JP2010150406A - Method for producing low electrostatically charging fluororesin film and conductive material-free low electrically charging fluororesin film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a low electrostatically charging fluororesin film and a conductive material-free low electrically charging fluororesin film. <P>SOLUTION: The method for producing the low electrostatically charging fluororesin film includes adhering a solution, a dispersion or a suspension containing an ultraviolet absorbing compound and a fluorine-based surfactant to the first surface of a fluororesin film having a thickness of <100 μm and irradiating the adhered surface with an ultraviolet laser beam. The conductive material-free low electrostatically charging fluororesin film has an attenuation rate of electrification voltage represented by the formula [(V<SB>0</SB>-V<SB>120</SB>)/V<SB>0</SB>]×100 (wherein V<SB>0</SB>is the electrification voltage (V) of the second surface immediately after the end of voltage application; and V<SB>120</SB>is the electrification voltage (V) of the second surface 120 seconds after the end of voltage application) of ≥4% when a voltage is impressed on the second surface of a conductive material-free fluororesin film having a thickness of <100 μm. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for producing a low charge fluororesin film and a conductive material-free low charge fluororesin film.

  Various types of rollers such as a fixing roller, a charging roller, a developing roller, a transfer roller, or a pressure roller are used in an electrophotographic image forming apparatus such as an electronic copying machine or a laser beam printer. The surface of such a roller is covered with a fluororesin film in order to improve releasability from the toner. However, since the fluororesin film generally has extremely low electrical conductivity, there has been a problem that charges accumulate and leaks occur.

  Thus, attempts have been made to improve the conductivity of the film surface and avoid the retention of electric charges by incorporating a conductive material such as carbon black into the fluororesin film. However, the blending may impair the original release properties of the fluororesin or deteriorate the surface smoothness. Since the conductive material, particularly carbon black, is difficult to disperse, film production may be complicated.

On the other hand, by attaching a solution, dispersion or suspension containing an ultraviolet absorbing compound and a fluorosurfactant to the surface of the fluororesin molded body, and irradiating the attached surface with ultraviolet laser light, Techniques for imparting excellent properties such as adhesiveness to the treated surface are known (Patent Documents 1 and 2).
Japanese Patent No. 2983438 Japanese Patent No. 3433931

  An object of this invention is to provide the method of manufacturing a low-chargeable fluororesin film.

  Another object of the present invention is to provide a conductive material-free low-chargeable fluororesin film.

  The present invention provides a solution containing an ultraviolet absorbing compound and a fluorosurfactant with respect to the first surface of a fluororesin film having a thickness of less than 100 μm and having a first surface and a second surface on the back side of the first surface, The present invention relates to a method for producing a low-chargeable fluororesin film, characterized in that a dispersion or suspension is adhered and an ultraviolet laser beam is irradiated onto the adhered surface.

In the present invention, when the second surface of the conductive material-free fluororesin film having a thickness of less than 100 μm having the first surface and the second surface on the back side of the first surface is charged by applying a voltage, the following formula:
[(V ₀ −V ₁₂₀ ) / V ₀ ] × 100
(In the formula, V ₀ is the charged voltage (V) of the second surface immediately after the end of voltage application; V ₁₂₀ is the charged voltage (V) of the second surface 120 seconds after the end of voltage application)
It is related with the electroconductive material-free low-chargeable fluororesin film characterized by the attenuation rate of the charged voltage represented by the following.

According to the method for producing a low-chargeable fluororesin film according to the present invention, it is possible to impart low chargeability to the second surface by performing a specific surface treatment on the first surface of the fluororesin film. Since the second surface is not directly processed, low chargeability can be imparted to the second surface without changing the physical properties and chemical properties of the second surface and the surface properties such as the appearance state. . Such an effect of the present invention can be effectively exhibited even when the fluororesin film does not contain a conductive material such as carbon black. As a result, according to the present invention, it is possible to provide a conductive material-free low-charge fluororesin film having a relatively large charge voltage decay rate on the second surface without directly treating the second surface.
Moreover, in the method for producing a low-chargeable fluororesin film according to the present invention, when a predetermined surface treatment is performed on the first surface, fluorine atoms on the first surface are removed, and the first surface has adhesiveness, wettability, etc. Improved characteristics.

(Manufacturing method of low charge fluororesin film)
In the method for producing a low charge fluororesin film according to the present invention, a low charge fluororesin film in which the other surface has low chargeability by performing a predetermined surface treatment on one surface of the fluororesin film. Can be obtained. In the present specification, a surface that is subjected to a predetermined surface treatment is referred to as a first surface, and a surface that is low in the fluororesin film is referred to as a second surface. The first surface and the second surface have a front-back relationship.

The fluororesin film to which the present invention is applied has a thickness of less than 100 μm, particularly 10 μm or more and less than 100 μm, preferably 10 μm or more and 90 μm or less, more preferably 10 μm or more and 60 μm or less, more preferably from the viewpoint of imparting low chargeability. Preferably they are 10 micrometers or more and 40 micrometers or less. If the thickness is too large, low chargeability cannot be imparted to the second surface. Such film thickness does not change even if the surface treatment described later is performed.
In this specification, the film thickness averages and uses the measured value of three arbitrary points measured with the micrometer (made by Mitutoyo).

  The fluororesin film to which the present invention is applied is a film produced from a fluorine-containing organic polymer compound. As the base resin of the film, polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkoxyethylene copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene- Hexafluoropropylene-perfluoroalkoxyethylene terpolymer (EPE), tetrafluoroethylene-ethylene copolymer (ETFE), polychlorotrifluoroethylene (PCTFE), trifluorochloroethylene-ethylene copolymer (ECTFE) , Polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), tetrafluoroethylene-perfluoromethoxyethylene copolymer (MFA), vinylidene fluoride-hexafluoropropylene copolymer, tetrafluoroethylene-hexa Fluoropropylene-vinylidene fluoride terpolymer (THV), tetrafluoroethylene-propylene copolymer, Daiel Thermoplastic (manufactured by Daikin Industries), Central Soft (manufactured by Central Glass), Teflon AF (manufactured by DuPont) , Cytop (manufactured by Asahi Glass Co., Ltd.), Dyneon HTE (manufactured by 3M), and any two or more of these mixed resins are exemplified. The fluororesin film may further contain silica, alumina, silicon carbide, silicon nitride and the like as appropriate for the purpose of improving wear.

  Although the present invention does not prevent the conductive material from being contained in the fluororesin film as an application object for the purpose of further improving the low chargeability, a conductive material-free fluororesin film containing no conductive material is used. It is preferred that This is because even when no conductive material is contained, conductivity can be effectively imparted to the second surface. As the conductive material, a known material conventionally used as a conductivity imparting agent in the field of resin film can be used. Specific examples of the conductive material include carbon black, graphite, and carbon nanostructure.

  The specific form of the fluororesin film treated in the present invention is not particularly limited, and may have an arbitrary shape depending on the application. For example, a planar shape, a tube shape (cylinder shape), etc. are illustrated.

  In the method for producing a low-charge fluororesin film according to the present invention, a predetermined surface treatment is performed on the first surface of the fluororesin film. Specifically, a treatment liquid such as a solution, dispersion or suspension containing an ultraviolet absorbing compound and a fluorosurfactant is attached to the first surface of the fluororesin film, and ultraviolet laser light is applied to the attached surface. Irradiate. As a result, the second surface has low chargeability.

  As the UV-absorbing compound, a compound known per se may be used as appropriate, and it is not particularly limited. However, aromatic UV-absorbing compounds such as aromatic hydrocarbons, aromatic carboxylic acids and salts thereof, aromatics Aromatic aldehydes, aromatic alcohols, aromatic amines and salts thereof, aromatic sulfonic acids and salts thereof, and phenols are preferable. Examples of this type of aromatic ultraviolet absorbing compound include the following.

  Naphthalene, phenanthrene, anthracene, naphthacene, pyrene, perylene, fluorenone, fluoranthene, 9-acetylanthracene, 9-methylanthracene, anthraquinonecarboxylic acid, anthracene-9-methanol, biphenyl, sodium benzoate, phthalic acid, benzaldehyde, benzyl alcohol, Phenylethanol, benzenesulfonic acid, 2-naphthalenesulfonic acid, sodium anthraquinone-2-sulfonate, phenol, cresol, 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-n-oct Xylbenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2'-dihydride Xyl-4-methoxybenzophenone, 2,2′-dihydroxy-4,4′-dimethoxybenzophenone, 2,2 ′, 4,4′-tetrahydroxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone, 2, -Hydroxy-4-methoxy-2'-carboxybenzophenone, 2'-hydroxy-4-chlorobenzophenone, 2 (2'-hydroxy-5-methoxyphenyl) benzotriazole, 2 (2'-hydroxy-3 ', 5'- Di-t-butylphenyl) benzotriazole, 2 (2′-hydroxy-3′-t-butyl-5′-methylphenyl) benzotriazole, phenyl salicylate, p-octylphenyl salicylate, p-t-butylphenyl salicylate, Carboxyphenyl salicylate, strontium salicylate, methyl salicylate, salicylate Acid dodecyl, resorcinol monobenzoate, 2-ethylhexyl-2-cyano-3,3-diphenyl acrylate, ethyl-2-cyano-3,3-diphenyl acrylate, Ni-bisoctylphenyl sulfide, [2,2′-thiobis ( 4-t-octylphenolato)]-n-butylamine-Ni.

  As the fluorosurfactant, a per se known surfactant having a fluorocarbon chain as a hydrophobic group may be appropriately used. Examples of this type of fluorosurfactant include the following activators.

(1) Anionic fluorosurfactant R _f COOM;
_{R f SO 2 N (R)} 2 CH 2 COOM;
R _f CONYOSO ₃ M;
R _f SO ₂ NRYOSO ₃ M;
R _f SO ₃ M;
R _f CH ₂ O (CH ₂ ) ₂ SO ₃ M
In the above formula, R _f and R _f ′ represent a fluoroalkyl group, R represents a hydrogen atom or a lower alkyl group, Y represents a lower alkylene group, M represents a hydrogen atom, —NH ₃ , an alkali metal atom or Indicates an alkaline earth metal atom.

(2) Cationic fluorosurfactant R _f CONHYN (R) (R ′) · HX;
R _f SO ₂ NHYN (R) (R ′) · HX
In the above formula, R _f , R and Y are as defined above, R ′ represents a hydrogen atom or a lower alkyl group, HX represents an acid, and X represents a halogen atom or an acid radical.

(3) Amphoteric fluorosurfactant
In the above formula, R _f , R and Y are as defined above.

(4) Nonionic fluorosurfactant R _f OH;
In said formula, _Rf and R are synonymous with the above, and n shows the number of 1-30. In addition, two or more kinds of the above-mentioned fluorosurfactants may be used in combination as desired.

  Suitable commercially available fluorosurfactants include “Surflon S-111” (perfluoroalkyl carboxylate), “Surflon S-112” (perfluoroalkyl phosphate ester), “Surflon” manufactured by Seimi Chemical Co., Ltd. "S-113" (perfluoroalkylcarboxylate), "Surflon S-121" (perfluoroalkyltrimethylammonium salt), "Surflon S-131" (perfluoroalkylbetaine), "Surflon S-132" (perfluoro Alkylbetaines) “Surflon S-141” (perfluoroalkylamine oxide), “Surflon S-145” (perfluoroalkylethylene oxide adduct), “Surflon S-381” (perfluoroalkyl-containing oligomer), “Surflon S” -383 "( -Fluoroalkyl-containing oligomer), "Surflon S-393" (perfluoroalkyl-containing oligomer), "Surflon SC-101" (perfluoroalkyl-containing oligomer), "Surflon SC-105" (perfluoroalkyl-containing oligomer), " Examples include "Surflon KH-40" (perfluoroalkylethylene oxide adduct) and "Surflon SA-100" (perfluoroalkyl-containing special compound).

  Other suitable commercially available fluorosurfactants include “Florard FC-430” (fluorinated alkyl ester) and “Florard FC-431” (fluorinated alkyl ester) manufactured by Sumitomo 3M Limited, and Mitsubishi Materials. “F-top EF-102” (perfluorosulfonate), “F-top EF-103” (perfluorosulfonate), “F-top EF-104” (perfluorosulfonate), “ F-top EF-122 (perfluoroalkylethylene oxide adduct), F-top EF-351 (fluorinated alkyl ester), F-top EF-352 (fluorinated alkyl ester), F-top EF-801 (Fluorinated alkyl ester), “F-top EF-802” (fluorinated) Alkyl ester) and "F-top EF-601" (fluorinated alkyl ester), Neos' "Factent 251" (fluorinated alkyl ester), FTX-218 "(fluorinated alkyl ester), Dainippon Ink and Chemicals, Inc. “Megafac F-470” (fluorinated alkyl ester), “Megafac F-482” (fluorinated alkyl ester), “Megafac F-484” (fluorinated alkyl ester), “Megafac F” -487 "(fluorinated alkyl ester).

  As the organosilicon compound, those known per se may be used as appropriate. Particularly preferred are (triphenylsilyl) acetylene, phenylsilane, tetraphenoxysilane, triphenylsilane, tribenzylsilane, allyltriphenyl. Examples include silane, triphenylvinylsilane, and phenyltriethoxysilane. Two or more of these organosilicon compounds may be used in combination as desired.

  The UV-absorbing compound, the fluorosurfactant, and the organosilicon compound (hereinafter simply referred to as UV-absorbing compound) used as desired are from the viewpoint of the modification efficiency and workability of the first surface of the fluororesin film. Is attached to the first surface as a solution, dispersion or suspension (hereinafter simply referred to as a solution or the like) using water or a water-soluble organic solvent as a solvent. As a solvent such as the solution, a mixture of water and a water-soluble organic solvent such as a lower alcohol (for example, methanol, ethanol, isopropanol, butanol, etc.) may be used. When used as an aqueous solution, a water-soluble organic solvent, for example, a lower alcohol such as isopropanol may be appropriately blended in order to enhance the solubility of the ultraviolet absorbing compound.

  The concentration of the UV-absorbing compound in a solution using water and / or a water-soluble organic solvent as a solvent is determined depending on the type of the compound, the solubility in water, the type of fluororesin to be treated, and the coexisting fluorosurfactant / organic Although it depends on the type and concentration of the silicon compound and is not particularly limited, it is generally 0.05 to 10% by weight, preferably 0.1 to 5% by weight.

  The concentration of the fluorosurfactant in the solution or the like is not particularly limited as long as it is a concentration that allows the UV-absorbing compound or the UV-absorbing compound and the organosilicon compound to be uniformly present at a sufficient concentration on the first surface of the fluororesin film. However, it is generally 0.05 to 2% by weight, preferably 0.1 to 1% by weight.

  The concentration of the organosilicon compound in the solution depends on the type of the compound, the solubility in water, etc., the type of the fluororesin to be treated, and the type and concentration of the coexisting ultraviolet absorbing compound and the fluorosurfactant. Although not limited, it is generally 0.05 to 10% by weight, preferably 0.1 to 5% by weight.

  The method of allowing a solution such as an ultraviolet absorbing compound to be present on the first surface of the fluororesin film may be any of a coating method, a spraying method, a dipping method, and the like. Moreover, after making this solution etc. exist in the fluororesin film 1st surface, you may perform a drying process before ultraviolet laser beam irradiation. Although natural drying is sufficient as a drying process, you may forcibly carry out at 60-150 degreeC as needed. Due to the action of the fluorosurfactant, the UV-absorbing compound or the UV-absorbing compound and the organosilicon compound are uniformly present at a sufficient concentration on the first surface of the fluororesin film.

In the present invention, the first surface is irradiated with ultraviolet laser light under the condition that an ultraviolet absorbing compound or the like is present on the first surface of the fluororesin film. As the ultraviolet laser light, one having a wavelength of 400 nm or less is desirable, and examples include argon laser light, krypton ion laser light, Nd: YAG laser light, N ₂ laser light, dye laser light, and excimer laser light. Among these, excimer laser light having a wavelength of 193 to 308 nm is preferable. In particular, KrF excimer laser light (wavelength: 248 nm), ArF excimer laser light (wavelength: 193 nm), and XeCl excimer laser light (308 nm) that can stably obtain a high output for a long time are preferable. Excimer laser light irradiation is usually performed at room temperature in the air, but may be performed in an oxygen atmosphere.

The total irradiation amount of the ultraviolet laser light is set within an appropriate range. Even if the total irradiation amount is too small or too large, low chargeability is not imparted to the second surface. Such an appropriate total irradiation dose range is determined depending on the type of laser light.
For example, when KrF excimer laser light is used, the total irradiation amount is 0.10 to 0.55 J / cm ² , and preferably 0.10 to 0.45 J from the viewpoint of imparting low chargeability to the second surface. / Cm ² .
For example, when ArF excimer laser light is used, the total irradiation amount is 0.05 to 0.30 J / cm ² , and preferably 0.05 to 0. 0 from the viewpoint of imparting low chargeability to the second surface. 20 J / cm ² .
In addition, for example, when XeCl excimer laser light is used, the total irradiation amount is 0.20 to 1.00 J / cm ² , and preferably from the viewpoint of imparting low chargeability to the second surface. it is a 20~0.80J / cm ^2.

The ultraviolet laser light is usually irradiated in multiple times. The irradiation amount per shot and the number of shots are not particularly limited as long as the total irradiation amount is within the above range.
For example, if the KrF excimer laser light is used, irradiation dose per one shot is usually, 20~200mJ / ^cm 2/1-shot, preferably 30~100mJ / ^cm 2/1-shot, the number of shots normally 2 to 20 times, preferably 2 to 10 times.

(Low-charge fluoropolymer film)
The low charge fluororesin film of the present invention produced by performing the above surface treatment on the first surface of the fluororesin film has excellent low chargeability on the second surface as described above. In particular, when the surface-treated fluororesin film is a conductive material-free fluororesin film containing no conductive material, the conductive material-free low-charge fluoropolymer film of the present invention is charged by applying a voltage to the second surface. The following formula:
[(V ₀ −V ₁₂₀ ) / V ₀ ] × 100
(In the formula, V ₀ is the charged voltage (V) of the second surface immediately after the end of voltage application; V ₁₂₀ is the charged voltage (V) of the second surface 120 seconds after the end of voltage application)
The attenuation rate of the charged voltage represented by is 4% or more, particularly 4 to 20%, preferably 6 to 20%, more preferably 10 to 20%. In general, a conductive material-free fluororesin film has a charging voltage attenuation rate of about 2% or less, and the present invention can provide an attenuation rate of about 2 times or more, preferably 3 times or more, more preferably 5 times or more. Recognize. In the present invention, the low charging property means a material that achieves the above-mentioned voltage decay rate.

The charged voltages V ₀ and V ₁₂₀ can be measured in an ambient environment at a temperature of 23 ° C. and a humidity of 50% RH in accordance with “5.1 Half Life Measurement Method” defined in JIS L1094 (1997).

Specifically, first, a test piece is prepared. The test piece is a low-charge fluororesin film bonded to an aluminum plate with a silicone rubber layer on the first surface. Specifically, the first surface of a low-charge fluoropolymer film (length 150 mm × width 150 mm) is applied to an aluminum plate (length 120 mm × width 120 mm × thickness 1 mm) with a two-component addition type silicone rubber (hardness JIS A A sample is manufactured by bonding the laminated body at 10 ° C. and a volume resistivity of 10 ¹⁵ Ω · cm insulator) and heating the laminated body at 120 ° C. for 30 minutes under no-load condition. A sample is cut into 45 mm × 45 mm and used as a test piece.

  Next, the test piece is neutralized using a static eliminator and then attached to a measuring machine. The measuring machine is defined in the JIS standard, and is shown in detail in FIG. 1 includes an application unit (needle electrode) 1, a power reception unit 2, a turntable 3, and a test piece mounting frame 4. The application unit 1 is connected to a high-voltage DC power source, and the power reception unit is a synchroscope or a recording device. Connected to the total. 5 is a scale plate, 6 is a pointer, and 7 is an arm. In such a measuring machine, the test piece is attached to the test piece mounting frame 4 so that the second surface faces up.

Thereafter, while rotating the turntable 3, (+) 10 kV is applied for 30 seconds, then the application is stopped and the turntable 3 is rotated as it is. The initial charged voltage V ₀ immediately after the voltage application is finished and the charged voltage V ₁₂₀ 120 seconds after the voltage application is finished are measured.
Such a measurement is repeated for three specimens and their average value is used.

  In the low charge fluororesin film of the present invention, if it is common to irradiate an excimer laser, the surface resistivity of the first surface is not greatly influenced by the thickness. However, the attenuation rate on the second surface side varies greatly depending on the difference in thickness even when excimer laser irradiation is common. If the thickness is 100 μm or more, low chargeability of the second surface cannot be sufficiently obtained even when excimer laser irradiation is performed.

(Use)
As described above, the low-charge fluoropolymer film of the present invention produced by performing the above surface treatment on the first surface of the fluororesin film imparts low chargeability to the second surface, and at the same time, Properties such as adhesion and wettability of one surface are also improved. Therefore, the fluororesin film of the present invention is preferably used as a surface layer of a fixing roller, a charging roller, a developing roller, a transfer roller, or a pressure roller of an electrophotographic image forming apparatus. Specifically, the low-charge fluororesin film of the present invention is used by being coated on a roller so that the first surface faces inward and the second surface faces outward.

  It is particularly preferable that the low-chargeable fluororesin film has a tube shape when used for the roller. In this case, the first surface is positioned because silicon rubber or the like is bonded to the inner surface of the tube, and the second surface is positioned on the outer surface (surface) side of the tube.

Example 1
"Fluorard FC-430" (commercially available from Sumitomo 3M Limited; fluorinated alkyl ester) is added at a concentration of 1.0% by weight to an ethanol solution of 1.0% by weight of phenanthrene and 1.0% by weight of tribenzylsilane. A treated liquid was prepared. Using an applicator (“YA type applicator” manufactured by Yoshimitsu Seiki Co., Ltd.), the treatment liquid is applied on one surface (first surface) of a PFA film (film thickness: 20 μm, conductive material free) with a coating thickness of 25 μm. And dried naturally for about 30 minutes to form a coating film. The surface on which the coating film was formed was irradiated with KrF excimer laser light so that the total irradiation amount was 0.3 J / cm ² .

(Examples 2 to 10 / Comparative Examples 1 to 17)
Surface treatment was performed on the first surface of the PFA film by the same method as in Example 1 except that the coating conditions, film conditions, and irradiation conditions described in the table were adopted.

(Battery voltage on the second surface)
Using the films (150 mm long × 150 mm wide) obtained in the examples / comparative examples, according to the method described above, the initial charging voltage V ₀ and voltage application immediately after completion of the preparation of the test piece and voltage application were completed. Measurement with the charged voltage V ₁₂₀ after 2 seconds was performed.

(Surface resistivity of the first surface)
On the first surface of the film (150 mm long × 150 mm wide) obtained in the examples / comparative examples, surface resistivity was measured at any three locations using Hiresta-IP MCP-HT260 manufactured by Mitsubishi Chemical Corporation. The average was taken as the measured value. The measurement voltage and probe were changed according to the resistance.

(Surface properties)
Elemental analysis was performed on the first and second surfaces of the untreated PFA film and the films obtained in the predetermined examples / comparative examples, and further observed with a scanning electron microscope. Table 3 shows the results of elemental analysis. Scanning electron micrographs are shown in FIGS. FIG. 2 is a scanning electron micrograph (SEM photograph) of the second surface of the film obtained in Example 8. FIG. 3 is a scanning electron micrograph (SEM photograph) of the second surface of the film obtained in Example 9. FIG. 4 is a scanning electron micrograph (SEM photograph) of the second surface of the film obtained in Comparative Example 12. FIG. 5 is a scanning electron micrograph (SEM photograph) of the surface of an untreated PFA film. 6 is a scanning electron micrograph (SEM photograph) of the first surface of the film obtained in Example 9. FIG.

From Table 3, when the predetermined surface treatment is performed on the first surface, fluorine atoms are effectively reduced and oxygen atoms are increased on the first surface, but the composition ratio does not change on the second surface. This suggests that the physical and chemical properties of the second surface have not changed.
2-5, even if it performed predetermined surface treatment with respect to the 1st surface, it turned out that the external appearance state of a 2nd surface does not change.
5 and 6 that the first surface is roughened by a predetermined surface treatment.
From these results, it is apparent that the second surface has low chargeability without changing the physical and chemical properties and the surface properties such as the appearance state on the second surface.

The method for producing a low-chargeable fluororesin film of the present invention is useful in the field of electrophotographic image forming apparatuses and the like.
In particular, the conductive material-free low-charge fluororesin film of the present invention is useful as a surface layer of a component of an electrophotographic image forming apparatus, for example, a fixing roller, a charging roller, a developing roller, a transfer roller, or a pressure roller.

The schematic block diagram of the measuring apparatus of a charged voltage is shown. It is a scanning electron micrograph (SEM photograph) of the 2nd surface in the film obtained in Example 8. It is a scanning electron micrograph (SEM photograph) of the 2nd surface in the film obtained in Example 9. It is a scanning electron micrograph (SEM photograph) of the 2nd surface in the film obtained by the comparative example 12. It is a scanning electron micrograph (SEM photograph) of the surface in an untreated PFA film. It is a scanning electron micrograph (SEM photograph) of the 1st surface in the film obtained in Example 9.

Claims (7)

  A solution, dispersion or suspension containing an ultraviolet absorbing compound and a fluorosurfactant is attached to the first surface of a fluororesin film having a thickness of less than 100 μm, and the attached surface is irradiated with ultraviolet laser light. A method for producing a low-chargeable fluororesin film, characterized in that: Ultraviolet laser light is KrF excimer laser, a manufacturing method of a low chargeability of the fluorine resin film according to claim 1 total dose is 0.10~0.55J / cm ^2. When a voltage is applied to the second surface of the conductive material-free fluororesin film having a thickness of less than 100 μm having the first surface and the second surface on the back side of the first surface, the following formula:
[(V ₀ −V ₁₂₀ ) / V ₀ ] × 100
(In the formula, V ₀ is the charged voltage (V) of the second surface immediately after the end of voltage application; V ₁₂₀ is the charged voltage (V) of the second surface 120 seconds after the end of voltage application)
A conductive material-free low-charge fluororesin film, characterized in that the attenuation rate of the charged voltage represented by the formula is 4% or more.   A solution, dispersion or suspension containing an ultraviolet absorbing compound and a fluorosurfactant is attached to the first surface of the conductive material-free fluororesin film, and the attached surface is irradiated with ultraviolet laser light. The electrically conductive material-free low-chargeable fluororesin film according to claim 3, which is manufactured by: Ultraviolet laser light is KrF excimer laser beam, low chargeability fluororesin film of the conductive material free of claim 4 total dose is 0.10~0.55J / cm ^2.   The conductive material-free low-charge fluororesin film according to any one of claims 3 to 5, which has a tube shape.   7. A conductive material-free low material according to claim 3, which is used as a surface layer of a fixing roller, a charging roller, a developing roller, a transfer roller, or a pressure roller of an electrophotographic image forming apparatus. Chargeable fluororesin film.