の前記ＬＳＩ実装エリア上に形成されたアンテナ接続端子部と、前記基板の前記ＬＳＩ実装エリアに一体的に突出成形され、ＬＳＩの実装時にそのバンプが前記アンテナ接続端子部に圧接される際に前記ＬＳＩを受ける突出部とを具備することを特徴とする。   According to a sixth aspect of the present invention, an antenna is formed and a substrate having an LSI mounting area, an antenna connection terminal portion formed on the LSI mounting area of the substrate, and the LSI mounting area of the substrate are integrated. And a protrusion that receives the LSI when the bump is pressed against the antenna connection terminal when the LSI is mounted.

請求項７記載の発明は、ＬＳＩ実装エリアを有する基板と、この基板の前記ＬＳＩ実装エリア上に形成された接続端子部と、前記基板のＬＳＩ実装エリアに実装され、バンプを前記接続端子部に圧接させるＬＳＩと、前記基板のＬＳＩ実装エリアに一体的に突出成形され、前記接続端子部に前記ＬＳＩのバンプが圧接される際に前記ＬＳＩを受ける突出部とを具備することを特徴とする。   The invention according to claim 7 is a substrate having an LSI mounting area, a connection terminal portion formed on the LSI mounting area of the substrate, and mounted on the LSI mounting area of the substrate, and bumps are formed on the connection terminal portion. An LSI to be press-contacted, and a protrusion formed integrally with an LSI mounting area of the substrate, and a protrusion that receives the LSI when the bump of the LSI is press-contacted to the connection terminal portion.

請求項８記載の発明は、アンテナを形成するとともに、ＬＳＩ実装エリアを有する基板と、この基板の前記ＬＳＩ実装エリア上に形成されたアンテナ接続端子部と、前記基板のＬＳＩ実装エリアに実装され、バンプを前記アンテナ接続端子部に圧接させるＬＳＩと、前記基板のＬＳＩ実装エリアに一体的に突出成形され、前記アンテナ接続端子部に前記ＬＳＩのバンプが圧接される際に前記ＬＳＩを受ける突出部とを具備することを特徴とする。   The invention according to claim 8 is mounted on the LSI mounting area of the substrate, the substrate having the LSI mounting area, the antenna connection terminal portion formed on the LSI mounting area of the substrate, and the antenna. An LSI that press-contacts the bump to the antenna connection terminal portion; and a protrusion that is integrally formed in an LSI mounting area of the substrate and receives the LSI when the bump of the LSI is press-contacted to the antenna connection terminal portion. It is characterized by comprising.

本発明によれば、ＬＳＩに対するクラックの発生を防止でき、製造工程時の歩留まりの向上、及び信頼性の向上を可能とする媒体用基板装置及び媒体を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, generation | occurrence | production of the crack with respect to LSI can be prevented, the board | substrate apparatus for media and medium which can improve the yield at the time of a manufacturing process, and can improve reliability can be provided.

以下、本発明の実施の形態を図面を参照して詳細に説明する。
図１は、本発明の一実施の形態である無線媒体としての無線カード（或いは無線冊子）を示す平面図である。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a plan view showing a wireless card (or wireless booklet) as a wireless medium according to an embodiment of the present invention.

図中１は無線カードの基板で、この基板１は例えばＰＥＴ（ポリエチレンテレフタレート）によって成形されている。基板１の上面一側部側にはＬＳＩ２が実装され、このＬＳＩ２の上面部側には上補強板８が設けられている。また、基板１の上面部にはアンテナパターン１３が形成されている。このアンテナパターン１３は、リード５及び後述するランド（アンテナ接続端子部）３を介して図２にも示すようにＬＳＩ２に接続されて回路を構成し、非接触で外部とのデータ通信を行うことができるようになっている。   In the figure, reference numeral 1 denotes a wireless card substrate, which is formed of, for example, PET (polyethylene terephthalate). An LSI 2 is mounted on one side of the upper surface of the substrate 1, and an upper reinforcing plate 8 is provided on the upper surface of the LSI 2. An antenna pattern 13 is formed on the upper surface of the substrate 1. The antenna pattern 13 is connected to the LSI 2 via a lead 5 and a land (antenna connection terminal portion) 3 described later, as shown in FIG. 2, to constitute a circuit and perform data communication with the outside in a non-contact manner. Can be done.

図３は、上記したＬＳＩ２の実装部を示す平面図で、図４はそのＡ−ＡＡ線に沿って示す断面図である。   FIG. 3 is a plan view showing the mounting portion of the LSI 2 described above, and FIG. 4 is a cross-sectional view taken along the line A-AA.

基板１のＬＳＩ実装エリア２１には４個のランド３が形成され、そのうちの２個のランド３がリード５を介してアンテナパターン１３に接続されている。ＬＳＩ２の端子には、４個の例えば金製のバンプ４，４ａが形成され、これら４個のバンプ４，４ａを上記した４個のランド３上に接合してフリップチップ実装されている。４個のバンプ４，４ａ中２個のバンプ４はアンテナパターン１３に接続されて通信回路を構成し、残りの２個のバンプ４ａは、ＬＳＩ２を基板１上に実装した際に安定した実装を可能とするために用いられるもので、アンテナパターン１３には接続されていない。また、４個のバンプ４，４ａはＬＳＩ２を安定して実装するためにＬＳＩ２の四隅に配設されている。   Four lands 3 are formed in the LSI mounting area 21 of the substrate 1, and two of the lands 3 are connected to the antenna pattern 13 via the leads 5. For example, four bumps 4, 4 a made of gold, for example, are formed on the terminals of the LSI 2, and these four bumps 4, 4 a are joined to the four lands 3 described above and are flip-chip mounted. Of the four bumps 4 and 4a, two bumps 4 are connected to the antenna pattern 13 to constitute a communication circuit, and the remaining two bumps 4a are stably mounted when the LSI 2 is mounted on the substrate 1. It is used to make it possible and is not connected to the antenna pattern 13. The four bumps 4 and 4a are arranged at the four corners of the LSI 2 in order to stably mount the LSI 2.

ＬＳＩ２の上側には、上接着剤６を介して上記した上補強板８が設けられ、下側には基板１及び下接着剤７を介して下補強板９が設けられている。さらに基板１の表裏にはプラスチックシート材５１が配設されて被覆されている。   The upper reinforcing plate 8 is provided above the LSI 2 via the upper adhesive 6, and the lower reinforcing plate 9 is provided below the substrate 1 and the lower adhesive 7. Further, a plastic sheet material 51 is disposed and covered on the front and back of the substrate 1.

ところで、上記した基板１のＬＳＩ実装エリア２１の中央部には、突出部２２が一体的に突出成形されている。突出部２２の高さ寸法ｈ１は、後述する製造時にＬＳＩ２に荷重が加えられてそのバンプ４とランド３とが接触したときにおけるＬＳＩ２の底面から基板１の表面までの寸法に設定されている。すなわち、突出部２２の高さ寸法ｈ１は、少なくとも基板１の表面からランド３の高さ以上に設定されている。   By the way, a projecting portion 22 is integrally projected and formed at the central portion of the LSI mounting area 21 of the substrate 1 described above. The height dimension h1 of the projecting portion 22 is set to a dimension from the bottom surface of the LSI 2 to the surface of the substrate 1 when a load is applied to the LSI 2 during manufacturing, which will be described later, and the bump 4 and the land 3 come into contact with each other. That is, the height dimension h1 of the protrusion 22 is set to be at least the height of the land 3 from the surface of the substrate 1.

突出部２２は、例えば、雄、雌の成形型により、ＰＥＴ（ポリエチレンテレフタレート）製の基板１を加圧することにより製作してもよく、また、成形型により加熱することにより製作してもよい。   The protrusion 22 may be manufactured by, for example, pressing a PET (polyethylene terephthalate) substrate 1 with a male or female mold, or may be manufactured by heating with a mold.

なお、基板１として、ＰＥＴ（ポリエチレンテレフタレート）などの屈曲性のある薄い材料を用いた場合には、突出部２２を例えば円錐状に成形すると、その先端が破れてしまう虞がある。また、突出部２２を円柱形状、角柱形状とした場合も、その稜線部あるいは角部が破れてしまう虞がある。   In addition, when a flexible thin material such as PET (polyethylene terephthalate) is used as the substrate 1, if the protrusion 22 is formed in a conical shape, for example, the tip may be broken. In addition, when the protruding portion 22 has a cylindrical shape or a prismatic shape, the ridge line portion or the corner portion may be broken.

そこで、この実施の形態では、突出部２２を半球形状とすることにより、強度を高めてその破れを防止できるようにしている。   Therefore, in this embodiment, the protrusion 22 is formed in a hemispherical shape so that the strength can be increased and the breakage can be prevented.

次に、無線カードの製造方法について説明する。   Next, a method for manufacturing a wireless card will be described.

まず、図５に示すように基板１を用意し、この基板１のＬＳＩ実装エリア２１上の複数個所、すなわち、図６に示すように、４個のランド３上、及び４個のランド３以外の４箇所にそれぞれ導電性接着剤１０を塗布する。この塗布後、基板１のＬＳＩ実装エリア２１にＬＳＩ２を搭載し、そのバンプ４，４ａをランド３に押圧接合させる。こののち、基板１を図７に示すように熱プレッシャ部２４に搬送する。そして、熱プレッシャヘッド４０を下降させて図８に示すように、ＬＳＩ２をその上面側から加圧、加熱する。これにより、導電性接着剤１０が硬化され、ＬＳＩ２のバンプ４とランド３とが電気的に確実に接続されることになる。こののち、ＬＳＩ実装済みの基板１を補強板取付部に搬送してＬＳＩ２の上側には、上接着剤６を介して上補強板８を設け、下側には基板１及び下接着剤７を介して下補強板９が設ける。ついで、基板１の表裏にプラスチックシート材５１を配設して被覆し、図４に示すように無線カードが構成される。プラスチックシート材５１としては例えば熱プレス等により熱溶着するものが用いられる。   First, a substrate 1 is prepared as shown in FIG. 5, and a plurality of locations on the LSI mounting area 21 of the substrate 1, that is, four lands 3 and other than four lands 3 as shown in FIG. The conductive adhesive 10 is applied to each of the four locations. After this application, the LSI 2 is mounted on the LSI mounting area 21 of the substrate 1, and the bumps 4, 4 a are pressed and joined to the land 3. Thereafter, the substrate 1 is transported to the heat pressure unit 24 as shown in FIG. Then, the thermal pressure head 40 is lowered to pressurize and heat the LSI 2 from the upper surface side as shown in FIG. As a result, the conductive adhesive 10 is cured, and the bumps 4 of the LSI 2 and the lands 3 are securely connected electrically. After that, the substrate 1 on which the LSI is mounted is conveyed to the reinforcing plate mounting portion, and the upper reinforcing plate 8 is provided on the upper side of the LSI 2 via the upper adhesive 6, and the substrate 1 and the lower adhesive 7 are provided on the lower side. A lower reinforcing plate 9 is provided. Next, a plastic sheet material 51 is disposed and covered on the front and back of the substrate 1 to constitute a wireless card as shown in FIG. As the plastic sheet material 51, for example, a material that is thermally welded by a hot press or the like is used.

ところで、上記したＬＳＩ２の実装時、及び熱プレス時には、ＬＳＩ２のバンプ４，４ａがランド３に押し付けられるため、ＬＳＩ２のバンプ４、４ａに荷重が集中しＬＳＩ２の特にバンプ４、４ａ近辺にクラックが入り、ＬＳＩ２の電気的特性に不具合が生じる虞がある。   By the way, when the LSI 2 is mounted and hot pressed, the bumps 4, 4 a of the LSI 2 are pressed against the lands 3, so that the load is concentrated on the bumps 4, 4 a of the LSI 2 and cracks are generated particularly in the vicinity of the bumps 4, 4 a of the LSI 2. There is a risk that the electrical characteristics of the LSI 2 will be defective.

しかしながら、この実施の形態では、上記したように、基板１のＬＳＩ実装エリア２１に突出部２２を一体的に形成するため、ＬＳＩ２の実装時、及び熱プレス時にＬＳＩ２に荷重が加えられた場合には、ＬＳＩ２の下面中心部が突出部２２に当接して支えられる。これにより、ＬＳＩ２のバンプ４，４ａに加わる荷重が分散され、ＬＳＩ２のバンプ４，４ａの近辺にクラックを発生させることがなく、ＬＳＩ２の電気的特性を良好に維持できる。   However, in this embodiment, as described above, since the protrusion 22 is integrally formed in the LSI mounting area 21 of the substrate 1, when a load is applied to the LSI 2 during mounting of the LSI 2 and during hot pressing. The lower surface center portion of the LSI 2 is supported by being in contact with the protruding portion 22. As a result, the load applied to the bumps 4 and 4a of the LSI 2 is dispersed, cracks are not generated in the vicinity of the bumps 4 and 4a of the LSI 2, and the electrical characteristics of the LSI 2 can be favorably maintained.

従って、製造工程時の歩留まりの向上、及び信頼性の向上が可能となるとともに、新たに新規部品を必要とすることがなく、コストを上昇させることもない。   Therefore, it is possible to improve the yield and reliability during the manufacturing process, and no new parts are required and the cost is not increased.

なお、基板１のＬＳＩ実装エリア２１に突出部２２がない場合には、図９に示すようにＬＳＩ２のバンプ４，４ａの近辺にクラック３０が発生してしまう。   If there is no protrusion 22 in the LSI mounting area 21 of the substrate 1, a crack 30 is generated in the vicinity of the bumps 4 and 4a of the LSI 2 as shown in FIG.

また、上記した第１の実施の形態では、ＬＳＩ実装エリア２１に突出部２２を一個のみ設けたが、本発明はこれに限られることなく、図１０に示すように、突出部２２をＬＳＩ実装エリア２１の中心部Ｓ周りに複数個一体的に成形するようにてもよい。   In the first embodiment described above, only one protrusion 22 is provided in the LSI mounting area 21, but the present invention is not limited to this, and the protrusion 22 is mounted on the LSI as shown in FIG. A plurality of pieces may be integrally formed around the center portion S of the area 21.

これによれば、ＬＳＩ２の実装時により一層、バランス良くＬＳＩ２を実装することが可能となる。   According to this, it is possible to mount the LSI 2 in a more balanced manner when the LSI 2 is mounted.

また、図１１に示すように、ＬＳＩ実装エリア２１の突出部２２に上下方向に沿って貫通穴２５を穿設しても良い。この場合には、突出部２２はＬＳＩ２の搭載初期の段階で比較的潰れ易い構成となる。   Further, as shown in FIG. 11, a through hole 25 may be formed in the protruding portion 22 of the LSI mounting area 21 along the vertical direction. In this case, the protruding portion 22 has a configuration that is relatively easily crushed at the early stage of mounting the LSI 2.

従って、バンプ４とランド３の接触が不安定とならないところまでＬＳＩ２に荷重をかけたときに、突出部２２の高さ寸法ｈ２がＬＳＩ２の底面部と基板２の上面部との間の寸法よりも大きい場合であっても、突出部２２に潰れが生じてＬＳＩ実装時のソフトランディングが可能となる。   Therefore, when a load is applied to the LSI 2 until the contact between the bump 4 and the land 3 does not become unstable, the height dimension h2 of the protrusion 22 is larger than the dimension between the bottom surface portion of the LSI 2 and the top surface portion of the substrate 2. Is larger, the protrusion 22 is crushed and soft landing at the time of LSI mounting becomes possible.

なお、上記一実施の形態では、無線式の媒体について説明したが、本発明は、無線式の媒体に限られることなく、接触式の媒体に採用しても同様な作用効果を得ることができることは勿論のことである。   In the above-described embodiment, the wireless medium has been described. However, the present invention is not limited to the wireless medium, and the same effect can be obtained even if it is applied to a contact medium. Of course.

また、この発明は、上述した実施の形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。さらに、上述した実施の形態に開示されている複数の構成要素の適宜な組み合わせにより種々の発明を形成できる。例えば、上述した実施の形態に示される全構成要素から幾つかの構成要素を削除しても良い。   Further, the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Furthermore, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, you may delete some components from all the components shown by embodiment mentioned above.

本発明の一実施の形態である無線カードを示す平面図。The top view which shows the radio | wireless card which is one embodiment of this invention. 図１のＬＳＩとアナテナコイルとの接続を示す模式図。The schematic diagram which shows the connection of LSI of FIG. 1, and an antenna coil. 図１のＬＳＩ実装部を示す平面図。The top view which shows the LSI mounting part of FIG. 図３中Ａ−ＡＡ線に沿って示す断面図。Sectional drawing shown along the A-AA line in FIG. 図１の無線カードの製造時に基板をセットした状態を示す図。The figure which shows the state which set the board | substrate at the time of manufacture of the wireless card | curd of FIG. 図５の基板のＬＳＩ実装エリアに導電性接着剤を塗布した状態を示す図。The figure which shows the state which apply | coated the conductive adhesive to the LSI mounting area of the board | substrate of FIG. 図６の基板の実装エリアにＬＳＩを搭載した状態を示す図。The figure which shows the state which mounted LSI in the mounting area of the board | substrate of FIG. 図７のＬＳＩを熱プレスした状態を示す図。The figure which shows the state which heat-pressed LSI of FIG. ＬＳＩのバンプ周辺にクラックが形成された状態を示す図。The figure which shows the state in which the crack was formed in the bump periphery of LSI. 本発明の突出部の他の例を示す図。The figure which shows the other example of the protrusion part of this invention. 本発明の突出部のさらに他の例を示す図。The figure which shows the further another example of the protrusion part of this invention.

２…ＬＳＩ、３…ランド（アンテナ接続端子部）、４、４ａ…バンプ、５…リード、６…上接着剤、７…下接着剤、８…上補強板、９…下補強板、１０…導電性接着剤、１１…中央部、１３…アンテナパターン（アンテナ）、１５…基板、２０…基板、２１…ＬＳＩ実装エリア、２２…突出部、２５…貫通穴、３０…クラック、４０…ヘッド、５１…プラスチックシート（シート材）。   2 ... LSI, 3 ... Land (antenna connection terminal part) 4, 4a ... Bump, 5 ... Lead, 6 ... Upper adhesive, 7 ... Lower adhesive, 8 ... Upper reinforcing plate, 9 ... Lower reinforcing plate, 10 ... Conductive adhesive, 11 ... central portion, 13 ... antenna pattern (antenna), 15 ... substrate, 20 ... substrate, 21 ... LSI mounting area, 22 ... protrusion, 25 ... through hole, 30 ... crack, 40 ... head, 51 ... Plastic sheet (sheet material).

Claims (8)

ＬＳＩ実装エリアを有する基板と、
この基板の前記ＬＳＩ実装エリア上に形成された端子部と、
前記基板の前記ＬＳＩ実装エリアに一体的に突出成形され、ＬＳＩの実装時にそのバンプが接続端子部に圧接される際に前記ＬＳＩを受ける突出部と
を具備することを特徴とする媒体用基板装置。 A substrate having an LSI mounting area;
A terminal portion formed on the LSI mounting area of the substrate;
A substrate device for a medium, comprising: a protrusion formed integrally with the LSI mounting area of the substrate; and a protrusion that receives the LSI when the bump is pressed against a connection terminal when the LSI is mounted. . 前記突出部は、半球形状に構成されたことを特徴とする請求項１記載の媒体用基板装置。   The medium substrate apparatus according to claim 1, wherein the protruding portion is formed in a hemispherical shape. 前記突出部は、前記ＬＳＩの実装エリアの略中央部に成形されたことを特徴とする請求項１または２記載の媒体用基板装置。   3. The medium substrate apparatus according to claim 1, wherein the protruding portion is formed at a substantially central portion of the LSI mounting area. 前記突出部は、前記ＬＳＩの実装エリアの中央部回りに複数形成されたことを特徴とする請求項１または２記載の特徴とする媒体用基板装置。   3. The medium substrate device according to claim 1, wherein a plurality of the protruding portions are formed around a central portion of the LSI mounting area. 前記突出部に貫通孔を設けたことを特徴とする請求項１乃至４記載のいずれか一項記載の媒体用基板装置。   The medium substrate device according to claim 1, wherein a through hole is provided in the protruding portion. アンテナを形成するとともに、ＬＳＩ実装エリアを有する基板と、
この基板の前記ＬＳＩ実装エリア上に形成されたアンテナ接続端子部と、
前記基板の前記ＬＳＩ実装エリアに一体的に突出成形され、ＬＳＩの実装時にそのバンプが前記アンテナ接続端子部に圧接される際に前記ＬＳＩを受ける突出部と
を具備することを特徴とする媒体用基板装置。 Forming an antenna and a substrate having an LSI mounting area;
An antenna connection terminal formed on the LSI mounting area of the substrate;
A projecting part integrally formed in the LSI mounting area of the substrate and receiving the LSI when the bump is pressed against the antenna connection terminal part when the LSI is mounted. Board device. ＬＳＩ実装エリアを有する基板と、
この基板の前記ＬＳＩ実装エリア上に形成された接続端子部と、
前記基板のＬＳＩ実装エリアに実装され、バンプを前記接続端子部に圧接させるＬＳＩと、
前記基板のＬＳＩ実装エリアに一体的に突出成形され、前記接続端子部に前記ＬＳＩのバンプが圧接される際に前記ＬＳＩを受ける突出部と
を具備することを特徴とする媒体。 A substrate having an LSI mounting area;
A connection terminal portion formed on the LSI mounting area of the substrate;
An LSI mounted on the LSI mounting area of the substrate and pressing the bump to the connection terminal portion;
A medium comprising: a protrusion formed integrally with an LSI mounting area of the substrate; and a protrusion that receives the LSI when the LSI bump is pressed against the connection terminal portion. アンテナを形成するとともに、ＬＳＩ実装エリアを有する基板と、
この基板の前記ＬＳＩ実装エリア上に形成されたアンテナ接続端子部と、
前記基板のＬＳＩ実装エリアに実装され、バンプを前記アンテナ接続端子部に圧接させるＬＳＩと、
前記基板のＬＳＩ実装エリアに一体的に突出成形され、前記アンテナ接続端子部に前記ＬＳＩのバンプが圧接される際に前記ＬＳＩを受ける突出部と
を具備することを特徴とする媒体。 Forming an antenna and a substrate having an LSI mounting area;
An antenna connection terminal formed on the LSI mounting area of the substrate;
An LSI mounted on the LSI mounting area of the substrate and pressing the bump to the antenna connection terminal portion; and
A medium comprising: a protrusion formed integrally with an LSI mounting area of the substrate; and a protrusion that receives the LSI when the LSI bump is pressed against the antenna connection terminal portion.
JP2009026261A 2009-02-06 2009-02-06 Substrate device for medium, and medium Withdrawn JP2010182938A (en)

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