JP2006059405A - Manufacturing method of magnetic recording medium and imprinting method - Google Patents

Manufacturing method of magnetic recording medium and imprinting method Download PDF

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JP2006059405A
JP2006059405A JP2004238093A JP2004238093A JP2006059405A JP 2006059405 A JP2006059405 A JP 2006059405A JP 2004238093 A JP2004238093 A JP 2004238093A JP 2004238093 A JP2004238093 A JP 2004238093A JP 2006059405 A JP2006059405 A JP 2006059405A
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Prior art keywords
imprinted
imprint
mold
recording medium
magnetic recording
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Inventor
Taizo Hamada
Tatsuro Ishida
Tadashi Okamoto
Masaya Sakaguchi
Terumi Yanagi
昌也 坂口
匡史 岡本
照美 柳
泰三 浜田
達朗 石田
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Matsushita Electric Ind Co Ltd
松下電器産業株式会社
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Abstract

In a process for fine patterning of discrete track media and patterned media using imprint technology, in order to form a uniform and highly reliable shape pattern, the pattern forming surface of the mold and the magnetic It is necessary to uniformly press the entire surface to be imprinted of the recording medium.
In a step of pressing a mold having a specific shape pattern onto a surface to be imprinted on a substrate and transferring the shape pattern to the surface to be imprinted, prior to press-contacting the mold to the surface to be imprinted, At least part of the imprinted surface is roughened.
[Selection] Figure 1

Description

  The present invention relates to a method of manufacturing a magnetic recording medium, such as a discrete track medium provided with a track for signal recording in advance with predetermined shape information, or a patterned medium provided with a bit for signal recording in advance with predetermined shape information, and The present invention relates to an imprint method that can be used in a manufacturing method.
In recent years, magnetic recording / reproducing apparatuses tend to have a higher recording density in order to realize a small size and a large capacity. In the field of hard disk drives, which are typical magnetic storage devices, devices having a surface recording density of 60 Gbit / in 2 (93 Mbit / mm 2 ) have already been commercialized, and soon, the surface recording density is 100 Gbit / in 2 ( 155 Mbit / mm 2 ) is recognized as a rapid technological advance to the extent that the practical application is discussed.
  The technical background that made it possible to achieve such a high recording density is the track density due to the practical use of a giant magnetoresistive head (GMR head) that is far superior in reproduction output performance than the conventional induction type magnetic head. Improvement of the linear recording density due to the advent of new signal processing methods such as improvement of the medium performance, head / disk interface performance, and partial response. Due to the above technical progress, the size of a recording signal bit recorded in a hard disk drive is currently reduced to a track width of several hundred nm and a magnetization reversal length in the line recording direction to several tens of nm.
  However, on the other hand, factors that hinder the higher recording density than the current state are gradually becoming clear and are recognized as problems to be solved in the future.
  One factor that hinders the improvement in track density is erase noise between adjacent tracks and crosstalk noise from adjacent tracks. As the track density increases, the distance between adjacent tracks decreases, so that after recording a signal, an erase band in which magnetic interference is complicated is formed between adjacent tracks, which causes noise during signal reproduction. Further, since the distance between adjacent tracks becomes small, a magnetic head attempting to reproduce a signal from a specific track also detects a signal recorded on the adjacent track as noise. Both of these are factors that reduce the reproduction signal S / N.
  One of the factors that hinder the improvement of linear recording density is demagnetization due to thermal fluctuations in recording magnetization. As the magnetization reversal length in the linear recording direction, that is, the bit length becomes smaller, the magnetic layer of the magnetic recording medium exhibits superparamagnetic behavior, and the recorded information disappears over time due to thermal disturbance of magnetization even at room temperature. .
  As means for solving the former erase noise and crosstalk noise, for example, Patent Document 1 and Patent Document 2 propose a magnetic recording medium called a discrete track medium. Discrete track media have a discrete structure in which nonmagnetic guard band regions are provided between adjacent tracks to magnetically separate individual tracks, thereby reducing magnetic interference between adjacent tracks.
  As a means for solving the demagnetization due to the latter thermal fluctuation, for example, Patent Document 3 proposes a magnetic recording medium called a patterned medium in which individual bits for signal recording are provided in a predetermined shape pattern in advance. Has been. In order to improve the recording resolution and obtain the necessary signal S / N in a conventional magnetic recording medium made of a continuous magnetic thin film, the magnetic thin film is made thinner and the magnetic moment is made smaller, and the magnetic thin film is configured. It was necessary to make the magnetic particles to be finer. These requirements are contradictory requirements for improving resistance to thermal fluctuations. On the other hand, with patterned media, a non-magnetic region is provided between individual bits and magnetically separated, so that sufficient recording resolution and signal S / N can be obtained even when a thicker magnetic material having a large magnetic moment is used. Can be obtained. Furthermore, since each bit can be composed of single domain particles without being finely divided, it is attracting attention as a structure capable of satisfying both good signal S / N and thermal fluctuation resistance during high-density recording.
  When manufacturing such discrete track media and patterned media as described above, it is necessary to pattern the surface of the magnetic recording medium one by one into a predetermined shape. However, as described above, the track width of the current hard disk is several hundred nm and the bit length is about several tens of nm, and it is not easy to process the entire hard disk into such a fine shape. The resolution required for such microfabrication can be achieved by using advanced lithography techniques such as electron beam lithography, but electron beam lithography basically performs pattern exposure in the manner of writing with a small diameter beam. Therefore, since much time is required for exposure, it is inferior in productivity and cost performance, and is not suitable for mass production of magnetic recording media.
  Thus, as means for improving the productivity of discrete track media and patterned media, for example, Patent Document 4, Patent Document 5, and Patent Document 6 disclose a method of performing shape patterning using an imprint technique. According to this patent document, it is possible to collectively transfer the shape onto the surface of the medium by pressing a mold having a predetermined shape pattern against the surface of the magnetic recording medium. That is, once a shape pattern is formed on a mold that is an original plate using electron beam lithography, shape patterning of each magnetic recording medium is performed in a relatively short time and easily as if resin molding is performed. It can be done.
Incidentally, in order to appropriately perform shape patterning by such an imprint technique, it is necessary to press the pattern forming surface of the mold and the imprinted surface of the magnetic recording medium uniformly over the entire surface. In particular, since the surface shape of the magnetic recording medium generally has a certain degree of waviness, how to efficiently remove voids that may be generated between the concave portions due to this waviness and the mold surface, It is important to press the entire surface uniformly to the mold surface. As one means for realizing the above, for example, in Patent Document 7, Patent Document 8, and Patent Document 9, a mold is made of a porous material, or a suction hole is provided in the mold, so A technique for degassing the space from the mold side is disclosed.
Japanese Patent Laid-Open No. 56-119934 JP-A-2-201730 JP-A-3-22211 JP 2003-16621 A JP 2003-16623 A US Patent Application Publication No. 2004/0046288 JP-A-1-259914 JP-A-2-69327 Japanese Patent Laid-Open No. 8-226099
  However, in the methods disclosed in Patent Document 7, Patent Document 8, and Patent Document 9, the shape is not limited to the shape of the hole formed on the mold side while being limited by the constituent materials in terms of the physical properties and workability of the mold. There is a problem that the pattern is formed on the imprinted surface.
  For example, when imprinting on discrete track media or patterned media, it may be required to heat the imprinted surface to an appropriate temperature. In the method of Patent Document 6, in order to perform such heating by light irradiation, the mold is made of a transparent material. The mold made of the porous material disclosed in Patent Document 7 or Patent Document 8 must have necessary physical properties such as heat resistance and translucency necessary for such heating means, for example. From such a viewpoint, the methods disclosed in Patent Document 7 and Patent Document 8 greatly limit the room for selecting a mold material.
  Further, as described above, the shape pattern imprinted on the discrete track media or patterned media has a very small size of several hundred nm in track width and several tens of nm in bit length. In the configurations disclosed in Patent Document 7, Patent Document 8, and Patent Document 9, the shape of the hole of the mold provided for degassing is transferred to the imprint surface together with such minute shape information. Will be. This is not preferable in terms of the configuration as a magnetic recording medium such as a discrete track medium or a patterned medium.
  The present invention solves the above-mentioned conventional problems, and magnetic recording capable of forming a high-quality shape pattern on the entire recording surface of discrete track media or patterned media using imprint technology. An object is to provide a method for manufacturing a medium.
  In order to achieve the above object, a method of manufacturing a magnetic recording medium according to the present invention includes a step of pressing a mold having a specific shape pattern on a surface to be imprinted on a substrate and transferring the shape pattern to the surface to be imprinted. And a step of forming a ferromagnetic layer on the imprinted surface, characterized in that a deaeration means is provided on the imprinted surface. Furthermore, the method for producing a magnetic recording medium of the present invention includes a step of pressing a mold having a specific shape pattern on the imprint surface on the substrate to transfer the shape pattern to the imprint surface, and a strength to the imprint surface. A method of manufacturing a magnetic recording medium comprising a step of forming a magnetic layer, wherein at least a part of the imprinted surface is roughened before the mold is pressed against the imprinted surface. To do.
  The configuration of the present invention is not limited to the method of manufacturing the magnetic recording medium, and can be applied to imprint technology used for manufacturing various microfabricated parts. In order to achieve the above, the imprint method of the present invention is an imprint method for transferring a shape pattern onto an imprint surface by pressing a mold having a specific shape pattern onto the imprint surface. A deaeration means is provided on the imprint surface. Furthermore, the imprint method of the present invention is an imprint method for transferring a shape pattern to an imprint surface by pressing a mold having a specific shape pattern onto the imprint surface, the mold being applied to the imprint surface. Prior to press contact, at least a part of the imprinted surface is roughened.
  According to the present invention, the pattern forming surface of the mold and the surface to be imprinted can be uniformly pressed over the entire surface, and the shape of the pattern to be imprinted as a hole pattern formed on the mold side is unnecessary. There is no problem of being formed on the surface, and high-quality patterning by imprint technology can be performed appropriately.
  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(Embodiment 1)
First, a method for manufacturing a magnetic recording medium according to Embodiment 1 of the present invention will be described. FIG. 1 shows a schematic process diagram for performing imprinting according to the present embodiment. In FIG. 1, the surface of the mold 1 is formed with a fine concavo-convex pattern that is transferred to the imprint surface 2 by imprinting. For example, in a mold for manufacturing a discrete track medium, such a concavo-convex shape pattern is a concentric or spiral shape pattern corresponding to a signal recording track shape. On the other hand, in a mold for manufacturing a patterned medium, such a concavo-convex shape pattern is a shape pattern constituted by a rectangular, circular, or oval array corresponding to each recording bit shape. In either case of discrete track media or patterned media, a shape pattern corresponding to the servo tracking signal can be provided at the same time.
  In the configuration example shown in FIG. 1, an imprint layer 3 is formed on a smooth substrate 4, and the uneven pattern of the mold 1 is transferred to the imprint layer 3. The imprinted layer can be used as long as it is made of a material that is plasticized at the time of imprinting and can transfer the uneven pattern of the mold. The most commonly used imprint layer in the imprint process is a resist layer for photosensitive or electron beam exposure and X-ray exposure. Other preferable examples include a thermoplastic polymer resin layer and a glass layer made of a glass material having a relatively low melting point. An Si film is also suitable as a material constituting the imprinted layer 3. In particular, amorphous Si films and polycrystalline Si films that can be formed using vapor deposition methods such as sputtering, CVD, and vapor deposition are relatively easily plasticized by heating by light irradiation such as a laser, resulting in fine molds. It is possible to transfer the shape well.
  The layer thickness of the imprinted layer 3 depends on the shape pattern and size transferred by imprinting and the material of the imprinted layer, but in many cases, it is preferably in the range of 10 nm to 500 nm. For example, when a discrete track medium is manufactured using a resist layer as the imprinted layer 3, the resist layer thickness is preferably about the width of the formed track, and may be optimized in the range of about 50 nm to 500 nm. On the other hand, in the case of manufacturing patterned media, the layer thickness of the imprinted layer is preferably about the bit size to be formed. good.
  On the imprinted surface 2, that is, the surface of the imprinted layer 3, at least a portion having a relatively large surface roughness is formed. At the time of imprinting, air existing between the mold 1 and the imprinted surface 2 is degassed through the roughened portion. As a result, when the mold 1 is in pressure contact with the base body 4, it is possible to make the entire surface uniformly contact without generating a gap therebetween.
  After the mold 1 is pressed against the substrate 4 at a specific pressure for a certain time, the imprint process is completed by separating the two from each other. When the imprint is completed and the two are separated from each other, the large surface roughness of the roughened portion originally formed on the surface 2 of the imprinted layer 3 disappears without remaining, and instead the fineness of the surface of the mold 1 is lost. A shape pattern corresponding to the uneven shape pattern is transferred and formed.
  By the process as described above, in the configuration of the present invention, it is possible to perform imprint with high reliability without causing a shape pattern defect.
  In order to sufficiently obtain the effects of the configuration of the present application as described above, the imprint apparatus preferably includes the configuration shown in FIG. In FIG. 2A, the substrate 4 and the stage 5 on which the imprinted layer 2 (not shown) is formed are stored in the chamber 6 together with the mold 1 having a fine pattern (not shown). Initially, the inside of the chamber 6 is maintained near atmospheric pressure, and the substrate 4 is suction chucked on the stage 5. The surface of the stage 5 is formed with a crown shape that protrudes in the vicinity of the center, and the base 4 chucked on the stage 5 also warps in the vicinity of the center. By pressing the mold 1 against the stage 5 in this state, the substrate 4 sequentially contacts the surface of the mold 1 from the vicinity of the center. Next, in a state where the mold 1 is sufficiently pressed against the stage 5, the inside of the chamber 6 is decompressed, and the suction chuck of the base 4 is released and released from the stage 5. Thereby, as shown in FIG. 2 (2), the entire surface of the substrate 4 is in close contact with the surface of the mold 1. At this time, since the base 4 is in close contact with the mold 1 from the vicinity of the center toward the outside, the air in the vicinity of the center is easily degassed to the outside, and the both are more easily adhered uniformly over the entire surface.
  In the configuration of FIG. 2, depending on the embodiment, the shape transfer to the imprint layer may be satisfactorily completed by sucking and adhering the mold 1 and the substrate 4 in the decompression chamber 6. If shape transfer to the imprint layer is not sufficient by the above-described suction adhesion alone, a separate pressurizing means may be employed to bring the mold 1 and the substrate 4 into pressure contact with each other. In many cases, the pressure during pressurization is preferably in the range of 0.1 MPa to 100 MPa. When the pressing pressure is less than 0.1 MPa, there is a case where sufficient shape transfer is not performed on the imprinted layer by imprinting. On the other hand, when the pressurizing pressure is larger than 100 MPa, there is a case where the mold life is shortened such that the shape pattern of the mold is deteriorated at an early stage, or the base body 4 is damaged.
  The surface roughness of the roughened portion of the imprinted surface 2 before imprinting is preferably as large as the unevenness of the shape pattern formed on the surface of the mold 1. Even if the surface roughness of the roughened portion becomes larger than the unevenness of the shape pattern to be transferred by imprinting, there is no problem in one direction. This is because when imprinting is completed and the mold 1 and the imprinted surface 2 are separated from each other, the large surface roughness of the roughened portion of the imprinted surface 2 disappears without remaining, and instead the surface of the mold 1 This is because a shape pattern corresponding to the fine uneven shape pattern is transferred and formed. Preferably, the surface roughness of the roughened portion of the imprinted surface 2 before imprinting is the value of the maximum height Rmax (JIS surface roughness: conforming to B0601) at a reference length of 1.25 μm, and the surface of the mold 1 1-10 or more and 2 times or less of the value of the maximum height Rmax (also according to JIS surface roughness: B0601) at the reference length of 1.25 μm of the concavo-convex pattern formed in the above. A typical configuration example is shown in FIG. In the configuration example shown in FIG. 3, Rmax of the roughened portion before imprinting is set to about 1.7 times Rmax of the mold surface.
  If Rmax of the roughened portion before imprint is smaller than 1/10 of Rmax of the mold surface, the deaeration effect between the mold surface and the imprinted surface is insufficient, There may be cases where it is not possible to achieve even adhesion. On the other hand, if the Rmax of the roughened portion before imprint is larger than twice the Rmax of the mold surface, bubbles remain between the mold surface and the imprinted surface during imprinting, and transfer A defect may occur in the formed shape pattern.
  Thereafter, a ferromagnetic thin film shape pattern corresponding to the imprinted shape pattern is formed on the substrate 4 onto which the fine shape pattern has been transferred by imprinting. A configuration example of this process is shown in FIG. FIG. 4A shows a substrate 4 having an imprinted layer 3 whose shape is transferred by imprinting. In this state, as shown in FIG. 4 (2), by performing dry etching or wet etching on the surface of the substrate 4, hole shape processing corresponding to the shape pattern of the imprint layer is performed on the substrate 4. The Next, as shown in FIG. 4C, a ferromagnetic thin film 8 is formed so as to be embedded in the etching hole 7 of the base formed by etching. For the formation of the ferromagnetic thin film 8, in addition to a vapor deposition method such as a sputtering method, a vapor deposition method and a CVD method, a plating method is suitable. Finally, as shown in FIG. 4 (4), the imprinted layer and the unnecessary ferromagnetic thin film deposited thereon are removed, and the surface of the magnetic recording medium is planarized. For removing the imprinted layer and unnecessary ferromagnetic thin film deposited thereon, for example, when the imprinted layer is a resist layer, a lift-off method is used in which the resist layer is dissolved with a solvent and removed together with the unnecessary ferromagnetic thin film. Can be used. When the imprint layer is made of a material that cannot be easily removed by a solvent, a polishing method such as polishing with tape or abrasive grains, or CMP can be used.
  FIG. 5 shows a configuration example of the roughened portion formed on the imprinted surface 2 before imprinting. 5 (1) to 5 (3) all show images of the roughened portion of the imprinted surface 2 measured using an AFM (atomic force microscope).
  FIG. 5A shows a configuration example in which the imprinted surface 2 is roughened into an isotropic dot shape. In order to form the roughened portion having such a configuration, for example, a blasting method of roughening the surface by spraying fine particles can be used.
  Further, when the imprinted surface is the surface of the resist layer, roughening can also be performed by exposing the resist layer to unsaturated exposure. FIG. 6 shows, as an example, the relationship between the resist residual film thickness after exposing and developing the i-line resist with UV light, the maximum surface height Rmax, and the exposure amount. In the example shown in FIG. 6, the initial resist film thickness of 450 nm decreases as the exposure amount increases at an exposure amount of E0 or more, and becomes zero at the exposure amount Es. In this specification, the exposure amount Es at this time is defined as a saturated exposure amount. In an ordinary photolithography process, an exposure amount (for example, E2 in FIG. 6) slightly larger than the saturation exposure amount Es is employed so that a resist residue does not remain reliably and does not cause deterioration of the resist pattern shape due to overexposure. There are many cases. On the other hand, the surface roughness is increased while leaving a resist layer having a constant film thickness by developing after exposure at an exposure amount between E0 and the saturation exposure amount Es, that is, unsaturated exposure, and developing. I can do it. For example, when exposure / development is performed with the exposure amount E1 shown in FIG. 6, the resist layer surface can be roughened without substantially reducing the resist film thickness.
  On the other hand, FIG. 5B shows a configuration example in which the imprinted surface 2 is roughened into a textured shape having groove-like anisotropy. In order to form the roughened portion having such a configuration, for example, polishing with a polishing tape or abrasive grains is suitable.
  Further, FIG. 5 (3) shows a configuration example in which the imprint surface 2 is roughened into a bump shape. In order to form the roughened portion having such a configuration, for example, a texturing method by laser heating can be used. However, in such laser texturing, since each bump is formed by laser overheating, the configuration shown in FIGS. 5 (1) and (2) is generally more productive. Yes.
  Now, when the mold is pressed against the imprint layer, the imprint layer 3 needs to have a certain degree of plasticity so that the shape of the imprint layer 3 changes according to the fine uneven shape formed on the surface of the mold. is there. In order to easily realize such a requirement, for example, a material having thermoplasticity is adopted as the imprinted layer, and when the mold is pressed against the imprinted layer or prior thereto, the imprinted layer is used. It is possible to employ a configuration in which the is heated. The imprinted layer can be heated by, for example, a method of directly heating the atmosphere around the imprinted layer 3 before press-contacting the mold. Or you may employ | adopt the method of heating through a mold by pressing the mold heated by methods, such as a heater, light irradiation, and electromagnetic induction.
  Alternatively, as shown in FIG. 7, at least a part of the mold having translucency is adopted, and the imprint layer 2 is irradiated with light such as laser light through the translucent portion of the mold. The layer 3 may be heated. As described above, in a configuration in which the imprinted layer is made of a Si film, it has been confirmed that the Si film is relatively easily plasticized by such light irradiation, and thus is particularly effective.
(Embodiment 2)
Next, a method for manufacturing a magnetic recording medium according to Embodiment 2 of the present invention will be described. FIG. 8 is a process schematic diagram for performing imprinting according to the present embodiment. As in the case of the first embodiment, a fine concavo-convex pattern that is transferred to the imprint surface 2 by imprinting is formed on the surface of the mold 1. For example, in a mold for manufacturing a discrete track medium, such a concavo-convex shape pattern is a concentric or spiral shape pattern corresponding to a signal recording track shape. On the other hand, in a mold for manufacturing a patterned medium, such a concavo-convex shape pattern is a shape pattern constituted by a rectangular, circular, or oval array corresponding to each recording bit shape. In either case of discrete track media or patterned media, a shape pattern corresponding to the servo tracking signal can be provided at the same time.
  In the configuration example of Embodiment 1 shown in FIG. 1, the imprint layer 3 is formed on the smooth substrate 4, and the uneven pattern of the mold 1 is transferred to the imprint layer 3. . On the other hand, in the configuration example of the second embodiment shown in FIG. 8, there is no imprint layer separately provided on the substrate 4, and the uneven pattern of the mold 1 is directly transferred to the surface of the substrate 4. Is done.
  The substrate 4 can be made of any material that is plasticized during imprinting and that can transfer the concave / convex pattern of the mold. As a preferable example, a thermoplastic polymer resin substrate, a glass substrate having a relatively low melting point, or the like can be used. An Si substrate is also suitable as a material for forming the imprinted layer 3. The surface of the Si substrate can be plasticized relatively easily by heating by light irradiation such as laser, and the fine shape of the mold can be transferred well.
  A portion having a relatively large surface roughness is formed on at least a portion of the imprint surface 2 of the substrate 4. As in the first embodiment, during imprinting, the air existing between the mold 1 and the imprinted surface 2 is deaerated through the roughened portion. As a result, when the mold 1 is in pressure contact with the base body 4, it is possible to make the entire surface uniformly contact without generating a gap therebetween.
  After the mold 1 is pressed against the substrate 4 at a specific pressure for a certain time, the imprint process is completed by separating the two from each other. When the imprint is completed and the two are separated from each other, the large surface roughness of the roughened portion originally formed on the imprint surface 2 disappears without remaining, and instead the fine uneven shape on the surface of the mold 1 A shape pattern corresponding to the pattern is transferred and formed.
  By the process as described above, in the configuration of the present invention, it is possible to perform imprint with high reliability without causing a shape pattern defect.
  Similar to the first embodiment, also in the second embodiment, in order to sufficiently obtain the effects of the configuration of the present application as described above, the imprint apparatus preferably includes the configuration shown in FIG. The description regarding the configuration shown in FIG. 2 is the same as that described for the first embodiment, and is omitted here.
  As in the first embodiment, the surface roughness of the roughened portion of the imprinted surface 2 before imprinting is preferably as large as the unevenness of the shape pattern formed on the surface of the mold 1. Even if the surface roughness of the roughened portion becomes larger than the unevenness of the shape pattern to be transferred by imprinting, there is no problem in one direction. This is because when imprinting is completed and the mold 1 and the imprinted surface 2 are separated from each other, the large surface roughness of the roughened portion of the imprinted surface 2 disappears without remaining, and instead the surface of the mold 1 This is because a shape pattern corresponding to the fine uneven shape pattern is transferred and formed. Preferably, the surface roughness of the roughened portion of the imprinted surface 2 before imprinting is the value of the maximum height Rmax (JIS surface roughness: conforming to B0601) at a reference length of 1.25 μm, and the surface of the mold 1 1-10 or more and 2 times or less of the value of the maximum height Rmax (also according to JIS surface roughness: B0601) at the reference length of 1.25 μm of the concavo-convex pattern formed in the above. If Rmax of the roughened part before imprinting is smaller than 1/10 of Rmax of the mold surface, the deaeration effect between the mold surface and the imprinted surface becomes insufficient, and both surfaces are uniform. It may not be possible to make it adhere to. On the other hand, if the Rmax of the roughened portion before imprint is larger than twice the Rmax of the mold surface, bubbles remain between the mold surface and the imprinted surface during imprinting, and transfer A defect may occur in the formed shape pattern.
  Thereafter, a ferromagnetic thin film shape pattern corresponding to the imprinted shape pattern is formed on the substrate 4 onto which the fine shape pattern has been transferred by imprinting. A configuration example of this process is shown in FIG. FIG. 9A shows a substrate 4 having an imprint surface 2 onto which a shape has been transferred by imprinting. In this state, as shown in FIG. 9B, the ferromagnetic thin film 8 is formed so as to be embedded in the hole shape of the base formed by imprinting. For the formation of the ferromagnetic thin film 8, in addition to a vapor deposition method such as a sputtering method, a vapor deposition method and a CVD method, a plating method is suitable. Finally, as shown in FIG. 9 (3), the surface of the magnetic recording medium is planarized so as to remove the protruding base portion and unnecessary ferromagnetic thin film deposited thereon. For the planar treatment, polishing with a tape or abrasive grains, or a polishing method such as CMP can be used.
  As an example of the configuration of the roughened portion formed on the imprinted surface 2 before imprinting, the configuration shown in FIGS. 5 (1) to (3) is the same as in the first embodiment also in the second embodiment. Can be adopted.
  As shown in FIG. 5A, the configuration example in which the imprinted surface 2 is roughened into an isotropic dot shape uses, for example, a blasting technique in which the surface is roughened by spraying fine particles. Can be realized.
  On the other hand, as shown in FIG. 5B, a configuration example in which the imprinted surface 2 is roughened into a textured shape having groove-like anisotropy can also be employed. Also in the second embodiment, for example, polishing with a polishing tape or abrasive grains is suitable for forming a roughened portion having such a configuration.
  Further, as shown in FIG. 5 (3), a configuration example in which the imprinted surface 2 is roughened into a bump shape can be employed. Also in the second embodiment, in order to form the roughened portion having such a configuration, for example, a texturing method by laser heating can be used.
  When the mold is pressed against the imprint layer, it is necessary that the imprint surface 2 has a certain degree of plasticity so that the shape of the imprint surface 2 changes according to the fine uneven shape formed on the surface of the mold. . In order to easily realize such a requirement, a material having thermoplasticity is adopted as the substrate 4, and the substrate surface, that is, the imprint surface, is formed when the mold is pressed against the imprint layer or prior thereto. It is possible to employ a configuration in which the is heated. The imprinted surface can be heated, for example, by a method such as directly heating the atmosphere around the substrate 4 before pressing the mold. Or you may employ | adopt the method of heating through a mold by pressing the mold heated by methods, such as a heater, light irradiation, and electromagnetic induction.
  Alternatively, in the same manner as the configuration described with reference to FIG. 7 in the first embodiment, at least a part of the mold having translucency is employed, and laser light or the like is applied to the imprint surface 2 through the translucent portion of the mold. It is good also as a structure which heats the to-be-printed layer 2 by performing this light irradiation. As described above, when the substrate 4 is composed of a Si substrate, the surface of the Si substrate is plasticized relatively easily by such light irradiation, and it has been confirmed that this is particularly effective.
  According to the present invention, it is possible to form a uniform and highly reliable fine shape pattern in a relatively large area by imprint technology. Therefore, a method for producing next-generation high-density magnetic recording media such as discrete track media or patterned media It can be applied to. In the specification of the present application, description has been made mainly on application examples to hard disk media. However, the configuration of the present invention is not limited to a hard disk drive, and other magnetic disk drive applications such as a large-capacity floppy (registered trademark) disk drive. It can also be applied to.
  Further, in the embodiments in the present specification, the description has been made mainly on the configuration examples relating to the method of manufacturing the magnetic recording medium. However, the configuration of the present invention is not limited to these, and various microfabricated parts. It is also possible to apply to the imprinting method used for manufacturing.
Sectional drawing which shows the structural example of the imprint process in the manufacturing method of the magnetic-recording medium of Embodiment 1 of this invention Sectional drawing which shows the preferable structural example of the imprint apparatus in Embodiment 1 and 2 of this invention Sectional drawing which shows the surface roughness of the mold and imprint surface in Embodiment 1 of this invention Sectional drawing which shows the structural example of the etching, film-forming, and planarization process in the manufacturing method of the magnetic-recording medium of Embodiment 1 of this invention The perspective view which shows the structural example of the roughening part formed in the to-be-printed surface before imprint in Embodiment 1 and 2 of this invention. The figure which shows the relationship between the resist residual film thickness at the time of roughening the imprinted surface of a resist layer in dot shape in Embodiment 1 of this invention, the maximum height of a surface, and the exposure amount Sectional drawing which shows another structural example of the imprint process in the manufacturing method of the magnetic recording medium of Embodiment 1 of this invention Sectional drawing which shows the structural example of the imprint process in the manufacturing method of the magnetic-recording medium of Embodiment 2 of this invention Sectional drawing which shows the structural example of the film-forming and planarization process in the manufacturing method of the magnetic-recording medium of Embodiment 2 of this invention
Explanation of symbols
DESCRIPTION OF SYMBOLS 1 Mold 2 Imprinted surface 3 Imprinted layer 4 Substrate 5 Stage 6 Chamber 7 Etching hole 8 Ferromagnetic thin film 9 Light

Claims (36)

  1. A step of pressing a mold having a specific shape pattern on the imprint surface on the substrate to transfer the shape pattern to the imprint surface; and a step of forming a ferromagnetic layer on the imprint surface. A method of manufacturing a magnetic recording medium,
    A method of manufacturing a magnetic recording medium, comprising a deaeration unit on the imprint surface.
  2. A step of pressing a mold having a specific shape pattern on the imprint surface on the substrate to transfer the shape pattern to the imprint surface; and a step of forming a ferromagnetic layer on the imprint surface. A method of manufacturing a magnetic recording medium,
    A method of manufacturing a magnetic recording medium, wherein at least a part of the imprinted surface is roughened before the mold is pressed against the imprinted surface.
  3. 3. The method for manufacturing a magnetic recording medium according to claim 2, wherein air between the mold and the mold is degassed through a roughened portion of the imprinted surface.
  4. The maximum height at the reference length of 1.25 μm of the roughened portion of the imprinted surface is 1 / the maximum height at the reference length of 1.25 μm of the surface on which the shape pattern of the mold is formed. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the magnetic recording medium is 10 or more and 2 or less.
  5. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the imprinted surface is constituted by a surface of a resist layer formed on a substrate.
  6. 6. The method of manufacturing a magnetic recording medium according to claim 5, wherein at least a part of the surface of the resist layer is roughened by exposure and development.
  7. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the imprinted surface is constituted by a surface of a Si layer formed on a substrate.
  8. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the imprinted surface is constituted by a surface of a resin layer made of a polymer material formed on a substrate.
  9. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the imprinted surface is constituted by a surface of a glass layer formed on a substrate.
  10. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the imprinted surface is a surface of a Si substrate.
  11. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the imprinted surface is a surface of a resin substrate made of a polymer material.
  12. The method of manufacturing a magnetic recording medium according to claim 2, wherein the imprinted surface is a surface of a glass substrate.
  13. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the imprint surface is heated when the mold is pressed against the imprint surface.
  14. The method of manufacturing a magnetic recording medium according to claim 13, wherein the imprint surface is heated by heating and pressing the mold.
  15. 14. The magnetic recording medium according to claim 13, wherein the mold has a translucent part at least in part, and the imprinted surface is heated by light irradiated through the translucent part. Production method.
  16. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the surface is roughened by spraying fine particles on the imprinted surface.
  17. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the imprinted surface is roughened by polishing with a polishing tape.
  18. 3. The method of manufacturing a magnetic recording medium according to claim 2, wherein the imprinted surface is roughened by polishing with abrasive grains.
  19. An imprint method for transferring a shape to the imprinted surface by pressing a mold having a specific shape pattern on the imprinted surface,
    An imprint method comprising a deaeration unit on the imprint surface.
  20. An imprint method for transferring a shape to the imprinted surface by pressing a mold having a specific shape pattern on the imprinted surface,
    An imprinting method comprising roughening at least a part of the imprinted surface prior to pressing the mold against the imprinted surface.
  21. 21. The imprint method according to claim 20, wherein air between the mold and the mold is degassed through a roughened portion of the imprinted surface.
  22. The maximum height at the reference length of 1.25 μm of the roughened portion of the imprinted surface is 1 / the maximum height at the reference length of 1.25 μm of the surface on which the shape pattern of the mold is formed. The imprint method according to claim 20, wherein the imprint method is 10 or more and 2 or less.
  23. 21. The imprint method according to claim 20, wherein the imprinted surface is constituted by a surface of a resist layer formed on a substrate.
  24. 24. The imprint method according to claim 23, wherein at least a part of the surface of the resist layer is roughened by exposure and development.
  25. 21. The imprint method according to claim 20, wherein the imprint surface is constituted by a surface of a Si layer formed on a substrate.
  26. 21. The imprint method according to claim 20, wherein the imprinted surface is constituted by a surface of a resin layer made of a polymer material formed on a substrate.
  27. 21. The imprint method according to claim 20, wherein the imprinted surface is constituted by a surface of a glass layer formed on a substrate.
  28. 21. The method of manufacturing a magnetic recording medium according to claim 20, wherein the imprinted surface is a surface of a Si substrate.
  29. 21. The imprint method according to claim 20, wherein the imprinted surface is a surface of a resin substrate made of a polymer material.
  30. 21. The imprint method according to claim 20, wherein the imprinted surface is a surface of a glass substrate.
  31. 21. The imprint method according to claim 20, wherein the imprint surface is heated when the mold is pressed against the imprint surface.
  32. 32. The imprint method according to claim 31, wherein the imprint surface is heated by heating and pressing the mold.
  33. 32. The imprint method according to claim 31, wherein the mold has a translucent part at least in part, and the imprint surface is heated by light irradiated through the translucent part.
  34. 21. The imprinting method according to claim 20, wherein the surface is roughened by spraying fine particles on the imprinted surface.
  35. 21. The imprint method according to claim 20, wherein the imprinted surface is roughened by polishing with a polishing tape.
  36. 21. The imprint method according to claim 20, wherein the imprinted surface is roughened by polishing with abrasive grains.
JP2004238093A 2004-08-18 2004-08-18 Manufacturing method of magnetic recording medium and imprinting method Pending JP2006059405A (en)

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Application Number Priority Date Filing Date Title
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008012844A (en) * 2006-07-07 2008-01-24 Hitachi High-Technologies Corp Device for transferring microstructure and method for transferring microstructure
WO2008062772A1 (en) * 2006-11-22 2008-05-29 Ulvac, Inc. Method for manufacturing magnetic recording medium
WO2009041373A1 (en) * 2007-09-28 2009-04-02 Toray Industries, Inc. Method and device for manufacturing sheet having fine shape transferred thereon
JP2009119695A (en) * 2007-11-14 2009-06-04 Hitachi High-Technologies Corp Nanoimprint resin stamper
JP2009226660A (en) * 2008-03-21 2009-10-08 Fujifilm Corp Method for patterning by dry etching, mold used for it and method for manufacturing inkjet head
JP2010076300A (en) * 2008-09-26 2010-04-08 Canon Inc Processing apparatus
JP2010093105A (en) * 2008-10-09 2010-04-22 Toshiba Mach Co Ltd Molded product holding apparatus, mold holding apparatus and transfer apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008012844A (en) * 2006-07-07 2008-01-24 Hitachi High-Technologies Corp Device for transferring microstructure and method for transferring microstructure
WO2008062772A1 (en) * 2006-11-22 2008-05-29 Ulvac, Inc. Method for manufacturing magnetic recording medium
WO2009041373A1 (en) * 2007-09-28 2009-04-02 Toray Industries, Inc. Method and device for manufacturing sheet having fine shape transferred thereon
US8814556B2 (en) 2007-09-28 2014-08-26 Toray Industries, Inc Method and device for manufacturing sheet having fine shape transferred thereon
US9573300B2 (en) 2007-09-28 2017-02-21 Toray Industries, Inc. Method and device for manufacturing sheet having fine shape transferred thereon
JP2009119695A (en) * 2007-11-14 2009-06-04 Hitachi High-Technologies Corp Nanoimprint resin stamper
JP2009226660A (en) * 2008-03-21 2009-10-08 Fujifilm Corp Method for patterning by dry etching, mold used for it and method for manufacturing inkjet head
JP2010076300A (en) * 2008-09-26 2010-04-08 Canon Inc Processing apparatus
JP2010093105A (en) * 2008-10-09 2010-04-22 Toshiba Mach Co Ltd Molded product holding apparatus, mold holding apparatus and transfer apparatus

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