JP2010142859A - Laser beam irradiation apparatus and laser beam machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a compact structure of a laser beam condensing unit for emitting a laser beam, in a laser beam irradiation apparatus and a laser beam machine. <P>SOLUTION: The laser beam machine 50 is equipped with a laser beam irradiation apparatus 1 comprising: a laser beam condensing unit 2 having a laser light source and a condensing lens for condensing a laser beam L that is radiated from this laser light source; a unit moving part 4 that holds the laser beam condensing unit 2 in a manner movable between an irradiation position 4A for irradiating a workpiece 30 with the laser beam L converged with the condensing lens and a retreat position 4B away from this irradiation position; and a cooling fan 6 for cooling the laser beam condensing unit 2 retreated to the retreat position 4B. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laser irradiation apparatus and a laser processing machine. For example, the present invention relates to a laser irradiation apparatus that irradiates an irradiation object with a laser and heats the irradiation object, and a laser processing machine including the laser irradiation apparatus.

2. Description of the Related Art Conventionally, there are known laser irradiation apparatuses and laser processing machines that perform localized heating using focused laser light and perform, for example, soldering, welding, resin welding, and the like.
In such a laser irradiation apparatus, a semiconductor laser chip has come to be used as a light source because of its high energy conversion efficiency.
In semiconductor lasers, the chip generates heat during light emission. When the temperature of the chip rises due to this, the light emission characteristics change or the element lifetime decreases. For this reason, heat dissipation means and cooling means are provided to suppress the temperature rise of the chip.
For example, Patent Document 1 describes a light source including a laser diode module in which a Peltier element and a heat sink with a fan are thermally connected to a laser diode chip (semiconductor laser) in order to keep the temperature of the laser diode chip constant. ing.
JP 2002-368326 A

However, the conventional laser irradiation apparatus and laser processing machine as described above have the following problems.
In the invention described in Patent Document 1, since the Peltier element and the heat sink with the fan are thermally connected to the semiconductor laser, the light source is increased in size and mass. Therefore, there is a problem that a moving mechanism for holding a laser light source for irradiating a workpiece (irradiated object) with laser light is also increased in size.
In addition, when the laser light source is increased in size as described above, there is a problem that the laser light source is reflected in an imaging range of an imaging camera for observing the workpiece during processing, and obstructs observation of the periphery of the workpiece.
In addition, when laser light is guided from an optical fiber from a laser light source and a workpiece is irradiated with laser light from a condensing unit provided with a lens barrel with a built-in condensing lens, the cooling of the laser light source itself is Since the position of the imaging camera and the position of the laser light source can be moved away, it can be performed outside the imaging range, but the laser beam emitted outside the aperture angle range of the condenser lens heats the lens barrel. Therefore, it is necessary to cool the light collecting unit. For this reason, there is still a problem that the light collecting unit is enlarged.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a laser irradiation apparatus and a laser processing machine that can have a laser condensing unit that emits laser light in a compact configuration. To do.

In order to solve the above-described problems, in the invention described in claim 1, a laser light collection unit including a laser light source unit that emits laser light and a condenser lens that collects the laser light emitted from the laser light source unit. The optical unit and the laser condensing unit can be moved between an irradiation position for irradiating the irradiated object with the laser beam condensed by the condensing lens and a retracted position separated from the irradiation position. And a cooling unit that cools the laser focusing unit retracted to the retracted position.
According to this invention, by moving the laser condensing unit to the irradiation position by the unit moving part, the laser light emitted from the laser light source part is condensed by the condenser lens, and the condensed laser light is The irradiated object can be irradiated. Further, the laser focusing unit can be cooled by the cooling unit by moving the laser focusing unit to the retracted position by the unit moving unit.
As described above, the cooling unit is separated from the laser condensing unit, and the unit moving unit reciprocates the laser condensing unit between the irradiation position and the retracted position, thereby suppressing the temperature increase of the laser condensing unit. Irradiation of the laser beam to the irradiated object can be continued.

According to a second aspect of the present invention, in the laser irradiation apparatus according to the first aspect, the cooling unit includes a cooling fan that air-cools the laser focusing unit.
According to this invention, the laser focusing unit moved to the retracted position by the cooling fan can be air-cooled.

According to a third aspect of the present invention, in the laser irradiation apparatus according to the first or second aspect, the cooling unit includes a solid-state cooling element provided so as to be able to contact the laser focusing unit.
According to this invention, the laser condensing unit moved by the solid state cooling element can be cooled.

According to a fourth aspect of the present invention, in the laser processing machine, the holding table for holding the workpiece, and the laser beam is irradiated with the workpiece held on the holding table as the irradiation target. It is set as the structure provided with the laser irradiation apparatus in any one of, and the imaging part which images the said to-be-processed object hold | maintained at the said holding stand.
According to this invention, it is possible to perform laser processing with the laser beam irradiated from the laser irradiation apparatus while imaging the workpiece held on the holding table by the imaging unit. And since the laser irradiation apparatus in any one of Claims 1-3 is provided, it has an effect | action similar to the invention in any one of Claims 1-3.

  According to the laser irradiation apparatus and the laser processing machine of the present invention, the cooling unit is separated from the laser condensing unit, and the unit moving unit reciprocates the laser condensing unit between the irradiation position and the retracted position, thereby collecting the laser collecting unit. Since it is possible to continue the laser irradiation to the irradiation object while suppressing the temperature rise of the optical unit, there is an effect that the laser condensing unit that emits the laser light can have a compact configuration.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
A laser irradiation apparatus and a laser processing machine according to an embodiment of the present invention will be described.
Fig.1 (a) is a typical front view which shows schematic structure of a laser processing machine provided with the laser irradiation apparatus which concerns on embodiment of this invention. FIG. 1B is a schematic diagram illustrating an example of an image around a workpiece being processed, which is captured by the laser processing machine according to the embodiment of the present invention. FIG. 2 is a cross-sectional view showing a schematic configuration of a laser focusing unit used in the laser irradiation apparatus according to the embodiment of the present invention. FIG. 3 is a schematic perspective view of the laser irradiation apparatus according to the embodiment of the present invention.

The laser processing machine 50 according to the present embodiment heats the workpiece 30 (irradiated object) by irradiating the workpiece 30 with laser light, and processes such as soldering, welding, and resin welding. Work.
In the following, as an example, as illustrated in FIGS. 1A and 1B, the workpiece 30 includes a printed board 30 a and an electronic component 30 b, and an electronic component is formed on a land portion (not shown) of the printed board 30 a. An example in which the lead 30c of 30b is soldered will be described.
The solder 31 is supported by a support member (not shown), and the tip is positioned in the vicinity of the lead 30c to be soldered.

  As shown in FIG. 1A, the schematic configuration of the laser processing machine 50 includes a holding base 10 that holds a workpiece 30, an imaging camera 13 (imaging unit), and the laser irradiation apparatus 1. Although not particularly shown, the laser processing machine 50 controls the operation of the imaging camera 13 and the laser irradiation apparatus 1, and therefore includes a control unit electrically connected to the imaging camera 13 and the laser irradiation apparatus 1 and the imaging camera 13. And a monitor that displays the captured image.

The imaging camera 13 is for imaging the workpiece 30 held on the holding table 10 and its surrounding area and observing the machining operation. The video imaged by the imaging camera 13 is displayed on a monitor (not shown). FIG. 1B shows an image in which a state during the soldering operation imaged by the imaging camera 13 is displayed on a display screen 13A of a monitor (not shown).
The imaging camera 13 is supported at an upper position facing the workpiece 30 on the holding table 10 by a fixed arm 12 extending in a horizontal direction from a support column 11 erected on an end of the holding table 10. .

  The laser irradiation apparatus 1 includes a laser focusing unit 2, a unit holding unit 3, a unit moving unit 4, a cooling fan holding unit 5, and a cooling fan 6 (cooling unit).

  As shown in FIG. 2, the laser condensing unit 2 includes a semiconductor laser 21 (laser light source unit), a condensing lens 22, and a lens frame 20 that holds these, and is emitted from the semiconductor laser 21 as divergent light. The light L is condensed by the condensing lens 22 and condensed from the front end of the lens frame 20 to a point P at a distance d. In this embodiment, as an example, d = 25 (mm).

  As long as the condensing lens 22 is a lens which can condense the laser beam L from the semiconductor laser 21 held by the lens frame 20 to the point P, an appropriate lens configuration can be adopted.

The lens frame 20 is a generally bottomed cylindrical member made of a metal having good thermal conductivity such as an aluminum alloy, for example.
The lens frame 20 has a cylindrical lens barrel portion 20b that holds the condenser lens 22 on its inner peripheral portion, and positions the semiconductor laser 21 on the optical axis of the condenser lens 22 on one end side of the lens barrel portion 20b. Laser fixing portion 20c to be fixed, lens frame end surface 20d provided so as to cover the range of laser mounting portion 20c at one end of lens barrel portion 20b, and heat dissipation provided at the outer peripheral portion surrounding laser mounting portion 20c in the circumferential direction The fin part 20a is provided.
Between the laser mounting portion 20c and the lens frame end surface 20d, a wiring space 20e opened to the radiation fin portion 20a side is formed. A cable 21A connected to a power source (not shown) that supplies current to the semiconductor laser 21 is inserted into the wiring space 20e from the outside of the side of the laser mounting portion 20c. The tip of the cable 21A and the lead of the semiconductor laser 21 are electrically connected inside the wiring space 20e.

The unit holding unit 3 has an annular holding frame 3a that holds the outer peripheral surface of the lens barrel 20b of the lens frame 20 from the outer peripheral side, and the position of the holding frame 3a is close to or away from the workpiece 30. The slider 3b is movably held on the unit moving unit 4 so as to move on the unit moving unit 4.
The slider 3b of this embodiment is held by the unit moving unit 4 so that the moving direction thereof is in the direction along the optical axis of the laser focusing unit 2 held by the holding frame 3a.

As shown in FIG. 3, the unit moving unit 4 has a substantially prismatic outer shape extending in one direction, and the slider 3b of the unit holding unit 3 is arranged in one axial direction on one side surface surrounding the central axis. A pair of guide grooves 4a for movably guiding is provided.
In addition, a moving mechanism (not shown) that reciprocates the slider 3b along the guide groove 4a between the longitudinal ends of the guide groove 4a is provided inside the unit moving unit 4. As this moving mechanism, for example, an appropriate moving mechanism such as a ball screw feeding mechanism, a linear motor, or a linear actuator can be adopted.

The unit moving unit 4 only needs to hold the unit holding unit 3 so as to be reciprocable between two positions separated from each other. The moving path between the two positions is not limited to a straight line.
The two positions in this embodiment are the two positions at both ends in the longitudinal direction of the guide groove 4a. The position 4A at one end is a position for irradiating the workpiece 30 with the laser light L condensed by the condenser lens 22, and is hereinafter referred to as an irradiation position 4A. Further, the position 4B of the other end is separated from the irradiation position 4A and is a position outside the imaging range of the imaging camera 13. Hereinafter, the position 4B is referred to as a retracted position 4B.

The unit moving unit 4 is at least tilted with respect to the imaging optical axis of the imaging camera 13 while the end on the irradiation position 4A side is close to the workpiece 30 by the holding unit 7 at least when performing the machining operation. It is held in a posture.
The holding unit 7 may be a support member whose positional relationship with the holding table 10 is fixed, and may be changed by, for example, a moving stage or a multi-axis robot so that the holding position and holding posture can be changed as necessary. It may be supported movably.
The proximity position of the unit moving unit 4 with respect to the workpiece 30 is such that the point P where the laser light L is focused when the unit holding unit 3 is moved to the irradiation position 4A is a position where the workpiece 30 can be processed. Set as follows.

The cooling fan holding unit 5 holds the cooling fan 6 on the retracted position 4B, and includes a support member 5a and a fixing member 5b.
The support member 5a is a plate-like member that extends and is fixed to the side of the unit moving part 4 provided with the guide groove 4a at the end of the unit moving part 4 on the retracted position 4B side.
The fixing member 5b includes a fixing member 5b that is extended in a range facing the retracted position 4B toward the side of the tip of the support member 5a in order to fix the cooling fan 6.

  The cooling fan 6 blows air to the laser condensing unit 2 moved to the retreat position 4B of the unit moving unit 4 to air-cool the laser condensing unit 2, and faces the retreat position 4B of the unit moving unit 4. At the position where the cooling fan is held, it is held by the fixing member 5b of the cooling fan holding unit 5.

Next, operations of the laser processing machine 50 and the laser irradiation apparatus 1 will be described.
FIGS. 4A and 4B are side views showing a state in which the laser focusing units of the laser irradiation apparatus according to the embodiment of the present invention are arranged at the irradiation position 4A and the retracted position 4B, respectively.

In order to process the workpiece 30 by the laser processing machine 50, as shown in FIG. 4A, the unit holding unit 3 is moved to the irradiation position 4A by the unit moving unit 4.
At this time, as shown in FIG. 1B, the state of the vicinity of the workpiece 30 is imaged by the imaging camera 13, and displayed on the display screen 13A of the monitor. In the present embodiment, only the tip of the unit moving unit 4, the laser focusing unit 2, and the unit holding unit 3 are brought close to the workpiece 30.

Then, the semiconductor laser 21 is excited to emit laser light L. As shown in FIG. 2, the laser light L is emitted as diverging light that spreads in the range of the spreading half angle θ ₁ of the semiconductor laser 21.
Of such laser light L, light radiated in an angle range equal to or smaller than the opening half angle θ ₀ (where θ ₀ <θ ₁ ) of the condensing lens 22 is condensed by the condensing lens 22 and is applied to the point P. Focused.

As shown in FIG. 1A, the laser light L condensed at the point P by the condensing lens 22 is applied to the solder 31 disposed in the vicinity of the lead 30c, and the solder 31 is heated and melted.
Thereby, the lead 30c can be soldered to the land part on the printed circuit board 30a.

On the other hand, among the laser light L emitted from the semiconductor laser 21, a part of the light emitted in an angle range larger than the opening half angle θ ₀ of the condenser lens 22 is reflected inside the lens barrel portion 20b as stray light. The light is emitted to the outside of the laser focusing unit 2. In addition, other portions are absorbed by the lens barrel portion 20b, and all of them lose light quantity.
Among these, the light absorbed by the lens barrel portion 20b is finally converted into heat energy, so that the lens barrel portion 20b is heated.
In the semiconductor laser 21, when such an excited state continues, heat is generated in the chip, and this heat is radiated from the element package to the laser mounting portion 20c.
In this way, the heat conducted to the lens frame 20 is radiated to some extent from the surface of the lens barrel portion 20b and the heat radiating fin portion 20a, but as the laser light L continues to be radiated, the lens gradually increases. As the heat is stored in the frame 20, the temperature of the semiconductor laser 21 and the lens frame 20 rises.

In the present embodiment, the emission of the laser light L is stopped before the temperatures of the semiconductor laser 21 and the lens frame 20 exceed the allowable values.
Then, as shown in FIG. 4B, the unit holding unit 3 is moved to the retracted position 4B by the unit moving unit 4.
When the laser condensing unit 2 is retracted to the retreat position 4B, the cooling fan 6 is rotated and blown toward the laser condensing unit 2 to cool the laser condensing unit 2 by air. When the cooling of the semiconductor laser 21 and the lens frame 20 is completed, the position of the unit holding unit 3 is switched to the irradiation position 4A, and the soldering operation is continued.
When the soldering at one place is completed, the unit moving unit 4 and the workpiece 30 are moved relative to each other while the laser focusing unit 2 is retracted to the retracted position 4B, and the position of the point P is set to the next position. Set so that it is a soldering spot.

  The timing for moving the unit holding unit 3 from the irradiation position 4A to the retracted position 4B in this embodiment is an allowable lighting time that does not exceed the temperature allowable value of the semiconductor laser chip according to the amount of light. (The number of pulses may be used) is experimentally examined in advance, and is set to a timing at which the lighting time of the laser light L is equal to or shorter than the allowable lighting time.

As described above, according to the laser processing machine 50, the cooling fan 6 is separated from the laser condensing unit 2 and is disposed at a position facing the retreat position 4B separated from the irradiation position 4A. By reciprocating the unit 2 between the irradiation position 4A and the retracted position 4B, it is possible to switch between laser irradiation by the laser focusing unit 2 and cooling. For this reason, since the cooling unit is separated from the laser focusing unit 2, the laser irradiation to the workpiece 30 can be continued while suppressing the temperature rise of the laser focusing unit 2 while having a compact configuration.
Further, as compared with the case where the cooling fan 6 is provided integrally with the laser condensing unit 2, the laser condensing unit 2 is reduced in weight so that the laser condensing unit 2 can be easily moved and the configuration of the unit moving unit 4 is simplified. And miniaturization.
Further, since the laser condensing unit 2 has such a compact configuration, when the laser condensing unit 2 moves to the irradiation position 4A and irradiates the laser light L, there is a range in which the laser condensing unit 2 blocks the imaging range of the imaging camera 13. Narrow. This makes it easy to observe the periphery of the workpiece 30 even during the machining operation.
Further, in the present embodiment, since the retreat position 4B is provided outside the imaging range of the imaging camera 13, the laser focusing unit 2 is retracted from the imaging range of the imaging camera 13 when the laser focusing unit 2 is cooled. Therefore, the state around the workpiece 30 can be observed in a wider range.

Next, a first modification of the present embodiment will be described.
FIG. 5 is a schematic perspective view of a laser irradiation apparatus according to a first modification of the embodiment of the present invention. FIGS. 6A and 6B are side views showing a state in which the laser focusing units of the laser irradiation apparatus according to the first modification of the embodiment of the present invention are arranged at the irradiation position and the retracted position, respectively.

  The laser irradiation apparatus 1A according to the present modified example deletes the cooling fan 6 of the laser irradiation apparatus 1 of the above-described embodiment, includes a cooling fin holding part 5A instead of the cooling fan holding part 5, and includes a Peltier element 25 (cooling part). Further, a heat radiating fin 26 is added. Such a laser irradiation apparatus 1A can be used in place of the laser irradiation apparatus 1 in the laser processing machine 50 of the above embodiment. Hereinafter, a description will be given focusing on differences from the above embodiment.

  The cooling fin holder 5A holds the Peltier element 25 and the heat radiating fin 26 at the end of the unit moving part 4 on the retracted position 4B side, and the guide groove is formed at the end of the unit moving part 4 on the retracted position 4B side. The unit moving part 4 provided with 4a is extended and fixed to the side surface side and is made of a plate-like member.

The Peltier element 25 is a solid cooling element that receives a current supplied from a control unit (not shown) and uses one of the front and back element surfaces as the heat absorbing surface 25a and the other element surface as the heat radiating surface 25b due to the Peltier effect.
The Peltier element 25 is disposed on the cooling fin holding portion 5A with the heat absorption surface 25a facing the end portion where the irradiation position 4A is provided.
A part of the radiating fin 26 is inserted into a through hole (not shown) of the cooling fin holding part 5A, and is held by the cooling fin holding part 5A in a state of being thermally connected to the heat radiating surface 25b of the Peltier element 25. . The material of the heat radiating fins 26 is made of a metal having good thermal conductivity such as an aluminum alloy.
With such a configuration, the heat transported to the heat radiating surface 25b by the Peltier element 25 is thermally transferred to the heat radiating fins 26, and is transferred by the Peltier element 25 by heat transfer from the heat radiating fins 26 to the surrounding air. Heat is dissipated into the air.

  As shown in FIG. 6B, the arrangement position of the Peltier element 25 is such that the endothermic surface 25a is the lens frame end surface of the lens frame 20 when the laser focusing unit 2 and the unit holding part 3 are moved to the retracted position 4B. It is set to a position where it is in close contact with 20d and thermally connected.

According to the laser irradiation apparatus 1A of this modification, when the unit holding part 3 is moved to the retracted position 4B, the lens frame end surface 20d of the lens frame 20 is thermally connected to the heat absorbing surface 25a of the Peltier element 25. The lens frame 20 and the semiconductor laser 21 are cooled.
For this reason, similarly to the above-described embodiment, the cooling unit is separated from the laser focusing unit 2, so that the laser irradiation to the workpiece 30 is suppressed while suppressing the temperature rise of the laser focusing unit 2 while having a compact configuration. Can continue.
As a result, even if the large heat radiating fin 26 is provided to promote the heat radiation of the Peltier element 25, the heat radiating fin 26 is brought into the imaging range of the imaging camera 13 when the laser focusing unit 2 moves to the irradiation position 4A. Since it is not reflected, it becomes easy to observe the periphery of the workpiece 30.
Further, since the laser condensing unit 2 can be cooled without blowing air to the laser condensing unit 2, dust or the like does not adhere to the condensing lens 22 due to the air blowing. Maintenance becomes easier.
Also, for example, it can be used in a working environment that dislikes disturbing the airflow, such as in a clean room.

Next, a second modification of the present embodiment will be described.
FIG. 7 is a cross-sectional view showing a schematic configuration of a laser focusing unit of a second modification of the embodiment of the present invention.

  The laser condensing unit 2A of the present modification deletes the semiconductor laser 21 of the laser condensing unit 2 of the above-described embodiment, includes a lens frame 23 instead of the lens frame 20, and includes a laser on the optical fiber 24 and the optical fiber 24. A laser light source (not shown) that transmits light is added. Such a laser condensing unit 2A can be used in place of the laser condensing unit 2 by providing a through hole through which the optical fiber 24 can be inserted into the support member 5a in the laser processing machine 50 of the above embodiment. Is. Hereinafter, a description will be given focusing on differences from the above embodiment.

The lens frame 23 is a generally bottomed cylindrical member made of a metal having a good thermal conductivity such as an aluminum alloy.
The lens frame 23 extends along the axial direction through a cylindrical lens barrel portion 23b that holds the condenser lens 22 on the inner peripheral portion and a center of the bottom portion that substantially covers one end side of the lens barrel portion 23b. And an optical fiber mounting portion 23c that is a stepped through hole, and a lens frame end surface 23d that constitutes the outer surface of the bottom portion that substantially covers one end side of the lens barrel portion 23b.

The optical fiber 24 is provided with a fiber holder 24b that fits with the optical fiber mounting portion 23c in the vicinity of one end portion, and an intermediate portion is inserted into a through hole (not shown) added to the support member 5a. The end (not shown) is opposed to a laser light source including, for example, a semiconductor laser and a coupling lens.
Thus, emits a laser beam L emitted from the laser light source is transmitted to the optical fiber 24, as divergent light diverging in half spread angle theta ₂ from the tip at a fiber end face 24a of the one end portion (laser light source unit) It has come to be.
The fiber end surface 24a is disposed at the same position as the light emitting surface of the semiconductor laser 21 of the above-described embodiment, so that, of the laser light L emitted from the fiber end surface 24a, the aperture half angle θ ₀ of the condensing lens 22 (however, Laser light of θ ₂ > θ ₀ ) or less is condensed by the condensing lens 22 and can be condensed from the tip of the lens frame 23 to a point P at a distance d.

As described above, in the laser focusing unit 2A, unlike the laser light source unit of the above-described embodiment, the laser from the laser light source provided outside is incorporated without including the laser light source that causes heat generation like the semiconductor laser 21. A laser light source unit that transmits light through the optical fiber 24 and emits the light into the lens frame 23 is provided.
For this reason, the lens frame 23 is heated from the inside by the laser light L emitted in an angle range larger than the opening half angle θ ₀ of the condensing lens 22, but the temperature rise due to heat conduction of the laser light source itself is not increased. Disappear.
As a result, when there is no large difference between the spread half angles θ ₂ and θ ₁ , the same cooling effect as that of the above embodiment can be obtained even if the cooling performance of the cooling portion of this modification is lower than that of the cooling portion of the above embodiment. The cooling unit can be reduced in size.

In the above description, the cooling fan 6 or the Peltier element 25 is used as the cooling unit. However, since the cooling unit can be arranged separately from the laser focusing unit, the cooling unit Is not limited to these.
For example, it may be a water-cooled cooling unit that includes a flow channel inside and circulates a refrigerant such as water in the flow channel, or a cooling unit that radiates heat using a heat pipe or the like.

  In the above description, the timing for moving to the retracted position 4B has been set in advance. For example, the temperature of the lens frames 20 and 23 and the semiconductor laser 21 is detected directly or indirectly, When the temperature reaches a certain temperature or higher, cooling may be performed by moving to the retreat position 4B.

  In the description of the second modification, the example in which the radiating fin 26 is brought into contact with the Peltier element 25 has been described. For example, instead of the radiating fin 26, the cooling fin holding portion 5A is used as the radiating member. It may be used.

In addition, all the constituent elements described in the above embodiment and each modification can be implemented in appropriate combination within the scope of the technical idea of the present invention.
For example, it is good also as a structure provided with the cooling fan 6 and the Peltier element 25 as a cooling part.

1 is a schematic front view illustrating a schematic configuration of a laser processing machine including a laser irradiation apparatus according to an embodiment of the present invention, and a schematic diagram illustrating an example of an image around a workpiece being processed. It is sectional drawing which shows schematic structure of the laser condensing unit used for the laser irradiation apparatus which concerns on embodiment of this invention. It is a typical perspective view of the laser irradiation apparatus which concerns on embodiment of this invention. It is a side view which shows a mode that the laser condensing unit of the laser irradiation apparatus which concerns on embodiment of this invention is each arrange | positioned in the irradiation position and the retracted position. It is a typical perspective view of the laser irradiation apparatus of the 1st modification of embodiment of this invention. It is a side view which shows a mode that the laser condensing unit of the laser irradiation apparatus of the 1st modification of embodiment of this invention was each arrange | positioned in the irradiation position and the retracted position. It is sectional drawing which shows schematic structure of the laser condensing unit of the 2nd modification of embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1A Laser irradiation apparatus 2, 2A Laser condensing unit 3 Unit holding part 4 Unit moving part 4A Irradiation position 4B Retraction position 5 Cooling fan holding part 5A Cooling fin holding part 6 Cooling fan (cooling part)
10 Holding stand 13 Imaging camera (imaging part)
13A Display screen 20, 23 Lens frame 20d, 23d Lens frame end face 21 Semiconductor laser 22 Condensing lens 24 Optical fiber 24a Fiber end face (laser light source section)
25 Peltier element (cooling part)
26 Radiation fin 30 Workpiece (object to be irradiated)
50 Laser processing machine L Laser light

Claims (4)

A laser condensing unit having a laser light source unit that emits laser light, and a condensing lens that condenses the laser light emitted from the laser light source unit;
A unit that holds the laser condensing unit so as to be movable between an irradiation position for irradiating the irradiated object with the laser light condensed by the condensing lens and a retracted position separated from the irradiation position. A moving part;
A laser irradiation apparatus comprising: a cooling unit that cools the laser focusing unit retracted to the retracted position.   The laser irradiation apparatus according to claim 1, wherein the cooling unit includes a cooling fan that air-cools the laser focusing unit.   The laser irradiation apparatus according to claim 1, wherein the cooling unit includes a solid cooling element provided so as to be able to contact the laser focusing unit. A holding table for holding the workpiece;
The laser irradiation apparatus according to any one of claims 1 to 3, wherein the workpiece held on the holding table is irradiated with a laser beam as an irradiation object,
A laser processing machine comprising: an imaging unit that images the workpiece held on the holding table.

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