JP2010153101A - Bulb type lamp - Google Patents

Bulb type lamp Download PDF

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JP2010153101A
JP2010153101A JP2008327710A JP2008327710A JP2010153101A JP 2010153101 A JP2010153101 A JP 2010153101A JP 2008327710 A JP2008327710 A JP 2008327710A JP 2008327710 A JP2008327710 A JP 2008327710A JP 2010153101 A JP2010153101 A JP 2010153101A
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insulating plate
led
cover body
led substrate
globe
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Toyosaku Shiobara
豊作 塩原
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SSEC KK
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SSEC KK
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bulb type lamp capable of making it difficult for the shadow and shade of a light source to appear on the front side of a globe while it is lighted. <P>SOLUTION: A cover body 2 is provided in the back side of the spherical globe 1, and a control substrate 7 on which an LED 5 mounted to an LED substrate 4, an insulating plate 6 located on the back side of the LED substrate 4, and a control circuit unit 8 are provided is disposed in the cover body. The LED substrate 4 is stuck fast to the insulating plate 6 on the back thereof, a heat dissipating film is formed on the back of each of the LED substrate 4, the insulating plate 6 and the cover body 2, and the insulating plate 6 is brought into contact with the cover body 2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、事務所、一般住宅、店舗、学校、冷凍庫、看板などに用いられる光源がＬＥＤである電球型ランプに関するものである。   The present invention relates to a light bulb type lamp in which a light source used for an office, a general house, a store, a school, a freezer, a signboard, or the like is an LED.

電球型ランプとして、光源である蛍光体を用いて発光する発光管を組み込んでいる蛍光ランプ（例えば特開平９−３２０５３０号公報及び特開２００５−２８１３４１号公報）、光源であるＬＥＤ（発光ダイオード）を組み込んでいるＬＥＤランプ（例えば実開平１−１２３３６９号公報）が提案されている。
近時、これら電球型の蛍光体ランプ及びＬＥＤランプは、白熱照明灯と比較して長寿命であってかつ消費電力が少ないことから、広く利用されている。
上記特開平９−３２０５３０号公報に記載の電球型蛍光ランプ（「従来例１」という。）は、ガラスグローブとケースとからなる外囲器内に発光管と点灯回路とを組み込んでいる。そして、上記特開２００５−２８１３４１号公報に記載の蛍光ランプ（「従来例２」という。）は、口金、ハウジング、蛍光ランプからなる発光管及び透明な外管からなるグローブを有している。また、上記実開平１−１２３３６９号公報に記載の電球型ＬＥＤランプ（「従来例３」という。）は、複数のＬＥＤを直列或いは直並列接続となるように実装したプリント配線板をステムに取り付け、これらをバルブ内に配設し、その端部に口金を取り付けているものである。
特開平９−３２０５３０号公報 特開２００５−２８１３４１号公報 実開平１−１２３３６９号公報 As a light bulb type lamp, a fluorescent lamp (for example, JP-A-9-320530 and JP-A-2005-281341) incorporating a light-emitting tube that emits light using a phosphor as a light source, an LED (light-emitting diode) as a light source An LED lamp (for example, Japanese Utility Model Laid-Open No. 1-123369) has been proposed.
In recent years, these bulb-type phosphor lamps and LED lamps are widely used because they have a longer life and consume less power than incandescent lamps.
The light bulb type fluorescent lamp described in Japanese Patent Laid-Open No. 9-320530 (referred to as “conventional example 1”) incorporates an arc tube and a lighting circuit in an envelope composed of a glass globe and a case. The fluorescent lamp described in Japanese Patent Application Laid-Open No. 2005-281341 (referred to as “conventional example 2”) has a base, a housing, an arc tube made of a fluorescent lamp, and a globe made of a transparent outer tube. In addition, the light bulb type LED lamp (referred to as “conventional example 3”) described in Japanese Utility Model Laid-Open No. 1-123369 is attached to a stem with a printed wiring board on which a plurality of LEDs are mounted in series or in series-parallel connection. These are disposed in the valve, and a base is attached to the end thereof.
JP 9-320530 A JP-A-2005-281341 Japanese Utility Model Publication No. 1-123369

上述した電球型ランプにおいて、点灯中、従来例１及び従来例２にあっては発光管の陰影がグローブの正面（前面）に線状に映し出され、美観を損なう課題があった。また、従来例３にあっては、ＬＥＤから発生する熱によってバルブ内の温度が上昇し、温度上昇がＬＥＤの劣化を招くおそれがある他に、ＬＥＤの陰影がバルブの正面に点（ドット）状に映し出され、上記従来例１及び従来例２と同じ課題がある。
この発明の目的は、点灯中における光源の陰影がグローブの正面側に表れ難くすることができる電球型ランプを提供することにある。 In the above-described light bulb type lamp, in the conventional example 1 and the conventional example 2, the shadow of the arc tube is projected linearly on the front surface (front surface) of the globe, and there is a problem of deteriorating the appearance. In Conventional Example 3, the temperature in the bulb rises due to the heat generated from the LED, and the rise in temperature may cause the LED to deteriorate, and the shadow of the LED is a dot (dot) on the front of the bulb. The same problem as the conventional example 1 and the conventional example 2 is present.
An object of the present invention is to provide a light bulb lamp capable of making it difficult for shadows of a light source during lighting to appear on the front side of a globe.

この発明の電球型ランプは、グローブ、このグローブの一端側である背部側に設けてあるカバー体、このカバー体に連続している口金、上記カバー体内に配置してあるＬＥＤ用基板、このＬＥＤ用基板に取り付けてあるＬＥＤ及び上記ＬＥＤ用基板の背面側に配置してある絶縁板を備えているものである。
この電球型ランプは、絶縁板の背面側に制御回路ユニットを設けてある制御基板を配置することによって光源であるＬＥＤの点灯・消灯の制御手段のユニット化を図ることができる。
この電球型ランプは、上記ＬＥＤ用基板とその背面に位置している絶縁板とが互いに密着され、上記ＬＥＤ用基板及び絶縁板のそれぞれの背面に放熱膜を形成し、上記絶縁板がカバー体に接触させることによって放熱効果を高めることができる。
この電球型ランプは、上記ＬＥＤ用基板とその背面に位置している絶縁板とが互いに密着され、上記ＬＥＤ用基板、絶縁板及びカバー体のそれぞれの背面に放熱膜を形成し、上記絶縁板がカバー体に接触させることによって放熱効果をより一層高めることができる。 The bulb-type lamp of the present invention includes a globe, a cover body provided on the back side which is one end side of the globe, a base continuous with the cover body, an LED substrate disposed in the cover body, and the LED And an insulating plate disposed on the back side of the LED substrate.
In this bulb-type lamp, the control means for turning on / off the LED as the light source can be unitized by arranging a control board provided with a control circuit unit on the back side of the insulating plate.
In this bulb-type lamp, the LED substrate and the insulating plate located on the back surface thereof are in close contact with each other, a heat radiation film is formed on the back surface of the LED substrate and the insulating plate, and the insulating plate is a cover body. The effect of heat dissipation can be enhanced by bringing them into contact with each other.
In this bulb-type lamp, the LED substrate and the insulating plate located on the back surface thereof are in close contact with each other, and a heat dissipation film is formed on the back surface of the LED substrate, the insulating plate, and the cover body. The heat dissipation effect can be further enhanced by bringing the cover into contact with the cover body.

この発明によれば、グローブの背部側内部にＬＥＤ及びＬＥＤ用の基板を配置してあるので、簡単な構成によってグローブ正面側の表面に光源であるＬＥＤの影が表れにくくなり、点灯中の電球型ＬＥＤランプの美観を損ねない。   According to the present invention, the LED and the LED substrate are arranged inside the back side of the globe, so that the shadow of the LED as the light source does not easily appear on the surface on the front side of the globe with a simple configuration. The appearance of the LED lamp is not impaired.

この発明に係る電球型ランプについて図面を参照して説明する。
図１及び図２に示す電球型ランプＬは、グローブ１、カバー体２、口金３、ＬＥＤ用基板４、ＬＥＤ５、絶縁板６、制御基板７及び制御回路ユニット８を備えている。 A light bulb type lamp according to the present invention will be described with reference to the drawings.
A light bulb type lamp L shown in FIGS. 1 and 2 includes a globe 1, a cover body 2, a base 3, an LED substrate 4, an LED 5, an insulating plate 6, a control substrate 7, and a control circuit unit 8.

図１において、グローブ１はその材質や色彩は適宜であるが、本例ではポリカーボネート、蛍光塗料、拡散材及び変色防止材を混合配分した乳白色のプラスチックによって球形に成形されている。グローブ１の背部端部がカバー体２の下端外周部２ａの内面に嵌め込まれて支持されている。
カバー体２はプラスチックによってグローブ１側が開口となっている椀状に形成され、グローブの一端部側である背部側（図１上端部側）に口金３が連続されている。カバー体２には、図３及び図４に示すように複数の放熱孔２ｃを図４に示す例では４個所にあけてある。放熱孔２ｃは、後述するＬＥＤ５の発光に伴って電球型ランプＬ内の温度上昇を抑制するためのものである。カバー体２の内周面には、各放熱孔２ｃの下端側開口を被覆するようにフィルター１４を装着してある。フィルター１４は、各放熱孔２ｃを通じて電球型ランプＬ内への塵埃の浸入を防止するものである。 In FIG. 1, the material and color of the globe 1 are appropriate. In this example, the globe 1 is formed into a spherical shape by milky white plastic mixed with polycarbonate, fluorescent paint, diffusing material, and anti-discoloration material. The back end portion of the globe 1 is fitted into and supported by the inner surface of the lower end outer peripheral portion 2 a of the cover body 2.
The cover body 2 is formed in a bowl shape having an opening on the globe 1 side by plastic, and a base 3 is continuous with a back side (upper end side in FIG. 1) which is one end side of the globe. As shown in FIGS. 3 and 4, the cover body 2 has a plurality of heat radiation holes 2 c at four locations in the example shown in FIG. 4. The heat radiating hole 2c is for suppressing the temperature rise in the light bulb type lamp L with the light emission of the LED 5 described later. A filter 14 is attached to the inner peripheral surface of the cover body 2 so as to cover the lower end side opening of each heat radiation hole 2c. The filter 14 prevents dust from entering the light bulb type lamp L through each heat radiating hole 2c.

ＬＥＤ用基板４はカバー体２内に配置されている。ＬＥＤ用基板４の正面側である前面側（図１下面側）には複数のＬＥＤ５を実装してある。ＬＥＤ用基板４は円板状に形成されており、このＬＥＤ用基板にはその外形に沿って各ＬＥＤ５を所定の間隔を持って配置してある。各ＬＥＤ５には表面実装型のものが使用されている。ＬＥＤ用基板４は制御基板７と電気的に接続されている。
図１及び図２において、絶縁板６はＬＥＤ用基板４の背面（裏面）側に配置してある。絶縁板６は、その前面（表面）でＬＥＤ用基板４をビスや接着剤などの固定手段（図１の例ではビス１２）によって固定している。絶縁板６は円板状に形成され（図２）、カバー体２内に水平状態に保持されている。絶縁板６は、カバー体２の内面から突出されている受け台２ｂの下面に当てられ、ビス１３によって固定されている。絶縁板６の外周面はカバー体２の内周面に接触している。
なお、図２において、絶縁板６には、ＬＥＤ用基板４と制御基板７とを電気的に接続するための配線を通すための配線用の孔６ａを開けてある。 The LED substrate 4 is disposed in the cover body 2. A plurality of LEDs 5 are mounted on the front side (the lower side in FIG. 1) which is the front side of the LED substrate 4. The LED substrate 4 is formed in a disc shape, and the LEDs 5 are arranged on the LED substrate with predetermined intervals along the outer shape thereof. Each LED 5 is of a surface mount type. The LED substrate 4 is electrically connected to the control substrate 7.
1 and 2, the insulating plate 6 is disposed on the back surface (back surface) side of the LED substrate 4. The insulating plate 6 fixes the LED substrate 4 on its front surface (front surface) with fixing means such as screws or adhesives (screws 12 in the example of FIG. 1). The insulating plate 6 is formed in a disc shape (FIG. 2) and is held in a horizontal state in the cover body 2. The insulating plate 6 is applied to the lower surface of the cradle 2 b protruding from the inner surface of the cover body 2 and is fixed by screws 13. The outer peripheral surface of the insulating plate 6 is in contact with the inner peripheral surface of the cover body 2.
In FIG. 2, the insulating plate 6 is provided with a wiring hole 6 a for passing a wiring for electrically connecting the LED substrate 4 and the control substrate 7.

制御基板７は絶縁板６の背面（裏面）側に配置してある。制御基板７は、図示しない保持手段によってカバー体２内に水平状態に保持されている。制御基板７の背面にはＬＥＤ５を点消灯させる制御回路ユニット８を設けてある。制御回路ユニット８はコンデンサー８ａなどを有している。   The control board 7 is arranged on the back surface (back surface) side of the insulating plate 6. The control board 7 is held horizontally in the cover body 2 by holding means (not shown). A control circuit unit 8 for turning on and off the LED 5 is provided on the back surface of the control board 7. The control circuit unit 8 includes a capacitor 8a and the like.

図示する電球型ランプには、ＬＥＤ５から発生する熱によってグローブ１及びカバー体２内の温度上昇を抑制するために下記の放熱手段を組み込んである。
そこで、図３に示す放熱手段について説明する。
ＬＥＤ用基板４、絶縁板６及びカバー体２の各背面（図上面）には、全面に放熱膜であるセラミックコート膜９，１０，１１を塗布してある。ＬＥＤ用基板４のセラミックコート膜９は絶縁板６の前面に密着されており、絶縁板６の外周面はカバー体２の内周面に密着されている。
このため、ＬＥＤ５から発生した熱は、ＬＥＤ用基板４を通じてセラミックコート膜９から絶縁板６のセラミックコート膜１０を介してカバー体２のセラミックコート膜１１に伝えられ、カバー体２の外方へ放出される。
このように、セラミックコート膜９，１０，１１はＬＥＤ５の熱を吸収してカバー体２の外へ逃すことによってグローブ１内の熱を下げる役割を果たし、その結果として、これらのセラミックコート膜を有するＬＥＤ用基板４、絶縁板６及びカバー体２が一体となってヒートシンクの機能が発揮される。 The illustrated light bulb type lamp incorporates the following heat dissipation means in order to suppress temperature rise in the globe 1 and the cover body 2 due to heat generated from the LED 5.
Therefore, the heat radiating means shown in FIG. 3 will be described.
Ceramic coating films 9, 10, and 11, which are heat dissipation films, are applied to the entire back surface (upper surface in the figure) of the LED substrate 4, the insulating plate 6, and the cover body 2. The ceramic coat film 9 of the LED substrate 4 is in close contact with the front surface of the insulating plate 6, and the outer peripheral surface of the insulating plate 6 is in close contact with the inner peripheral surface of the cover body 2.
For this reason, the heat generated from the LED 5 is transmitted from the ceramic coat film 9 through the LED substrate 4 to the ceramic coat film 11 of the cover body 2 via the ceramic coat film 10 of the insulating plate 6, and to the outside of the cover body 2. Released.
Thus, the ceramic coat films 9, 10, and 11 serve to lower the heat in the globe 1 by absorbing the heat of the LED 5 and letting it out of the cover body 2, and as a result, these ceramic coat films The LED substrate 4, the insulating plate 6, and the cover body 2 that are included are integrated to exhibit the function of the heat sink.

上記構成の電球型ランプＬにおいて、ＬＥＤ５からの放射光は、その光軸を中心として円錐状（放射状）に広がり、グローブ１の正面側の照射面を透過して電球型ランプの正面側（図１下方側）へ面発光される。発光の際、ＬＥＤ５を支持しているＬＥＤ用基板４は、グローブ１の背部側のカバー体２内の絶縁板６の前面に固定されているために、ＬＥＤ５の放射角度が広がり、このために、面発光としての効果が発揮され、グローブ１の正面側の照射面へのＬＥＤ５の影がドット状に表れにくくなり、この効果はグローブ１の色彩が乳白色であることによってより一層発揮されている。
ＬＥＤ５から発生される熱は、上述したようにＬＥＤ用基板４から絶縁板６に吸収され、吸収された熱は絶縁板からグローブ１を経て外部に放出されて電球型ランプＬ内の高熱化が抑制される。ＬＥＤ用基板４、絶縁板６及びカバー体２のそれぞれのセラミックコート膜９，１０，１１によって高熱化の抑制がより一層効果的になる。
ＬＥＤ用基板４の熱は、一方で絶縁板６へ放熱されるが、他方でＬＥＤ用基板が接触しているカバー体２内面を通じてカバー体のセラミックコート膜１１に直接吸収される。
また絶縁板６の熱は、一方でカバー体２の受け台２ｂを通じてカバー体２のセラミックコート膜１１に吸収され、他方でその外周面がカバー内面に接触しているので、外周面を通じてカバー体のセラミックコート膜に吸収される。
さらに、電球型ランプＬ内の熱は、放熱孔２ｃからカバー体２の外へ排出されるので、ＬＥＤ５の発光に伴う温度上昇を抑制することができる。 In the bulb-type lamp L having the above-described configuration, the emitted light from the LED 5 spreads conically (radially) around the optical axis, passes through the irradiation surface on the front side of the globe 1, and the front side of the bulb-type lamp (see FIG. 1) the surface is emitted. At the time of light emission, the LED substrate 4 supporting the LED 5 is fixed to the front surface of the insulating plate 6 in the cover body 2 on the back side of the globe 1, so that the radiation angle of the LED 5 is widened. The effect of surface light emission is exhibited, and the shadow of the LED 5 on the irradiation surface on the front side of the globe 1 is less likely to appear in the form of dots, and this effect is further exhibited by the color of the globe 1 being milky white. .
The heat generated from the LED 5 is absorbed from the LED substrate 4 to the insulating plate 6 as described above, and the absorbed heat is released from the insulating plate to the outside through the globe 1 to increase the heat in the light bulb type lamp L. It is suppressed. The suppression of the increase in heat becomes even more effective by the ceramic coat films 9, 10, and 11 of the LED substrate 4, the insulating plate 6, and the cover body 2.
The heat of the LED substrate 4 is radiated to the insulating plate 6 on the one hand, but is directly absorbed by the ceramic coat film 11 of the cover body through the inner surface of the cover body 2 in contact with the LED substrate.
The heat of the insulating plate 6 is absorbed on the one hand by the ceramic coat film 11 of the cover body 2 through the cradle 2b of the cover body 2, and on the other hand, the outer peripheral surface thereof is in contact with the inner surface of the cover. Is absorbed by the ceramic coating film.
Furthermore, since the heat in the light bulb type lamp L is discharged from the heat radiating hole 2c to the outside of the cover body 2, it is possible to suppress the temperature rise caused by the light emission of the LED 5.

グローブ１は、上述したように予め乳白色のポリカーボネートペレット、蛍光塗料ペレット、拡散材ペレット及び変色防止材のそれぞれの配分比率を所定の値に設定しておく。これらの材質の配合比率を適宜変更することによって、電球型ランプＬから投射される光の拡散、透視度及び光源からの投射率量の調整が図られる。   As described above, the globe 1 previously sets distribution ratios of milky white polycarbonate pellets, fluorescent paint pellets, diffusion material pellets, and discoloration prevention materials to predetermined values. By appropriately changing the blending ratio of these materials, it is possible to adjust the diffusion of light projected from the light bulb type lamp L, the degree of transparency, and the amount of projection from the light source.

図示する電球型ランプＬでは、ＬＥＤ５を取り付けているＬＥＤ用基板４を支持している絶縁板６をグローブ１の背部側のカバー体２内に配置しているので、光軸を中心として放射状に広がるＬＥＤの光は、照射面までの距離が長くなるので、放射エリアが広がり、グローブの正面側の表面に各ＬＥＤ５のドット状の影が表れにくく、電球型ランプの設置場所やその用途の範囲が広がり、換言すれば、電球型ランプの利用範囲を広げることができる。
また、グローブ１はポリカーボネート、蛍光塗料、拡散材及び変色防止材を混合配分して乳白色のプラスチックによって構成されているので、光の拡散、透視度及び光源であるＬＥＤ５からの投射率量を調整することができ、グローブ背部側のカバー体２内にＬＥＤ５を配置してあることと相俟ってグローブの正面側の表面に各ＬＥＤ５によるドット状の影が表れにくくする効果がより良く発揮され、電球型ランプＬを多方面の照明手段として利用することができる。 In the illustrated light bulb-type lamp L, the insulating plate 6 supporting the LED substrate 4 to which the LED 5 is attached is disposed in the cover body 2 on the back side of the globe 1, so that it radiates about the optical axis. The spread of LED light increases the distance to the irradiation surface, so that the radiation area is widened, and the dot-like shadow of each LED 5 is difficult to appear on the front surface of the globe. In other words, the range of use of the bulb-type lamp can be expanded.
Further, the globe 1 is made of milky white plastic by mixing and distributing polycarbonate, fluorescent paint, diffusing material, and anti-discoloring material, and thus adjusts the light diffusion, transparency, and projection rate from the LED 5 as the light source. In combination with the fact that the LEDs 5 are arranged in the cover body 2 on the back side of the globe, the effect of making it difficult for dot-like shadows due to the respective LEDs 5 to appear on the front surface of the globe is exhibited better. The light bulb type lamp L can be used as a lighting device in various directions.

上述した例では、乳白色のプラスチック製のグローブ１内に白色光のＬＥＤ５が配置されているが、グローブにおける色彩は、ＬＥＤ５の発光色と同系色（同一色を含む。）とすることが、グローブの表面にＬＥＤの影が表れることを極力制限する観点から望ましい。もちろん、グローブ１の材質及びその色彩並びにＬＥＤ５の発光色は上例に限定されない。
図１では、カバー体２と口金３とが別部材で構成されているが、それぞれを一体的に連続させても良い。カバー体２の材質は適宜であるが、プラスチックに限られずガラスなどであっても良い。
ＬＥＤ５の種類も図示の例に限定されず、弾丸型のものなど適宜であり、またＬＥＤの種類によってはＬＥＤ用基板４の背面に絶縁板６の正面（前面）を密着することができない場合には、ＬＥＤ用基板と絶縁板との間に放熱部を介在させるのが良い。放熱部として、例えばＬＥＤ用基板の背面から突出させた突出部で構成し、この突出部を絶縁板に接触させるなどであっても良い。
ＬＥＤ用基板４と絶縁板６とを密着できない場合には、ＬＥＤ用基板からカバー体２へ直接放熱するようにしても良い。
放熱膜９，１０，１１はセラミックコート膜に限られない。 In the above-described example, the white light LED 5 is arranged in the milky white plastic globe 1, but it is assumed that the color of the globe is the same color (including the same color) as the emission color of the LED 5. It is desirable from the viewpoint of limiting the shadow of the LED on the surface of the LED as much as possible. Of course, the material and color of the globe 1 and the emission color of the LED 5 are not limited to the above examples.
In FIG. 1, the cover body 2 and the base 3 are formed of separate members, but they may be continuously integrated. The material of the cover body 2 is appropriate, but is not limited to plastic and may be glass or the like.
The type of the LED 5 is not limited to the example shown in the figure, and a bullet type or the like is appropriate. Also, depending on the type of the LED, the front surface (front surface) of the insulating plate 6 cannot be adhered to the back surface of the LED substrate 4. It is preferable to interpose a heat dissipation part between the LED substrate and the insulating plate. For example, the heat radiating portion may be constituted by a protruding portion protruding from the back surface of the LED substrate, and the protruding portion may be brought into contact with an insulating plate.
When the LED substrate 4 and the insulating plate 6 cannot be adhered to each other, heat may be directly radiated from the LED substrate to the cover body 2.
The heat dissipation films 9, 10, and 11 are not limited to ceramic coat films.

この発明に係る電球型ランプを示す一部切欠正面図である。It is a partially cutaway front view showing a light bulb type lamp according to the present invention. 図１のＩＩ−ＩＩ線断面図である。It is the II-II sectional view taken on the line of FIG. この発明に係る電球型ランプに使用するカバー体、絶縁板、ＬＥＤ用基板の関係を示す正面図であって、カバー体を断面にしている図である。It is a front view which shows the relationship between the cover body used for the light bulb type lamp concerning this invention, an insulating board, and the board | substrate for LED, Comprising: It is the figure which made the cover body the cross section. この発明に係る電球型ランプに使用するカバー体を示す平面図である。It is a top view which shows the cover body used for the light bulb type lamp concerning this invention.

符号の説明Explanation of symbols

Ｌ 電球型ランプ
１ グローブ
２ カバー体
３ 口金
４ ＬＥＤ用基板
５ ＬＥＤ
６ 絶縁板
７ 制御基板
８ 制御回路ユニット
９，１０，１１ セラミックコート膜（放熱膜） L Light bulb type lamp 1 Globe 2 Cover body 3 Base 4 LED substrate 5 LED
6 Insulating plate 7 Control board 8 Control circuit unit 9, 10, 11 Ceramic coating film (heat dissipation film)

Claims (4)

グローブ、このグローブの一端側である背部側に設けてあるカバー体、このカバー体に連続している口金、上記カバー体内に配置してあるＬＥＤ用基板、このＬＥＤ用基板に取り付けてあるＬＥＤ及び上記ＬＥＤ用基板の背面側に配置してある絶縁板を備えていることを特徴とする電球型ランプ。   A globe, a cover provided on the back side which is one end of the globe, a base continuous to the cover, an LED substrate disposed in the cover, an LED attached to the LED substrate, and A bulb-type lamp comprising an insulating plate disposed on the back side of the LED substrate. 絶縁板の背面側には、制御回路ユニットを設けてある制御基板を配置してあることを特徴とする請求項１記載の電球型ランプ。   2. The light bulb type lamp according to claim 1, wherein a control board provided with a control circuit unit is disposed on the back side of the insulating plate. ＬＥＤ用基板はその背面で絶縁板と密着されており、上記ＬＥＤ用基板及び絶縁板のそれぞれの背面に放熱膜を形成してあり、上記絶縁板がカバー体に接触されていることを特徴とする請求項１又は請求項２記載の電球型ランプ。   The LED substrate is in close contact with the insulating plate on the back surface, a heat dissipation film is formed on the back surface of each of the LED substrate and the insulating plate, and the insulating plate is in contact with the cover body. The light bulb type lamp according to claim 1 or 2. ＬＥＤ用基板はその背面で絶縁板と密着されており、上記ＬＥＤ用基板、絶縁板及びカバー体のそれぞれの背面に放熱膜を形成してあり、上記絶縁板が上記カバー体に接触されていることを特徴とする請求項１又は請求項２記載の電球型ランプ。
The LED substrate is in close contact with the insulating plate on the back surface, and a heat dissipation film is formed on the back surface of each of the LED substrate, the insulating plate, and the cover body, and the insulating plate is in contact with the cover body. The light bulb type lamp according to claim 1 or 2, characterized by the above.
JP2008327710A 2008-12-24 2008-12-24 Bulb type lamp Pending JP2010153101A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012008132A1 (en) * 2010-07-12 2012-01-19 ハリソン東芝ライティング株式会社 Light source device
JP2012221807A (en) * 2011-04-11 2012-11-12 Toshiba Lighting & Technology Corp Bulb
JP2013048090A (en) * 2011-07-22 2013-03-07 Panasonic Corp Lamp
KR101244855B1 (en) * 2011-01-14 2013-03-18 (주)뉴옵틱스 LED lamp

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JP2002312892A (en) * 2001-02-06 2002-10-25 Tokiwa Dengyo Kk Light emitting body and signal light
JP2006313731A (en) * 2005-04-08 2006-11-16 Toshiba Lighting & Technology Corp Lamp

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JP2002312892A (en) * 2001-02-06 2002-10-25 Tokiwa Dengyo Kk Light emitting body and signal light
JP2006313731A (en) * 2005-04-08 2006-11-16 Toshiba Lighting & Technology Corp Lamp

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012008132A1 (en) * 2010-07-12 2012-01-19 ハリソン東芝ライティング株式会社 Light source device
JP2012022802A (en) * 2010-07-12 2012-02-02 Harison Toshiba Lighting Corp Light source device
CN102959309A (en) * 2010-07-12 2013-03-06 东芝照明技术株式会社 Light source device
KR101244855B1 (en) * 2011-01-14 2013-03-18 (주)뉴옵틱스 LED lamp
JP2012221807A (en) * 2011-04-11 2012-11-12 Toshiba Lighting & Technology Corp Bulb
JP2013048090A (en) * 2011-07-22 2013-03-07 Panasonic Corp Lamp
US8981636B2 (en) 2011-07-22 2015-03-17 Panasonic Intellectual Property Management Co., Ltd. Lamp having improved insulation of the circuit unit

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