JP2010157773A - Method of manufacturing light emitting diode device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a light emitting diode device which is obviously improved in luminous efficiency as compared with a conventional light emitting device. <P>SOLUTION: An n-type GaN layer is grown on the surface of a substrate, and silicon oxide is grown on the surface of the n-type GaN layer and an n-type GaN layer in a mesa region is exposed by a lithographic process. A light-emitting diode structure is grown in the mesa region by an MOCVD to a wafer, a structure having a pn identical surface is formed by the characteristics of a gallium nitride epitaxial layer selectively grown in a region, and an electrode is manufactured on the structure, thus manufacturing the light-emitting diode device. The structure of the pn identical surface is completed without requiring etching, and the manufacture of the GaN light-emitting diode device is simplified. The problems of the unevenness of an etching depth and the excessive roughness of the surface due to the etching and defective conductivity and a leakage current due to etching damage are avoided. Silicon oxide is used as a diffusion layer, and light emitted from a light-emitting layer modifies a beam path by the diffusion of the diffusion layer by the diffusion effect of silicon oxide, and internal total reflection is reduced to attain excellent luminous efficiency. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a light-emitting diode device using an n-type GaN layer as a main material, and a method for manufacturing a light-emitting diode device using an InAlGaN layer as a main material.

  Most GaN-based semiconductor materials grow on non-conductive sapphire substrates, so when fabricating LED devices, electrodes must be formed on the same surface by etching techniques. However, conventional wet etching is not applicable to GaN-based materials because it has very strong acid-alkali resistance. For this reason, in general, wet etching of GaN-based materials is unsuitable for mass production because the etching rate is too slow. For this reason, dry etching is almost always adopted. A method of dry etching a group semiconductor material is described. However, although dry etching can overcome the problem of wet etching, it is easy to form damage to the epitaxial layer. Therefore, there are many problems that dry etching forms on the device, which includes uneven etching depth and etching. Non-patent literature 1 reports that the surface is too rough, or electrical defects such as etching damage are formed, and non-patent literatures 2 and 3 include mesa side walls. The problem of electrical leakage caused by the etching of is described. For this reason, in the GaN-based LED manufacturing process, it is necessary to solve the problem of etching.

  In addition, there is a very large difference in refractive index between the III-V semiconductor GaN (n = 2.3) and air (n = 1), and the total reflection critical angle is only about 25 degrees. Therefore, most of the light rays of the light emitting layer are only totally reflected internally and are not emitted. In order to modify the structure of such an interface, the surface of the semiconductor is already roughened, the roughened layer interface is allowed to elapse after the light beam is emitted from the light emitting layer, the light beam is diffused to modify the path of incident light, Techniques have been provided to increase the probability of light emission after total reflection. Further, Non-Patent Document 4 describes that the luminous efficiency is clearly increased to 40% after roughening. A known roughening method is to etch an epitaxial surface. For example, Patent Document 2 describes a technique for roughening the surface of a light emitting device by chemical etching to increase the luminous efficiency. Has been. Patent Documents 3 and 4 also describe related techniques. However, such a processing method is applied only to the red LED. The main cause is the property that material processing is relatively easy, and it is not applicable to GaN-based materials, which is due to the very strong acid-alkali resistance properties of GaN-based materials. Although dry etching overcomes the problem of wet etching, it tends to form epitaxial layer damage, its p-type GaN pole is very prone to form an increase in electrical resistance, and growth of p-type GaN is usually If the p-type GaN is roughened very thinly (0.1 to 0.3 μm), the light emitting layer may be destroyed and the light emitting area may decrease. In general, the transparent electrode used in the GaN LED is very thin (10 nm) due to light transmission, so that the transparent electrode becomes discontinuous and affects current dispersion, and the luminous efficiency is lowered. For this reason, it is extremely difficult to directly roughen p-type GaN, and non-p-type GaN must be grown thick.

International Patent No. WO09854757 US Patent No. 5040044 US Pat. No. 5,429,954 US Pat. No. 5,898,192

Journal of Electronic, 27, No. 4,261,1998 Appl. Phys. Lett. 72, 1998 Jpn. J. et al. Appl. Phys. 37, L1202, 1998 IEEE Transactions on Electron Devices, 47 (7), 1492, 2000

  In order to solve the above-mentioned problems of the prior art, the present invention provides a method for exposing n-type GaN without the need to etch the semiconductor material, thereby improving the problems formed by etching. To do. The present invention provides a method for manufacturing a GaN-based light emitting device, which can provide a light emitting device that prevents various problems formed by etching as compared with a conventional light emitting device.

In addition, in order to solve the problem of total internal reflection described in the rear part of the above-mentioned prior art, the present invention also provides a diffusion effect of roughening by a method of filling a local area of the InAlGaN layer with an SiO ₂ layer during the epitaxial process. This improves the luminous efficiency of the GaN-based light emitting device. The present invention provides a method capable of achieving the roughening effect without roughening the p-type GaN in the GaN-based light emitting device. According to the present invention, the conventional light emitting device can be obtained without destroying the p-type GaN or the light emitting layer. Compared with the light emitting device, the light emitting efficiency is clearly improved.

The invention of claim 1 includes a substrate, a first semiconductor layer formed on the surface of the substrate, a groove formed in a local region of the first semiconductor, an isolation layer grown in the region of the groove, In a method of manufacturing a light emitting diode device comprising: a light emitting diode structure formed on a surface of a first semiconductor layer;
The light emitting diode structure combines a light emitting active layer and a p-type GaN-based III-V group compound layer, the p-type GaN-based III-V group compound layer is electrically connected to a p-type low-resistance ohmic contact electrode, and n A method for manufacturing a light-emitting diode device is characterized in that a type GaN-based III-V group compound layer is electrically connected to an n-type low-resistance ohmic contact electrode to provide a forward bias.
The invention according to claim 2 is the light emitting diode device manufacturing method according to claim 1, wherein the substrate is any one of sapphire, SiC, Si, GaAs, LiAlO ₂ , LiGaO ₂ and AlN. It is a manufacturing method of a diode device.
According to a third aspect of the present invention, in the method for manufacturing a light emitting diode device according to the first aspect, the first semiconductor layer is an Al _x Ga _(1-XY) In _Y N thick film, of which 0 ≦ X, Y ≦ 1 , 0 ≦ X + Y ≦ 1, a method for manufacturing a light-emitting diode device.
The invention of claim 4 is the method for manufacturing a light emitting diode device according to claim 1, wherein the thickness of the first semiconductor layer is larger than 0.1 μm.
According to a fifth aspect of the present invention, there is provided a method for manufacturing a light emitting diode device according to the first aspect, wherein the groove of the first semiconductor layer is formed by either a lithography process or laser processing. Yes.
The invention of claim 6 is the method for manufacturing a light emitting diode device according to claim 1, wherein the groove of the first semiconductor layer is formed by wet etching or dry etching. .
The invention of claim 7 is the method for manufacturing a light emitting diode device according to claim 1, wherein the depth of the groove is made smaller than the thickness of the first semiconductor layer.
The invention of claim 8 is the method of manufacturing a light emitting diode device according to claim 1, wherein the depth of the groove is equal to or greater than the thickness of the first semiconductor layer. .
The invention of claim 9 is the method of manufacturing a light emitting diode device according to claim 1, wherein the groove shape of the first semiconductor layer is any one of a rectangle, a triangle, a circle, a polygon, or a combination thereof. This is a method for manufacturing a light emitting diode device.
The invention of claim 10 is the method of manufacturing a light emitting diode device according to claim 1, wherein the isolation layer is any one of SiO ₂ , Si ₃ N ₄ , AlN, TiN, TiO ₂ or a combination thereof. This is a method for manufacturing a light emitting diode device.
The invention of claim 11 is the method for manufacturing a light emitting diode device according to claim 1, wherein the isolation layer is made of metal, alloy, or a combination thereof. .
The invention of claim 12 is the method for manufacturing a light emitting diode device according to claim 1, wherein the isolation layer has a thickness of 0.01 μm or more.
According to a thirteenth aspect of the present invention, in the method for manufacturing a light emitting diode device according to the first aspect, the light emitting active layer has a pn junction, DH, SQW or MQW structure. It's a way.

  The present invention provides a method for exposing n-type GaN without the need to etch the semiconductor material, thereby improving the problems formed by etching. The present invention provides a method for manufacturing a GaN-based light emitting device, which can provide a light emitting device that prevents various problems formed by etching as compared with a conventional light emitting device.

The present invention also achieves a rough diffusion effect by filling the SiO ₂ layer locally in the InAlGaN layer during the epitaxial process, thereby improving the luminous efficiency of the GaN-based light emitting device. The present invention provides a method capable of achieving the roughening effect without roughening the p-type GaN in the GaN-based light emitting device. According to the present invention, the conventional light emitting device can be obtained without destroying the p-type GaN or the light emitting layer. Compared with the light emitting device, the light emitting efficiency is clearly improved.

It is a summary display figure of the manufacture process of the light emitting diode apparatus which uses GaN as the main material of 1st Example of this invention. It is a general | schematic display figure of the manufacturing process of the light emitting diode apparatus which uses InAlGaN of 2nd Example of this invention as a main material. It is a general | schematic display figure of the manufacturing process of the light emitting diode apparatus which uses InAlGaN of 2nd Example of this invention as a main material. It is a general | schematic display figure of the manufacturing process of the light emitting diode apparatus which uses InAlGaN of 2nd Example of this invention as a main material. It is a general | schematic display figure of the manufacturing process of the light emitting diode apparatus which uses InAlGaN of 2nd Example of this invention as a main material. It is a general | schematic display figure of the manufacturing process of the light emitting diode apparatus which uses InAlGaN of 2nd Example of this invention as a main material. It is a general | schematic display figure of the manufacturing process of the light emitting diode apparatus which uses InAlGaN of 2nd Example of this invention as a main material. It is a summary display figure of the manufacture process of the light emitting diode apparatus which uses InAlGaN of 3rd Example of this invention as a main material. It is a summary display figure of the manufacture process of the light emitting diode apparatus which uses InAlGaN of 3rd Example of this invention as a main material. It is a summary display figure of the manufacture process of the light emitting diode apparatus which uses InAlGaN of 3rd Example of this invention as a main material. It is a summary display figure of the manufacture process of the light emitting diode apparatus which uses InAlGaN of 3rd Example of this invention as a main material. It is a summary display figure of the manufacture process of the light emitting diode apparatus which uses InAlGaN of 3rd Example of this invention as a main material. It is a summary display figure of the manufacture process of the light emitting diode apparatus which uses InAlGaN of 3rd Example of this invention as a main material.

The present invention is an n-type GaN layer on the surface of the wafer by epitaxial growth, the interface layer SiO ₂ was added, by lithography, to prepare a mesa (mesa) on the surface of SiO _2, and removing the SiO ₂ of the mesa In addition, the n-type GaN layer is exposed, and a light-emitting diode structure is epitaxially grown on the wafer in the mesa region by MOCVD. Depending on the characteristics of the selectively epitaxially grown GaN epitaxial layer, a pn coplanar structure is formed, and finally SiO ₂ is removed to obtain a pn coplanar light emitting diode structure. As a result, the present invention completes the pn-coplanar structure necessary for the LED device without using an etching process, thereby solving a number of problems formed by etching.

The present invention also provides an epitaxial growth of InAlGaN, followed by a lithography process to form a groove in the surface, remove the local region and expose the substrate, and grow a SiO ₂ layer in the groove, and finally A light emitting diode structure is formed thereon to form a light emitting diode device. By providing the diffusion effect using this SiO ₂ as a diffusion layer, the light emitted from the light emitting layer is diffused by this diffusion layer and the total reflection is reduced, thereby increasing the light emission efficiency.

In order to solve the above-mentioned object of the present invention, the sapphire substrate (1) is placed in an MOCVD system as shown in FIG. 1 and is 20 to 50 nm thick at 500 to 600 ° C. The GaN buffer layer (2) is grown. Subsequently, the substrate temperature is increased to 1000 to 1200 ° C. to grow a silicon doped GaN layer having a thickness of 2 to 4 μm. Thereafter, the wafer is taken out, and 0.5 to 1 μm of SiO ₂ (3) is grown by PECVD. Subsequently, SiO ₂ in the mesa region (4) is removed by a lithography process. Subsequently, this wafer is placed in a MOCVD system at 700 to 900 ° C., and an InGaN / GaN multiple quantum well structure (5) is grown in the mesa region to form a light emitting layer. Thereafter, the substrate temperature is raised to 1000 to 1200 ° C. to grow a single layer of a magnesium-doped GaN contact layer having a thickness of 0.1 to 0.2 μm. Finally, this wafer is taken out, and SiO ₂ other than the mesa region is removed, and thus a light emitting diode epitaxial structure (10) having the same surface as that of pn is completed. Further, Ni / Au is formed on the p-type GaN surface to form a p-type ohmic contact electrode (7), and Ti / Al is formed on the n-type GaN surface to form an n-type ohmic contact electrode (8). The die structure of the present invention is formed.

In order to specifically implement the object described in the rear part of the problem to be solved by the above-described invention, the present invention adopts the following scheme. Please refer to FIG. 2 to FIG. First, the sapphire substrate (11) is placed in an MOCVD system, and an InAlGaN layer (12) having a thickness of more than 0.1 μm is grown. Subsequently, the wafer is taken out and this InAlGaN, which is a buffer layer, is formed by a lithography process and dry etching. The layer (12) is etched to form a groove (14), and the thickness of the groove (14) is the thickness of the InAlGaN layer. Subsequently, SiO ₂ (13) is grown in this groove, and the wafer is further placed in MOCVD, and the substrate temperature is raised to 800-1200 ° C. to grow a silicon-doped InAlGaN layer having a thickness of 1-2 μm. Subsequently, the substrate temperature is lowered to 700 to 900 ° C., and an InGaN / GaN multiple quantum well structure (15) is grown to form a light emitting layer. Thereafter, the substrate temperature is raised to 1000 to 1200 ° C. to grow a magnesium-doped GaN contact layer (16) having a thickness of 0.1 to 0.2 μm, thus forming a light emitting diode epitaxial structure (20). For this epitaxial structure, some p-type GaN (magnesium-doped GaN contact layer (16)) and InGaN / GaN multiple quantum well structure (15) are removed by dry etching, and the n-type GaN surface is exposed. Further, a p-type ohmic contact electrode (17) is formed on the p-type GaN surface with Ni / Au, and an n-type ohmic contact electrode (18) is formed on the n-type GaN surface with Ti / Al, thus forming the die structure of the present invention. Complete.

Please refer to FIG. 8 to FIG. A sapphire substrate (21) is placed in a MOCVD system, and a 0.1 μm thick InAlGaN layer (22) is grown thereon. Subsequently, the wafer is taken out, and a groove (24) is etched on the InAlGaN buffer layer using a lithography process and dry etching, so that the depth of the groove is 0.2 to 5 μm deeper than the thickness of the InAlGaN layer. Subsequently, SiO ₂ (23) is grown in the trench, and the wafer is further placed in MOCVD, and the substrate temperature is raised to 800-1200 ° C. to grow a silicon-doped InAlGaN layer having a thickness of 1-2 μm. Subsequently, the substrate temperature is lowered to 700 to 900 ° C., and an InGaN / GaN multiple quantum well structure (25) is grown to form a light emitting layer. Thereafter, the substrate temperature is further raised to 1000 to 1200 ° C. to grow a magnesium-doped GaN contact layer (26) having a thickness of 0.1 to 0.2 μm, and an abnormal light-emitting diode epitaxial structure (30) is completed. The p-type GaN (magnesium-doped GaN contact layer (26)) and the InGaN / GaN multiple quantum well structure (25) are removed by dry etching on the epitaxial structure, and the n-type GaN surface is exposed. The p-type ohmic contact electrode (27) is formed on the p-type GaN surface with Ni / Au, and the n-type ohmic contact electrode (28) is formed on the n-type GaN surface with Ti / Al. Complete.

1 substrate 2 GaN buffer layer 3 SiO ₂ region 4 mesa region 5 multiple quantum well structure 7 p-type ohmic contact electrode 8 n-type ohmic contact electrode 10 light emitting diode epitaxial structure 11 substrate 12 InAlGaN layer 13 SiO ₂ region 14 groove 15 multiple quantum well Structure 16 GaN contact layer 17 p-type ohmic contact electrode 18 n-type ohmic contact electrode 20 light-emitting diode epitaxial structure 21 substrate 22 InAlGaN layer 23 SiO ₂ region 24 groove 25 multiple quantum well structure 26 GaN contact layer 27 p-type ohmic contact electrode 28 n Type ohmic contact electrode 30 light emitting diode epitaxial structure

Claims (13)

A substrate, a first semiconductor layer formed on the surface of the substrate, a groove formed in a local region of the first semiconductor, an isolation layer grown in the region of the groove, and a surface of the first semiconductor layer In the manufacturing method of the light emitting diode device comprising the light emitting diode structure formed in
The light emitting diode structure combines a light emitting active layer and a p-type GaN-based III-V group compound layer, the p-type GaN-based III-V group compound layer is electrically connected to a p-type low-resistance ohmic contact electrode, and n A method for manufacturing a light-emitting diode device, wherein a type GaN-based III-V group compound layer is electrically connected to an n-type low-resistance ohmic contact electrode to provide a forward bias. The method of manufacturing a light emitting diode device according to claim 1, wherein the substrate is sapphire, SiC, Si, GaAs, LiAlO 2, LiGaO 2 , and characterized in that it is the one of AlN, the method of manufacturing the light emitting diode device. The method of manufacturing a light emitting diode device according to claim 1, the first semiconductor layer is a _{Al X Ga (1-XY)} In Y N thick, of which, 0 ≦ X, in Y ≦ 1,0 ≦ X + Y ≦ 1 A method for manufacturing a light-emitting diode device, comprising:   2. The method of manufacturing a light emitting diode device according to claim 1, wherein the thickness of the first semiconductor layer is larger than 0.1 [mu] m.   2. The method of manufacturing a light emitting diode device according to claim 1, wherein the groove of the first semiconductor layer is formed by either a lithography process or laser processing.   2. The method of manufacturing a light emitting diode device according to claim 1, wherein the groove of the first semiconductor layer is formed by wet etching or dry etching.   2. The method of manufacturing a light emitting diode device according to claim 1, wherein the depth of the groove is made smaller than the thickness of the first semiconductor layer.   2. The method for manufacturing a light emitting diode device according to claim 1, wherein the depth of the groove is equal to or greater than the thickness of the first semiconductor layer.   2. The method of manufacturing a light emitting diode device according to claim 1, wherein the groove shape of the first semiconductor layer is any one of a rectangle, a triangle, a circle, and a polygon, or a combination thereof. Production method. 2. The method of manufacturing a light emitting diode device according to claim 1, wherein the isolation layer is any one of SiO ₂ , Si ₃ N ₄ , AlN, TiN, TiO ₂ or a combination thereof. Production method.   2. The method of manufacturing a light emitting diode device according to claim 1, wherein the isolation layer is made of a metal, an alloy, or a combination thereof.   2. The method of manufacturing a light emitting diode device according to claim 1, wherein the isolation layer has a thickness of 0.01 [mu] m or more.   2. The method for manufacturing a light-emitting diode device according to claim 1, wherein the light-emitting active layer has any one of a pn junction, DH, SQW, and MQW structure.

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