JP2010151495A - Testing device and testing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stably apply stress to a semiconductor device, and to easily confirm the semiconductor device to which stress has been applied. <P>SOLUTION: A testing device 10 for performing a bending test of a semiconductor device X disposed on the main surface of a substrate 1g includes: a pressing piece 4 having a projecting surface disposed facing the back at a side opposite to the main surface of the substrate 1g; and a contacting means 1 for moving the substrate 1g to the side of the pressing piece 4 and allows the back to abut on the pressing piece 4. This sort of testing device 10 can apply stress to the semiconductor device X stably and can easily confirm the semiconductor device X to which stress has been applied. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a test apparatus and a test method, and more particularly to a test apparatus and a test method for performing a bending test of a semiconductor device.

2. Description of the Related Art Conventionally, a bending test has been performed in which a bending stress is applied to a printed circuit board on which an electronic component is mounted to check the damage state of the electronic component at that time (see, for example, Patent Documents 1 and 2).
A test apparatus for performing a bending test will be described below with reference to the drawings.

FIG. 3 is a diagram for explaining a test apparatus for performing a bending test of a semiconductor device.
The test apparatus 20 performs a bending test on the semiconductor device X when the substrate 14 on which the semiconductor device X is disposed is pressed by the pressing unit 11. Further, the substrate 14 on which the semiconductor device X is arranged is fixed by sandwiching and fixing the front and back surfaces at predetermined positions between the upper substrate retainer 15a and the lower substrate retainer 15b, respectively, and is opposed to the pedestal 12 and surrounded by the side plate 13. It has been broken.

The pressing means 11 includes a cylinder 11a, a pressing shaft 11b fitted into the cylinder 11a, and a pressing piece 11c installed at the tip of the pressing shaft 11b.
Next, a bending test using the test apparatus 20 will be described.

First, the semiconductor device X is disposed on the back surface (the lower surface of the substrate 14 in FIG. 3) of the substrate 14 fixed between the upper substrate retainer 15a and the lower substrate retainer 15b.
By driving the cylinder 11a of the pressing means 11 and lowering the pressing shaft 11b, the pressing piece 11c presses the substrate 14 from the surface (upper surface of the substrate 14 in FIG. 3) side. The pressed substrate 14 is distorted and stress is applied to the semiconductor device X. The stress applied to the semiconductor device X is controlled by the cylinder 11a.

A bending test is performed by observing the semiconductor device X to which stress is applied in this manner. When the bending test is completed, the pressing shaft 11b is raised by the cylinder 11a, and the pushing piece 11c is retracted from the surface of the substrate 14. At this time, the substrate 14 also returns to its original state by its own elastic force.
JP 10-318896 A JP 2003-65920 A

However, the test apparatus 20 has the following problems.
First, when the pressing force of the pressing piece 11c against the substrate 14 is larger than a predetermined amount, the pressing position may be shifted as the test progresses. In particular, as in the above example and Patent Document 1, etc., if the substrate 14 to which the pressing piece 11c is pressed is supported with the upper and lower substrate retainers 15a and 15b sandwiching the front and back surfaces, the displacement of the depressed position is likely to occur. . For this reason, it cannot be confirmed whether or not the desired pushing position of the substrate 14 has been repeatedly pushed. Further, it is impossible to accurately grasp the influence of stress at a desired indentation position.

  Further, as in the above example and Patent Document 2, etc., when the semiconductor device X is disposed on the back surface of the substrate 14, the behavior of the semiconductor device X when it is pressed from the front surface side of the substrate 14, the damage start state, and It is not possible to immediately observe the progress of breakage and to perform detailed analysis.

  The present invention has been made in view of the above points, and provides a test apparatus and a test method capable of stably applying stress to a semiconductor device and easily confirming the semiconductor device to which the stress is applied. The purpose is to provide.

In order to achieve the above object, a test apparatus for performing a bending test of a semiconductor device disposed on a main surface of a substrate is provided.
The test apparatus includes a pressing portion having a convex surface disposed opposite to the back surface opposite to the main surface of the substrate, and the substrate is moved to the pressing portion side so that the back surface contacts the pressing portion. Abutting means for contacting.

  According to such a test apparatus, the pressing portion having the convex surface is disposed opposite to the back surface opposite to the main surface of the substrate, the substrate is moved to the pressing portion side, and the back surface is pressed by the contact means. It comes to contact | abut.

In order to achieve the above object, a test method for a bending test of a substrate on which a semiconductor device is disposed on a main surface is provided.
In this test method, the substrate is moved to the pressing portion side having a convex surface disposed opposite to the back surface opposite to the main surface of the substrate, and the back surface is brought into contact with the pressing portion.

  According to such a test method, the substrate is moved to the pressing portion side having the convex surface disposed opposite to the back surface opposite to the main surface of the substrate so that the back surface is brought into contact with the pressing portion. Become.

  In the test apparatus and the test method, stress can be stably applied to the semiconductor device, and the semiconductor device to which the stress is applied can be easily confirmed.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram for explaining a test apparatus that performs a bending test of a semiconductor device according to an embodiment.

  The test apparatus 10 includes a contact means 1 on which a semiconductor device X to be tested is disposed, a pedestal portion 2 disposed to face the contact means 1, and a push piece 4 disposed on the pedestal section 2 via a spacer 3. (Pressing part). The push piece 4 is formed of a member having a convex surface. The push piece 4 is made of a material having a certain degree of hardness, such as metal. Furthermore, as the push piece 4, members of various sizes having a convex surface are applied. For this reason, as will be described later, it is possible to change the pressure when the pressing piece 4 presses the substrate 1g.

  Further, the contact means 1 includes a cylinder 1a, a contact shaft 1b that passes through the cylinder 1a and moves up and down by driving the cylinder 1a, a support plate 1c installed at the tip of the contact shaft 1b, and a support plate A pair of sandwiching portions 1d disposed on 1c, an adjustment shaft 1e disposed on the sandwiching portion 1d, and a knob 1f are provided. The cylinder 1a moves the contact shaft 1b up and down by, for example, a hydraulic, pneumatic or electric motor. Further, the cylinder 1a is connected to, for example, a control device (not shown) to control the speed of operation of the contact shaft 1b by the cylinder 1a, the operation range, and the like. Further, the sandwiching portion 1d has a plate shape extending in the direction perpendicular to the paper surface of FIG. 1, and the notch portion 1da is formed along the sandwiching portion 1d in the direction perpendicular to the paper surface. The adjusting shaft 1e and the knob 1f adjust the distance between the pair of holding portions 1d. In the present embodiment, as shown in FIG. 1, nothing is arranged on the opposing side where the pair of holding portions 1d of the support plate 1c are not arranged, and the substrate 1g is arranged. The semiconductor device X can be observed visually, for example.

  Further, both sides of the frame portion of the substrate 1g arranged in the abutting means 1 are fitted and held in the notch portion 1da of the holding portion 1d and fixed. The semiconductor device X to be tested is disposed on the surface of the substrate 1g (the upper surface of the substrate 1g in FIG. 1). The notch 1da is a notch that extends toward the cylinder 1a so that the pressed substrate 1g is distorted as will be described later, and is inclined so that the distorted substrate 1g is along.

Next, a bending test of the semiconductor device X using the test apparatus 10 will be described.
FIG. 2 is a diagram for explaining a state in which the semiconductor device is bent by the test apparatus according to the embodiment.

  First, the semiconductor device X to be tested is placed at a predetermined location on the surface of the substrate 1g held by the holding portion 1d of the contact means 1. The adjustment shaft 1e is screwed into the holding portion 1d, and the adjustment shaft 1e is rotated together with the knob 1f so that the holding portion 1d firmly holds the substrate 1g.

  The position of the push piece 4 is adjusted such that the push piece 4 overlaps the desired push position of the semiconductor device X by moving the pedestal 2 and the spacer 3 on the pedestal 2 and the push piece 4 by a position adjusting mechanism (not shown). For example, if the pressing position is the central portion of the semiconductor device X, the semiconductor device X is adjusted so as to overlap the push piece 4 as shown in FIG.

  The cylinder 1a is driven, and the support plate 1c is lowered (moved downward in FIG. 2) via the contact shaft 1b, so that the back surface of the substrate 1g held by the holding portion 1d (the substrate 1g in FIG. 2). The lower surface of the plate) is brought into contact with the push piece 4. At this time, stress is applied to the semiconductor device X by pressing the back surface of the substrate 1g from the push piece 4 (FIG. 2).

  Since both sides of the substrate 1g are held by the holding portion 1d, the substrate 1g hardly deviates even when pressed by the push piece 4 from the back surface. For this reason, it becomes possible to confirm the pressed position of the semiconductor device X that is continuously pressed. In addition, it is possible to accurately grasp the influence generated on the stressed semiconductor device X. Further, the semiconductor device X may be disposed on the upper surface of the substrate 1g, so that the behavior of the semiconductor device X, the breakage start state, the breakage process, and the like can be observed immediately and easily, and detailed analysis is performed. Will be able to.

  When the observation is completed, when the substrate 1g on which the semiconductor device X is disposed is retracted from the push piece 4 via the contact shaft 1b by driving the cylinder 1a, the substrate 1g is brought into the state shown in FIG. 1 by its own elasticity. Return.

It is a figure for demonstrating the testing apparatus which performs the bending test of the semiconductor device in embodiment. It is a figure for demonstrating the state by which the semiconductor device was bent by the test apparatus in embodiment. It is a figure for demonstrating the test apparatus which performs the bending test of a semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Contact means 1a Cylinder 1b Contact shaft 1c Support plate 1d Nipping part 1da Notch part 1e Adjustment shaft 1f Knob 1g Board | substrate 2 Base part 3 Spacer 4 Pushing piece 10 Test apparatus X Semiconductor device

Claims (4)

In a test apparatus for performing a bending test of a semiconductor device arranged on the main surface of a substrate,
A pressing portion having a convex surface disposed opposite to the back surface of the substrate opposite to the main surface;
An abutting means for moving the substrate to the pressing portion side and bringing the back surface into contact with the pressing portion;
A test apparatus characterized by comprising: The abutting means includes a holding portion that holds the frame portion of the substrate from at least both sides,
The test apparatus according to claim 1, wherein the substrate is brought into contact with the pressing portion while being held by the holding portion. In a test method of a bending test of a substrate in which a semiconductor device is arranged on a main surface,
A test method, wherein the substrate is moved to a pressing portion side having a convex surface disposed opposite to the back surface opposite to the main surface of the substrate, and the back surface is brought into contact with the pressing portion.   The test method according to claim 3, wherein the substrate is brought into contact with the pressing portion in a state where the frame portion of the substrate is held at least from both sides.

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