KR102404318B1 - Printed circuit board and manufacturing method of the same - Google Patents

Abstract

One aspect of the present invention is formed on at least one of a core portion, a plurality of rod-shaped vertical electrodes penetrating the core portion in a thickness direction, and upper and lower portions of the core portion, and electrically at least a portion of the plurality of vertical electrodes. It provides a printed circuit board including a wiring layer for connecting.

Description

Printed circuit board and manufacturing method thereof

The present invention relates to a printed circuit board and a method for manufacturing the same.

Recently, the need to improve the heat dissipation characteristics or stability of the printed circuit board is emerging. In particular, electronic device packages are miniaturized and complex, such as MCP (Multi Chip Package), which stacks several semiconductor chips on one substrate, or POP (Package On Package), which stacks multiple substrates on which semiconductor chips are mounted. Accordingly, printed circuit boards for electronic device packages are required to have improved heat dissipation characteristics, stability, reliability, and the like.

Printed circuit boards generally use CCL (Copper Clad Laminate) as a base to form through-holes in the base by laser or mechanical processing, and then, through processes such as exposure, development, plating, and etching, conductive vias and wiring layers are formed. to form However, in the case of a through hole formed by a laser or mechanical processing method, there are many variations in size, shape, alignment method, etc. depending on processing conditions. In addition, in the case of the printed circuit board obtained in this way, there is a problem in that the heat generated in the upper IC, etc. cannot be effectively dissipated due to low thermal conductivity.

One object of the present invention is to provide a printed circuit board in which heat dissipation and mechanical properties can be improved by using a rod-shaped vertical electrode instead of a conventional conductive via, and a method for efficiently manufacturing the same.

One aspect of the present invention is

A magnetic body and a coil pattern part embedded in the magnetic body, the coil pattern part including a spiral-shaped internal coil part and a lead part connected to an end of the internal coil part and exposed to the outside of the magnetic body, wherein the lead part includes the Provided is a chip electronic component that is connected to an end of an internal coil and protrudes outwardly therefrom and includes a plurality of protrusions that are spaced apart from each other.

In an embodiment of the present invention, the space between the plurality of protrusions may be filled with a material constituting the magnetic body.

One aspect of the present invention is

A core part, a plurality of rod-shaped vertical electrodes penetrating the core part in a thickness direction, and a wiring layer formed on at least one of upper and lower portions of the core part and electrically connecting at least some of the plurality of vertical electrodes A printed circuit board is provided.

In an embodiment of the present invention, the plurality of vertical electrodes may be arranged at regular intervals and sizes.

In an embodiment of the present invention, a total volume of the plurality of vertical electrodes may be greater than a volume of the core part.

In an embodiment of the present invention, a stopper may be formed on at least one end of some of the plurality of vertical electrodes so that the one end is not exposed to the outside.

In one embodiment of the present invention, it is disposed on at least one of the upper and lower portions of the core portion, and further comprising an insulating layer and a buildup layer including a plurality of conductive vias electrically connected to the wiring layer through the insulating layer. can

In an embodiment of the present invention, diameters of the plurality of conductive vias may be greater than diameters of the plurality of vertical electrodes.

In an embodiment of the present invention, the plurality of vertical electrodes may be formed in a cylindrical shape, and may be formed so that the side surfaces do not have a tapered shape.

In an embodiment of the present invention, the plurality of vertical electrodes may be formed to have a single layer based on the width direction of the core part.

In an embodiment of the present invention, the plurality of vertical electrodes may include at least one of copper and carbon nanotubes (CNT).

On the other hand, another aspect of the present invention,

Providing a plurality of rod-shaped vertical electrodes, forming a core portion formed to surround the plurality of vertical electrodes and having a shape penetrated in the thickness direction by the plurality of vertical electrodes, and upper and lower surfaces of the core portion It provides a printed circuit board manufacturing method comprising the step of forming a wiring layer connecting at least a portion of the plurality of vertical electrodes to at least one of the.

In an embodiment of the present invention, the plurality of vertical electrodes may be arranged at regular intervals and sizes.

In an embodiment of the present invention, in the step of providing the plurality of vertical electrodes, the plurality of vertical electrodes may be provided in a form attached to a carrier film.

In an embodiment of the present invention, forming the core part may include injecting a resin into a molding mold and impregnating the plurality of vertical electrodes in the resin.

In an embodiment of the present invention, a protective layer made of a flexible material may be formed on the bottom surface of the molding mold.

In an embodiment of the present invention, the method may further include curing the resin after impregnating the plurality of vertical electrodes and removing the molding mold and the protective layer from the plurality of vertical electrodes.

In an embodiment of the present invention, after the step of removing the molding mold and the protective layer, the method may further include removing portions in which the plurality of vertical electrodes protrude from the core in the region from which the protective layer is removed. can

In one embodiment of the present invention, after the forming of the core part, the method may further include removing a region corresponding to at least one end of some of the plurality of vertical electrodes and forming a stopper in the thus removed region. .

In an embodiment of the present invention, after forming the core part, the method may further include preparing a plurality of unit bodies by cutting the core part and the plurality of vertical electrodes perpendicular to the longitudinal direction of the plurality of vertical electrodes. can

In an embodiment of the present invention, the method may further include arranging the plurality of units to form columns and rows.

As one effect among various effects of the present invention, by using a rod-shaped vertical electrode instead of a conventional conductive via, heat dissipation characteristics and mechanical characteristics of the printed circuit board can be improved, and furthermore, such a printed circuit board can be efficiently manufactured A manufacturing method can be provided.

Various and advantageous advantages and effects of the present invention are not limited to the above, and will be more easily understood in the course of describing specific embodiments of the present invention.

1 is a cross-sectional view schematically showing a printed circuit board according to an embodiment of the present invention.
2 to 14 are process diagrams schematically illustrating a method of manufacturing a printed circuit board according to a temporary embodiment of the present invention.
15 to 18 are process diagrams schematically illustrating a method of manufacturing a printed circuit board according to a modified embodiment.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present embodiments may be modified in other forms or various embodiments may be combined with each other, and the scope of the present invention is not limited to the embodiments described below. In addition, the present embodiments are provided to more completely explain the present invention to those of ordinary skill in the art. For example, shapes and sizes of elements in the drawings may be exaggerated for clearer description.

Meanwhile, the expression “one example” used in this specification does not mean the same embodiment as each other, and is provided to emphasize and explain different unique features. However, the embodiments presented in the description below are not excluded from being implemented in combination with features of other embodiments. For example, even if a matter described in a specific embodiment is not described in another embodiment, it may be understood as a description related to another embodiment unless a description contradicts or contradicts the matter in another embodiment.

1 is a cross-sectional view schematically showing a printed circuit board according to an embodiment of the present invention. Referring to FIG. 1 , a printed circuit board 100 according to an embodiment of the present invention includes a core part 101 , a plurality of vertical electrodes 102 , wiring layers 103 and 106 , an insulating layer 104 , and conductive vias. 105 and a solder resist layer 107 may be included. Hereinafter, the components of the printed circuit board 100 will be described in detail.

The core part 101 forms a core region of the printed circuit board 100 , and the shape thereof is not particularly limited, but may be formed in a plate shape. The core part 101 may be basically made of an insulating material, and the insulating material includes, for example, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a reinforcing material such as glass fiber or an inorganic filler. An impregnated resin, for example, a prepreg (PPG) may be used, but is not particularly limited thereto. That is, as will be described later, if a material suitable for molding the vertical electrode 102 is formed in the form of a non-conductive paste and then cured, the core part 101 may be obtained.

The vertical electrode 102 is provided in the shape of a rod penetrating the core portion in the thickness direction, and performs a function of electrically connecting the wiring layers 103 and 106 formed on the upper and lower surfaces of the printed circuit board 100, a heat dissipation function, and the like. can do. In this case, the rod shape may be understood as a structure in which the length is longer than the width of the upper and lower surfaces.

In the present embodiment, the plurality of vertical electrodes 102 are different in terms of processing method, structure, and the like, compared to conductive vias that are conventionally used for a similar purpose. Specifically, in terms of processing method, the vertical electrode 102 can be obtained independently and then molded by the core part 101, which is formed by punching a hole in the core part 101 and filling it. distinguished In the conventional method, after forming a hole in the core part 101 by laser or machining, electroless plating and electrolytic plating are sequentially performed in the hole to form a conductive via. The conductive via formed in this way typically has a tapered shape, and is formed in a form divided into a plurality of layers by using two plating processes.

In comparison, the plurality of vertical electrodes 102 proposed in this embodiment may be provided in a rod shape, for example, a cylindrical shape, which may be understood as a form in which the side surface of the vertical electrode 102 is not substantially tapered. There will be. In addition, in terms of the manufacturing method, since it is not necessary to perform plating on the holes of the core part 101 by molding them into the core part 101 using a plurality of pre-fabricated vertical electrodes 102 , the conventional conductive via Also, there is no need to carry out the two-step plating process. Accordingly, the vertical electrode 102 may be formed to have a single layer based on the width direction of the core part 101 .

Furthermore, the plurality of vertical electrodes 102 is not essential in that it is not obtained by processing the core portion 101 and then filling it as described above, but it is relatively easy to form the plurality of vertical electrodes 102 regularly. It can be arranged by spacing and size. In the case of the process of drilling a hole in the core part 101, there is a problem that the deviation increases in size and alignment position as the number of holes increases, and this problem does not occur by employing the vertical electrode 102 in the present embodiment. made not to

According to the present embodiment, by using a method of manufacturing a plurality of vertical electrodes 102 in advance and then molding them into the core part 101, the size of the vertical electrodes 102 and the distance between them can be reduced. Accordingly, a relatively large amount of vertical electrodes 102 may be disposed in the core portion 101 . As described above, as the volume of the vertical electrode 102 occupied in the core part 101 increases, electrical characteristics may be improved and, in particular, a heat dissipation function may be improved. That is, the heat generated from the IC chip can be more easily discharged to the outside along the vertical electrode 102 increased in volume, which is a material in which the vertical electrode 102 has significantly higher thermal conductivity than the core portion 101 . , for example, because it may be made of copper, nickel, silver, or the like.

In this case, the volume occupied by the vertical electrode 102 in the core part 101 may be appropriately adjusted, but according to the inventor's own research, the total volume of the plurality of vertical electrodes 102 is the core part ( 101), that is, when the volume occupied by the vertical electrode 102 when viewed as a whole of the core portion 101 and the vertical electrode 102 is greater than 50%, excellent heat dissipation without compromising other characteristics performance could be obtained. In addition, considering that the material constituting the vertical electrode 102 has superior mechanical strength than the material constituting the core part 101 , the amount of the vertical electrode 102 is increased to increase mechanical rigidity such as bending, tensile, and shrinkage characteristics. could be improved In consideration of such heat dissipation function, electrical conduction function, mechanical properties, etc., a preferable material for the vertical electrode 102 is copper. will be able to use materials that are not widely used.

On the other hand, as can be seen in FIG. 1 , in the case of some of the plurality of vertical electrodes 102 that do not need to be connected to the wiring layer 103 , a stopper P is formed at one or both ends of the plurality of vertical electrodes 102 so that the one or both ends are connected to each other. It can be prevented from being exposed to the outside. Any material may be used for the plug portion P as long as it has an electrically insulating material, and both the same material as the core portion 101 and a different material may be used. Among the plurality of vertical electrodes 102 , those in which the stopper portion P is not formed may be appropriately connected to the wiring layer 103 as shown in FIG. 1 , but in FIG. 1 , the upper and lower portions of the core portion 101 . Although the form in which the wiring layer 103 is formed is shown in all of them, the wiring layer 103 may be formed only on the upper portion or the lower portion of the core portion 101 if necessary.

A build-up layer for electrical wiring is disposed on the upper and lower portions of the core part 101 , and the build-up layer includes an insulating layer 104 and a plurality of conductive layers electrically connected to the wiring layer 103 through the insulating layer 104 . The structure may include a via 105 and a wiring layer 106 . In addition, a solder resist layer 107 exposing a portion of the wiring layer 106 to the outside in an appropriate pattern shape may be formed on the build-up layer. In this case, the wiring layer 106 may be referred to as a second wiring layer 106 to distinguish it from the wiring layer 103 directly connected to the vertical electrode 102 . In addition, although FIG. 1 shows a form in which the buildup layer is formed on both the upper and lower portions of the core part 101 , the buildup layer may be formed only on the upper part or the lower part of the core part 101 if necessary.

The conductive via 105 included in the build-up layer is obtained in a different way from the aforementioned rod-shaped vertical electrode, and thus may have a different shape. Specifically, the conductive via 105 may be obtained by drilling a hole in the insulating layer 104 and filling it, and may have a tapered shape as shown in FIG. 1 . In addition, the diameter of the conductive via 105 may be larger than that of the vertical electrode 102 that may be formed in a relatively small size.

Hereinafter, a method for efficiently manufacturing the above-described printed circuit board will be described, and the above-described components may be understood in more detail through the description of the following manufacturing method. 2 to 14 are process diagrams schematically illustrating a method of manufacturing a printed circuit board according to a temporary embodiment of the present invention, and FIGS. 15 to 18 are process diagrams schematically illustrating a method of manufacturing a printed circuit board according to a modified embodiment.

First, the method of manufacturing a printed circuit board according to the present embodiment includes, first, providing a plurality of rod-shaped vertical electrodes 102 and forming the core portion 101 to surround them, specifically, As shown in FIG. 2 , the plurality of vertical electrodes 102 may be provided in a form attached to the carrier film 200 . In this case, the plurality of vertical electrodes 102 may be obtained by a separate process capable of forming a rod structure and then attached to the carrier film 200 , otherwise, directly on the carrier film 200 based on the seed layer. may be growing. As described above, the plurality of vertical electrodes 102 attached to the carrier film 200 may be arranged at regular intervals and sizes.

As can be seen in FIG. 3 , the plurality of vertical electrodes 102 attached to the carrier film 200 is impregnated with the resin injected into the molding mold 300 , and then the plurality of vertical electrodes 102 through an appropriate curing step. ) may form the core part 101 having a penetrating shape in the thickness direction. In this case, a protective layer 301 made of a soft material may be formed on the bottom surface of the molding mold 300 . The protective layer 301 serves to protect the vertical electrode 102 during the impregnation process and is subsequently polished. It allows the thickness of the plurality of vertical electrodes 102 to be uniform.

Subsequently, in the state impregnated in the molding mold 300 , the resin is cured, and thereafter, the carrier film 200 , the molding mold 300 and the protective layer 301 are removed from the plurality of vertical electrodes 102 . do. The state in which the carrier film 200, the molding mold 300 and the protective layer 301 are removed is as shown in FIG. 4, and then, an appropriate polishing process is performed for the vertical electrode 102 so that the thickness becomes uniform. can do. That is, in the region where the protective layer 301 is removed, the plurality of vertical electrodes 102 remove the protruding portion from the core portion 101, and this removal process is a suitable mechanical, chemical, or combination thereof known in the art. Polishing methods may be used. 5 is a perspective view illustrating the core part 101 and the vertical electrode 102 after the polishing process is completed. As described above, when the manufacturing method according to the present embodiment is used, there is no need to separately drill a hole in the core part 101 to form the through-type via electrode, so process convenience is increased and the uniformity of the vertical electrode 102 is increased. and heat dissipation characteristics can be expected to be improved.

Thereafter, a stopper P is formed on a portion of the vertical electrode 102 . Specifically, as shown in FIG. 6 , the end of the vertical electrode 102 is removed using an etching process after the mask 400 is formed in an area excluding the area where the stopper is to be formed, and the stopper is located in the removed area. (P) is formed. 7 and 8 show a state in which the mask 400 is removed after forming the stopper P, and corresponds to a cross-sectional view and a perspective view, respectively.

Thereafter, as shown in FIGS. 9 and 10 , a wiring layer 103 is formed to be electrically connected to the vertical electrode 102 . The wiring layer 103 may be obtained by forming a metal material having high electrical conductivity, such as copper, nickel, silver, etc., on the entire upper and lower portions of the core part 101 , and then removing a portion to pattern it into an appropriate shape.

Next, a build-up layer is formed. First, as shown in FIG. 11 , an insulating layer 104 is formed. The insulating layer 104 may also be obtained by forming the whole on the wiring layer 103 and then patterning it in an appropriate shape by removing a portion thereof. The insulating layer 104 may be any electrically insulating material suitable for use in a printed circuit board, and may be made of the same or different material as the core part 101 .

Next, as shown in FIGS. 12 and 13 , a conductive via 105 penetrating through the insulating layer 104 and a wiring layer 106 connected thereto are formed. Thereafter, as shown in FIG. 14 , a solder resist layer 107 is formed on the outermost part of the printed circuit board 100 , and it is provided in an appropriate shape according to a design or a necessary function as a form suitable for use as an IC package substrate, etc. it could be

A manufacturing method of the form applied from the above-described manufacturing method will be described with reference to FIGS. 15 to 18 . The manufacturing method applied below may be implemented together with or separately from the above-mentioned manufacturing method.

First, as shown in FIG. 15 , a plurality of vertical electrodes 102 attached to the carrier film 200 are provided, and a process related thereto is the same as in the previous embodiment. Thereafter, the core part 101 is formed so that the vertical electrode 102 is disposed therein, and the core part 101 forming process is also the same as the previous embodiment, that is, a method of impregnating the vertical electrode in the molding mold. is available.

Next, before forming the wiring layer, the core portion 101 and the plurality of vertical electrodes 102 are cut perpendicularly to the longitudinal direction of the plurality of vertical electrodes 102 , that is, in the width direction of the core portion 101 . A plurality of unit bodies (C) are provided. The plurality of unit bodies C thus obtained are arranged to form columns and rows as shown in FIG. 18 , whereby the plate-shaped core part 101 can be obtained. It can be processed into a shape by the manufacturing method of the applied shape described above.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited by the appended claims. Therefore, various types of substitution, modification and change will be possible by those skilled in the art within the scope not departing from the technical spirit of the present invention described in the claims, and it is also said that it falls within the scope of the present invention. something to do.

100: printed circuit board
101: core part
102: vertical electrode
103: wiring layer
104: insulating layer
105: conductive via
106: wiring layer
107: solder resist layer
200: carrier film
300: molding mold
301: protective layer
400: mask

Claims (15)

core part;
a plurality of rod-shaped vertical electrodes penetrating the core portion in a thickness direction; and
a wiring layer formed on one surface of the core and formed in contact with at least a portion of the plurality of vertical electrodes; includes,
A stopper is formed on at least one end of some of the plurality of vertical electrodes so that the one end is not exposed to the outside,
The stopper part penetrates a part of the core part in the thickness direction, and is in direct contact with the core part,
printed circuit board.
The method of claim 1,
The plurality of vertical electrodes are arranged at regular intervals and sizes.
The method of claim 1,
A total volume of the plurality of vertical electrodes is greater than a volume of the core part.
According to claim 1,
The printed circuit board further comprising a build-up layer disposed on at least one of an upper portion and a lower portion of the core portion and including an insulating layer and a plurality of conductive vias passing through the insulating layer and electrically connected to the wiring layer.
5. The method of claim 4,
A diameter of the plurality of conductive vias is greater than a diameter of the plurality of vertical electrodes.
According to claim 1,
The plurality of vertical electrodes are formed in a cylindrical shape, the printed circuit board is formed so as not to have a tapered shape.
According to claim 1,
The plurality of vertical electrodes is a printed circuit board formed to have a single layer based on the width direction of the core portion.
According to claim 1,
The plurality of vertical electrodes is a printed circuit board including at least one material of copper and carbon nanotubes (CNT).
providing a plurality of vertical electrodes in the shape of a rod;
forming a core part formed to surround the plurality of vertical electrodes and having a shape penetrated in a thickness direction by the plurality of vertical electrodes;
removing a region corresponding to at least one end of a portion of the plurality of vertical electrodes and forming a stopper in the removed region; and
forming a wiring layer in contact with at least a portion of the plurality of vertical electrodes on one surface of the core part; includes,
The stopper part penetrates a part of the core part in the thickness direction, and is in direct contact with the core part,
A method for manufacturing a printed circuit board.
10. The method of claim 9,
The plurality of vertical electrodes are arranged at regular intervals and sizes in a printed circuit board manufacturing method.
10. The method of claim 9,
In the step of providing the plurality of vertical electrodes, the plurality of vertical electrodes are provided in a form attached to a carrier film.
10. The method of claim 9,
The step of forming the core part,
A method for manufacturing a printed circuit board, comprising: injecting a resin into a molding mold; and impregnating the resin with the plurality of vertical electrodes.
13. The method of claim 12,
A method for manufacturing a printed circuit board in which a protective layer made of a flexible material is formed on the bottom surface of the molding mold.
14. The method of claim 13,
The printed circuit board manufacturing method further comprising curing the resin after impregnating the plurality of vertical electrodes and removing the molding mold and the protective layer from the plurality of vertical electrodes.
15. The method of claim 14,
After removing the molding mold and the protective layer,
The method of manufacturing a printed circuit board further comprising removing a portion in which the plurality of vertical electrodes protrude from the core in the region from which the protective layer is removed.

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