JP2010152434A - Noncontact data sender/receiver and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a noncontact data sender/receiver with excellent chemical resistance, weather resistance, heat resistance and communication characteristics. <P>SOLUTION: The noncontact data sender/receiver 10 includes an inlet 11 and a cover 23 for covering the inlet 11 via resist layers 17, 18. The inlet 11 includes: a glass epoxy base 12, a first conductor 13 provided on one side 12a thereof; a second conductor 14 provided on the other side 12b; third conductors 15, 16 provided on the inner surfaces of through-holes 12c, 12d passing through the glass epoxy base 12 in its thickness direction, for connecting the first conductor 13 to the second conductor 14; and an IC chip 20 connected to the first conductor 13. The resist layers 17, 18 are provided to cover at least the first conductor 13, the second conductor 14 and the boundary between the conductors and the glass epoxy base 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention is a non-contact type data that can receive information from the outside using radio waves, mainly microwaves as a medium, and transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). The present invention relates to a transmitter / receiver and a manufacturing method thereof, and more particularly, to a non-contact type data receiver / transmitter excellent in chemical resistance, weather resistance and heat resistance, and further excellent in communication characteristics, and a manufacturing method thereof.

An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave from the apparatus is received, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and information in the IC chip is converted into a signal, and this signal is transmitted from the antenna of the IC tag. Called.
A signal transmitted from the IC tag is received by the antenna of the information writing / reading device, sent to the data processing device via the controller, and data processing such as identification is performed.

In order to make such an IC tag excellent in heat resistance and weather resistance, an IC tag packaged by coating an inlet with a thermoplastic resin or the like has been proposed.
As a method for manufacturing such a packaged IC tag, a method is disclosed in which an inlet is sandwiched between thermoplastic resin sheets and then subjected to hot press molding to coat the inlet with a thermoplastic resin (for example, , See Patent Document 1). Here, a flexible substrate such as a polyethylene terephthalate (PET) substrate is used as the inlet substrate.
Also, the IC tag can be packaged by sandwiching the inlet between the thermoplastic resin sheets and then ultrasonically welding the mating surfaces of the thermoplastic resin sheets in this state.
International Publication No. 2008/001729 Pamphlet

However, when the inlet is coated with a thermoplastic resin by the manufacturing method disclosed in Patent Document 1, (1) the base material of the inlet expands and contracts due to heat and pressure during hot press molding, and the IC chip is displaced. (2) The adhesive used for mounting the IC chip is dissolved, and the IC chip is displaced. (3) The mounting portion of the IC chip causes adhesion failure, and the IC chip is displaced. There was a problem.
When the IC chip is displaced as described above, there is a problem that the IC tag causes a communication failure.

In addition, in the method of ultrasonically welding the mating surfaces of the thermoplastic resin sheet, heat or pressure that causes a defect in the inlet is not applied, but air is blown between the inlet and the thermoplastic resin sheet during molding. In some cases, the IC tag is trapped and an IC tag having an air layer inside is formed.
As described above, when an air layer exists inside the IC tag, when the IC tag is used in a high temperature environment, the air layer expands and the IC tag is deformed. As a result, the resonance frequency is shifted, and the IC tag However, there was a problem of causing poor communication.

  The present invention has been made in view of the above circumstances, and provides a non-contact type data transmitter / receiver excellent in chemical resistance, weather resistance and heat resistance, and excellent in communication characteristics, and a method for manufacturing the same. With the goal.

  The non-contact type data transmitting / receiving body of the present invention includes an inlet, a resist layer provided on one surface and the other surface of the inlet, and a covering material that covers the inlet via the resist layer. The inlet is provided on a glass epoxy substrate, a first conductor provided on one surface of the glass epoxy substrate, and on the other surface of the glass epoxy substrate. A second conductor, a third conductor provided on an inner surface of a through-hole penetrating the glass epoxy substrate in the thickness direction, and connecting the first conductor and the second conductor; and the first conductor Or an IC chip connected to the second conductor, and the resist layer includes at least the first conductor, the second conductor, a boundary between the first conductor and the glass epoxy substrate, and The first Characterized in that provided conductor and to cover the boundary of the glass epoxy substrate.

  It is preferable that the through hole is filled with a resin material forming the covering material via the third conductor.

  The manufacturing method of the non-contact type data transmitting / receiving body of the present invention includes an inlet, a resist layer provided on one side and the other side of the inlet, and a covering material that covers the inlet via the resist layer. A process A for providing a first conductor on one surface of a glass epoxy substrate and a second conductor on the other surface of the glass epoxy substrate. And forming a through hole substantially perpendicular to the glass epoxy substrate from one surface of the glass epoxy substrate to the other surface, and forming a third conductor on the entire inner surface of the through hole. Step B for connecting the first conductor and the second conductor via the third conductor, at least the first conductor, the second conductor, the first conductor and the glass epoxy Board boundary And the step C of providing the resist layer so as to cover the boundary between the second conductor and the glass epoxy substrate, and on one surface of the glass epoxy substrate, an IC chip is connected to the first conductor, It has the process D which obtains an inlet, and the process E which pinches | interposes the said inlet with the resin sheet which makes the said coating | covering material, and carries out hot press molding.

  According to the non-contact type data receiving / transmitting body of the present invention, since the glass epoxy substrate having excellent heat resistance is used as the base material of the inlet, even when hot press molding is performed when the coating material is provided, The IC chip is not displaced due to expansion and contraction, and as a result, the communication failure of the non-contact type data receiver / transmitter does not occur. In addition, a resist layer is interposed between the inlet and the covering material, and the resist layer includes at least a first conductor, a second conductor, a boundary between the first conductor and the glass epoxy substrate, and a second conductor and glass. Since it is provided so as to cover the boundary of the epoxy substrate, the adhesion between the inlet and the covering material is improved, so that an air layer is not formed between the inlet and the covering material, and non-contact type data reception is performed in a high temperature environment. Even if the transmitter is used, the air layer does not expand and the inlet 11 is not deformed. As a result, the resonance frequency is shifted and the non-contact type data receiver / transmitter does not cause communication failure. Moreover, since the inlet is covered with a coating material, the non-contact type data receiving / transmitting body is excellent in chemical resistance, weather resistance and heat resistance.

According to the method for manufacturing a non-contact type data transmitting / receiving body of the present invention, in step C, at least the first conductor, the second conductor, the boundary between the first conductor and the glass epoxy substrate, and the second conductor A resist layer is provided so as to cover the boundary of the glass epoxy substrate, and in step E, the inlet is sandwiched between the resin sheets forming the coating material, and hot press molding is performed. Therefore, when forming the coating material, hot press molding may be performed. The IC chip is not displaced due to the expansion and contraction of the glass epoxy substrate, and as a result, the communication failure of the obtained non-contact type data receiving / transmitting body does not occur.
In addition, since the inlet having a resist layer on the surface is coated with a coating material by hot press molding, the adhesion between the inlet and the coating material is improved, so that an air layer is not generated between the inlet and the coating material. Even if the obtained non-contact type data receiving / transmitting body is used in a high temperature environment, the air layer does not expand and the inlet is not deformed. The transmitter does not cause communication failure.

The best mode of the contactless data receiving / transmitting body and the manufacturing method thereof according to the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment of Non-Contact Type Data Receiver / Transmitter FIG. 1 is a schematic view showing a first embodiment of a non-contact type data receiver / transmitter of the present invention, (a) is a plan view, (B) is sectional drawing which follows the AA line of (a).
The contactless data transmitting / receiving body 10 of this embodiment includes an inlet 11, a resist layer 17 provided on the entire surface of one side of the inlet 11, a resist layer 18 provided on the entire other surface of the inlet 11, and the like. And a covering material 23 that covers the inlet 11 via the resist layers 17 and 18.
The inlet 11 includes a glass epoxy substrate 12, a planar first conductor 13 provided on one surface 12 a of the glass epoxy substrate 12, and a planar shape provided on the other surface 12 b of the glass epoxy substrate 12. The second conductor 14 and the third conductors 15 and 16 penetrating the glass epoxy substrate 12 in the thickness direction and connecting the first conductor 13 and the second conductor 14 to each other at one end side. , And the IC chip 20 connected to the first conductor 13.

In the inlet 11, the first conductor 13 is provided on one surface 12 a of the glass epoxy substrate 12 via an adhesive or adhesive, and the adhesive or adhesive on the other surface 12 b of the glass epoxy substrate 12. A second conductor 14 is provided via the.
Further, the first conductor 13 and the second conductor 14 are arranged to face each other with the glass epoxy substrate 12 interposed therebetween. The first conductor 13 and the second conductor 14 are in a parallel relationship.

  The third conductor 15 is provided in the through hole 12c penetrating the glass epoxy substrate 12 in the thickness direction, that is, substantially perpendicular to the glass epoxy substrate 12 from one surface 12a to the other surface 12b. In the through hole 12c, the entire inner surface 12e of the through hole 12c is provided. And the through-hole 12c provided with the third conductor 15 is not filled with the third conductor 15, but the central portion of the through-hole 12c provided with the third conductor 15 is made of glass. A resin material constituting the covering material 23 is filled from one surface 12a of the epoxy substrate 12 to the other surface 12b. That is, the through hole 12 c is filled with a resin material that forms the covering material 23 via the third conductor 15.

  Similarly, the third conductor 16 is provided substantially perpendicular to the glass epoxy substrate 12 in a through-hole 12d penetrating the glass epoxy substrate 12 in the thickness direction, that is, from one surface 12a to the other surface 12b. The through hole 12d is provided on the entire inner surface 12f of the through hole 12d. And the through-hole 12d provided with the third conductor 16 is not filled with the third conductor 16, but the central portion of the through-hole 12d provided with the third conductor 16 is not filled with glass. A resin material constituting the covering material 23 is filled from one surface 12a of the epoxy substrate 12 to the other surface 12b. That is, the through hole 12 d is filled with a resin material that forms the covering material 23 via the third conductor 16.

  Further, the through hole 12 c and the through hole 12 d are provided at a predetermined interval along the longitudinal direction of the glass epoxy substrate 12. That is, the third conductor 15 and the third conductor 16 are provided at predetermined intervals along the longitudinal direction of the glass epoxy substrate 12.

And the 3rd conductor 15 is connected with the 1st conductor 13 in the opening part by the side of one surface 12a of the glass epoxy board | substrate 12 in the through-hole 12c, and the other side of the glass epoxy board | substrate 12 in the through-hole 12c The second conductor 14 is connected to the opening on the surface 12b side. Similarly, the third conductor 16 is connected to the first conductor 13 at the opening on the one surface 12a side of the glass epoxy substrate 12 in the through hole 12d, while the other of the glass epoxy substrate 12 in the through hole 12d. The second conductor 14 is connected to the opening on the surface 12b side.
Accordingly, the first conductor 13 and the second conductor 14 are electrically connected via the third conductors 15 and 16, and the first conductor 13, the second conductor 14, and the third conductor 15, Reference numeral 16 denotes an antenna 19 in which the cross-sectional shape in the thickness direction of the glass epoxy substrate 12 is substantially square-shaped.

  The length in the longitudinal direction of the antenna 19, that is, the first conductor 13 provided on the one surface 12 a of the glass epoxy substrate 12 through the third conductors 15, 16 is provided on the other surface 12 b. The length over the two conductors 14 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> or the microwave band that is the use frequency of the non-contact type data transmitter / receiver 10. It is length.

The cross-sectional shape of the through holes 12c and 12d perpendicular to the thickness direction of the glass epoxy substrate 12, that is, the shape in plan view, is circular. The shape of the cross section of the through holes 12c and 12d is not particularly limited, and may be an ellipse, a triangle, a quadrangle (rectangle), a pentagon or more polygon.
The sizes of the through holes 12c and 12d are not particularly limited, and are appropriately adjusted according to the resonance frequency of the antenna 19.

The IC chip 20 is connected to the first conductor 13 by wire bonding using fine wires 21 and 21 on one surface 12 a of the glass epoxy substrate 12. Thereby, the antenna 19 and the IC chip 20 are electrically connected.
The IC chip 19 mounted on the glass epoxy substrate 12 is sealed with a sealing material 22.

The resist layer 17 provided on the entire surface of one surface of the inlet 11 (the surface on the one surface 12a side of the glass epoxy substrate 12) is the first conductor 13 provided on the one surface 12a of the glass epoxy substrate 12. And the boundary between the first conductor 13 and the glass epoxy substrate 12 are covered. The resist layer 17 gradually decreases in thickness from the corner 13b on one end side of the first conductor 13 toward one end of the glass epoxy substrate 12 at both ends of the glass epoxy substrate 12 in the longitudinal direction. The shape is such that the thickness gradually decreases from the corner 13 c on the other end side of the conductor 13 toward the other end of the glass epoxy substrate 12. That is, the resist layer 17 has a smooth curved shape in the vicinity of the corner 13 b on one end side and the corner 13 c on the other end side of the first conductor 13.
The resist layer 17 is provided to improve the adhesion between the inlet 11 and the covering material 23. This is because if the first conductor 13 provided on the one surface 12a of the glass epoxy substrate 12 is directly covered with the covering material 23, the adhesion between the two at the interface between the first conductor 13 and the covering material 23 is poor. Interfacial peeling occurs. Therefore, the adhesiveness between the inlet 11 and the covering material 23 is improved by interposing the resist layer 17 between the first conductor 13 and the covering material 23. Further, since the resist layer 17 has a smooth curved shape in the vicinity of the corner 13b on the one end side and the corner 13c on the other end side of the first conductor 13, the corner 13b on the one end side of the first conductor 13 is formed. Even in the vicinity of the corner 13c on the other end side, the covering material 23 easily deforms following the outer shape of the inlet 11, so that the adhesion between the inlet 11 and the covering material 23 is improved.

Similarly, the resist layer 18 provided on the entire other surface of the inlet 11 (the surface on the other surface 12b side of the glass epoxy substrate 12) is a second conductor provided on the other surface 12b of the glass epoxy substrate 12. 14, and covers the boundary between the second conductor 14 and the glass epoxy substrate 12. The resist layer 18 gradually decreases in thickness from the corner 14b on one end side of the second conductor 14 toward one end of the glass epoxy substrate 12 at both ends in the longitudinal direction of the glass epoxy substrate 12, and The shape is such that the thickness gradually decreases from the corner 14 c on the other end side of the conductor 14 toward the other end of the glass epoxy substrate 12. That is, the resist layer 18 has a smooth curved shape in the vicinity of the corner 14 b on one end side and the corner 14 c on the other end side of the second conductor 14.
The resist layer 18 is provided to improve the adhesion between the inlet 11 and the covering material 23. Because, when the second conductor 14 provided on the other surface 12b of the glass epoxy substrate 12 is directly covered with the covering material 23, the adhesion between the two conductors 14 and the covering material 23 is poor at the interface between the second conductor 14 and the covering material 23. Interfacial peeling occurs. Therefore, the adhesiveness between the inlet 11 and the covering material 23 is improved by interposing the resist layer 18 between the second conductor 14 and the covering material 23. Further, since the resist layer 18 has a smooth curved shape in the vicinity of the corner 14b on one end side and the corner 14c on the other end side of the second conductor 14, the corner 14b on the one end side of the second conductor 14 is formed. Even in the vicinity of the corner 14c on the other end side, the covering material 23 is easily deformed following the outer shape of the inlet 11, so that the adhesion between the inlet 11 and the covering material 23 is improved.

  As the glass epoxy substrate 12, a substrate formed by impregnating an epoxy resin into a laminate of nonwoven fabrics made of glass fibers and press-molding is used. Since the glass epoxy substrate 12 is excellent in heat resistance, it is excellent in dimensional stability. Further, since the glass epoxy substrate 12 is a material having a very low dielectric constant, the communication characteristics of the antenna 19 are not deteriorated when used as the base material of the inlet 11.

  The 1st conductor 13, the 2nd conductor 14, and the 3rd conductors 15 and 16 consist of metal thin films, and gold, silver, copper, tin, aluminum etc. are mentioned as a metal which forms this metal thin film.

  As a material for forming the resist layers 17 and 18, a resist material mainly composed of an epoxy resin and a glycol solvent is used. Specifically, as this resist material, for example, epoxy resin 23.1% by mass, acrylic resin 3.3% by mass, glycol solvent (containing 17.9% by mass of propylene glycol monomethyl ether) 29.3% by mass %, Aromatic solvent 11.1% by mass, pigment (containing 1.7% by mass of silica) 27.5% by mass, photopolymerization initiator 3.9% by mass, additive 1.8% by mass, DSR-330P18-15 made by Kensha is used. In addition, content of each component is a ratio with respect to the total amount (100 mass%) of each component which comprises a resist material.

  The IC chip 20 is not particularly limited and may be a non-contact type IC tag, a non-contact type IC label, or a non-contact type as long as information can be written and read out in a non-contact state via the antenna 19. Anything applicable to RFID media such as an IC card can be used.

Although it does not specifically limit as the sealing material 22, A thermosetting adhesive, an ultraviolet curable adhesive, an electron beam curable adhesive, etc. are used.
Examples of the thermosetting adhesive include phenol resin, epoxy resin, polyurethane curable resin, urea resin, melamine resin, and acrylic reaction resin. Specifically, bisphenol F-type epoxide is mentioned.
Examples of the UV curable adhesive include UV curable acrylic resin, UV curable urethane acrylate resin, UV curable polyester acrylate resin, UV curable polyurethane resin, UV curable epoxy acrylate resin, and UV curable imide acrylate resin. It is done.
Electron beam curable adhesives include electron beam curable acrylic resins, electron beam curable urethane acrylate resins, electron beam curable polyester acrylate resins, electron beam curable polyurethane resins, electron beam curable epoxy acrylate resins, and cationic curable resins. Resin etc. are mentioned.

  As the resin material forming the covering material 23, an elastomer material such as a silicone resin, a polyester elastomer, a urethane elastomer, a polyamide elastomer, a styrene elastomer, and an olefin elastomer is used.

According to the non-contact type data transmitting / receiving body 10, since the glass epoxy substrate 12 having excellent heat resistance is used as the base material of the inlet 11, the glass epoxy substrate can be used even when hot press molding is performed when the coating material 23 is provided. As a result, the communication failure of the non-contact type data receiving / transmitting body 10 does not occur.
In addition, resist layers 17 and 18 are interposed between the inlet 11 and the covering material 23, and the resist layer 17 covers the entire surface of the first conductor 13 and the boundary between the first conductor 13 and the glass epoxy substrate 12. Furthermore, in the vicinity of the corner 13b on one end side and the corner 13c on the other end side of the first conductor 13, a smooth curved shape is formed, and the resist layer 18 is formed on the entire surface of the second conductor 14, Since it covers the boundary between the second conductor 14 and the glass epoxy substrate 12, and has a smooth curved shape in the vicinity of the corner 14b on one end side and the corner 14c on the other end side of the second conductor 14, Since the adhesion between the inlet 11 and the covering material 23 is improved, an air layer is not generated between the inlet 11 and the covering material 23, and even if the non-contact type data transmitting / receiving body 10 is used in a high temperature environment, Air layer Zhang and without the inlet 11 is deformed, as a result, deviated resonance frequency, non-contact type data reception and transmission body 10 is not caused poor communication.
Further, since the inlet 11 is covered with the covering material 23, the non-contact type data receiving / transmitting body 10 is excellent in chemical resistance, weather resistance and heat resistance.

  Further, the resin material forming the covering material 23 is filled in the through hole 12c of the glass epoxy substrate 12 via the third conductor 15, and the third conductor 16 is interposed in the through hole 12d of the glass epoxy substrate 12. Since the resin material forming the covering material 23 is filled, the resin material holds the connection portions of the third conductors 15 and 16 with the first conductor 13 and the second conductor 14. Since the connection is stabilized, stable conduction between the third conductors 15 and 16 and the first conductor 13 and the second conductor 14 is ensured, and communication failure of the non-contact type data transmitter / receiver 10 is prevented. Can do.

  In this embodiment, the resist layer 17 covers the entire surface of the first conductor 13 and the boundary between the first conductor 13 and the glass epoxy substrate 12, and the resist layer 18 covers the entire surface of the second conductor 14. The non-contact type data receiving / transmitting body 10 covering the boundary between the second conductor 14 and the glass epoxy substrate 12 is exemplified, but the non-contact type data receiving / transmitting body of the present invention is not limited to this. In the contactless data transmission / reception body of the present invention, the resist layer includes at least the first conductor, the second conductor, the boundary between the first conductor and the glass epoxy substrate, and the second conductor and the glass epoxy. What is necessary is just to be provided so that the boundary of a board | substrate may be covered.

Further, in this embodiment, the through hole 12c of the glass epoxy substrate 12 is filled with the resin material forming the covering material 23 via the third conductor 15, and the through hole 12d of the glass epoxy substrate 12 is filled with the third hole 12c. Although the non-contact type data receiving / transmitting body 10 filled with the resin material forming the covering material 23 via the conductor 16 is illustrated, the non-contact type data receiving / transmitting body of the present invention is not limited to this. In the non-contact type data transmitting / receiving body of the present invention, it is sufficient that only the third conductor is provided in the through hole of the glass epoxy substrate, and the resin material that forms the coating material may not be filled. .
In this embodiment, the non-contact type data receiving / transmitting body 10 in which the IC chip 20 is connected to the first conductor 13 on the one surface 12a of the glass epoxy substrate 12 is exemplified. The type data receiving / transmitting body is not limited to this. In the non-contact type data transmitting / receiving body of the present invention, the IC chip may be connected to the second conductor on the other surface of the glass epoxy substrate.

(2) First Embodiment of Method for Manufacturing Non-Contact Data Receiver / Transmitter First Embodiment of the Method for Manufacturing Non-Contact Data Receiver / Transmitter of the Present Invention will be described with reference to FIGS. .
First, as shown in FIGS. 2 and 3, the first conductor 13 is disposed on one surface 12a of the glass epoxy substrate 12 via an adhesive or an adhesive, and the other surface of the glass epoxy substrate 12 is disposed. A second conductor 14 is disposed on 12b via an adhesive or an adhesive (Step A).

  Next, as shown in FIG. 4, through holes 12 c and 12 d that are substantially perpendicular to the glass epoxy substrate 12 are drilled from one surface 12 a of the glass epoxy substrate 12 to the other surface 12 b by a drill. At this time, the glass epoxy substrate 12 is drilled together with the first conductor 13 provided on the one surface 12 a of the glass epoxy substrate 12, but the drill contacting the first conductor 13 is the glass epoxy substrate 12. The through-holes 12c and 12d are formed at the same time, and at the same time, a part of the first conductor 13 is extended, and the extended portions are dragged into the through-holes 12c and 12d, so that the third surface is entirely formed on the inner surface 12e of the through-hole 12c. The conductor 15 is formed, and the third conductor 16 is formed on the entire inner surface 12f of the through hole 12d. As a result, the first conductor 13 and the second conductor 14 are connected via the third conductors 15 and 16 (step B).

  Next, as shown in FIG. 5, the entire surface of the first conductor 13 and the boundary between the first conductor 13 and the glass epoxy substrate 12 are covered, and the entire surface of the second conductor 14, A resist material is applied so as to cover the boundary of the glass epoxy substrate 12, and then the resist material is cured to form resist layers 17 and 18 (step C).

  In this step C, when the resist material is applied to one surface 12a and the other surface 12b of the glass epoxy substrate 12, the first conductor 13 and the thickness are determined with reference to the one surface 12a and the other surface 12b. The thickness is equal to or greater than the thickness of the second conductor 14. In this way, the resist layer 17 formed by curing the resist material has a smooth curved shape in the vicinity of the corner 13b on one end side and the corner 13c on the other end side of the first conductor 13, The resist layer 18 formed by curing the resist material has a smooth curved shape in the vicinity of the corner 14 b on one end side and the corner 14 c on the other end side of the second conductor 14.

  Further, in this step C, the resist material is not applied to the mounting portion of the first conductor 13 on the IC chip, that is, the contact of the first conductor 13.

  Next, as shown in FIG. 6, on one surface 12 a of the glass epoxy substrate 12, the IC chip 20 is connected to the first conductor 13 by wire bonding, and then the sealing material 22 so as to cover the IC chip 20. Then, the sealing material 22 is cured, and the IC chip 20 is sealed to obtain the inlet 11 (step D).

  Next, as shown in FIG. 7, the inlet 11 is sandwiched between a pair of resin sheets 24 and 24 that form the covering material 23, and further, hot pressing is performed using a mold 30 including a lower mold 31 and an upper mold 32 from the outside. Molding is performed, and the inlet 11 is covered with the covering material 23 to obtain the non-contact type data receiving / transmitting body 10 as shown in FIG. 1 (step E).

The lower mold 31 used in this step E has an outer shape of the non-contact type data receiving / transmitting body 10 (specifically, a lower half divided into two in a direction perpendicular to the thickness direction of the non-contact type data receiving / transmitting body 10). Is provided with a recess 31a substantially equal to the outer shape). Similarly, the upper die 32 has an outer shape of the non-contact type data receiving / transmitting body 10 (more specifically, an outer shape of the upper half divided into two in the direction perpendicular to the thickness direction of the non-contact type data receiving / transmitting body 10). A concave portion 32a substantially equal to is provided.
The inlet 11 sandwiched between the resin sheets 24 and 24 is hot press-molded by the mold 30 in which the lower mold 31 and the upper mold 32 are arranged so that the concave portion 31a and the concave portion 32a face each other. The non-contact type data receiving / transmitting body 10 in which the resin sheet 24, 24 is welded and integrated with each other and the inlet 11 is covered with the covering material 23 is obtained while 24 is in close contact with the inlet 11.

  Further, in this step E, the covering material 23 (resin sheet 24) is formed in the through hole 12c of the glass epoxy substrate 12 via the third conductor 15 simultaneously with the coating of the inlet 11 with the resin sheets 24, 24 described above. The resin material is filled and the through hole 12d of the glass epoxy substrate 12 is filled with the resin material forming the covering material 23 (resin sheet 24) through the third conductor 16.

  According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, in Step C, the entire surface of the first conductor 13 and the boundary between the first conductor 13 and the glass epoxy substrate 12 are covered, and the second A resist material is applied so as to cover the entire surface of the conductor 14 and the boundary between the second conductor 14 and the glass epoxy substrate 12, and then the resist material is cured to form resist layers 17 and 18. In E, the inlet 11 is sandwiched between a pair of resin sheets 24, 24 forming the covering material 23, and further, hot press molding is performed from the outside using a mold 30 including a lower mold 31 and an upper mold 32, and the inlet 11 is formed. Since the covering material 23 is coated, even when hot press molding is performed when the covering material 23 is formed, the position of the IC chip 20 due to the expansion and contraction of the glass epoxy substrate 12 does not occur. Te, communication failure of contactless data reception and transmission body 10 obtained does not occur.

  Further, it covers the entire surface of the first conductor 13 and the boundary between the first conductor 13 and the glass epoxy substrate 12, and further, in the vicinity of the corner 13b on one end side and the corner 13c on the other end side of the first conductor 13. The resist layer 17 is provided so as to form a smooth curved shape, covers the entire surface of the second conductor 14, and the boundary between the second conductor 14 and the glass epoxy substrate 12. In the vicinity of the corner 14b on one end side and the corner 14c on the other end side, the resist layer 18 is provided so as to form a smooth curved shape, and then the inlet 11 having the resist layers 17 and 18 provided on the surface thereof is subjected to hot press molding. Since the cover 11 is covered with the covering material 23, the adhesion between the inlet 11 and the covering material 23 is improved, so that an air layer is not generated between the inlet 11 and the covering material 23, and the obtained non-contact type data receiving / transmitting body is obtained. Even if 0 is used in a high temperature environment, the air layer does not expand and the inlet 11 is not deformed. As a result, the resonance frequency is shifted, and the non-contact type data transmitter / receiver 10 causes a communication failure. There is no.

  In this embodiment, in Step C, the entire surface of the first conductor 13 and the boundary between the first conductor 13 and the glass epoxy substrate 12 are covered, and the entire surface of the second conductor 14 and the second conductor are covered. A resist material was applied so as to cover the boundary between the glass epoxy substrate 12 and the glass epoxy substrate 12, and the resist material was cured to form a resist layer. It is not limited. In the method of manufacturing a non-contact type data transmitting / receiving body of the present invention, at least the first conductor, the second conductor, the boundary between the first conductor and the glass epoxy substrate, and the second conductor and the glass epoxy substrate A resist layer may be provided so as to cover the boundary.

  In this embodiment, the through hole 12c of the glass epoxy substrate 12 is filled with the resin material forming the covering material 23 via the third conductor 15 by hot press molding, and the through hole 12d of the glass epoxy substrate 12 is also formed. In addition, the resin material forming the covering material 23 is filled via the third conductor 16, but the method of manufacturing the non-contact type data transmitting / receiving body of the present invention is not limited to this. In the method for manufacturing a non-contact type data transmitting / receiving body of the present invention, it is only necessary to provide the third conductor in the through hole of the glass epoxy substrate, and it is not necessary to fill the resin material forming the coating material. .

(3) Second Embodiment of Method for Manufacturing Non-Contact Type Data Receiver / Transmitter Referring to FIGS. 1 and 8 to 10, the second embodiment of the method for manufacturing the contactless data receiver / transmitter of the present invention. Will be described.
In this embodiment, the inlet 11 is obtained in the same manner as the steps A to D of the first embodiment described above.

On the other hand, separately from the manufacture of the inlet 11, a housing 25 (see FIG. 9) that forms a part of the covering material 23 is formed.
As shown in FIG. 8, after the elastomer material forming the covering material 23 is filled from the gate 43 into the cavity 42 by injection molding using the mold 41 having the cavity 42 having the same shape as the outer shape of the housing 25. The casing 25 is obtained by releasing the molded body made of the elastomer material from the mold 41 (step F).

  In the cavity 42 of the mold 41, a shape substantially equal to the outer shape of the sealing material 22 at a position corresponding to the position where the sealing material 22 for sealing the IC chip 20 is provided in the inlet 11. The protrusion 42a is provided. As a result, as shown in FIG. 9, in the obtained casing 25, the accommodating portion 25 a substantially equal to the outer shape of the inlet 11, and the sealing material 22 is disposed when the inlet 11 is accommodated in the accommodating portion 25 a. A recessed portion 25b having a shape substantially equal to the outer shape of the sealing material 22 is provided at a position corresponding to the position to be processed.

  Next, as shown in FIG. 10, after the inlet 11 is accommodated in the accommodating portion 25 a of the housing 25 so that the sealing material 22 that seals the IC chip 20 is fitted into the concave portion 25 b of the housing 25, the gold 11 The inlet 11 is disposed together with the housing 25 in the cavity 52 of the mold 51 (step G).

  Next, an elastomer material that forms the covering material 23 is filled from the gate 53 into the cavity 52 by injection molding, and the inlet 11 in the housing 25 is covered with this elastomer material. After integrating the inlet 11 with the covering material 23 and then releasing the inlet 11 covered with the covering material 23 from the mold 51, the non-contact type data receiving / transmitting body 10 as shown in FIG. To obtain (step H).

  Further, in this step H, simultaneously with the filling of the elastomer material into the cavity 52 by the injection molding described above, the covering material 23 (resin sheet 24) is inserted into the through hole 12c of the glass epoxy substrate 12 via the third conductor 15. The through hole 12d of the glass epoxy substrate 12 is filled with the resin material forming the covering material 23 (resin sheet 24) through the third conductor 16.

  According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, in Step C, the entire surface of the first conductor 13 and the boundary between the first conductor 13 and the glass epoxy substrate 12 are covered, and the second A resist material is applied so as to cover the entire surface of the conductor 14 and the boundary between the second conductor 14 and the glass epoxy substrate 12, and then the resist material is cured to form resist layers 17 and 18. In H, with the inlet 11 accommodated in the housing 25 placed in the cavity 52 of the mold 51, the cavity 52 is filled with an elastomer material forming the covering material 23 by injection molding, In addition to covering the inlet 11 in the casing 25, this elastomer material is integrated with the casing 25 and the inlet 11 is covered with the covering material 23. 3, even if injection molding is performed, the IC chip 20 is not displaced due to the expansion and contraction of the glass epoxy substrate 12, and as a result, the communication failure of the obtained non-contact type data receiving / transmitting body 10 is caused. It does not occur.

  Further, it covers the entire surface of the first conductor 13 and the boundary between the first conductor 13 and the glass epoxy substrate 12, and further, in the vicinity of the corner 13b on one end side and the corner 13c on the other end side of the first conductor 13. The resist layer 17 is provided so as to form a smooth curved shape, covers the entire surface of the second conductor 14, and the boundary between the second conductor 14 and the glass epoxy substrate 12. After providing the resist layer 18 so as to form a smooth curved shape in the vicinity of the corner 14b on one end side and the corner 14c on the other end side, the inlet 11 having the resist layers 17 and 18 provided on the surface is formed by injection molding. Since it coat | covers with the coating | covering material 23, since the adhesiveness of the inlet 11 and the coating | covering material 23 improves, an air layer does not arise between the inlet 11 and the coating | covering material 23, and the obtained non-contact-type data transmission / reception body 10 is obtained. Even when used in a high temperature environment, the air layer does not expand and the inlet 11 is not deformed. As a result, the resonance frequency does not shift and the non-contact type data transmitter / receiver 10 does not cause communication failure. .

  In this embodiment, the through hole 12c of the glass epoxy substrate 12 is filled with the resin material forming the covering material 23 via the third conductor 15 by injection molding, and the through hole 12d of the glass epoxy substrate 12 is filled. Although the resin material forming the covering material 23 is filled via the third conductor 16, the method for manufacturing the non-contact type data receiving / transmitting body of the present invention is not limited to this. In the method for manufacturing a non-contact type data transmitting / receiving body of the present invention, it is only necessary to provide the third conductor in the through hole of the glass epoxy substrate, and it is not necessary to fill the resin material forming the coating material. .

(4) Second Embodiment of Non-Contact Data Receiver / Transmitter FIG. 11 is a schematic sectional view showing a second embodiment of the non-contact data receiver / transmitter of the present invention.
In FIG. 11, the same components as those shown in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.
The non-contact type data receiving / transmitting body 60 of this embodiment is different from the above-described non-contact type data receiving / transmitting body 10 in that the surface 23a of the covering 23 opposite to the surface facing the IC chip 20 is provided. The metal layer 61 is provided.

  Examples of the metal forming the metal layer 61 include copper, silver, gold, platinum, and aluminum.

  This non-contact type data receiving / transmitting body 60 not only has the same effect as the non-contact type data receiving / transmitting body 10 described above, but also when the IC chip 20 is attached to the antenna 19 even when it is affixed to a metal article. There is an effect that an induced electromotive force sufficient to operate is generated.

It is the schematic which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention, (a) is a top view, (b) is sectional drawing which follows the AA line of (a). It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention.

Explanation of symbols

10, 60 ... Non-contact type data transmitting / receiving body, 11 ... Inlet, 12 ... Glass epoxy substrate, 13 ... First conductor, 14 ... Second conductor, 15, 16, .. Third conductor, 17, 18 ... resist layer, 19 ... antenna, 20 ... IC chip, 21 ... wire, 22 ... sealing material, 23 ... covering material, 24 ... Resin sheet, 25 ... Housing, 30 ... Mold, 31 ... Lower mold, 32 ... Upper mold, 41, 51 ... Mold, 42, 52 ... Cavity, 43, 53 ... gate, 61 ... metal layer.

Claims (3)

A non-contact type data transmitter / receiver comprising an inlet, a resist layer provided on one side and the other side of the inlet, and a covering material covering the inlet via the resist layer,
The inlet includes a glass epoxy substrate, a first conductor provided on one surface of the glass epoxy substrate, a second conductor provided on the other surface of the glass epoxy substrate, and the glass epoxy substrate. A third conductor connected to the first conductor and the second conductor, and an IC chip connected to the first conductor or the second conductor, provided on the inner surface of the through-hole penetrating in the thickness direction; And having
The resist layer is provided to cover at least the first conductor, the second conductor, the boundary between the first conductor and the glass epoxy substrate, and the boundary between the second conductor and the glass epoxy substrate. A non-contact type data receiving / transmitting body.   The non-contact type data transmitting / receiving body according to claim 1, wherein the through hole is filled with a resin material forming the covering material via the third conductor. A method of manufacturing a non-contact type data transmitter / receiver comprising: an inlet; a resist layer provided on one side and the other side of the inlet; and a covering material that covers the inlet via the resist layer. There,
Providing a first conductor on one side of the glass epoxy substrate and providing a second conductor on the other side of the glass epoxy substrate; and
By forming a through hole substantially perpendicular to the glass epoxy substrate from one surface of the glass epoxy substrate to the other surface, and forming a third conductor on the entire inner surface of the through hole, Step B connecting the first conductor and the second conductor via a third conductor;
The resist layer is provided so as to cover at least the first conductor, the second conductor, the boundary between the first conductor and the glass epoxy substrate, and the boundary between the second conductor and the glass epoxy substrate. Step C,
A step D of connecting an IC chip to the first conductor on one surface of the glass epoxy substrate to obtain an inlet; and
And a step E of sandwiching the inlet with a resin sheet forming the covering material and performing hot press molding.

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