JP2010161010A - Contact - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact with a structure in which barrier parts are provided in four direction around an elastic contact part to prevent intrusion of foreign materials in a movable area of the elastic contact part and flatness of a solder-jointed surface is not deteriorated when the barrier parts are formed in a bending process. <P>SOLUTION: The contact 1 is provided with a barrier part 7 arranged back-and-forth and right-and-left of an elastic contact part 5 and surrounding a periphery of the elastic contact part 5 from four sides. The barrier part 7 has a front wall part 11 or the like formed in a front side of the elastic contact part with a part of a thin sheet extending from a front end of a solder-jointed part 3 being bent upward, and a front side upright part 25 formed behind the front wall part 11. The front side upright part 25 enhances rigidity of the solder-jointed part 3, and furthermore, since the front wall part 11 and the front side upright part 25 have their V-shaped bent sides at a position opposed to each other when they are bent upward respectively, distortions at the solder-jointed part 3 generated at bending-process of each of them are offset. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention is mounted on a surface to be attached to a printed wiring board and sandwiched between the printed wiring board and a conductive member different from the printed wiring board, thereby providing a conductive pattern and a conductive property of the printed wiring board. The present invention relates to a contact for electrically connecting a member.

  Conventionally, the present applicant has already proposed a conductive member described in Patent Document 1 as this type of contact.

  The conductive member described in Patent Document 1 can be surface-mounted on the mounting target surface of a printed wiring board using an automatic mounting machine. If such a conductive member is used, for example, the printed wiring board side By electrically connecting the earth pattern and a part of the casing having the ground potential, noise countermeasures and the like could be achieved.

Japanese Patent No. 3425546

  By the way, when an electronic device is used for a long period of time, foreign matters such as dust and dust may be accumulated inside the electronic device. Therefore, when repairing such an electronic device, if the printed wiring board is removed from the electronic device body or the removed printed wiring board is attached to the electronic device body again, fine foreign objects will be caught in the gaps between the contacts. May get in. In the worst case, such a foreign substance becomes an obstacle, and a portion that functions as a contact with elastic deformation (hereinafter referred to as an elastic contact portion) may not be displaced as originally designed. .

  In this respect, since the conductive member described in Patent Document 1 has a structure in which three sides of the periphery of the elastic contact portion are surrounded by a barrier, foreign matters enter at least the inner side of the three sides with the barrier. This is restrained and helps maintain the function of the elastic contact as designed.

  However, since only the remaining one of the surroundings of the elastic contact portion has a structure without a barrier (see Patent Document 1: FIG. 1 (c)), foreign matters enter more than other directions only from this direction. The situation is easy. Therefore, in order to solve such a problem, it may be possible to provide a barrier on the other side.

  However, if a barrier is provided on all four sides around the elastic contact portion, there will be no open surface without the barrier. Therefore, when bending a metal thin plate, the inner side surrounded by the barrier (valley folds). The jig cannot be inserted into the side).

  For this reason, the jig is applied only to the outer side of the portion serving as the barrier, and the bending process is performed without applying the jig to the inner side surrounded by the barrier. As a result, when the portions extending from the front and rear ends of the bottom portion that becomes the solder joint portion are bent upward, the bottom portion bulges outward as compared with the case where a jig is applied to the inside (for example, the bottom portion is There is a possibility that another problem that the flatness of the solder joint surface is lowered tends to be caused.

  The present invention has been made in order to solve the above-described problem, and its purpose is to prevent foreign matter from entering the movable range of the elastic contact portion by providing four barrier portions around the elastic contact portion. An object of the present invention is to provide a contact that can be suppressed more than before and that has a structure that does not lower the flatness of the solder joint surface when such a barrier portion is formed by bending.

  Hereinafter, the configuration employed in the present invention will be described.

The contact according to claim 1 is:
It is formed by bending a thin metal plate, and when used, it is surface-mounted on the surface to which the printed wiring board is attached, and is sandwiched between the printed wiring board and another conductive member. A contact electrically connecting the conductive pattern and the conductive member provided in the printed wiring board,
A solder joint part whose bottom surface is a solder joint surface solder-bonded to the conductor pattern;
An elastic contact portion that is configured above the solder joint portion and is in a state of being pressed against the conductive member with elastic deformation when contacting the conductive member;
A barrier portion that is provided on the front, rear, left, and right sides of the elastic contact portion and surrounds the periphery of the elastic contact portion from four sides, and suppresses foreign matter from entering inside the enclosed range;
As the barrier portion,
A front wall portion formed on the front side of the elastic contact portion by bending a part of the thin plate extending from the front end of the solder joint portion upward;
A rear wall portion formed on the rear side of the elastic contact portion by bending a part of the thin plate extending from the rear end of the solder joint portion upward;
Any of bending a part of the thin plate extending from the left end portion of the front wall portion backward and bending a part of the thin plate extending from the left end portion of the rear wall portion forward. Either or both, a left wall formed on the left side of the elastic contact portion;
Any of bending a part of the thin plate extending from the right end portion of the front wall portion backward and bending a portion of the thin plate extending from the right end portion of the rear wall portion forward. A right wall portion formed on the right side of the elastic contact portion by one or both of the following:
The solder joint portion has an inner edge portion that forms the opening by forming an opening penetrating the solder joint surface in the vertical direction.
Further, “a front side standing portion formed at the rear of the front wall portion by bending a part of the thin plate extending backward from the front side of the inner edge portion”, “of the inner edge portion” A part of the thin plate extending from the rear side to the front side is bent upward to bend the rear side standing part formed in front of the rear wall part, "from the left side of the inner edge part to the right side. Bending a part of the thin plate extending upward to the left, the left standing part formed on the right side of the left wall part, and "extending from the right side of the inner edge part to the left side" At least one of the above four standing portions is provided by bending a part of the protruding thin plate upward to form a right standing portion formed on the left side of the right wall portion. It is characterized by being.

  In the configuration of the present invention, in order to briefly explain the relative positional relationship of each part, the front, rear, left, right, top and bottom directions are defined, but these directions are only the relative positional relationship of each part. It is only a definition for showing, and does not prescribe an attachment direction or the like when using the contact of the present invention. For example, in the configuration of the present invention described above, the solder joint portion defines that the lower surface is a solder joint surface. This is exemplified by a case where the solder joint surface is a lower surface. However, the use of the contact of the present invention does not prescribe the main point that the solder joint surface is always directed downward.

  Based on the above assumption, the description will be continued. According to the contact of the present invention, the elastic contact portion is surrounded from all sides by the front wall portion, the rear wall portion, the left wall portion, and the right wall portion as described above. Therefore, the effect of suppressing the entry of foreign matter into the movable range of the elastic contact portion is significantly higher than that of the contact having a structure in which at least one of the contacts is open.

  However, when the part that becomes the front wall part and the part that becomes the rear wall part are bent upward, there are a part that becomes the left wall part and a part that becomes the right wall part. It is more difficult to insert a tool and perform the bending process than in the case of a structure without a right wall portion or a left wall portion. Therefore, it is necessary to bend the part that becomes the front wall part and the part that becomes the rear wall part without applying a jig inside, and at this time, the solder joint part is deformed in the direction in which the solder joint surface swells. The intended force acts on the solder joint. Therefore, if no measures are taken, the flatness of the solder joint may be reduced.

  In this regard, in the contact of the present invention, as a first countermeasure, since an opening is formed in the solder joint portion, at least the area where the opening is formed does not bulge. Moreover, as a second countermeasure, the “at least one standing portion” described above is formed by bending a part of the thin plate extending from the inner edge portion upward. Therefore, such a standing portion functions as a rib that increases the rigidity of the solder joint, and deformation and bulge that reduce the flatness of the solder joint surface are suppressed.

  Therefore, according to the contact of the present invention, by providing the barrier portions in four directions around the elastic contact portion, it is possible to suppress the entry of foreign matter into the movable range of the elastic contact portion more than ever, and such When the barrier portion is formed by bending, the flatness of the solder joint surface is not lowered.

Next, the contact according to claim 2 is the contact according to claim 1,
As the at least one standing part, at least the front side standing part and the rear side standing part are provided,
The front wall portion and the front side standing portion are formed at positions where the valley-folded sides face each other when the upper wall portion is folded upward, and the rear wall portion and the rear side standing portion are respectively positioned above the upper side. It is characterized in that it is formed at a position where the valley-folded sides face each other when it is folded.

  According to the contact configured in this manner, the portion that becomes the front wall portion and the portion that easily bulges when the portion that becomes the rear wall portion is bent around the opening of the solder joint portion are the front standing portion, When the rear side standing portion is provided, it is twisted in the opposite direction to that when the front wall portion and the rear wall portion are provided, and the distortion in the bulging direction is offset. Therefore, compared to the case where only the right side erected part is provided as the standing part, or the case where only the left side erected part is provided, the effect of suppressing deformation / bulging that reduces the flatness of the solder joint surface is achieved. Can be increased.

Next, the contact according to claim 3 is the contact according to claim 1 or 2,
A part of the thin plate extending from the inner edge is bent upward to form the at least one standing portion, and then the one of the thin plates extended from the front end and the rear end of the solder joint portion, respectively. The front wall portion and the rear wall portion are formed by bending the portion upward.

  In the case of the contact configured as described above, since the standing portion as described above has a structure formed before the front wall portion and the rear wall portion, when forming the standing portion, The front wall part and the rear wall part do not get in the way, and the processing accuracy of the standing part can be improved as compared with the case where the front wall part and the rear wall part are formed first, and thus more processing is possible. A highly accurate contact can be obtained.

Next, the contact according to claim 4 is the contact according to any one of claims 1 to 3,
The elastic contact portion is curved from the base end and extends diagonally to the left, with the portion connected to the left end of the solder joint portion as a base end, and further curved through the inside of the left wall portion. It extends to the upper right, further curves and extends to the right, further curves and extends to the lower left, further curves and extends to the left and reaches the tip,
At least one of the front wall portion and the rear wall portion is formed with a spring tip hook portion on which the tip of the elastic contact portion is hooked, and the spring tip hook portion displaces the elastic contact portion upward. Is regulated.

  According to the contact configured as described above, the tip of the elastic contact portion is on the left side and below the right end of the portion extending rightward, and the tip at such a position is the spring-end hook portion. Since it is hooked, the spring-end hooking portion is also disposed below the portion of the elastic contact portion extending to the right.

  Accordingly, the spring tip hook is in a state of being disposed at a position surrounded by the elastic contact portion, and an object that contacts the contact is less likely to be caught by the spring tip hook, so that the spring tip hook is damaged. There is nothing.

The contact illustrated as embodiment of this invention is shown, (a) is the top view, (b) is the left view, (c) is the front view, (d) is the right view, (e) The bottom view. 1 shows the same contact as FIG. 1, (a) is a perspective view seen from the upper left front, (b) is a perspective view seen from the upper right rear, (c) is a perspective view seen from the lower left front, (d) ) Is a perspective view seen from the lower right rear. The contact usage state is shown, (a) is a longitudinal sectional view showing a state mounted on a printed wiring board, (b) is a longitudinal sectional view showing a state sandwiched between the printed wiring board and a member.

  Next, an embodiment of the present invention will be described with an example.

  FIG. 1 shows a contact exemplified as an embodiment of the present invention, wherein (a) is a plan view thereof, (b) is a left side view thereof, (c) is a front view thereof, (d) is a right side view thereof, (e) is a bottom view thereof. 2 also shows the same contact as FIG. 1, (a) is a perspective view seen from the upper left front, (b) is a perspective view seen from the upper right rear, and (c) is seen from the lower left front. (B) is the perspective view seen from the lower right back. 3A and 3B show a usage state of the contact, wherein FIG. 3A is a longitudinal sectional view showing a state of being mounted on a printed wiring board, and FIG. 3B is a longitudinal section showing a state of being sandwiched between the printed wiring board and a member. FIG.

  In the following description, the relative positional relationship of each part of the contact 1 will be described with the directions indicated by the arrows in FIGS. However, as already mentioned, these directions are merely definitions for indicating the relative positional relationship between the respective parts of the contact 1, and do not prescribe the mounting direction when the contact 1 is actually used.

  The contact 1 is a component that is surface-mounted on the surface to be attached to the printed wiring board P (see FIG. 3A), and is disposed between the printed wiring board P and a conductive member Q different from the printed wiring board P. By being sandwiched (see FIG. 3B), the conductive pattern provided in the printed wiring board P and the conductive member Q are electrically connected.

  The contact 1 is formed by punching a thin metal plate (in the case of this embodiment, the surface of the phosphor bronze for the spring is plated; plate thickness: 0.1 mm) by press working, and the predetermined shape is punched. It is formed by bending each part of the thing at a predetermined location.

  In the present embodiment, the contact 1 has a left-right dimension of 6.2 mm, a front-rear dimension of 3 mm, and a vertical dimension of a maximum of 5 mm. The vertical dimension of the printed circuit board P and the conductive member Q is When it is sandwiched between, it changes with the displacement of the movable part.

  Next, the form of the contact 1 will be described more specifically.

  As shown in FIGS. 1 and 2, the contact 1 includes a solder joint portion 3, an elastic contact portion 5, and a barrier portion 7.

  The lower surface of the solder joint portion 3 is a solder joint surface 9 that is soldered to the conductor pattern of the printed wiring board P.

  The elastic contact portion 5 is a portion formed above the solder joint portion 3, and comes into contact with the conductive member at the elastic contact portion 5. At this time, the elastic contact portion 5 becomes a conductive member with elastic deformation. It will be in a state of pressure contact.

  The barrier portion 7 is provided on the front, back, left and right of the elastic contact portion 5 and surrounds the elastic contact portion 5 from four sides, thereby suppressing foreign matter from entering the area surrounded by the barrier portion 7. is doing. As such a barrier part 7, in this embodiment, the front wall part 11, the rear wall part 12, the left wall parts 13A and 13B, and the right wall parts 14A and 14B are provided.

  The front wall portion 11 is formed on the front side of the elastic contact portion 5 by bending a part of a thin plate extending from the front end of the solder joint portion 3 upward. The rear wall portion 12 is formed on the rear side of the elastic contact portion 5 by bending a part of a thin plate extending from the rear end of the solder joint portion upward.

  The left wall portion 13A is formed on the left side of the elastic contact portion 5 by bending a part of a thin plate extending from the left end of the front wall portion 11 backward, and the left wall portion 13B is formed at the left end of the rear wall portion 12. A portion of the thin plate extending from the front is bent forward and formed on the left side of the elastic contact portion 5.

  The right wall portion 14A is formed on the right side of the elastic contact portion 5 by bending a part of a thin plate extending from the right end of the front wall portion 11 backward, and the right wall portion 14B is formed on the right end of the rear wall portion 12. A portion of the thin plate extending from the front is bent forward and formed on the right side of the elastic contact portion 5.

  In addition, the solder joint portion 3 has a shape having an inner edge portion 23 forming the opening 21 by forming an opening 21 penetrating the solder joint surface 9 in the vertical direction. A part of the thin plate extending from the front side of the inner edge portion 23 to the rear side is bent upward, whereby a front side standing portion 25 is provided behind the front wall portion 11. A rear side standing portion 27 formed in front of the rear wall portion 12 is provided by bending upward a part of the thin plate extending forward from the side.

  The front wall portion 11 and the front side standing portion 25 formed in this way face each other when the valley is folded upward (= the side where the surfaces on both sides of the bent portion form an angle smaller than 180 degrees). It is formed in the position to do. Further, the rear wall portion 12 and the rear side standing portion 27 are formed at positions where the valley-folded sides face each other when each of them is bent upward.

  The front side erected part 25 and the rear side erected part 27 function as a part for forming a solder fillet, and when the contact 1 is surface-mounted on the printed wiring board P as shown in FIG. Compared with the case where the front side erected portion 25 and the rear side erected portion 27 are not provided, the contact 1 can be firmly bonded to the printed wiring board P.

  Further, the elastic contact portion 5 has a base end 30 at a location connected to the left end of the solder joint portion 3, and the first portion 31 and the left wall portions 13A and 13B that are curved from the base end 30 and extend obliquely to the left. A second portion 32 that is curved from the first portion 31 and extends diagonally upward to the right through the inside, a third portion 33 that is curved from the second portion 32 and extends to the right, and is further curved and third. A fourth portion 34 extending obliquely downward to the left from the portion 33 and a fifth portion 35 curved from the fourth portion 34 and extending to the left are provided. The fifth portion 35 is the tip of the elastic contact portion 5. ing.

  And the front-end | tip (5th part 35) of the elastic contact part 5 is hooked by the spring tip hook parts 37A and 37B formed in the front wall part 11 and the rear wall part 12, and the displacement to the upper direction of the elastic contact part 5 is carried out. Is regulated.

  The spring-end hook portion 37A is formed by bending a part of a thin plate extending upward from the upper end of the front wall portion 11 backward. The spring-end hooking portion 37B is formed by bending a part of a thin plate extending upward from the upper end of the rear wall portion 12 forward.

  As shown in FIG. 3, the elastic contact portion 5 having such a configuration is provided in the printed wiring board P by being elastically deformed and brought into pressure contact with the conductive member Q in contact with the conductive member Q. The conductor pattern and the conductive member Q are electrically connected.

  Further, stoppers 39A and 39B are formed at upper ends of the front wall portion 11 and the rear wall portion 12 so as to protrude upward from the spring tip hook portions 37A and 37B. As shown in FIG. 3B, the stoppers 39A and 39B are in contact with the conductive member Q so that the conductive member Q is not excessively pressed against the printed wiring board P side. Regulate displacement. That is, the portions provided with the stoppers 39A and 39B serve as spacers for maintaining the distance between the printed wiring board P and the conductive member Q so as not to fall below a predetermined minimum distance.

  In addition, a carrier connecting portion 41 protruding rightward is formed at the right end of the solder joint portion 3. The carrier connecting portion 41 is a connecting portion with a carrier portion (not shown) of the hoop material. That is, the contact 1 of this embodiment is a component having a structure that can be formed on the hoop material.

  According to the contact 1 of the present embodiment configured as described above, the elastic contact portion 5 is formed by the front wall portion 11, the rear wall portion 12, the left wall portions 13A and 13B, and the right wall portions 14A and 14B as described above. Therefore, it is possible to suppress the entry of foreign matter into the movable range of the elastic contact portion 5 as compared with the contact having a structure in which at least one of the contacts is open.

  As apparent from FIG. 3B, when the conductive member Q is in pressure contact, the elastic contact portion 5 is surrounded by the barrier portion 7 on all sides, and the printed wiring is below Since there is a plate P and there is a conductive member Q above, all of the front, rear, left, right and up are surrounded. Therefore, in such a state, even if the elastic contact portion 5 breaks for some reason and is separated from the solder joint portion 3 side, the separated fragments are confined in the space surrounded by the front, rear, left, right, and upper sides. It is done. Therefore, according to the contact 1 of the present embodiment, foreign matter can be prevented from entering the inside of the barrier portion 7, and in the unlikely event, the foreign matter can be prevented from coming out to the outside of the barrier portion 7.

  In the contact 1, an opening 21 is formed in the solder joint portion 3, and a front side standing portion 25 and a rear side standing portion 27 are provided. The front wall portion 11 and the front side standing portion 25 are provided. Is formed at a position where the valley-folded sides face each other when folded upward, and the rear wall portion 12 and the rear side standing portion 27 also face each other when the valley-folded sides are folded upward. Formed in position.

  Therefore, even if the front wall portion 11 and the rear wall portion 12 are bent without inserting a jig into the inner portion of the barrier portion 7, at least the range of the opening 21 may bulge. No. Further, the front side erected portion 25 and the rear side erected portion 27 function as ribs that increase the rigidity of the solder joint portion 3, thereby deforming / bulging to reduce the flatness of the solder joint surface 9. Will be suppressed. Further, the portion that becomes the front wall portion 11 and the portion that easily bulges out when the portion that becomes the rear wall portion 12 is bent around the opening 21 are the front standing portion 25 and the rear standing portion 27 in advance. By being provided, the front wall portion 11 and the rear wall portion 12 are twisted in the opposite direction. Therefore, when the front wall portion 11 and the rear wall portion 12 are bent, the distortion when the front standing portion 25 and the rear standing portion 27 are formed by bending, the front wall portion 11, and Distortion when the rear wall portion 12 is formed by bending is offset, and as a result, swelling of the solder joint surface 9 is suppressed.

  Therefore, according to the contact 1, by providing the barrier portions 7 on the four sides around the elastic contact portion 5, it is possible to suppress the foreign matter from entering the movable range of the elastic contact portion 5 more than before, and When such a barrier portion 7 is formed by bending, the flatness of the solder joint surface 9 is not lowered.

  Further, in the contact 1, the tip of the elastic contact portion 5 is located on the left side and below the right end of the portion extending rightward, and the tip at such a position is connected to the spring-end hook portions 37A and 37B. Since it is hooked, the spring hooks 37A and 37B are also arranged below the portion (third portion 33) extending to the right of the elastic contact portion 5.

  Accordingly, the spring tip hook portions 37A and 37B are arranged at positions surrounded by the elastic contact portion 5, and the object that contacts the contact 1 has a structure that is difficult to catch on the spring tip hook portions 37A and 37B. The first hooks 37A and 37B are not damaged.

  Further, in the contact 1, gaps are formed between the left wall portions 13A and 13B, between the right wall portions 14A and 14B, and between the spring-end hook portions 37A and 37B, respectively. Therefore, when a load acts on the front wall portion 11 for some reason, the front wall portion 11 is slightly elastically deformed and displaced rearward to serve as a cushion, and the solder joint surface 9 is excessively large. It can suppress that force acts.

  Moreover, if the front wall 11 is greatly displaced, the gap between the left wall portions 13A and 13B, between the right wall portions 14A and 14B, and between the spring-end hook portions 37A and 37B. The load received by the front wall portion 11 at the time when is completely crushed is also transmitted to the rear wall portion 12. Therefore, thereafter, both the front wall portion 11 and the rear wall portion 12 serve as cushions, and the effect of suppressing an excessive force from acting on the solder joint surface 9 is further improved.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to said specific one Embodiment, In addition, it can implement with a various form.

  For example, in the above-described embodiment, the opening 21 having a specific shape and size is illustrated. However, when a portion where the solder joint surface 9 is likely to bulge is present in a wider range, the solder joint portion is defined as the opening. 3 may be soldered only at the outer edge portion. Moreover, in that case, you may expand the range which provides the front side standing part 25 and the rear side standing part 27. FIG.

  Moreover, although the said embodiment demonstrated the case where the front side standing part 25 and the rear side standing part 27 were provided as a standing part provided inside the barrier part 7, in addition to this, a left side standing part and A right standing part may be provided. Specifically, in the case of the left side standing portion, a part of the thin plate is extended from the left side of the inner edge portion 23 to the right side, and a part of the extended thin plate is bent upward so that the left side What is necessary is just to form the left side standing part in the right of wall part 13A, 13B. Further, in the case of the right standing portion, a part of the thin plate is extended from the right side of the inner edge portion 23 to the left side, and a part of the extended thin plate is bent upward, whereby the right wall portion 14A. 14B may be formed on the left side of 14B.

  Since these front side erection part 25, rear side erection part 27, left side erection part, and right side erection part can form any one, the rigidity of the solder joint part 3 can be increased accordingly. It is possible to suppress deformation / bulging that lowers the flatness of the solder joint surface 9.

  Furthermore, in the said embodiment, although spring tip hook part 37A, 37B was formed in both the front wall part 11 and the rear wall part 12, only one of the front wall part 11 and the rear wall part 12 is formed. You may form a spring tip hook part in this.

  DESCRIPTION OF SYMBOLS 1 ... Contact, 3 ... Solder joint part, 5 ... Elastic contact part, 7 ... Barrier part, 9 ... Solder joint surface, 11 ... Front wall part, 12 ... Back Wall part, 13A, 13B ... Left wall part, 14A, 14B ... Right wall part, 21 ... Opening, 23 ... Inner edge part, 25 ... Front side standing part, 27 ... Rear Side standing part, 30 ... proximal end, 31 ... first part, 32 ... second part, 33 ... third part, 34 ... fourth part, 35 ... fifth Part, 37A, 37B ... spring tip hooking part, 39A, 39B ... stopper, 41 ... carrier connecting part, P ... printed wiring board, Q ... conductive member.

Claims (4)

It is formed by bending a thin metal plate, and when used, it is surface-mounted on the surface to which the printed wiring board is attached, and is sandwiched between the printed wiring board and another conductive member. A contact electrically connecting the conductive pattern and the conductive member provided in the printed wiring board,
A solder joint part whose bottom surface is a solder joint surface solder-bonded to the conductor pattern;
An elastic contact portion that is configured above the solder joint portion and is in a state of being pressed against the conductive member with elastic deformation when contacting the conductive member;
A barrier portion that is provided on the front, rear, left, and right sides of the elastic contact portion and surrounds the periphery of the elastic contact portion from four sides, and suppresses foreign matter from entering inside the enclosed range;
As the barrier portion,
A front wall portion formed on the front side of the elastic contact portion by bending a part of the thin plate extending from the front end of the solder joint portion upward;
A rear wall portion formed on the rear side of the elastic contact portion by bending a part of the thin plate extending from the rear end of the solder joint portion upward;
Any of bending a part of the thin plate extending from the left end portion of the front wall portion backward and bending a part of the thin plate extending from the left end portion of the rear wall portion forward. Either or both, a left wall formed on the left side of the elastic contact portion;
Any of bending a part of the thin plate extending from the right end portion of the front wall portion backward and bending a portion of the thin plate extending from the right end portion of the rear wall portion forward. A right wall portion formed on the right side of the elastic contact portion by one or both of the following:
The solder joint portion has an inner edge portion that forms the opening by forming an opening penetrating the solder joint surface in the vertical direction.
Further, “a front side standing portion formed at the rear of the front wall portion by bending a part of the thin plate extending from the front side of the inner edge portion to the rear side”, “ A part of the thin plate extending from the rear side to the front side is bent upward to bend the rear side standing part formed in front of the rear wall part, "from the left side of the inner edge part to the right side. Bending a part of the thin plate extending upward to the left, the left standing part formed on the right side of the left wall part, and "extending from the right side of the inner edge part to the left side" At least one of the above four standing portions is provided by bending a part of the protruding thin plate upward to form a right standing portion formed on the left side of the right wall portion. Contact characterized by being. As the at least one standing part, at least the front side standing part and the rear side standing part are provided,
The front wall portion and the front side standing portion are formed at positions where the valley-folded sides face each other when the upper wall portion is folded upward, and the rear wall portion and the rear side standing portion are respectively positioned above the upper side. 2. The contact according to claim 1, wherein the valley-folded side is formed at a position where the two sides are opposed to each other. A part of the thin plate extending from the inner edge is bent upward to form the at least one standing portion, and then the one of the thin plates extended from the front end and the rear end of the solder joint portion, respectively. The contact according to claim 1, wherein the front wall portion and the rear wall portion are formed by bending a portion upward. The elastic contact portion is curved from the base end and extends diagonally to the left, with the portion connected to the left end of the solder joint portion as a base end, and further curved through the inside of the left wall portion. It extends to the upper right, further curves and extends to the right, further curves and extends to the lower left, further curves and extends to the left and reaches the tip,
At least one of the front wall portion and the rear wall portion is formed with a spring tip hook portion on which the tip of the elastic contact portion is hooked, and the spring tip hook portion displaces the elastic contact portion upward. The contact according to claim 1, wherein the contact is restricted.

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