JP2010182719A - Metal core printed wiring board, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent migration etc., of copper with respect to a metal core printed wiring board manufactured by removing an unnecessary portion of an outer periphery after coated solder resist through metal die-processing, by suppressing cracking of solder resist and chipping of the solder resist during the metal die processing. <P>SOLUTION: In the manufacturing method of the metal core printed wiring board which has a plurality of through holes arrayed linearly at one side to mount a connector having a plurality of terminals arranged in an array, prepregs 31 are laminated on both surfaces of a core plate 21 as a metal core so that the array direction y of holes 22 formed on the core plate 21 to form the through holes and a direction X in which the density of glass cloth 33 increases by application of tension during manufacture of the prepregs 31 are orthogonal to each other. Thus the strength of insulating layers on both surface sides of the core plate 21 is made high at formation parts of the holes 22 by thus setting the directionality to suppress damage of the solder resist. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a metal core printed wiring board manufactured by cutting or removing the outer periphery by mold processing. More specifically, the present invention suppresses damage to the solder resist applied to the surface during mold processing, and improves performance. The present invention relates to a metal core printed wiring board and a method for manufacturing the same, which can suppress generation of defective products.

The metal core printed wiring board is manufactured as follows.
First, holes to be through holes and the like are formed in a core plate made of copper or aluminum. Next, a prepreg is laminated on both sides of the perforated core plate, and a copper foil is laminated on the prepreg. Then, a prepreg resin is melted and cured by a high-temperature vacuum press to obtain a copper-clad laminate. Thereafter, a hole is formed at a predetermined position, and through-hole plating is performed to form a through-hole. Subsequently, a predetermined wiring pattern is formed by etching, and a solder resist is applied to a portion that needs to be insulated. Finally, unnecessary surrounding parts are removed or separated into product sizes.

  For such a method of removing unnecessary parts or separating them, metal mold processing is used in the metal core printed wiring board. However, since the die processing is a method of punching by shearing, there is an advantage that a large amount of processing can be performed in a short time, but there is a problem that the end face of the substrate is broken.

  In this regard, in Patent Document 1 below, the thickness of the portion (scheduled cutting line) where the metal core is cut is reduced so that burrs are less likely to occur in the metal core made of the perforated core plate when punched. A method has been proposed.

JP 2000-133913 A

  According to the invention according to Patent Document 1, the generation of burrs is suppressed. However, no consideration is given to solder resist damage.

  That is, if the component mounted on the metal core printed wiring board is a connector in which a plurality of terminals are arranged in a row, a large number of through holes for that purpose are arranged in a row on the metal core printed wiring board. In addition, the position of the through hole is often formed on one side that is close to the outer peripheral edge of the metal core printed wiring board.

  However, the through hole is formed by forming a hole in the core plate as described above, filling the hole with the resin of the prepreg, forming a hole smaller than the hole of the core plate, and then performing through hole plating. Therefore, in the portion where the plurality of through holes in the metal core printed wiring board are close to each other, the hardness due to the metal core cannot be obtained, and the metal core printed wiring board is easily bent.

  For this reason, a large bending stress is applied to the portion where the through-holes are arranged and the vicinity thereof due to the shearing force acting during punching by die machining, and local deformation is likely to occur. Although it is sandwiched between the molds when the mold is processed, it is impossible to completely prevent bending stress from being applied to the mold. As a result, the metal core printed wiring board is partially bent and easily cracked.

  In particular, in the case of a metal core printed wiring board, while the metal core is hard, the insulating layer composed of the prepreg is softer than that, and there is a difference in breakage when a shearing force is applied. Moreover, since the metal core is hard, the force required for shearing must be large. For this reason, the solder resist applied to the surface of the insulating layer is likely to crack.

  If cracks occur in the solder resist, copper migration occurs when left for a long time at high humidity, leading to dielectric breakdown.

  SUMMARY OF THE INVENTION Accordingly, the main object of the present invention is to suppress solder resist damage, improve performance, and suppress the occurrence of defective products.

  Means therefor is a metal core printed wiring board formed by laminating a metal core plate and a prepreg formed by impregnating a glass cloth with a resin, and a plurality of through holes are linearly arranged on one side, This is a metal core printed wiring board in which the arrangement direction of the through holes and the direction in which the tension is applied during the manufacture of the prepreg are substantially orthogonal.

  Also, a method of manufacturing a metal core printed wiring board in which a plurality of through holes are linearly arranged on one side, and the through holes are formed when the prepreg is laminated on both surfaces of the core board to be a metal core. And a method of manufacturing a metal core printed wiring board in which the holes are formed so that the arrangement direction or length direction of the holes formed in the core plate and the direction in which the tension is applied at the time of manufacturing the prepreg are substantially orthogonal.

  As described above, according to the present invention, with respect to the prepreg laminated on both surfaces of the core plate serving as the metal core, the arrangement direction of the plurality of through holes formed on one side, in other words, the holes formed in the core plate. Since the arrangement direction or length direction of the prepreg is substantially orthogonal to the direction in which the tension is applied at the time of manufacturing the prepreg, the deformation of the insulating layer made of the prepreg on one side can be made difficult to occur.

  In other words, the prepreg is manufactured by impregnating a glass cloth with varnish, but in the glass cloth weaving process and the varnish impregnation process, the glass cloth is conveyed in tension in the longitudinal direction. Glass cloth becomes dense. For this reason, the bending elastic modulus of the prepreg is higher in the longitudinal direction than in the direction orthogonal to the longitudinal direction. That is, the mechanical strength is higher in the longitudinal direction.

  As a result of making the direction of the high strength of such a prepreg substantially orthogonal to the direction of the portion considered to be easily deformed by the presence of a plurality of through holes arranged in a straight line, even when a shearing force acts, The portion where the through holes are arranged in a straight line becomes difficult to bend, and cracks can be prevented from entering the solder resist applied to the surface of the insulating layer.

The perspective view which shows schematic structure of the core board and prepreg which are laminated | stacked. The partially broken top view of a metal core printed wiring board. Explanatory drawing which shows the manufacturing process of a metal core printed wiring board. The cross-sectional view of a through-hole part. Sectional drawing of the part in which the several through hole was arranged in linear form. Sectional drawing of the part in which the several through hole was arranged in linear form. Sectional drawing of the part in which the several through hole was arranged in linear form. The perspective view of a prepreg. Explanatory drawing which shows the manufacturing process of a prepreg. The schematic diagram of a prepreg. Explanatory drawing of die processing.

An embodiment for carrying out the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view showing a schematic structure of a core plate 21 and a prepreg 31 for manufacturing the metal core printed wiring board 11, and FIG. 2 is a partial view showing a schematic structure of the metal core printed wiring board 11 manufactured using them. FIG. 3 is an explanatory view showing a manufacturing process of the metal core printed wiring board 11.

First, the outline of the manufacturing method of the metal core printed wiring board 11 is demonstrated using FIG.
For the metal core of the metal core printed wiring board 11, the core plate 21 made of a rectangular metal plate made of copper or aluminum is used (a). A hole 22 is made in a predetermined position of the core plate 21 (b). The hole 22 is a hole that will later become a through hole or the like.

  Then, a prepreg 31 in which a glass cloth is impregnated with an epoxy resin is laminated on both surfaces of the core plate 21 with holes 22, and a copper foil 41 is laminated on both outer sides of the prepreg 31 (c).

  In this state, high-temperature vacuum pressing is performed to fill the holes 22 of the perforated core plate 21 with the resin 32 in which the prepreg 31 is melted. When the resin 32 is solidified, the insulating layer 12 is formed on both surfaces of the core plate 21 and bonded to the core plate 21, and the copper foil 41 is bonded to the outer side of the copper plate 41 (d).

  After that, a hole 14 for a through hole penetrating in the thickness direction with a smaller diameter than the hole 22 of the core plate 21 is formed in the portion filled with the resin 32 of the copper clad laminate 13 (e), and the through hole plating 15 is performed. The through hole 16 is formed and the copper foils 41 on both sides are electrically connected (f). That is, in the through hole 16 portion, as shown in the cross-sectional view of FIG. 4, the resin 32 is located in the hole 22 of the core plate 21, and the through hole plating 15 exists inside the resin 32. .

  A portion A in which a plurality of through holes 16 are linearly arranged on one side 11a side of the metal core printed wiring board 11 shown in FIG. 2 is a portion for mounting a connector (not shown) in which a plurality of terminals are arranged in a row. In this portion, since the connector terminal pitch is narrow, the holes 22 in the core plate 21 are connected in the form of dumplings in which a plurality of holes are continuously arranged in a line as shown in FIG. Alternatively, it is formed in one continuous hole 22a, or as shown in FIG. 6A, it is formed in a slit-like long hole 22b.

  5, 6, and 7, (a) is a cross-sectional view of a portion A in which a plurality of through holes 16 are linearly arranged, and (b) is a vertical cross-section of a portion BB in (a). FIG.

  Thus, when the hole 22 of the core plate 21 becomes the communication hole 22a or the long hole 22b, since the core plate 21 does not exist between the through holes 16 (see FIG. 5B and FIG. 6B), the strength is low. . When the pitch of the terminals is larger than the diameter of the holes 22, the holes 22 c are formed as independent holes 22 c as shown in FIG. 7A, but the distance between the holes 22 c is narrow (see FIG. 7B). ) In this case, high strength cannot be expected.

  5, 6, and 7, the resin 32 is located in the hole 22 of the core plate 21, and the inside of the resin 32 is the same as the through hole 16 shown in FIG. 4. In this state, the through-hole plating 15 is present.

  After the through hole 16 is formed, a wiring pattern 17 is formed by etching (see FIG. 3G), and a solder resist 18 is applied to a portion on the surface where insulation is required (see FIG. 3H).

  Finally, in order to remove unnecessary portions around the product or to divide it into product sizes, punching with a mold (see FIG. 11) is performed, and a desired metal core printed wiring board 11 for each wiring pattern (see FIG. 2). )

  In the present invention, as described above, since the strength of the portion A in which the plurality of through holes 16 are linearly arranged on the side 11a side of the metal core printed wiring board 11 is low, the solder resist 18 is damaged at the time of punching with a mold. The prepreg 31 is stacked on the core plate 21 so as to suppress the occurrence of the prepreg. That is, as shown in FIGS. 1 and 2, for the prepreg 31 laminated on both surfaces of the core plate 21, the arrangement direction y of the plurality of through holes 16 arranged in a straight line parallel to the side 11 a side, In other words, the arrangement direction y (see FIGS. 5 and 7) or the length direction y (see FIG. 6) of the holes 22 formed in the core plate 21 and the direction X (manufacturing) when the prepreg 31 is manufactured. The layers are laminated so that the longitudinal direction of the time and the direction in which the density of the fibers of the glass cloth 33 constituting the prepreg 31 is high) are substantially orthogonal. In the present invention, “substantially orthogonal” means including orthogonal.

Here, the prepreg 31 will be described.
As shown in FIG. 8, the prepreg 31 has a structure in which a glass cloth 33 is impregnated with a varnish as a resin (thermosetting resin), and has a plate shape.

The glass cloth 33 is as follows.
A bundle of dozens to several hundreds of glass fiber filaments, each having a diameter of several μm to several tens of μm, is called a strand, and one obtained by twisting the strand is called a yarn. This yarn is made of warp (warp) and weft (weft), and plain weave is a glass cloth. Warp yarns and weft yarns are generally woven in such a manner that yarns having the same specifications are used and arranged at a predetermined density (the number of yarns per unit width). In some cases, strands may be plain woven as warps and wefts instead of yarns.

  The prepreg 31 is manufactured as shown in FIG.

  The belt-shaped glass cloth 33 is immersed in the varnish 32a while being transported in a state where tension is applied in the longitudinal direction. And when it comes out of the varnish 32a, it heats with the heater 61 and the varnish 32a is dried and semi-hardened. Thereafter, the long plate is cut into a predetermined size by the cutter 62.

  Since the prepreg 31 manufactured in this way is manufactured in a state in which tension is applied as described above, the mechanical strength differs depending on whether it is the longitudinal direction X or the direction Y orthogonal thereto.

  In other words, the glass cloth 33 is manufactured with the warp direction in the plain weaving as the longitudinal direction. Therefore, the warp direction in the plain weaving is the longitudinal direction in order to continuously manufacture the glass cloth 33 when processing into the prepreg 31 thereafter. Processed. Therefore, tension is applied in the warp direction (longitudinal direction X) as described above. In other words, it can be said that the yarn density in the vertical direction is high from the state of the glass cloth 33 before becoming the prepreg 31.

  Further, the glass cloth 33 is tightly stretched in the tensioned direction, and the glass cloth 33 is knitted so as to sew between the tensioned glass cloths 33 in the direction orthogonal to the tension direction. In FIG. 31, the glass cloth 33 in the longitudinal direction X is straighter than the Y direction orthogonal to the longitudinal direction X, and the glass cloth 33 in the Y direction is more wavy. Thereby, the bending rigidity in the X direction becomes higher than the bending rigidity in the Y direction.

  Thus, the yarn density increases in the tensioned direction, and both the tensile strength and bending rigidity increase.

Specifically, the bending elastic modulus in a state where eight prepregs made of glass cloth and epoxy resin are laminated and cured is 2400 kN / cm ² in the longitudinal direction X and 2200 kN / cm in the direction Y orthogonal thereto. cm ² . In addition to this, in the 2500kN / cm ² in the longitudinal direction X, the same or that of 2300kN / cm ² in the orthogonal direction Y, at 2300kN / cm ² in the longitudinal direction X, 2100kN / cm in the direction Y at the same perpendicular There are prepregs 31 with multiple specifications, such as ^two . As the prepreg 31 to be used, one having an appropriate bending elastic modulus is selected according to the size of the metal core printed wiring board 11, the specification of the hole 22, the required strength, and the like.

  As described above, some prepregs 31 have different bending elastic coefficients, but all have high strength in the longitudinal direction X.

  When the appearance is observed, the density of the glass cloth 33 is higher in the longitudinal direction X in which the tension is applied than in the direction Y orthogonal thereto, as shown schematically in FIG. is there. Actually, the glass cloth 33 has a density in the longitudinal direction X (longitudinal direction) of about 44 (number of yarns per 25 mm width) and a density in the direction Y (lateral direction) perpendicular to the longitudinal direction X of 32. Degree.

  When laminating such a prepreg 31 on both surfaces of the perforated core plate 21, as shown in FIG. 1, the arrangement direction y of the holes 22 formed in a position near the portion to be punched later in the core plate 21 or The length direction y and the direction X in which the fiber density of the glass cloth 33 is increased by applying tension to the longitudinal direction of the glass cloth 33 at the time of manufacturing the prepreg 31 are orthogonal to each other. Then, the metal core printed wiring board 11 manufactured using the core plate 21 and the prepreg 31 has high mechanical strength of the insulating layer 12 in the X direction of FIGS.

  As shown in FIG. 11, the punching process using the above-described mold is performed by holding the product side portion in the thickness direction by a pair of upper and lower molds 51 and 52, and the removal side part also by a pair of upper and lower molds 53 and 54. Punching is performed by clamping in the thickness direction and relatively moving in the vertical direction. In the figure, relief portions 51a and 52a formed on the inner surfaces of the molds 51 and 52 sandwiching the product side portion absorb the thickness of the wiring pattern 18 and protect the wiring pattern 18 and the like. .

  As described above, since the mechanical strength of the insulating layer 12 is high, a shearing force acts when punching with the molds 51, 52, 53, and 54 regardless of the specifications of the prepreg. When bending stress is applied, the solder resist 18 applied to the surface of the insulating layer 12 can be prevented from being cracked or chipped and damaged.

  That is, a plurality of through holes 16 are linearly arranged on the side 11a side, which is a position close to the outer peripheral edge to be punched, and the space of the core plate 21 is large so that a decrease in strength can be considered. In addition, since the strength of the insulating layer 12 sandwiching the core plate 21 is high, even when bending stress is applied during shearing, bending at the side on the side 11a side can be suppressed. For this reason, even if it is the metal core printed wiring board 11 of the laminated structure, since bending strength improves, the bending in a metal mold | die at the time of a shear becomes small, and a shear can be performed neatly.

  As a result, as described above, damage to the solder resist 18 on the surface of the insulating layer 12 can be suppressed. Further, since it is possible to prevent the solder resist 18 from being cracked or chipped, it is possible to prevent inconvenience such as copper migration, so that the performance of the metal core printed wiring board 11 can be improved and defective products can be produced. Can be suppressed.

The above is one form for implementing this invention, This invention is not limited only to said structure, Other structures can also be employ | adopted.
For example, the through-hole arrangement direction y and the arrangement direction or length direction y of the holes formed in the core plate, the direction X in which tension was applied during manufacture of the prepreg, and the density of fibers of the glass cloth constituting the prepreg are high. The direction X is perpendicular to the direction X, and may intersect at an appropriate angle.

DESCRIPTION OF SYMBOLS 11 ... Metal core printed wiring board 11a ... One side 16 ... Through hole 21 ... Core board 22 ... Hole 22a ... Continuous hole 22b ... Slit-like long hole 22c ... Independent hole 31 ... Prepreg 33 ... Glass cloth y ... Direction of arrangement of through hole , Arrangement direction or length direction of holes formed in the core plate X: direction in which tension is applied during manufacture of the prepreg, direction in which the density of the fibers of the glass cloth constituting the prepreg is high

Claims (6)

A metal core printed wiring board formed by laminating a metal core plate and a prepreg made of glass cloth impregnated with resin,
A plurality of through holes are arranged in a straight line on one side,
A metal core printed wiring board in which an arrangement direction of the through holes and a direction in which a tension is applied at the time of manufacturing a prepreg is substantially orthogonal. A metal core printed wiring board in which a plurality of through holes are linearly arranged on one side,
A metal core printed wiring board in which the arrangement direction of the through holes and the direction in which the density of the yarns or strands of the glass cloth constituting the prepreg is substantially orthogonal. 3. The metal core printed wiring according to claim 1, wherein the hole provided in the core plate serving as a metal core for forming the through hole is a single continuous hole in which a plurality of holes are continuously arranged in a line. Board. 3. The metal core printed wiring board according to claim 1, wherein a hole formed in a core plate serving as a metal core for forming the through hole is a slit-like long hole. A method of manufacturing a metal core printed wiring board in which a plurality of through holes are linearly arranged on one side,
When prepregs are laminated on both surfaces of a core plate to be a metal core, the arrangement direction or length direction of the holes formed in the core plate to form the through holes and the direction in which tension is applied during the manufacture of the prepreg A manufacturing method of a metal core printed wiring board laminated so as to be substantially orthogonal. A method of manufacturing a metal core printed wiring board in which a plurality of through holes are linearly arranged on one side,
When the prepreg is laminated on both surfaces of the core plate to be a metal core, the arrangement direction or length direction of the holes formed in the core plate to form the through hole and the density of the yarn or strand of the glass cloth constituting the prepreg A method of manufacturing a metal core printed wiring board that is laminated so that the direction in which the height is high is substantially orthogonal.

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