JP2010157457A - Insulated wire - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a coated layer, of which an adhesive property is not deteriorated even by high-temperature treatment, in an insulated wire having a resin layer with epoxy resin cured with a curing agent on the surface of a conductor. <P>SOLUTION: The resin layer curing an epoxy resin by applying and calcining a resin composition including the curing agent of 5-30 pts.wt. such as block isocyanate based on a THEIC denatured phenoxy resin (nonvolatile matter) of 100 pts.wt. wherein bisphenol substituted with a THEIC at 5% or more of the degree of denaturation and bisphenol type epoxy resin are polymerized is formed on the conductor. Then, it is preferable that a different resin layer in which at least one or more resin selected from a group of polyester imide, polyamide-imide, and polyester, and polyimide is principal is formed on an upper layer of the resin layer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an insulated wire.

  In light of the fact that insulation coating breaks in so-called windings of motors, etc., inadequate layering and poor grounding, etc., improve mechanical strength and workability, and improve adhesion to conductors such as core wires. It is required for insulated wires to be made.

  Under such circumstances, for example, Japanese Patent No. 3766447 (Patent Document 1) includes aromatic polyamide-based paints, polyimide-based paints, polyamide-imide-based paints, polyester-imide-based paints, polyester-based paints, polyurethane-based paints, and the like. Curability such as acetylenes, alkynols and amines as metal deactivators different from the film-forming resin, and second phenolic resin, epoxy resin and melamine resin different from the resin component in the paint. A coating material for forming an insulating film using a resin is disclosed.

  Japanese Patent Laid-Open No. 10-334735 (Patent Document 2) discloses a coating material for forming an insulating film containing a polyimide resin in which melamine is added to a polyimide resin. By applying and baking these resin paints on the surface of the conductor, an insulated wire having high mechanical strength such as high adhesion to the conductor and not easily damaged, and excellent workability can be obtained.

Japanese Patent No. 3766447 Japanese Patent Laid-Open No. 10-334735

  However, even when these insulating paints are used, when a large current flows through the insulated wire, the conductor generates heat, and the temperature rise causes softening and deterioration of the insulating coating, resulting in insufficient layer and poor grounding. Etc. may occur. Therefore, not only the adhesiveness and mechanical strength are high and the processability is excellent, but further heat resistance is desired.

  For so-called windings, impregnating varnish treatment is applied to reduce friction and wear that occurs when the coil is wound, or multiple insulated wires are twisted together, and then the wires are fused together by heat treatment May be done. In this case, when the above-mentioned paint is used, especially when a melamine resin is used, after being exposed to a high temperature during the impregnation varnish treatment or the fusion treatment, the adhesion with the conductor is lowered, and only the coating is stretched. In some cases, the conductor was exposed.

  In order to solve the above problems, the inventors of the present application have developed an insulated wire formed with a primer layer in which a resin layer formed by mixing a curing agent with an epoxy resin and curing it is formed on a conductor surface. It is carried out. This resin layer is obtained by applying a resin composition obtained by adding a melamine compound or an isocyanate compound as a curing agent to an epoxy resin, for example, a bisphenol A type epoxy resin, and curing the resin composition. As a result, it was possible to obtain an insulated wire that not only improved the adhesion to the conductor but also did not deteriorate the adhesion even during the high temperature treatment during the varnish impregnation treatment.

  However, this insulated wire uses heat-resistant, especially polyester imide resin varnish or high adhesion type polyester imide resin varnish in JIS double load softening temperature resistance test, which is tested under severe conditions. It was inferior to.

  The present invention has been made in view of such circumstances, and the present invention is an insulated wire having a resin layer obtained by curing an epoxy resin with a curing agent on a conductor surface, and adhesion is also achieved by high-temperature treatment. It aims at forming the resin layer which does not fall.

  The inventors of the present application have made diligent efforts and found that the above object can be achieved by using a THEIC-modified phenoxy resin as the epoxy resin, and have completed the present invention.

  That is, the insulated wire of the present invention is an insulated wire having a resin layer that covers a conductor and the surface of the conductor and in which an epoxy resin is cured by a curing agent, and the epoxy resin is a THEIC-modified phenoxy resin. Features.

  According to the present invention, an insulated wire excellent in workability such as mechanical strength and flexibility is not deteriorated even when exposed to a high temperature such as varnish impregnation treatment or fusion treatment. Is provided.

  The present invention is an insulated wire having a resin layer in which a THEIC-modified epoxy resin is cured with a curing agent, covering the conductor and the surface of the conductor. As a conductor used for the insulated wire of the present invention, a conductor similar to the conductor conventionally used for the insulated wire is used, and examples thereof include a copper wire and an aluminum wire.

  In the present invention, the epoxy resin used for the resin layer covering the conductor surface is a THEIC-modified phenoxy resin, which is a phenoxy resin modified with THEIC (tris (2-hydroxyethyl) isocyanurate). In this application, the THEIC-modified phenoxy resin is a low molecular weight bisphenol type epoxy resin having a weight average molecular weight of about 30000 or less, a bisphenol type epoxy resin polymerized by using bisphenols and THEIC, and among them, an epoxy resin having a large molecular weight, Specifically, it means a bisphenol type epoxy resin having a weight average molecular weight of 20000 or more. In other words, the THEIC modification means that when an epoxy resin is polymerized using bisphenols, a part of the bisphenols necessary for the polymerization is replaced with THEIC.

  In the present invention, the bisphenol type epoxy resin means a bisphenol type epoxy resin obtained from bisphenols and epichlorohydrin. Examples of the bisphenol include 2,2-bis (4-hydroxyphenyl) methane, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (4-hydroxyphenyl) sulfide, 2,2- Examples thereof include bis (4-hydroxyphenyl) sulfone, 3,4,5,6-dibenzo-1,2-oxaphosphane-2-oxide hydroquinone and the like.

  Preferred examples of the bisphenol type epoxy resin include a bisphenol A type epoxy resin obtained from bisphenol A and epihalohydrin, a bisphenol F type epoxy resin obtained from bisphenol F and epihalohydrin, and a bisphenol S type epoxy obtained from bisphenol S and epihalohydrin. Resins are exemplified. Moreover, these various epoxy resins can be used not only independently but also by mixing two or more kinds of epoxy resins.

  The bisphenol polymerized with the bisphenol-type epoxy resin is not particularly limited, and various bisphenols used for the production of the bisphenol-type epoxy resin are used. It is not limited to bisphenol A type bisphenol, and bisphenol F type and bisphenol S type bisphenols can also be used. The bisphenol constituting the epoxy resin and the bisphenol polymerized with the epoxy resin preferably use the same or the same type of bisphenol, but bisphenols belonging to different types can also be used.

  The THEIC-modified phenoxy resin of the present invention is produced by polymerization of a bisphenol type epoxy resin, bisphenols and THEIC. That is, these components are dissolved in various organic solvents as described below, and polymerized using a polymerization catalyst (polymerization accelerator, polymerization initiator, etc.). It is not necessary to use a special method as a polymerization method, and the solution may be heated appropriately while stirring. Examples of the polymerization catalyst used include monoamines such as triethylamine, diamines such as tetramethylethylenediamine, various tertiary amines typified by cyclic amines such as triethylenediamine, and organometallic catalysts such as stannous octoate. . In principle, 1 equivalent is polymerized as the total of both bisphenols and THEIC for 1 equivalent of bisphenol-type epoxy resin.

  The present invention has been completed by finding that by using a phenoxy resin modified by THEIC, a resin layer having better heat resistance can be formed compared to the case of using an unmodified phenoxy resin. Is. Corresponding to the degree of modification of the phenoxy resin, that is, the amount of THEIC used, the JIS double-fold softening temperature, which is one of the heat resistance indexes, changes. If the degree of modification of THEIC increases, the softening temperature increases. In the present invention, for example, by setting the degree of modification of THEIC to 10% or more, the JIS 2 times softening resistance can be made 370 ° C. or more. Therefore, in the present invention, the lower limit of the degree of THEIC modification is 5%, preferably 10%. The upper limit is 30%, preferably 20%. If it exceeds 30%, the strength of the resin layer may be lowered, and an increase in the softening temperature according to the blending amount cannot be expected. The THEIC modification degree of the phenoxy resin means the THEIC amount to be replaced with bisphenols, and the THEIC amount (A equivalent) used for the total amount of THEIC (A equivalent) and bisphenols (B equivalent) used for polymerization. Equivalent)) (= A / (A + B) × 100%).

  In the present invention, it is not sufficient to apply and bake only the epoxy resin on the conductor surface, or to mix the epoxy resin with polyester imide, polyamide imide, polyester or polyimide resin, and the like. It is necessary to make it. In this respect, as described in Patent Document 1, it is completely different from a resin layer in which a curable resin such as an epoxy resin is simply blended. The curing agent in the present invention functions to form a three-dimensional network by reacting with an epoxy resin, and the curing agent is not particularly limited as long as it can perform this function. Various curing agents widely used as curing agents for epoxy resins are used. For example, urea, melamine compounds, isocyanate compounds, aminopolyamide resins, alicyclic acid anhydrides such as methyltetrahydrophthalic anhydride, fats Examples thereof include aromatic acid anhydrides and aromatic acid anhydrides. These curing agents are appropriately selected according to the characteristics of the target insulated wire, but in consideration of the object of the present invention, among these, curing agents of isocyanate compounds and melamine compounds are preferably used. .

  Examples of the melamine compound include methylated melamine, butylated melamine, methylolated melamine, and butyrololized melamine.

  As isocyanate compounds, aromatic diisocyanates such as tolylene diisocyanate (TDI), diphenylmethane isocyanate (MDI), p-phenylene diisocyanate, naphthalene diisocyanate, hexamethylene diisocyanate (HDI), 2,2,4-trimethylhexane diisocyanate, lysine C3-C12 aliphatic diisocyanate such as diisocyanate, 1,4-cyclohexane diisocyanate (CDI), isophorone diisocyanate (IPDI), 4,4'-dicyclohexylmethane diisocyanate (hydrogenated MDI), methylcyclohexane diisocyanate, isopropylidene dicyclohexyl -4,4'-diisocyanate, 1,3-diisocyanatomethylcyclohexane (hydrogenated XDI) 5 carbon atoms such as hydrogenated TDI, 2,5-bis (isocyanatomethyl) -bicyclo [2,2,1] heptane, 2,6-bis (isocyanatomethyl) -bicyclo [2,2,1] heptane Examples include aliphatic diisocyanates having an aromatic ring such as -18 cycloaliphatic isocyanate, xylylene diisocyanate (XDI), tetramethylxylylene diisocyanate (TMXDI), and modified products thereof. The above curing agents can be used alone or in admixture of two or more compounds.

  In the present invention, considering application to a conductor, it is generally used as a resin composition in which an epoxy resin or the like is mixed in an organic solvent as described later. In view of the stability at this time, a blocked isocyanate type curing agent is preferably used.

  The blocked isocyanate is obtained by protecting the isocyanate compound with a blocking agent. A blocking agent is a compound that is added to an isocyanate group and is stable at room temperature, but can regenerate a free isocyanate group when heated above its dissociation temperature. Examples of the blocking agent include alcohols, phenols, ε-caprolactam, butyl cellosolve and the like, but are not limited thereto. Examples of alcohols include aliphatic alcohols having about 1 to 4 carbon atoms such as methanol, ethanol, propanol and butanol, aromatic alcohols such as benzyl alcohol, and alicyclic alcohols such as cyclohexanol. Examples of phenols include phenol, cresol, xylenol, and the like, but alcohols are preferably used as a blocking agent from the viewpoint of handleability. The blocked isocyanate preferably has a dissociation temperature of preferably 80 to 160 ° C, more preferably 90 to 130 ° C.

  In the present invention, it is necessary to cure such a curing agent and an epoxy resin, but the amount ratio of the epoxy resin and the curing agent is appropriately determined in consideration of the characteristics of the obtained resin layer. That is, if the amount of the curing agent is small, the mechanical strength and heat resistance may be insufficient, and if the amount is large, there is a possibility that the resin layer becomes unfavorable because processability decreases. Therefore, in the present invention, the curing agent is at least 5 parts by mass, more preferably at least 10 parts by mass, and even more preferably at least 20 parts by mass with respect to 100 parts by mass of the THEIC-modified epoxy resin (as a non-volatile component). . Further, the upper limit is at most 200 parts by mass, preferably 150 parts by mass or less, more preferably 100 parts by mass or less, and further 50 parts by mass or less.

  In this invention, the said component is provided as a resin composition uniformly disperse | distributed to the organic solvent, and a resin layer is formed by apply | coating and hardening the said resin composition on the conductor surface. The organic solvent used at this time is not particularly limited. Examples of the organic solvent include polar organic solvents such as N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, dimethyl sulfoxide, tetramethylurea, hexaethylphosphoric triamide, and γ-butyrolactone. First, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, esters such as methyl acetate, ethyl acetate, butyl acetate, diethyl oxalate, diethyl ether, ethylene glycol dimethyl ether, diethylene glycol monomethyl ether, ethylene glycol monobutyl ether (butyl cellosolve) ), Ethers such as diethylene glycol dimethyl ether and tetrahydrofuran, charcoal such as hexane, heptane, benzene, toluene and xylene Examples include hydrogen, halogenated hydrocarbons such as dichloromethane and chlorobenzene, phenols such as cresol and chlorophenol, and tertiary amines such as pyridine. These organic solvents may be used alone or in combination of two or more. Used.

  The amount of the organic solvent is not particularly limited as long as the epoxy resin and the curing agent can be uniformly dispersed. Usually, it is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, and even more preferably 30 parts by mass or more with respect to 100 parts by mass of the epoxy resin, but if it is too much, an appropriate coating film cannot be formed. From this viewpoint, it is at most 200 parts by mass, preferably 150 parts by mass or less, more preferably 100 parts by mass or less.

  In order to improve the fluidity of fillers and insulating paints such as silica, magnesium oxide, silicon carbide, titanium carbide and the like within the range that does not impair the object of the present invention, this resin composition is, for example, tetra Additives such as titanium compounds such as isopropyl titanate, tetrabutyl titanate, and tetrahexyl titanate, zinc compounds such as zinc naphthenate and zinc octenoate, curing accelerators, antioxidants, and leveling agents may be added.

  This resin composition is applied to the conductor surface and cured to form a resin layer. The coating method is not particularly limited, and for example, a conventional method such as a dipping method is used. After the application, the resin layer is formed by naturally drying or heat drying the coating film at a temperature of room temperature to 300 ° C.

  In addition, from the viewpoint of sufficiently reacting the epoxy resin and the curing agent, it is preferable not to dry naturally but to bake after applying the resin composition on the conductor. Baking can be performed by a conventional method. The baking temperature is 150 to 400 ° C., preferably 200 to 400 ° C. from the viewpoint of preventing the reaction between the epoxy resin and the curing agent and the deterioration of the resin layer due to the high temperature treatment. Moreover, when using blocked isocyanate as a hardening | curing agent, in order to make a blocking agent dissociate and to function as a hardening | curing agent, it is preferable to heat to the temperature more than the dissociation temperature. Moreover, baking may be performed only once or may be performed twice or more.

  The resin layer obtained in this way can be used as a skin as it is, but it is a primer layer from the viewpoint of use as a winding, heat resistance, wear resistance, mechanical strength, oil resistance, chemical resistance, insulation, etc. And one or more other resin layers are formed on the resin layer. From such a viewpoint, the film thickness of the resin layer obtained by curing the epoxy resin is set to the same thickness as when a conventional esterimide resin or the like is used as the primer layer. Specifically, the resin composition is applied so that the thickness of the resin layer (thickness after baking) is 0.5 to 5 μm, preferably 1 to 5 μm.

  As the resin layer laminated on the resin layer (primer layer), there are insulating paints including various known resins conventionally used for coating insulated wires, such as polyesterimide, polyamideimide, polyester and polyimide. Used. These resins can be used alone or in combination of two or more resins. In addition, the resin layer to be laminated only needs to use these resins as a main component. In addition to these resins, other resins and additives are added for the purpose of improving heat resistance, improving wear resistance and slipperiness. It does not mean to exclude the blended resin layer. Moreover, it is also possible to provide various known lubricating layers on top of these resin layers in order to impart lubricity. In the present invention, these resin layers are provided on the upper layer of a resin layer obtained by curing an epoxy resin, but the formation method is not different from the conventional method. Needless to say, the laminated resin layer is not limited to one layer, and a plurality of layers may be laminated.

  Moreover, although the film thickness of the resin layer provided in an upper layer can also be determined suitably, it is about 20-200 micrometers normally as a whole resin layer (including a primer layer) of an insulated wire, Preferably it is about 20 micrometers-100 micrometers in film thickness. It is formed.

  As described above, the insulated wire of the present invention has a resin layer obtained by curing a THEIC-modified phenoxy resin with a curing agent, so that the adhesion between the coating and the conductor is good, and during high-temperature treatment such as varnish impregnation treatment or fusion treatment In this case, there is provided an insulated wire that is free from the conductor and has the same degree of softening resistance as when coated with a widely used highly adhesive esterimide resin.

Next, based on an Example, this invention is demonstrated still in detail.
First, a THEIC-modified phenoxy resin for forming a primer layer was produced.

(Production Example 1)
THEIC 7.86 parts by mass (0.1 equivalent), bisphenol A (2,2-bis (4′-hydroxyphenyl) propane) 92.59 parts by mass (0.9 equivalent), bisphenol A type epoxy resin (YD-128) : Toto Kasei Co., Ltd.) 169.56 parts by mass (1.0 equivalent) and 1.37 parts by mass (0.015 equivalents) of triethylamine as a catalyst were mixed with 270 parts by mass of cyclohexanone and stirred at 80 ° C. The temperature was raised to. Thereafter, the temperature was raised to 140 ° C. over 4 hours, and then the temperature was raised to 150 ° C., and then held at 150 ° C. for 10 hours. Thereto, 460 parts by mass of cyclohexanone was added and diluted to obtain a THEIC modified phenoxy resin varnish (nonvolatile content 27%) having a modification degree of 10%.

(Production Example 2)
THEIC 11.84 parts by mass (0.15 equivalent), bisphenol A 87.84 parts by mass (0.85 equivalent), bisphenol A type epoxy resin (YD-128: manufactured by Toto Kasei Co., Ltd.) 170.33 A THEIC-modified phenoxy resin varnish (nonvolatile content) having a modification degree of 15% was prepared in the same manner as in Production Example 1, except that the mass (1.0 equivalent) and 1.38 parts by mass (0.015 equivalent) of triethylamine as a catalyst were used. 27%).

(Production Example 3)
THEIC 15.86 parts by mass (0.2 equivalents), bisphenol A 83.04 parts by mass (0.8 equivalents), bisphenol A type epoxy resin (manufactured by Toto Kasei Co., Ltd., trade name YD-128) 171 A THEIC-modified phenoxy resin varnish (nonvolatile) having a modification degree of 20% was prepared in the same manner as in Production Example 1, except that .10 mass (1.0 equivalent) and 1.38 parts by mass (0.015 equivalent) of triethylamine were used as the catalyst. 27%).

  Block type isocyanate (Nippon Polyurethane) which is a curing agent dissolved in cresol at 27% with respect to 1000 parts by mass (270 parts by mass of nonvolatile content) of each THEIC modified phenoxy resin varnish of Production Example 1 to Production Example 3 obtained above. 200 mass parts (54 mass parts of non-volatile matters) of the product made by Kogyo Co., Ltd., brand name MS-50) was added, and the resin composition was obtained.

  An epoxy resin obtained by applying this resin composition to a copper wire surface having a diameter of 1.0 mm so that the film thickness after baking is 3 μm, and baking and curing for several seconds in a baking furnace set at a furnace temperature of 300 to 400 ° C. The resin layer was formed.

  Next, a resin solution of general-purpose polyesterimide resin (general-purpose EsI: manufactured by Hitachi Chemical Co., Ltd., trade name Isomid 40SM-45) is applied so that the film thickness after baking is 25 μm, and the furnace temperature is 300 to 300 ° C. The second resin layer was formed by baking for several seconds in a baking oven set at 400 ° C.

  Furthermore, a general-purpose PAI was applied so that the film thickness after baking was 5 μm, and a third resin layer was formed under the same conditions as in the general-purpose EsI baking. In addition, the general purpose PAI used what was obtained by the following method.

(Manufacture of general-purpose PAI)
Under a nitrogen gas environment, 176.9 g of trimellitic anhydride, 1.95 g of trimellitic acid and 233.2 g of methylene diisocyanate were charged into the flask, and 536 g of N-methyl-2-pyrrolidone was added as a solvent while stirring. After heating at 80 ° C. for 3 hours, the temperature in the flask was raised to 120 ° C. over about 4 hours and heated at the same temperature for 3 hours. Thereafter, the heating was stopped, 134 g of xylene was added to the flask, and then allowed to cool to obtain a polyamideimide resin varnish (general-purpose PAI) having a nonvolatile content of 35% by mass.

  Finally, a self-lubricating PAI for improving lubricity was applied so that the film thickness after baking was 2 μm, and a fourth resin layer serving as a surface layer was formed under the same conditions as in the general-purpose EsI. The self-lubricating PAI was obtained by the following method.

(Manufacture of self-lubricating PAI)
Polyamide wax 1.5 (self-lubricating PAI) was obtained by mixing 1.5 parts by mass of polyethylene wax with respect to 100 parts by mass of the non-volatile content of the general-purpose PAI obtained above.

  In addition, as a comparative example, as an alternative to the resin layer of the epoxy resin, the above-mentioned general-purpose polyesterimide varnish (general-purpose EsI: manufactured by Hitachi Chemical Co., Ltd., trade name Isomid 40SM-45) and a highly adhesive polyesterimide varnish ( Highly-adhesive EsI: Insulated wire (Comparative Example 1 and Comparative Example 2) in which a first resin layer (corresponding to a primer layer) is formed using Dainichi Seika Kogyo Co., Ltd., trade name EH402-45No.3) Was made. And about the insulated wire of each Example and each comparative example, it tested about the flexibility, the heat shock, the unidirectional wear, the film floating, and the softening resistance. The results are summarized in Table 1. In each test, six insulated wires were prepared in each example and each comparative example, and the average value of the obtained measured values was shown for items that can be evaluated numerically.

[Flexibility]
JIS C3003 7. Flexibility A test was conducted in accordance with Method A. As a result, in Comparative Example 1, no cracks or the like were observed in the visual observation (1d) including the present Example and Comparative Example 2 at a magnification (2d) of 2 times.

〔heat shock〕
JIS C3003 12. Thermal shock A test was conducted in accordance with Method A. As a result, in Comparative Example 1, no cracks or the like were observed in the visual observation (1d) including the present Example and Comparative Example 2 at a magnification (2d) of 2 times.

[One-way wear]
JIS C3003 9. The test was conducted according to wear resistance.

(Film float test)
JIS C3003 8. Adhesiveness 8.1 a) Measured according to the term of rapid elongation. Regarding the film floating test, before heating (initial stage), when heated in a 160 ° C. constant temperature bath for 6 hours (160 ° C. × 6 h), and when heated in a 180 ° C. constant temperature bath for 6 hours (180 ° C. × 6 h) ) Was tested.

[Softening temperature test]
According to JIS C3003 11.1 A method, the softening resistance temperature was measured. In addition, the test was done about both the case where the load prescribed | regulated to JIS and 2 times the load prescribed | regulated to JIS (JIS 2 times) were added.

  From the above results, it was possible to improve the softening resistance, which is an index of heat resistance, by using the THEIC-modified phenoxy resin as compared with the case of using the non-modified phenoxy resin. Specifically, by using a THEIC-modified phenoxy resin, an insulated wire having a JIS double softening temperature higher than the JIS double softening temperature when using a non-modified phenoxy resin was 350 ° C. or higher could be obtained. . And compared with the case where a highly adhesive polyesterimide is used as the resin layer of the first layer (primer layer), the insulated wire of the present invention has mechanical strength (unidirectional friction) and softening resistance that are almost the same as this. Obtained. Moreover, in the film | membrane floating test which shows the parameter | index of adhesiveness, although it exists in the tendency to deteriorate a little rather than general purpose ester imide, a better result was obtained than highly adhesive polyesterimide, and it was also excellent in adhesiveness.

  As described above, the insulated wire of the present invention has high mechanical strength and maintains good adhesion and softness even when heated to a high temperature such as varnish impregnation treatment. An insulated wire that can accommodate an output motor is provided.

  The embodiments and examples shown above are exemplifications, and the present invention is not limited to the embodiments and examples described above, and is included in the scope of the claims and all equivalents thereto. Are intended to be included in the present invention.

Claims (7)

An insulated electric wire having a conductor and a resin layer covering the conductor surface, the epoxy resin being cured by a curing agent,
The epoxy resin is an insulated wire which is a THEIC-modified phenoxy resin.   The insulated wire according to claim 1, wherein the JIS double softening temperature is 350 ° C or higher.   The insulated wire according to claim 1 or 2, wherein the epoxy resin has a THEIC modification degree of 5% or more.   The insulated wire according to any one of claims 1 to 3, wherein the resin layer is a cured product of a resin composition containing a curing agent of 5 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the epoxy resin.   The insulated wire according to any one of claims 1 to 4, wherein the curing agent is isocyanate.   The insulated wire according to any one of claims 1 to 5, further comprising a resin layer made of at least one other resin on the resin layer.   The insulated wire according to claim 6, wherein the resin layer made of the other resin mainly includes at least one resin selected from the group consisting of polyesterimide, polyamideimide, polyester, and polyimide.