JP2010147435A - Nanoimprint device and method for manufacturing memory media using the device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a fine pattern eliminating a residue of a resist layer when imprinting by a nanoimprint device and to manufacture a bit patterned medium of a high density. <P>SOLUTION: The nanoimprint device, which transfers an unevenness on a surface of a resist with a protrusion portion 47 on a mold 41 by pressing a mold 41 which has a minute unevenness pattern, is constructed in a manner such that continuous grooves 48 are positioned on the top surface of the protrusion portion 47 of the mold 41, and when pressing the mold 41 to the resist, the residue of the resist is reduced so that a part of the resist are held in the grooves 48. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  This application relates to a nanoimprint apparatus that forms a fine pattern with a resin. In particular, the present invention relates to a structure of a nanoimprint apparatus that uses a mold that does not generate a resist residue during imprinting, and a method of manufacturing a storage medium that is manufactured using the nanoimprint apparatus and that is used in an information recording / reproducing apparatus such as a hard disk apparatus.

  In recent years, magnetic recording / reproducing devices (HDDs) have been rapidly reduced in size and capacity. At one year before the present application, HDD magnetic storage media supplied to the market had a structure in which a magnetic material was laminated on a glass or aluminum alloy substrate by sputtering or the like. The recording magnetic material has been devised in various ways to make the magnetic particles small, and the magnetic particle unit has been reduced to about 8 nm. This miniaturization of the magnetic particles greatly contributes to the reduction in noise of the storage medium. However, this miniaturization has a limit from the viewpoint of the film forming process and thermal fluctuation. As a breakthrough, a medium called a so-called discrete track medium or a bit patterned medium is considered. These media are characterized by patterning a film of a recording magnetic material. In the case of a discrete track medium, the track in the radial direction is patterned. The bit patterned medium is patterned in both the circumferential direction and the radial direction (see Patent Document 1).

  Such a bit patterned medium is manufactured by applying a semiconductor lithography technique to a storage medium. One of mass production techniques for bit patterned media is a technique called nanoimprint (see Non-Patent Document 1). This is a technique in which a fine stamping die is transferred to a resin, which is a transfer molding material applied to a medium, and the magnetic material is shaved using the resin as a mask. The pressing mold of the nanoimprint apparatus is generally called a mold, a master, a template or the like, and becomes a glass pressing mold when using an ultraviolet curable resin. In some cases, a thermosetting resin is used. In general, the use of a UV curable resin is suitable for a fine pattern because the influence of the thermal expansion on the pattern can be ignored.

Japanese Patent Laid-Open No. 3-022211 (FIG. 1)

Paper S. Y. Chou, et all. Appl. Phys. Vol. 76, 6673 (1994)

  However, a pattern imprinted with a UV curable resin always has a “push residue” due to the pressing mold. This “push residue” is called a resist residue. The resist residue becomes an obstacle when the material immediately under the resist is etched. Therefore, generally, before patterning, a process of removing residues called residue removal, bottoming out, etc. is performed, but there is a problem that this process causes an increase in manufacturing process steps, cost, environmental burden, etc. there were.

Therefore, this application eliminates the residue in the nanoimprinted pattern with the UV curable resin, or eliminates the residue as much as possible, thereby omitting the process of removing the residue in the nanoimprint apparatus, reducing the manufacturing process steps, and reducing the cost. The purpose is to reduce environmental impact.
In addition, this application eliminates residues in nanoimprinted patterns with UV curable resins, or reduces resist pattern deformation (edge roundness) by eliminating residues as much as possible, faithfully transfers, and increases density. The purpose is also to plan.

  The nanoimprint apparatus of this application that achieves the above-described object is a nanoimprint apparatus that transfers the unevenness on the mold to the surface of the transfer molding material by pressing a mold having a fine unevenness pattern on the surface of the transfer molding material. The top surface of the convex portion of the mold is provided with a groove portion that can accommodate a part of the transfer molding material when the mold is pressed against the transfer molding material.

  In addition, a method of manufacturing a storage medium using a nanoimprint apparatus that achieves the above object includes laminating a soft magnetic backing layer, an intermediate layer, a magnetic layer, an underlayer, and a transfer molding material on both sides of a disk-shaped substrate. A mold that manufactures a disk medium and has a minute uneven pattern provided in a nanoimprint apparatus is made of an ultraviolet transmitting member, and a groove that can accommodate a part of a molding material to be transferred is provided on the top surface of the protrusion. The mold is pressed against both sides of each disk medium to transfer the irregularities on the mold to the surface of the transfer molding material, and at the same time, a part of the molding material to be transferred pushed away by the projection is accommodated in the groove portion. Irradiate ultraviolet rays from the back side of the disk to cure the material to be transferred, perform ashing with oxygen gas on the disk-shaped medium after removing the mold, and To remove the dummy pattern formed by, it is characterized in that to produce a storage medium to form a pattern of recesses on the mold in a magnetic layer by removing the transferred molded material and the underlayer.

  According to this application, the residue imprinted in the nano-imprinted pattern with the UV curable resin disappears or almost disappears. Therefore, the process of removing the residue is omitted, thereby reducing the manufacturing process steps, the cost, and the environmental load. be able to. Further, by eliminating the residue of the nano-imprinted pattern using a UV curable resin, the deformation (edge roundness) of the resist pattern can be reduced, and faithful transfer and higher density can be achieved.

  Hereinafter, embodiments of this application will be described in detail based on specific examples with reference to the accompanying drawings, but before that, problems of the prior art will be described with reference to the drawings.

  FIG. 1A is an enlarged view of an outline of a conventional bit patterned medium 1 (hereinafter referred to as a disk 1) and an example of the bit pattern. On the nonmagnetic substrate (disk substrate) 2 constituting the disk 1, single domain fine particles (dots) made of a magnetic material are provided in the circumferential direction by the number of tracks. Such a disc 1 is manufactured by processes as shown in FIGS.

  FIG. 1B shows the configuration of the disk 1 before the bit pattern is formed and the conventional mold 9 which is a pressing mold for forming the bit pattern on the disk 1, but the configuration of the disk 1 is simplified. It is described. In this example, a configuration in which a resist layer 7 is provided on the upper surface of the magnetic layer 5 is shown. On the other hand, although the mold 9 shows a local cross section, actually, a substantially lattice-like projection 47 is formed on the mold 9.

  FIG. 1C shows a state where the mold 9 is pressed against the resist from the state of FIG. 1B and then returned to the original position. A groove 57 is formed in the resist 7 at the portion pressed by the protrusion 47 of the mold 9, but the tip of the protrusion 47 of the mold 9 does not reach the magnetic layer 5. The remaining 17 is generated. This pushing residue 17 is called a resist residue. Since this resist residue becomes an obstacle when the magnetic layer 5 directly under the resist is etched, a process called residue removal is performed before the patterning of the magnetic layer 5.

  FIG. 1 (d) shows a state where a residue removal process has been performed before patterning of the magnetic layer 5. When the residue removing process is performed, the edge of the top surface of the resist 7 is not vertically cut and the edge is rounded. In the patterning of the magnetic layer 5 performed thereafter, the edge portion of the pattern of the magnetic layer 5 is There was a possibility that it was dull and density could not be increased. This application has been made to solve such problems.

  FIG. 2 shows a schematic configuration of the nanoimprint apparatus 10 according to this application. The nanoimprint apparatus 10 includes a cleaning unit 12, an inspection unit 14, an adhesion layer forming unit 16, a resin unit forming unit 18, an imprint unit 20, and a control unit 22. Reference numeral 24 denotes a disk holder whose structure will be described in detail later, and can hold a plurality of disks 1, for example, 20 or more disks 1. The nanoimprint apparatus 10 receives a plurality of discs 1 held by a disc holder 24 from the inlet 11, processes them in-line from cleaning to imprinting, and discharges them from the outlet 13.

  In the cleaning unit 12, dust is removed so that the imprint unit 20 does not have a defect in the disc 1 held by the disc holder 24. There are two methods for cleaning discs, the dry method and the wet method. The inspection unit 14 optically inspects particles. The adhesion layer forming unit 16 performs an adhesion layer forming process for improving the adhesion between the disk substrate and the ultraviolet curable resist. Then, the resin part forming part 18 performs a process of applying an ultraviolet curable resist to the disk substrate.

  FIG. 3A shows an example of the structure of the imprint unit 20 of the nanoimprint apparatus 10 shown in FIG. The imprint unit 20 includes a control device 21, a holder moving mechanism 22, a disc lifter 23 provided with a lifting rod 25, a disc holder 24, two ultraviolet irradiation devices 26, a vacuum suction device 27, and two molding devices 30L and 30R. There is. The control device 21 controls operations of the holder moving mechanism 22, the disc lifter 23, the disc holder 24, the ultraviolet irradiation device 26, the vacuum suction device 27, and the molding devices 30L and 30R. The control device 21 may be provided in the imprint unit 20 as in this embodiment, but the control unit 22 shown in FIG. 2 can replace the control device 21.

  The holder moving mechanism 22 moves a disk holder 24 that holds a plurality of disks 1, and sequentially positions the disks 1 held by the disk holder 24 directly above the disk lifter 23. The disc lifter 23 raises the elevating rod 25 to push up the discs 1 held by the disc holder 24 one by one to the space between the molding devices 30L and 30R to perform imprint processing. The disc lifter 23 also performs an operation of returning the disc on which the imprint process has been completed to the disc holder 24. The molding devices 30L and 30R perform imprint processing on both surfaces of the disk 1 using a mold described later. The mold is composed of a member that transmits ultraviolet light, and the ultraviolet irradiation device 26 transmits the mold and irradiates the both surfaces of the disk 1 with ultraviolet light, thereby curing the resist applied to the disk substrate. The vacuum suction device 27 suctions excess resist generated during operation of the molding devices 30L and 30R to eliminate the excess resist.

  FIG. 3B shows an embodiment of one configuration of the molding apparatuses 30L and 30R in FIG. Since the mold apparatuses 30L and 30R have the same structure, the configuration of one mold apparatus 30 will be described. The molding device 30 has a cylindrical piezo element 32 attached to the tip of a cylindrical main body 31, and a control valve 38 attached to a rotating shaft 37 of a motor 36 at the rear end of the main body 31. ing. The part to which the rotating shaft 37 of the main body 31 is attached can be a metal cylinder. A rear end portion of the main body 31 is connected to a vacuum pump 27P of the vacuum suction device 27 through a control valve 38 through a conduit (not shown).

  The control valve 38 is opened and closed by an open / close signal VS from the control device 21, and when the control valve 38 is opened, the piezo element 32 side is sucked. There are electrodes 33 and 34 at both ends of the piezo element 32, and one electrode is grounded, while the other electrode 34 is connected to a power source + B via a switch 35. When the switch 35 is closed by the signal S from the control device 21, the piezo element 32 is expanded by the voltage applied to both ends of the piezo element 32. For example, the tip of the piezo element 32 moves to the position of the broken line in the figure. To do. The moving distance of the tip of the piezo element 32 is, for example, about 0.4 mm.

  4A is a partially enlarged view showing the configuration of the mold 41 of the first embodiment used in the imprint unit 20 of the nanoimprint apparatus 10 shown in FIG. 2, and FIG. The local cross section in the AA of (a) is shown. The mold 41 according to the first embodiment includes a base plate 46, protrusions 47 protruding in a lattice wall shape on the base plate 46, and a groove 48 provided on the top surface of the protrusion 47. Is done. In this embodiment, the groove 48 has a rectangular cross section and is provided continuously on the top surface of the protrusion 47. However, the groove 48 may be discontinuous.

  In FIG. 4A, the shape of the protrusions 47 protruding from the base plate 46 has been described as a lattice wall, but in reality, the protrusions 47 in the radial direction of the disk are radially extended. The circumferential protrusion 47 of the disk extends in an arc shape.

  The groove portion 48 is configured to accommodate all excess portions of the resist described later in the groove portion 48. The depth of the groove 48 is smaller than the height of the protrusion 47 from the base plate 46 so that the pattern remaining by the resist that has entered the groove 48 does not interfere with the original patterning. For example, a magnetic film is patterned on a disk having a structure of a disk substrate / soft magnetic backing layer / intermediate layer / magnetic film / carbon layer (underlayer) / ultraviolet curable resist layer with a two-layer mask of an ultraviolet resist layer and a carbon layer. Think about the case. In this case, when the selectivity ratio between the ultraviolet resist layer and the carbon layer is set to 1.2 when the carbon layer is 1, the resist layer is scraped faster than the carbon layer. Should be the same as the carbon thickness. Further, it is desirable that the groove 48 be arranged at the center position of the protrusion 47.

  Note that when the magnetic layer is etched, the structure of the underlayer differs depending on whether the etching is performed using only a resist mask or a metal mask. The carbon described above is used for the purpose of absorbing the dummy height when the resist mask is used alone. In addition, since the process of a metal mask is described in the Example mentioned later, chromium is described as a base layer.

  Further, a groove 48A having a semicircular cross section may be provided on the top surface of the protrusion 47 as in the mold 42 of the second embodiment shown in FIG. The molds 41 and 42 of the first and second embodiments are made of a material that transmits ultraviolet rays, for example, glass. In this case, the thickness may be about 200 μm. In addition, the molds 41 and 42 of the first and second embodiments are provided with lattice-like protrusions 47 because they form a bit pattern, but in the case of a discrete track medium, the shape of the protrusions 47 is concentric. become.

  FIG. 5A is a partially enlarged view showing the configuration of the mold 43 of the third embodiment used in the imprint unit 20 of the nanoimprint apparatus 10 shown in FIG. 2, and the structure is easy to understand. In order to do so, a part is cut out. Moreover, (b) shows the local cross section in the BB line of (a). Similar to the mold 41 of the first embodiment, the mold 43 of the third embodiment includes a base plate 46, protrusions 47 protruding in a lattice wall shape on the base plate 46, and protrusions 47. It is comprised from the groove part 48 provided in the top surface.

  The mold 43 of the third embodiment is different from the mold 41 of the first embodiment in that a through hole 49 that penetrates the base plate 46 is provided on the bottom surface of the groove portion 48. The through holes 49 do not need to be provided on the entire bottom surface of the groove portion 48, and may be provided at predetermined intervals, for example. The through hole 49 serves to release the resist that has entered the groove 48 to the back side of the base plate 46. The resist that has escaped to the back side of the base plate 46 is sucked by the vacuum suction device 27 described with reference to FIG. Further, since the resist in the through hole 49 and the groove 48 is also sucked by the vacuum suction device 27, in the third embodiment, no dummy pattern is generated after the mold 43 is removed.

  FIG. 6 shows a configuration in which the mold 41 of the first embodiment shown in FIG. 4 is attached to the tip of the piezo element 32 of the molding apparatus 30 shown in FIG. The molding apparatus 30 includes a cylindrical body 31, a piezo element 32 attached to the front end portion thereof, a control valve 38 provided at the rear end portion, and a mold 40 provided at the end portion of the piezo element 32. It has been. A rear end portion of the main body 31 is connected to a vacuum pump 27P of the vacuum suction device 27 through a control valve 38 through a conduit (not shown).

  The mold 40 of this embodiment has a flange portion 40F for attaching to the end face of the piezo element 32. The diameter of the flange portion 40F is smaller than the outer diameter of the piezo element 32, and the flange portion 40F is fixed to the end face of the piezo element 32 by a ring-shaped mold retainer 39. In this figure, illustration of the electrodes of the piezo element 32 is omitted. In addition, the diameter of the mold 40 in this embodiment is substantially the same as the diameter of the disk 1, and the inner diameter of the hole 39 </ b> A provided in the mold retainer 39 is large enough to accommodate the disk 1 and the mold 40.

  Here, the operation of the imprint unit 20 of the nanoimprint apparatus 10 configured as described above will be described with reference to FIGS. 7 and 8.

  FIG. 7A shows an example of the structure of the disc holder 24 shown in FIG. 3A, and is a longitudinal sectional view of the disc holder 24. FIG. 7B is a cross-sectional view of the disc holder 24 shown in FIG. The disk holder 24 is provided with a holding groove 24B that holds a plurality of disks 1 in an upright state. The disk 1 is held in the holding groove 24B, and a through hole 24A is formed below the holding groove 24B. Is provided. Here, for the sake of simplicity, the disk 1 is shown with a resist layer 7 formed on a disk substrate 2. The disc holder 24 is moved in the imprint portion by the holder moving mechanism 22 described with reference to FIG. 3A so that the through hole 24 </ b> A is directly above the lifting rod 25 of the disc lifter 23. A holding portion 25 </ b> A for holding the disk 1 is provided at the tip of the lifting rod 25.

  FIG. 7 (c) shows a state in which the elevating rod 25 is raised and the disk 1 in the disk holder 24 is pulled up to the imprint position. Then, the disc 1 pulled up to the imprint position is sandwiched between the mold devices 30L and 30R from both sides as shown in FIG. 7 (d). At this time, the control valve 38 described in FIG. 3B is in a half-open state (opening degree: about 20%). This is because the control valve 38 is always slightly opened (opening 20%) in order to promote the volatilization of the resist, and evacuation is performed. The mold 40 of the molding devices 30L and 30R comes into contact with the disk 1 from above, and the disk 1 is fitted into the hole 39A of the ring-shaped mold retainer 39 described with reference to FIG.

  FIG. 8A shows a state in which the disk 1 is completely sandwiched between the molds 40 of the molding devices 30L and 30R from both sides. In this state, since the switch 35 described with reference to FIG. 3B is turned on, the piezo element 32 expands, and the resist layer of the disk 1 is imprinted by the mold 40. At this time, the resist of the resist layer that does not become dots is accommodated in the groove portion of the mold 40. Since the resist is completely patterned, this state is maintained for a certain period of time, at which time the control valve 38 is fully opened and the residue is sucked. The control valve 38 sucks the residue while being fully opened for the same time as the time for spreading the resist.

  Thereafter, the control valve 38 is brought into a half-open state (opening degree: about 20%), ultraviolet irradiation is performed from the ultraviolet irradiation device 26, and ultraviolet (UV light) passes through the mold 40 and hits the resist layer, so that the resist is cured. . The irradiation time of UV light is, for example, about 5 seconds. As a result, a concavo-convex pattern by the mold 40 is formed in the resist layer of the disk 1.

  When the concavo-convex pattern is formed on the resist layer of the disk 1, as shown in FIG. 8B, the mold 40 of the molding devices 30L and 30R releases the disk 1 from the lower side, and the disk 1 is again attached to the lifting rod 25. Retained. Thereafter, the elevating rod 25 is lowered, and the disk 1 with the uneven pattern is returned to the holding groove 24B of the disk holder 24. When the disc 1 returns to the disc holder 24, the disc holder 24 is moved by the holder moving mechanism 22 (see FIG. 3A), and the adjacent disc 1 is positioned immediately above the disc lifter 25.

  The state shown in FIG. 8C is the same as the state where the disk 1 is shifted by one sheet from the state shown in FIG. 7A. Thereafter, the state shown in FIG. ), (D), and the operations described in FIGS. 8A to 8C are repeatedly executed. This operation is performed on all the disks 1 held by the disk holder 24, and when the uneven pattern is formed on all the disks 1, the disk holder 24 is ejected from the imprint unit 20.

  The operations of the holder moving mechanism 22, the disc lifter 23, the disc holder 24, the molding devices 30L and 30R, and the ultraviolet irradiation device 26 in the imprint unit 20 have been described above. Next, the manufacturing process of the disc for forming the uneven pattern on the disc 1 described above will be described with reference to FIGS. 9 and 10 as a process viewed from the disc 1 side.

  FIG. 9A shows a state before the disk 1 is pushed by the mold 41 of the first embodiment described with reference to FIGS. 4A and 4B. The disk 1 includes a disk substrate 2 made of glass having an inner diameter of 20 mm, an outer diameter of 65 mm, and a thickness of 0.7 mm. On the glass substrate 2, the soft magnetic underlay 3, the intermediate layer 4, the magnetic layer 5, the etching mask layer chromium (or carbon) 6, and the resist layer 7 are formed in this order using a sputtering apparatus (not shown). It is a membrane. Then, imprinting is performed on the formed disk 1 by the mold 41 of the first embodiment.

  In the mold 41 of the first embodiment, when the data track of the disk 1 is formed with a pitch of, for example, 100 nm, the distance T between the protrusion 47 corresponding to the data track is 70 nm, the magnetic material The width E of the protrusion 47 for etching the substrate may be 30 nm. Further, the depth of the groove portion 48 of the mold 41 that accommodates the residue after imprinting may be set to the same level as the thickness of the chromium 6. This is because the resist layer 7 is scraped faster than the carbon 6 when the selection ratio of the resist layer 7 and the carbon 6 is 1 for carbon and 1.2 for the resist layer. If the resist layer 7 is cut faster than the carbon 6, the residue pattern (dummy pattern) formed by the groove portion 48 is removed first, and the etching of the carbon 6 is not affected.

  FIG. 9B shows a state in which the mold 41 is pressed against the resist layer 7 from the state of FIG. At this time, the resist of the resist layer 7 pushed by the protrusion 47 of the mold 41 is accommodated in the groove 48 of the mold 41. In this state, ultraviolet irradiation is performed from the back surface of the mold 41 as described above, and the mold layer 7 is cured. Thereafter, when the mold 41 is pulled away from the disk 1, the state shown in FIG. A groove 57 is formed in the resist layer 7, and a dummy pattern 58 imprinted by the mold 41 remains in the groove 57. Note that when the mold 43 of the third embodiment is used, the dummy pattern 58 is not generated.

  The lower chromium 6 with respect to oxygen gas is not scraped by oxygen. Therefore, when ashing is performed by introducing oxygen gas from the state of FIG. 9C, the dummy pattern 58 disappears as shown in FIG. 10A, and the ashing is continued, as shown in FIG. 10B. In this way, the resist layer 7 is peeled off to form a dot pattern composed of the magnetic layer 5 and the chromium 6.

  In the embodiment described above, the dummy pattern is arranged between the tracks. However, in the hard disk device, since the disk is divided into sections, the dummy pattern may be arranged for each section by molding. In addition, the dummy pattern can be arranged on the outermost periphery and the innermost periphery of the disk of the hard disk device.

  Furthermore, the remaining dummy pattern in the embodiment described above is volatile and does not need to be noticed in subsequent processes. On the other hand, as in the configuration of the imprint unit 20 shown in FIGS. 3A and 3B, the resist accommodated in the mold immediately after imprinting is eliminated by being vacuumed by a vacuum suction device. You can also. Therefore, the dummy pattern formed by the mold is not imprinted. The resist that could not be vaporized by vacuum suction is sucked out to the back surface. At this time, the resist can be completely vaporized by blowing with nitrogen gas.

  According to the disk manufacturing method as described above, the resist residue can be made as thin as possible, thereby reducing the load on the disk manufacturing process. In addition, deformation of the resist pattern due to the resist residue (edge roundness) can be reduced. Furthermore, by using the mold 43 of the third embodiment as a mold and vacuum suction from the back surface of the mold 43, it is possible to suck excess resist that has oozed out on the back surface of the mold. By doing so, the residue can be eliminated without providing a dummy pattern. In addition, excess resist that has oozed out on the back surface of the mold can be volatilized by blowing nitrogen gas.

  FIG. 11A shows the shape of the mold 19 and the molded resist 7 of another conventional configuration used in the imprint unit 20 of the nanoimprint apparatus 10 shown in FIG. The pitch of the recessed part 51 and the projection part 53 provided in the mold 19 of this example is large. In such a case, in this application, a resist pool 52 is formed in the portion of the mold 19 between the adjacent recesses 51 as in the fourth embodiment shown in FIG. In the mold 44 of the fourth embodiment, excess resist can be drawn into the resist reservoir 52 during imprinting, so that no resist residue is generated during imprinting.

  FIG. 11C shows a configuration of the mold 45 of the fifth embodiment of this application, which is a modified embodiment of the mold 44 of the fourth embodiment shown in FIG. The difference between the mold 45 of the fifth embodiment and the mold 44 of the fourth embodiment is that a groove 54 similar to that of the first embodiment is formed at the tip of the protrusion 53. In the mold 45 of the fifth embodiment, excess resist can be drawn into the resist reservoir 52 during imprinting, and a dummy pattern 58 can be formed on the disk substrate 2 by the groove 54. The method for removing the dummy pattern 58 is the same as in the first embodiment.

  In the mold of the present application and the manufacturing method of the disk using this mold, not only the residue when imprinted and patterned can be reduced as much as possible, but also the pattern can be highly accurate and miniaturized. Also, it can be expected to reduce costs by reducing the load on the process.

  The nanoimprint apparatus of this application has been described above for the manufacture of patterned media used in HDDs. On the other hand, the nanoimprint technology in the nanoimprint apparatus of this application can also be applied to the formation of columns in accordance with the size of molecules to be extracted in a biochip and the determination of the gate size of an LSI.

  The present application has been described in detail with particular reference to preferred embodiments thereof. For easy understanding of the present application, specific forms of the present application are appended below.

(Additional remark 1) In the nanoimprint apparatus which transfers the unevenness | corrugation on the said mold to the surface of the said to-be-transferred molding material by pressing the mold which has a micro unevenness | corrugation pattern on the surface of the to-be-transferred molding material,
A nanoimprint apparatus, wherein a groove portion is provided on a top surface of a convex portion of the mold to accommodate a part of the transfer molding material when the mold is pressed against the transfer molding material.
(Additional remark 2) The nanoimprint apparatus of Additional remark 1 characterized by the convex part of the said mold having a grid | lattice form.
(Additional remark 3) The nanoimprint apparatus of Additional remark 1 characterized by the convex part of the said mold being concentric.
(Supplementary note 4) The nanoimprint apparatus according to any one of Supplementary notes 1 to 3, wherein the groove is provided continuously on a top surface of the convex portion.
(Supplementary note 5) The nanoimprint apparatus according to any one of supplementary notes 1 to 3, wherein the groove portion is provided intermittently on a top surface of the convex portion.

(Appendix 6) The nanoimprint apparatus according to any one of appendices 1 to 5, wherein a through-hole communicating with the back surface side of the mold is provided at a predetermined position on the bottom surface of the groove.
(Supplementary note 7) The nanoimprint apparatus according to any one of supplementary notes 1 to 6, wherein the mold is made of an ultraviolet transmitting member, and an ultraviolet irradiation device is provided on the back side of the mold.
(Supplementary Note 8) The back side of the mold is connected to a suction means, and the transferred molding material extruded by the mold is sucked by the suction means when the mold is pressed against the transferred molding material. The nanoimprint apparatus according to appendix 6, wherein the nanoimprint apparatus is configured as described above.
(Supplementary Note 9) The nanoimprint apparatus performs transfer on a disk medium in which a soft magnetic backing layer, an intermediate layer, a magnetic layer, an underlayer, and the material to be transferred are laminated on a disk-shaped substrate. The nanoimprint apparatus according to any one of appendices 1 to 8, wherein the nanoimprint apparatus is configured as follows.
(Additional remark 10) The nanoimprint apparatus of Additional remark 9 characterized by the depth of the said groove part being substantially equal to the thickness of the said base layer.

(Additional remark 11) When the ratio of the convex part of the said mold is large with respect to a recessed part, the said groove part was made into the large-sized groove part which has a volume larger than the said recessed part and is not concerned with a transfer pattern, It is characterized by the above-mentioned. Nanoimprint device.
(Supplementary Note 12) The nanoimprint apparatus performs transfer on a disk medium in which a soft magnetic backing layer, an intermediate layer, a magnetic layer, an underlayer, and the transfer target material are laminated on a disk-shaped substrate. The nanoimprint apparatus according to appendix 11, which is configured as follows.
(Additional remark 13) It is a mold used for the nanoimprint apparatus which transfers the unevenness | corrugation on the said mold to the surface of the said to-be-transferred molding material by pressing the mold which has a micro unevenness | corrugation pattern on the surface of a to-be-transferred molding material,
A mold having a groove on the top surface of a convex portion of the mold that can accommodate a part of the material to be transferred when the mold is pressed against the material to be transferred.
(Additional remark 14) The mold of Additional remark 13 characterized by the convex part of the said mold being a grid | lattice form.
(Additional remark 15) The mold apparatus of Additional remark 13 characterized by the convex part of the said mold being concentric.

(Supplementary Note 16) The mold according to any one of Supplementary Notes 13 to 15, wherein the groove portion is provided continuously on a top surface of the convex portion.
(Supplementary Note 17) The mold according to any one of Supplementary Notes 13 to 15, wherein the groove portion is provided intermittently on a top surface of the convex portion.
(Supplementary note 18) The mold according to any one of supplementary notes 13 and 17, wherein a through-hole communicating with the back side of the mold is provided at a predetermined position on the bottom surface of the groove.
(Additional remark 19) The mold according to any one of Additional remarks 13 and 18 characterized in that the mold is composed of an ultraviolet transmitting member.
(Supplementary note 20) A method of manufacturing a storage medium using a nanoimprint apparatus,
A disk medium is manufactured by laminating a soft magnetic backing layer, an intermediate layer, a magnetic layer, an underlayer, and the transferred material on both sides of a disk-shaped substrate,
The mold having a micro uneven pattern provided in the nanoimprint apparatus is composed of an ultraviolet ray transmitting member, and a groove part capable of accommodating a part of the transfer molding material is provided on the top surface of the convex part.
By pressing the mold against both sides of each disk medium, the unevenness on the mold is transferred to the surface of the transfer molding material, and a part of the molding material to be transferred that is pushed away by the projection into the groove Contain
Irradiate ultraviolet rays from the back side of the mold to cure the transferred molding material,
Ashing is performed on the disk-shaped medium after the mold is removed, and the dummy pattern formed by the groove is removed, and the transfer molding material and the underlayer are removed to form the magnetic layer on the magnetic layer. A method of manufacturing a storage medium, wherein a storage medium is manufactured by forming a pattern of recesses on a mold.

(A) is a perspective view showing an example of an external shape of a conventional bit pattern medium and an example of the bit pattern, and (b) to (d) are process diagrams showing an initial stage of a conventional method for producing a bit patterned medium. It is a block block diagram which shows schematic structure of the nanoimprint apparatus which concerns on this application. (A) is a block block diagram which shows an example of the structure of the imprint part of the nanoimprint apparatus shown in FIG. 2, (b) is a block diagram which shows an example of an internal structure of the molding apparatus of (a). (A) is the elements on larger scale which show the structure of the 1st Example of the mold used in the imprint part of the nanoimprint apparatus shown in FIG. 2, (b) is local sectional drawing in the AA of (a). (C) is a local sectional view of the same part as Drawing 3 (b) of the 2nd example of a mold used in the imprint part of the nanoimprint apparatus shown in Drawing 2. (A) is the elements on larger scale which show the structure of the 3rd Example of the mold used in the imprint part of the nanoimprint apparatus shown in FIG. 2, (b) is local sectional drawing in the BB line of (a). It is. FIG. 5 is an assembly perspective view showing a configuration in which the mold of the first embodiment shown in FIG. 4 is attached to the molding apparatus shown in FIG. (A) is a longitudinal sectional view of the disc holder showing an example of the structure of the cassette shown in FIG. 3 (a), (b) is a sectional view in the short direction of the disc holder shown in (a), (c) FIG. 3A is a cross-sectional view showing a state where the lifting rod shown in FIG. 3A lifts one disc from the disc holder, and FIG. 3D is a diagram for explaining a state where the lifted disc is sandwiched by the molding apparatus from both sides. It is. (A) is a diagram showing a state in which a lifted disc is sandwiched and molded from both sides by a molding device, and ultraviolet rays are irradiated from the back side of the mold, and (b) is a state in which the molding device removes the disc from the state of (a). FIG. 6C is a diagram showing a state in which the cassette is released, and FIG. 8C is a diagram showing a state in which the cassette moves the next disk to the operating position of the disk lifter by the cassette moving mechanism. FIGS. 2A and 2B show a manufacturing process of a disk medium, where FIG. 1A shows a state before the disk medium is pressed by a mold, FIG. 2B shows a state where the disk medium is molded by a mold, and FIG. FIG. 4 is a view showing a state where the mold is returned to the original position. FIGS. 9A and 9B show a disk medium manufacturing process, where FIG. 9A shows a state where the resist is peeled off by ashing from the state of FIG. 9C, and FIG. 9B shows a dot pattern formed by thinning the resist. FIG. (A) is sectional drawing which shows the conventional structure of the mold used in the imprint part of the nanoimprint apparatus shown in FIG. 2, and the shape of the molded resist, (b) is the imprint part of the nanoimprint apparatus shown in FIG. Sectional drawing which shows the structure of the 4th Example of this application of the mold used for this invention, and the shape of the molded resist, (c) is the mold of this application of the mold used in the imprint part of the nanoimprint apparatus shown in FIG. It is sectional drawing which shows the structure of the 5th Example, and the shape of the molded resist.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Bit patterned medium 2 Disk substrate 3 Backing layer 7 Resist layer 9 Conventional mold 10 Nanoimprint apparatus 20 Imprint part 21 Control apparatus 22 Holder moving mechanism 23 Disk lifter 24 Disk holder 25 Lifting rod 26 Ultraviolet irradiation apparatus 27 Vacuum suction apparatus 30 Mold device 32 Piezo element 33, 34 Electrode 38 Control valve 40 Mold 41 Mold of the first embodiment 42 Mold of the second embodiment 43 Mold of the third embodiment 44 Mold of the fourth embodiment 45 Mold of the fifth embodiment 47 53 Projection 48, 54, 57 Groove 49 Through-hole 51 Recess 58 Dummy pattern

Claims (5)

In the nanoimprint apparatus for transferring the unevenness on the mold to the surface of the transfer molding material by pressing a mold having a minute uneven pattern on the surface of the transfer molding material,
A nanoimprint apparatus, wherein a groove portion is provided on a top surface of a convex portion of the mold to accommodate a part of the transfer molding material when the mold is pressed against the transfer molding material.   The nanoimprint apparatus according to claim 1, wherein the groove is continuously provided on a top surface of the convex portion.   The back side of the mold is connected to a suction means, and when the mold is pressed against the transfer molding material, the transfer molding material extruded by the mold is sucked by the suction means. The nanoimprint apparatus according to claim 1, wherein the nanoimprint apparatus is characterized.   The nanoimprint apparatus is configured to perform transfer to a disk medium in which a soft magnetic backing layer, an intermediate layer, a magnetic layer, an underlayer, and the transfer molding material are laminated on a disk-shaped substrate. The nanoimprint apparatus according to any one of claims 1 to 3, wherein the nanoimprint apparatus is provided. A method of manufacturing a storage medium using a nanoimprint apparatus,
A disk medium is manufactured by laminating a soft magnetic backing layer, an intermediate layer, a magnetic layer, an underlayer, and the transferred material on both sides of a disk-shaped substrate,
The mold having a micro uneven pattern provided in the nanoimprint apparatus is composed of an ultraviolet ray transmitting member, and a groove part capable of accommodating a part of the transfer molding material is provided on the top surface of the convex part,
By pressing the mold against both sides of each disk medium, the unevenness on the mold is transferred to the surface of the transfer molding material, and a part of the molding material to be transferred that is pushed away by the convex portion into the groove portion. Contain
Irradiate ultraviolet rays from the back side of the mold to cure the transferred molding material,
Ashing is performed on the disk-shaped medium after the mold is removed, and the dummy pattern formed by the groove is removed, and the transfer molding material and the underlayer are removed to form the magnetic layer on the magnetic layer. A method of manufacturing a storage medium, wherein a storage medium is manufactured by forming a concave pattern on a mold.

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