JP2010170621A - Terminal connection structure for small space - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure to reliably connect terminals even in a small space. <P>SOLUTION: The connection structure includes:beams 12a having crossings arranged in the same pattern as a plurality of grid-like pads 11; a thin conductive metal plate 12 formed concave and having conductive probes 13 in contact with the pads 11 at the crossing of the beams; a presser plate 15 to press the probes 13 of the thin plate 12 to the pads 11; and an elastic cushion 14 to distribute the pressure of the presser plate 15 to transmit it to the thin plate 12. The terminal connection structure for small space electrically connects the probes 13 to the pads 11 by pressing the probe 13 to the pads 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a narrow space terminal conducting structure capable of conducting a plurality of terminals in a narrow space, and is particularly suitable when wire bonding a ground wire to a plurality of terminals of a row bar on which a large number of magnetic head elements are mounted. The present invention relates to a terminal conduction structure for a narrow space.

  In recent years, magnetic heads for magnetic disk devices have produced a row bar by cutting a large number of semiconductor elements called wafers into rods, and in this row state, the gap depth of the magnetic head element is polished to a predetermined depth. In order to prevent electrostatic breakdown of the magnetic head element, it is necessary to perform the wire bonding work necessary for the wrapping work with the terminal of the magnetic head element grounded.

  As shown in FIG. 4, the wire bonding operation according to the prior art is performed by attaching a row bar 60 to the side surface of a mounting tool 50 made of a conductive material such as stainless steel (SUS) and attaching the magnetic head element terminal of the row bar 60 to the wire 80. In a state where a flexible substrate (PCB) 10 for conducting through one end of the PCB 10 is mounted on the mounting tool 50 and the pad 11 of the PCB 10 is grounded through the conducting bolt 52 and the mounting tool 50, the wire bonding mechanism 70 This is done by welding the other end of the wire 80 and the PCB 10.

  A technique for performing wire bonding while grounding the workpiece to be welded is described in, for example, the following Patent Document 1, which describes a technique in which a bonding pad on a chip is grounded through the inside of the chip. Has been.

  JP 2008-78626 A

  As shown in FIG. 4, the conventional apparatus that performs wire bonding while grounding the magnetic head element row bar presses a plurality of probes 13 against a plurality of pads 11 on the other end of the PCB 10 while holding the magnetic head element. In order to perform grounding, the lower surface of the wire bonding mechanism 70 interferes with the tip of the conduction bolt 52 for supporting the pressing plate 51, and the interval indicated by the symbol H in the drawing must be increased, and wire bonding work is performed. There was a problem that it was difficult. Specifically, the terminals of the magnetic head element are arranged at high density, the terminals of the PCB 10 provided at the corresponding positions are also arranged at high density, and the wire bonding mechanism 70 is also arranged at the above-described high density. Since it is necessary to perform bonding in close proximity to the arranged terminals, it is difficult to reduce the distance to 10 mm or less in the conventional apparatus, although the dimension required for the distance H is 2 mm or less. There was a defect that there was.

  An object of the present invention is to provide a terminal connection structure for a narrow space that can reliably contact a plurality of terminals and a probe even in a narrow space.

In order to achieve the above object, the present invention is a terminal conductive structure for a narrow space that conducts with a plurality of pads arranged in a grid pattern,
A conductive metal thin plate portion having a grid-like beam portion having intersections in the same arrangement as the plurality of pads, and a conductive protrusion contacting the plurality of pads at the intersection portion of the beam portions,
A first feature is that a pressing plate for pressing the protruding portion of the thin plate portion against a plurality of pads is provided.

  The second feature of the present invention is that, in the narrow space terminal conducting structure according to the first feature, the thin plate portion is bent so as to form a concave shape that accommodates the pressing plate therein.

  In the narrow space terminal conduction structure according to any one of the above features, the present invention provides a cushion having an elastic property that disperses the pressing force of the pressing plate and transmits it to the thin plate portion between the pressing plate and the thin plate portion. The arrangement is the third feature.

  According to a fourth aspect of the present invention, there is provided the narrow space terminal conducting structure according to any one of the above features, wherein the thin plate portion is grounded, and the thin plate portion is disposed in the narrow space terminal conducting structure according to any one of the above features. A fifth feature is that the material is stainless steel.

  A terminal conductive structure for a narrow space according to the present invention is a conductive metal having a grid-like beam portion having intersecting portions arranged in the same arrangement as a plurality of pads, and a conductive protrusion contacting the plurality of pads at the lattice-like intersecting portions. By having a thin plate portion made of metal and a pressing plate that presses against a plurality of pads arranged in a grid pattern with the protruding portion as a probe, the protruding portion can be uniformly pressed against the plurality of pads, and thus a narrow space Can be conducted with a plurality of pads.

The disassembled perspective view of the terminal conductive structure for narrow spaces by one Embodiment of this invention. The figure for demonstrating the probe by this embodiment. The side view of the terminal conductive structure for narrow spaces by this embodiment. The figure for demonstrating the wire bonding by a prior art.

Hereinafter, a terminal space structure for a narrow space according to an embodiment of the present invention will be described in detail with reference to the drawings.
As shown in the exploded perspective view of FIG. 1, the terminal conductive structure for a narrow space according to the present embodiment has a large number of probes 13 (protruding portions) projecting downward corresponding to a large number of pads 11 arranged in a grid on the PCB 10. ), A cushion 14 for pressing the probe 13 of the thin plate 12 with elasticity, and a pressing plate 15 for pressing the cushion 14. Incidentally, the pad 11 of the PCB 10 has 63 (3 × 21) plural terminals in a grid shape, and is a terminal for detecting a change in resistance value during lapping work. The terminal conduction structure for narrow space according to the present embodiment. Uses the pad 11 for grounding at the time of wire bonding.

  The thin plate 12 is manufactured from a conductive stainless steel (SUS) plate and has a lattice shape by punching a plurality of space portions 12b into a concave flat back portion as shown in FIG. A plurality of columnar probes 13 protruding in the direction of the pad 11 are formed by etching at the intersections of the beam portions 12a.

  For this reason, the probe 13 according to the present embodiment is elastically supported in the four directions of the cross by the beam portion 12a of the thin plate 12, and is pressed by the pressing plate 15 via the cushion 14 as shown in FIG. 11 evenly. The thin plate 12 is attached to the conduction bolt 52 of the mounting tool 50 shown in FIG. Therefore, in the terminal conduction structure for a narrow space according to the present embodiment, the probe 13 is elastically supported at the intersection of the lattice-like beam portions 12a, and the pressing plate 15 presses the upper surface of the cushion 14 in a plane. In addition, the magnetic head element can be grounded evenly and reliably even in a narrow space.

  The narrow space terminal conducting structure according to the present embodiment is formed by bending the thin plate 12 in order to fold a conductive long plate-shaped thin plate into a concave shape and house the cushion 14 and the pressing plate 15 in the concave portion. The height direction dimension including the probe 13 can be formed to 2 mm or less. Therefore, even when the wire bonding mechanism shown in FIG. 4 is used, wire bonding is performed while maintaining good grounding of the magnetic head element. Work can be done.

  11: pad, 12: thin plate, 12a: beam portion, 12b: space portion, 13: probe, 14: cushion, 15: pressing plate, 50: mount tool, 51: pressing plate, 52: conduction bolt, 60: rover, 70: Wire bonding mechanism, 80: Wire.

Claims (5)

A terminal conduction structure for a narrow space that conducts with a plurality of pads arranged in a grid pattern,
A thin plate portion made of conductive metal having lattice-shaped beam portions having intersections in the same arrangement as the plurality of pads, and conductive protrusions that contact the plurality of pads at the intersection portions of the beam portions,
A terminal conductive structure for a narrow space, comprising a pressing plate for pressing the protruding portion of the thin plate portion against a plurality of pads.   The terminal conduction structure for narrow spaces according to claim 1, wherein the thin plate portion is bent so as to form a concave shape that accommodates the pressing plate therein.   The terminal conduction structure for narrow spaces according to claim 1 or 2, wherein a cushion having an elastic characteristic for dispersing and transmitting the pressing force of the pressing plate to the thin plate portion is disposed between the pressing plate and the thin plate portion.   The terminal conduction structure for narrow spaces according to any one of claims 1 to 3, wherein the thin plate portion is grounded.   The terminal conduction structure for narrow spaces according to any one of claims 1 to 4, wherein a material of the thin plate portion is stainless steel.

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