JP2010171095A5 - - Google Patents

Download PDF

Info

Publication number
JP2010171095A5
JP2010171095A5 JP2009010539A JP2009010539A JP2010171095A5 JP 2010171095 A5 JP2010171095 A5 JP 2010171095A5 JP 2009010539 A JP2009010539 A JP 2009010539A JP 2009010539 A JP2009010539 A JP 2009010539A JP 2010171095 A5 JP2010171095 A5 JP 2010171095A5
Authority
JP
Japan
Prior art keywords
wiring pattern
pair
gap
land portions
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009010539A
Other languages
Japanese (ja)
Other versions
JP2010171095A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2009010539A priority Critical patent/JP2010171095A/en
Priority claimed from JP2009010539A external-priority patent/JP2010171095A/en
Publication of JP2010171095A publication Critical patent/JP2010171095A/en
Publication of JP2010171095A5 publication Critical patent/JP2010171095A5/ja
Pending legal-status Critical Current

Links

Claims (3)

絶縁基板上に固着された配線パターンに電子部品が接続されるプリント配線基板において、
電子部品の接続部近傍の配線パターンに、隙間を有して互いに対向する一対のランド部が設けられ、さらに、該一対のランド部を前記隙間を跨がるようにして接続する溶融可能な部材が設けられ、
電子部品に過電流が流れた際に発生する熱により前記部材が溶融して、前記一対のランド部の双方を分離することを特徴とするプリント配線基板。 In a printed wiring board in which electronic components are connected to a wiring pattern fixed on an insulating substrate,
A meltable member that has a pair of land portions facing each other with a gap in the wiring pattern in the vicinity of the connection portion of the electronic component, and further connects the pair of land portions across the gap. Is provided,
Printed circuit board by melting the previous SL member by heat generated when an overcurrent flows through the electronic component, and separating both of the pair of the land portions. 前記配線パターンの各ランド部は、当該配線パターンの長手方向において互いに反対方向に凹んで形成され、該凹みにより形成された隙間を跨がる前記溶融可能な部材によって接続されていることを特徴とする請求項１記載のプリント配線基板。 Each land part of the wiring pattern is formed to be recessed in opposite directions in the longitudinal direction of the wiring pattern, and is connected by the meltable member straddling the gap formed by the recess. The printed wiring board according to claim 1. 前記溶融可能な部材は、低融点部材であることを特徴とする請求項１又は２記載のプリント配線基板。The printed wiring board according to claim 1, wherein the meltable member is a low melting point member.
JP2009010539A 2009-01-21 2009-01-21 Printed circuit board Pending JP2010171095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009010539A JP2010171095A (en) 2009-01-21 2009-01-21 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009010539A JP2010171095A (en) 2009-01-21 2009-01-21 Printed circuit board

Publications (2)

Publication Number Publication Date
JP2010171095A JP2010171095A (en) 2010-08-05
JP2010171095A5 true JP2010171095A5 (en) 2011-08-04

Family

ID=42702962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009010539A Pending JP2010171095A (en) 2009-01-21 2009-01-21 Printed circuit board

Country Status (1)

Country Link
JP (1) JP2010171095A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014115588B4 (en) 2014-10-27 2022-04-28 Lisa Dräxlmaier GmbH Security device and method for manufacturing a security device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09161635A (en) * 1995-12-14 1997-06-20 S M C:Kk Temperature fuse and manufacture thereof
JP2005203686A (en) * 2004-01-19 2005-07-28 Funai Electric Co Ltd Printed-circuit board

Similar Documents

Publication Publication Date Title
JP2012060132A5 (en)
WO2013190604A1 (en) Circuit substrate
DE502007002406D1 (en) PCB WITH ADDITIONAL FUNCTIONAL ELEMENTS AS WELL AS MANUFACTURING PROCESS AND APPLICATION
ATE531241T1 (en) EMBLED CIRCUIT BOARD
WO2015035016A3 (en) High current interconnect system and method for use in a battery module
JP2006303360A5 (en)
EA201990574A1 (en) PCB FOR CONNECTING THE BATTERY ELEMENTS AND THE BATTERY BATTERY
JP2012500455A5 (en)
JP2009135470A5 (en)
JP2014036085A5 (en)
JP2011515862A5 (en)
JP6421491B2 (en) Electronics
WO2012175207A3 (en) Electronic assembly and method for the production thereof
DE602009001232D1 (en) Printed circuit board and manufacturing method for it
EP2706829A3 (en) Printed wiring board, printed circuit board, and printed circuit board manufacturing method
JP2013247225A5 (en)
WO2011140141A3 (en) Printed circuit board with embossed hollow heatsink pad
JP2017038046A5 (en)
SG170744A1 (en) Circuit board and connection substrate
JP2013168517A5 (en)
WO2011016341A3 (en) Voltage conversion apparatus and electrical load driving apparatus
WO2009054105A1 (en) Part built-in printed wiring board, and its manufacturing method
JP2015035531A5 (en)
JP2013058663A5 (en)
JP5737252B2 (en) Circuit device and manufacturing method thereof