JP2010140918A - Suction head, spherical body mounting device and spherical body suction method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a suction head capable of reliably preventing fine spherical bodies from being excessively mounted on a mounting object body. <P>SOLUTION: The suction head is configured to suck a solder ball 300 at an edge of a suction hole 33a formed on a suction surface 32a of a head body 21, and includes a pressurized container 22 which is formed in a box shape having a bottom wall 42, is mounted on the head body 21 such that its opening surface 45 faces the suction surface 32a, and also has an internal space 41 formed in the mounted state together with the suction surface 32a, wherein the internal space is pressurized by gas supplied to the internal space 41. The pressurized container 22 has a through hole 43, which in turn is so large that only one solder ball 300 passes through it and is formed in the bottom wall 42 to suck the one solder ball 300 having passed through the through hole 43 on the head body 21, while stopping other solder balls 300 except the one solder ball from passing with the edge of the through hole 43, and is also configured to jet the gas from the through hole 43 as the internal space 41 is pressurized. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an adsorption head that adsorbs a spherical body to the edge of an air intake port formed on the adsorption surface of the head body, a spherical body mounting device including the adsorption head, and a spherical body adsorption that adsorbs the spherical body to the adsorption head It is about the method.

As this type of spherical body mounting apparatus, a solder ball mounting apparatus disclosed in Japanese Patent Application Laid-Open No. 2003-1000078 is known. This solder ball mounting device includes an alignment mask having a plurality of suction holes formed on the suction surface, and a moving unit for moving the alignment mask, so that the solder balls sucked by the alignment mask can be mounted on the connection terminals of the package. Has been. In addition, the solder ball mounting device includes a detachment plate in which a plurality of through holes larger than the solder balls are formed in the same arrangement as the suction holes of the alignment mask and are movable relative to the alignment mask. When mounting the solder balls on the connection terminals of the package using this solder ball mounting device, the solder balls are detached into the solder ball container in which the solder balls are accommodated with the separation plate in contact with the suction surface of the alignment mask. Move the plate and alignment mask. At this time, one solder ball is adsorbed to the suction hole of the alignment mask through the through hole of the separation plate, and unnecessary air other than the solder ball is generated by the air current sucked from the gap between the solder ball and the suction hole. Solder balls are adsorbed. Next, the release plate is moved downward to be separated from the suction surface of the alignment mask. At this time, the above-described unnecessary solder balls are pulled away from the alignment mask as the detachment plate moves, and fall into the solder ball container. For this reason, in this solder ball mounting apparatus, it is possible to prevent unnecessary solder balls from being mounted on the connection terminals.
Japanese Unexamined Patent Publication No. 2003-1000078 (page 3-4, FIG. 1-6)

  However, the solder ball mounting apparatus has the following problems. That is, in this solder ball mounting apparatus, unnecessary solder balls are removed (dropped) from the alignment mask by moving the release plate downward and away from the adsorption surface of the alignment mask. On the other hand, with the recent increase in the density of packages, solder balls have been miniaturized. In this case, the smaller the solder balls are, the greater the force with which the solder balls are attracted to each other due to static electricity between the solder balls and intermolecular forces relative to the weight of the solder balls. For this reason, as shown in FIGS. 11 to 13, when the minute solder balls are attracted to the alignment mask 531, the pulling force between the solder balls is relatively large with respect to the weight of the solder balls. Thus, all unnecessary solder balls may not be removed from the alignment mask 531 simply by moving the release plate 550 downward. Therefore, in the solder ball mounting device described above, it is difficult to prevent unnecessary mounting of the solder balls on the connection terminals (that is, excessive mounting of the solder balls on the connection terminals) when the solder balls are very small. There is a problem.

  The present invention has been made in view of such problems, and provides a suction head, a spherical body mounting device, and a spherical body suction method that can surely prevent excessive mounting of a minute spherical body on a mounting object. The main purpose.

  In order to achieve the above object, the suction head according to claim 1 is a suction head configured to be capable of sucking a spherical body at an edge of an air inlet formed in a suction surface of a head body, the box having a bottom wall. And is attached to the head body so that the opening surface of the head body and the suction surface of the head body face each other, and gas in the internal space formed in combination with the suction surface in the mounted state. A pressure vessel in which the internal space is pressurized by supply; the pressure vessel has a through-hole having a size capable of passing only one spherical body formed in the bottom wall; The one spherical body that has passed is adsorbed to the head body, and the passage of the other spherical body except the one through the through hole is restricted by the edge of the through hole, and the inner space is pressurized. As a result, the gas is ejected from the through hole. And it is configured to function.

  The suction head according to claim 2 is the suction head according to claim 1, wherein the pressure vessel has a diameter of the through hole longer than a diameter of the spherical body and twice a diameter of the spherical body. Is also formed short.

  The suction head according to claim 3 is the suction head according to claim 1 or 2, wherein the pressurized container has a length from the opening surface to the inner surface of the bottom wall shorter than the diameter of the spherical body. Is formed.

  The suction head according to claim 4 is the suction head according to any one of claims 1 to 3, wherein the pressurized container has a length from the opening surface to the outer surface of the bottom wall in the mounted state. It is formed shorter than the diameter of the spherical body.

  A spherical body mounting device according to a fifth aspect is the suction head according to any one of the first to fourth aspects, a moving mechanism that moves the suction head, an intake mechanism that performs intake from the intake port, An air supply mechanism for supplying the gas; a process for controlling the moving mechanism to move the suction head to the suction position of the spherical body; a process for controlling the intake mechanism to perform intake from the intake port; Processing for controlling the air supply mechanism to supply the gas to the internal space of the pressurized container, and controlling the moving mechanism to move the suction head that sucks the spherical body to a target position And a control unit for executing the processing.

  The spherical body adsorption method according to claim 6 is a spherical body adsorption method for adsorbing a spherical body to an edge of an air inlet formed in the adsorption surface of the head main body of the adsorption head, and having a box shape having a bottom wall. A through-hole formed in the bottom wall of the pressurized container in a state where the pressurized container formed on the head body is mounted on the head body so that the opening surface thereof faces the suction surface of the head body The one spherical body that has passed through the head is adsorbed to the head main body, and the passage of the through-holes of the other spherical bodies excluding the one is restricted by the edge of the through-hole, and combined with the adsorption surface. The internal space is pressurized by supplying a gas to the internal space of the pressurization vessel formed in the above-described manner, and the other spherical body is formed by ejecting the gas from the through-hole due to the pressurization to the internal space. Remove from suction head

  The spherical body adsorption method according to claim 7 is the spherical body adsorption method according to claim 6, wherein the diameter of the through hole is longer than the diameter of the spherical body and shorter than twice the diameter of the spherical body. The formed pressurized container is used.

  The spherical body adsorption method according to claim 8 is the spherical body adsorption method according to claim 6 or 7, wherein a length from the opening surface to the inner surface of the bottom wall is shorter than a diameter of the spherical body. The above pressurized container is used.

  The spherical body adsorption method according to claim 9 is the spherical body adsorption method according to any one of claims 6 to 8, wherein a length from the opening surface to the outer surface of the bottom wall in the mounted state is the spherical shape. The pressurized container formed shorter than the body diameter is used.

  The suction head according to claim 1, the spherical body mounting device according to claim 5, and the spherical body suction method according to claim 6, wherein the pressurization container formed in a box shape having a bottom wall includes an opening surface thereof and a head main body. It is attached to the head main body so that it faces the suction surface, and one spherical body (spherical body to be mounted) that has passed through the through hole formed in the bottom wall is adsorbed to the head main body and one of them is removed. The passage of other spherical bodies (unnecessary spherical bodies) through the through-holes is restricted by the edge of the through-hole, and in that state, the internal space is pressurized by supplying gas to the internal space of the pressurized container, and the pressurization is accompanied. Gas is ejected from the through hole. For this reason, in this suction head, spherical body mounting apparatus, and spherical body suction method, only the spherical body to be mounted is attracted to the suction head, and the unnecessary spherical body attached to the mounting target spherical body and its unnecessary The gas spouted from the through hole is blown against other unnecessary spheres that are further attached to the sphere, and these unnecessary spheres are forcibly separated from the target sphere for adsorption. It can be reliably removed from the head. Therefore, according to the suction head, the spherical body mounting device, and the spherical body suction method, only the spherical body to be mounted can be sucked to the suction head. Excessive loading of the spherical body on the target body can be reliably prevented.

  In the suction head according to claim 2, the spherical body mounting device according to claim 5, and the spherical body suction method according to claim 7, the diameter of the through hole is longer than the diameter of the spherical body and the diameter of the spherical body is larger. A pressurized container formed shorter than twice is used. Therefore, according to the suction head, the spherical body mounting device, and the spherical body suction method, it is possible to reliably prevent unnecessary spherical bodies from passing through the through holes. It can prevent more reliably.

  In the suction head according to claim 3, the spherical body mounting device according to claim 5, and the spherical body suction method according to claim 8, the length from the opening surface to the inner surface of the bottom wall is larger than the diameter of the spherical body. Use a short pressurized container. Therefore, according to the suction head, the spherical body mounting device, and the spherical body suction method, when the spherical body is suctioned, the spherical body that has passed through the through hole enters the gap between the suction surface and the bottom wall of the head body. Since the situation can be surely prevented, it is possible to prevent the unnecessary spherical body that has entered the gap from being mounted on the mounting target body.

  In the suction head according to claim 4, the spherical body mounting device according to claim 5, and the spherical body suction method according to claim 9, the length from the opening surface to the outer surface of the bottom wall in the mounted state is spherical. A pressurized container formed shorter than the diameter is used. Therefore, according to the suction head, the spherical body mounting device, and the spherical body suction method, the lower end of the spherical body sucked by the head body can be projected outside the bottom wall of the pressurized container. The spherical body can be mounted on the mounting target body as it is by moving the suction head with the pressurized container mounted on the head body to the placement position of the mounting target body.

  Hereinafter, the best mode of a suction head, a spherical body mounting device, and a spherical body suction method according to the present invention will be described with reference to the accompanying drawings.

  First, the configuration of the solder ball mounting apparatus 1 shown in FIG. 1 will be described. The solder ball mounting apparatus 1 is an example of a spherical body mounting apparatus according to the present invention. As shown in the figure, the suction head 11, the moving mechanism 12, the intake mechanism 13, the air supply mechanism 14, the supply mechanism 15, and the control are provided. A solder ball (microball) 300 (see FIG. 2), which is a fine spherical particle as an example of a spherical body in the present invention, is provided with a portion 16 and a terminal 401 (see FIG. 7) of a substrate 400 as a mounting object. It is configured so that it can be mounted (mounted). In this case, the solder ball 300 has a spherical shape with a diameter L1 (see FIG. 3) of about 70 μm. Further, the solder balls 300 are mounted on the terminals 401 of the substrate 400 by the solder ball mounting apparatus 1 and then heated and melted to constitute a ball grid array (BGA) on the substrate 400.

  The suction head 11 is an example of a suction head according to the present invention. As shown in FIG. 2, the suction head 11 includes a head main body 21 and a pressure vessel 22, and sucks a solder ball 300 according to the spherical body suction method according to the present invention. It is configured to be possible. As an example, the head body 21 is configured in a box shape having a gap 31 formed therein, as shown in FIG. Further, the bottom wall 32 of the head body 21 has an intake air that opens to the outer surface of the bottom wall 32 (a surface that functions as a suction surface in the present invention and is also referred to as “suction surface 32 a” hereinafter) and communicates with the gap 31. A plurality of holes 33 are formed along the thickness direction of the bottom wall 32 (only two of them are shown in the figure). The opening portion of the suction hole 33 in the suction surface 32a corresponds to the suction port (hereinafter also referred to as “suction port 33a”) in the present invention. In this case, as shown in FIG. 3, the diameter L2 of the air inlet 33 (that is, the air inlet 33a) is defined to be about 40 μm shorter than the diameter L1 of the solder ball 300 (70 μm in this example). As shown in FIG. 2, the head body 21 is formed with an exhaust hole 34 for exhausting air in the gap 31. In the head main body 21, the air in the air gap 31 is brought into a negative pressure state by the exhaust of air, and air is sucked from the air intake 33 a accordingly. The solder ball 300 can be adsorbed to the portion (see FIG. 4).

  As shown in FIG. 2, the pressurized container 22 is formed in a box shape (dish shape) having a bottom wall 42 and one side opening, and the opening surface 45 and the suction surface 32 a of the head body 21 face each other. In addition, the suction surface 32a and the upper surface (inner surface in the present invention) 42a of the bottom wall 42 are configured to be attachable to the head body 21 with a predetermined distance therebetween. Further, the bottom wall 42 of the pressurized container 22 has a plurality of (two in the figure, two) in positions facing the respective intake holes 33 of the head main body 21 when mounted on the head main body 21 (mounted state). Through hole 43 is formed).

  In this case, as shown in FIG. 3, the pressurized container 22 has a length L3 from the opening surface 45 to the upper surface 42a of the bottom wall 42 (the length between the suction surface 32a of the head body 21 and the upper surface 42a in the mounted state). ) Is about 40 μm shorter than the diameter L1 of the solder ball 300 (70 μm in this example). The pressurized container 22 is formed so that the thickness L4 of the bottom wall 42 is about 20 μm, which is thinner than the diameter L1 (70 μm in this example) of the solder ball 300. As a result, the length (L3 + L4) from the opening surface 45 of the pressurized container 22 to the lower surface (outer surface in the present invention) 42b of the bottom wall 42 is 60 μm, which is shorter than the diameter L1 of the solder ball 300 (70 μm in this example). It is about. Further, as shown in the figure, the pressurized container 22 has a diameter L5 of the through hole 43 longer than the diameter L1 (70 μm in this example) of the solder ball 300 and 90 μm shorter than twice the diameter L1. It is formed so as to be about.

  In the pressurized container 22, the diameter L5 of the through hole 43 is set to the above length, so that only one solder ball 300 passes through the through hole 43 at a time, and the single solder ball 300 is moved to the head main body 21 ( Other solder balls 300 (except for the solder balls 300 (hereinafter also referred to as “solder balls 300 to be mounted”) adsorbed to the head body 21 and adsorbed to the edge of the air inlet 33a. Hereinafter, it is possible to restrict the passage of the solder ball 300 through the through hole 43 of the “unnecessary solder ball 300” (see FIG. 4).

  In the pressurized container 22, air (main book) is supplied from an air supply hole 44 (see FIG. 2) formed in the side wall with respect to the internal space 41 formed in combination with the suction surface 32 a of the head main body 21 in the mounted state. The internal space 41 is pressurized by supplying a gas (an example of the invention), and air is ejected (discharged) from the through hole 43 to the outside of the pressurized container 22. It is possible to remove the unnecessary solder balls 300 adhering to the mounting target solder balls 300 adsorbed on (see FIGS. 5 and 6).

  In the pressurized container 22, the length L3 from the opening surface 45 to the upper surface 42a of the bottom wall 42 in the pressurized container 22 is set to the above length, so that the solder ball 300 that has passed through the through hole 43 is attracted to the suction surface. The situation of entering the gap between 32a and the bottom wall 42 is reliably prevented. Further, in the pressurized container 22, the length L3 from the opening surface 45 to the upper surface 42a of the bottom wall 42 and the thickness L4 of the bottom wall 42 (the length from the opening surface 45 to the lower surface 42b of the bottom wall 42 (L3 + L4)). 3), the lower end of the solder ball 300 attracted to the head main body 21 is moved from the lower surface 42b of the bottom wall 42 to the outside of the pressurized container 22 as shown in FIG. It protrudes (in this example, the protrusion length L6 is about 5 μm).

  The moving mechanism 12 moves the suction head 11 between the arrangement position of the supply mechanism 15 (the suction position in the present invention) and the arrangement position of the substrate 400 (the target position in the present invention) according to the control of the control unit 16. The intake mechanism 13 includes, for example, a vacuum pump (not shown) connected to the exhaust hole 34 of the head main body 21 in the suction head 11 via the pipe 20 (see FIG. 1). In accordance with the control, intake from the intake port 33a is performed by setting the inside of the gap 31 of the head body 21 to a negative pressure state. The air supply mechanism 14 includes a compressor (not shown) connected to the air supply hole 44 of the pressurization container 22 in the suction head 11 via a pipe 20 (see the same figure), and is controlled by the control unit 16. Accordingly, air is supplied to the internal space 41 of the pressurized container 22 to pressurize the internal space 41. The compressor of the air supply mechanism 14 is also connected to the container 51 (see FIG. 2) of the supply mechanism 15 via the pipe 20 (see FIG. 1), and supplies air to the internal space 52 of the container 51. .

  The supply mechanism 15 supplies the solder ball 300 to the suction head 11. In this case, as shown in FIG. 2, the supply mechanism 15 includes a container 51 that is open at the top and is configured to be able to accommodate the solder ball 300 in its internal space 52. Further, the bottom wall and the side wall constituting the container 51 are formed of a material having air permeability in which many holes having a diameter smaller than the diameter L1 of the solder ball 300 are formed. In the supply mechanism 15, the solder ball 300 accommodated in the internal space 52 can be floated in the internal space 52 by supplying air to the internal space 52 by the air supply mechanism 14.

  The control unit 16 includes a CPU and a memory (both not shown), and controls the moving mechanism 12, the intake mechanism 13, and the air supply mechanism 14. Specifically, the control unit 16 controls the intake mechanism 13 by controlling the moving mechanism 12 to move the suction head 11 to the arrangement position of the supply mechanism 15 (hereinafter also referred to as “first moving process”). Then, a process of performing suction from the suction port 33a in the head body 21 of the suction head 11 (hereinafter also referred to as “intake process”), the air supply mechanism 14 is controlled, and the internal space 52 of the container 51 in the supply mechanism 15 is controlled. Air supply process (hereinafter also referred to as “first air supply process”), air supply mechanism 14 is controlled to supply air to the internal space 41 of the pressurized container 22 (hereinafter referred to as “second air supply process”). An air supply process ”, a process of controlling the moving mechanism 12 to move the suction head 11 that sucks the solder balls 300 to the arrangement position of the substrate 400 (hereinafter also referred to as a“ second movement process ”), and Of the substrate 400 Processing for stopping the intake by controlling the intake mechanism 13 at location position (hereinafter, also referred to as "intake stop processing") to perform the.

  Next, using the solder ball mounting device 1, the process of causing the suction head 11 to suck the solder ball 300 according to the spherical body suction method according to the present invention and mounting the solder ball 300 on the terminal 401 of the substrate 400, The operation of the solder ball mounting apparatus 1 will be described with reference to the drawings. In this example, it is assumed that the suction head 11 sucks and sucks the solder balls 300 with the suction surface 32a of the head body 21 facing downward. In addition, it is assumed that a large number of solder balls 300 are accommodated in the container 51 of the supply mechanism 15.

  In the solder ball mounting apparatus 1, when the start operation is performed, the control unit 16 executes the first movement process. In this first movement process, the control unit 16 controls the movement mechanism 12 to move the suction head 11 above the position where the supply mechanism 15 (container 51) is arranged, and then, as shown in FIG. The suction head 11 is lowered so that the lower surface 42 b of the bottom wall 42 of the pressure vessel 22 contacts the upper end of the side wall of the vessel 51. Subsequently, the control unit 16 performs an intake process. In this intake process, the control unit 16 controls the intake mechanism 13 to exhaust the air in the gap 31 in the head main body 21 of the suction head 11 so that the inside of the gap 31 is in a negative pressure state. Let the air intake from.

  Next, the control unit 16 performs a first air supply process. In the first air supply process, the control unit 16 controls the air supply mechanism 14 to supply air to the internal space 52 of the container 51 in the supply mechanism 15. At this time, the supplied solder balls 300 are floated in the internal space 52 by supplying air to the internal space 52. Also, as shown in FIG. 4, the solder ball 300 floating in the internal space 52 is attracted by the suction force accompanying the suction from the suction port 33 a by the suction process described above, and the suction port 33 a of the head body 21 in the suction head 11. Be drawn towards Subsequently, as shown in the drawing, the solder ball 300 drawn toward the air inlet 33a passes through the through hole 43 formed in the bottom wall 42 of the pressurization container 22 in the suction head 11, and the head main body 21. Is adsorbed to the edge of the intake port 33a on the adsorption surface 32a.

  Further, as described above, since the force with which the minute solder balls 300 are attracted to each other is relatively large with respect to the weight thereof, as shown in FIG. 4, they are attracted to the head body 21 (the edge of the air inlet 33a). Unnecessary solder balls 300 adhere to the solder balls 300 to be mounted. In this case, as described above, since the passage of the unnecessary solder ball 300 through the through hole 43 is restricted, the unnecessary solder ball 300 is maintained in a state of being located outside the pressurized container 22 (bottom wall 42). The Next, the control unit 16 ends (stops) the first air supply process. At this time, as shown in FIG. 5, other solder balls 300 excluding the solder ball 300 to be mounted adsorbed on the head main body 21 and the unnecessary solder ball 300 attached to the solder ball 300 to be mounted are present. It falls by its own weight toward the bottom of the container 51.

  Subsequently, the control unit 16 executes a second air supply process. In the second air supply process, the control unit 16 controls the air supply mechanism 14 to supply air to the internal space 41 of the pressurized container 22. At this time, as shown in FIGS. 5 and 6, the internal space 41 is pressurized by the supply of air, and air is ejected from the through hole 43 along with the pressurization. Further, the air ejected from the through hole 43 is blown onto the unnecessary solder ball 300 attached to the solder ball 300 to be mounted. For this reason, even if the solder ball 300 to be mounted and the unnecessary solder ball 300 attract each other strongly, the unnecessary solder ball 300 is forcibly separated from the solder ball 300 to be mounted and reliably removed from the suction head 11. Is done. In this state, as shown in FIG. 6, the lower end of the solder ball 300 to be mounted protrudes from the lower surface 42 b of the bottom wall 42.

  Next, the control unit 16 executes a second movement process. In the second movement process, the control unit 16 controls the movement mechanism 12 to move the suction head 11 that is sucking the solder ball 300 to be mounted, above the substrate 400, as shown in FIG. Subsequently, the suction head 11 is lowered to a position where the tip of the solder ball 300 to be mounted is close to the terminal 401 of the substrate 400 (arrangement position of the substrate 400). Next, the control unit 16 performs an intake air stop process. In the intake stop process, the control unit 16 controls the intake mechanism 13 to stop the exhaust of air in the gap 31 in the head body 21 of the suction head 11, thereby stopping the intake from the intake port 33 a. At this time, as shown in the figure, the suction by the suction from the suction port 33a is released, and the solder ball 300 is placed on the terminal 401 of the substrate 400 (on the solder flux applied to the surface of the terminal 401). Is done. Subsequently, the control unit 16 controls the moving mechanism 12 to move the suction head 11 to the initial position after moving it upward as shown in FIG. Thus, the mounting of the solder ball 300 on the terminal 401 of the substrate 400 is completed. In this case, as described above, the suction head 11 does not need to perform the second air supply process to pressurize the internal space 41 of the pressurization container 22 and eject air from the through hole 43 by the pressurization. The solder ball 300 is reliably removed. For this reason, unnecessary mounting of the solder balls 300 to the terminals 401 (that is, excessive mounting of the solder balls 300 to the terminals 401) is reliably prevented.

  As described above, in the suction head 11, the solder ball mounting device 1, and the spherical body suction method, the pressurization container 22 formed in a box shape having the bottom wall 42 is provided with the opening surface 45 and the suction surface 32 a of the head body 21. Are mounted on the head main body 21 in a state of being opposed to each other, and one solder ball 300 (solder ball 300 to be mounted) that has passed through the through-hole 43 formed in the bottom wall 42 is attracted to the head main body 21 and one of them. Passing through the through holes 43 of other solder balls 300 (unnecessary solder balls 300) except for the inner space 41 is regulated by the edge of the through holes 43 and air is supplied to the inner space 41 of the pressurized container 22 in this state. And air is ejected from the through-hole 43 in accordance with the pressurization. Therefore, in this suction head 11, solder ball mounting apparatus 1, and spherical body suction method, only the solder ball 300 to be mounted is sucked to the suction head 11 and unnecessary solder attached to the solder ball 300 to be mounted. The air blown from the through hole 43 is blown onto the balls 300 and other unnecessary solder balls 300 further adhered to the unnecessary solder balls 300, and these unnecessary solder balls 300 are mounted on the solder balls to be mounted. It can be forcibly removed from 300 and reliably removed from the suction head 11. Therefore, according to the suction head 11, the solder ball mounting apparatus 1, and the spherical body suction method, only the solder ball 300 to be mounted can be sucked to the suction head 11. Mounting, that is, excessive mounting of the solder balls 300 on the terminals 401 can be reliably prevented.

  Further, in the suction head 11, the solder ball mounting device 1, and the spherical body suction method, the diameter L5 of the through hole 43 is formed to be about 90 μm which is longer than the diameter L1 of the solder ball 300 and shorter than twice the diameter L5. A pressurized container 22 is used. Therefore, according to the suction head 11, the solder ball mounting device 1, and the spherical body suction method, it is possible to reliably prevent the unnecessary solder ball 300 from passing through the through-hole 43, and thus the unnecessary terminals 401 of the solder ball 300. Can be reliably prevented.

  In the suction head 11, the solder ball mounting device 1, and the spherical body suction method, the length L 3 from the opening surface 45 to the upper surface 42 a of the bottom wall 42 is formed to be about 40 μm shorter than the diameter L 1 of the solder ball 300. A pressurized container is used. Therefore, according to the suction head 11, the solder ball mounting device 1, and the spherical body suction method, when the solder ball 300 is sucked, the solder ball 300 that has passed through the through hole 43 is located between the suction surface 32 a and the bottom wall 42. Therefore, it is possible to reliably prevent the solder ball 300 that has entered the gap from being mounted on the terminal 401.

  In the suction head 11, the solder ball mounting device 1, and the spherical body suction method, the length (L 3 + L 4) from the opening surface 45 to the lower surface 42 b of the bottom wall 42 is about 60 μm shorter than the diameter L 1 of the solder ball 300. The pressurized container 22 is used. Therefore, according to the suction head 11, the solder ball mounting device 1, and the spherical body suction method, the lower end of the solder ball 300 sucked by the head body 21 can be protruded outside the bottom wall 42. Then, the suction head 11 with the pressurized container 22 mounted on the head main body 21 is moved to the arrangement position of the substrate 400, and the solder ball 300 can be mounted on the terminal 401 as it is.

  In addition, this invention is not limited to said structure and method. For example, the configuration and method for attracting the solder ball 300 to the suction head 11 with the suction surface 32a of the head main body 21 facing downward have been described above. However, the solder head 300 is soldered to the suction head 11 with the suction surface 32a facing upward or sideways. A configuration and a method for adsorbing the ball 300 may be employed.

  Further, the configuration and method for moving the suction head 11 with the pressurized container 22 mounted on the head main body 21 have been described above. However, as with the suction head 111 shown in FIG. It is also possible to adopt a configuration and method in which the container 22 is configured to be separable (detachable) and the moving mechanism 12 moves only the head body 21. In this case, in this configuration and method, it is not necessary to project the lower end of the solder ball 300 attracted by the suction head 11 from the bottom wall 42 of the pressure vessel 22 in the mounted state. The thickness can be increased.

  Further, as in the suction head 211 shown in FIG. 10, a recess 33b formed by chamfering the edge of the suction port 33a in the suction surface 32a is provided, and when the solder ball 300 is sucked, the solder 33 is soldered to the recess 33b. A configuration and a method for fitting the ball 300 may be employed. According to this configuration and method, when the solder ball 300 to be mounted is attracted to the edge of the air inlet 33a, the outer surface of the solder ball 300 and the inner surface of the recess 33b can be brought into close contact with each other. The solder ball 300 can be reliably adsorbed. For this reason, it is possible to reliably prevent the solder ball 300 to be mounted from being pulled away from the suction head 11 when the unnecessary solder balls 300 are removed by blowing air ejected from the through holes 43.

  Further, instead of the configuration in which the solder ball 300 is placed on the solder flux applied to the surface of the terminal 401 on the substrate 400, the tip of the solder ball 300 adsorbed by the adsorption head 11 is immersed in the solder flux accommodated in the tray. It is also possible to adopt a configuration in which the solder ball 300 is placed on the terminal 401 to which the solder flux is not applied after the solder flux is attached to the tip portion. In addition, a configuration in which air ionized by a static eliminator (ionizer) such as an ionizer is supplied to the internal space 41 and pressurized, and the ionized air is ejected from the through-hole 43 and sprayed onto unnecessary solder balls 300 and The method can also be adopted. According to this configuration and method, the unnecessary solder ball 300 strongly adhered to the mounting target solder ball 300 due to static electricity can be easily pulled away from the mounting target solder ball 300 and removed. Moreover, it can replace with air and the structure and method using another gas can also be employ | adopted.

1 is a configuration diagram showing a configuration of a solder ball mounting device 1. 3 is a cross-sectional view of the suction head 11 and a supply mechanism 15. FIG. 3 is an enlarged cross-sectional view of the suction head 11 showing the configuration of the bottom wall 32 of the head body 21 and the bottom wall 42 of the pressurized container 22. FIG. FIG. 6 is a first explanatory view illustrating a process of mounting solder balls 300 on terminals 401 of a substrate 400. FIG. 10 is a second explanatory diagram illustrating a process of mounting the solder ball 300 on the terminal 401 of the substrate 400. FIG. 10 is a third explanatory diagram illustrating a process of mounting the solder ball 300 on the terminal 401 of the substrate 400. FIG. 10 is a fourth explanatory diagram illustrating a process of mounting the solder ball 300 on the terminal 401 of the substrate 400. FIG. 10 is a fifth explanatory diagram illustrating a process of mounting the solder ball 300 on the terminal 401 of the substrate 400. 3 is a cross-sectional view showing a configuration of a suction head 111. FIG. 3 is a cross-sectional view showing a configuration of a suction head 211. FIG. It is the 1st explanatory view explaining operation of the conventional solder ball mounting device. It is the 2nd explanatory view explaining operation of the conventional solder ball mounting device. It is the 3rd explanatory view explaining operation of the conventional solder ball mounting device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder ball mounting apparatus 11, 111, 211 Adsorption head 12 Movement mechanism 13 Air intake mechanism 14 Air supply mechanism 15 Supply mechanism 16 Control part 21 Head main body 22 Pressurization container 32a Adsorption surface 33a Intake port 41 Internal space 42 Bottom wall 42a Upper surface 42b Lower surface 43 Through hole 45 Open surface 300 Solder balls L1, L5 Diameter L3 Length L4 Thickness

Claims (9)

An adsorption head configured to adsorb a spherical body at the edge of an air inlet formed on the adsorption surface of the head body,
It is formed in a box shape having a bottom wall and is mounted on the head body so that the opening surface thereof faces the suction surface of the head body, and is formed in combination with the suction surface in the mounted state. A pressure vessel in which the internal space is pressurized by supplying gas to the internal space;
The pressurized container has a through-hole having a size that allows only one of the spherical bodies to pass through the bottom wall, and adsorbs the single spherical body that has passed through the through-hole to the head body. The passage of the other spherical body except the one through the through-hole is restricted by the edge of the through-hole, and the gas can be ejected from the through-hole as the internal space is pressurized. Suction head.   2. The suction head according to claim 1, wherein the pressurized container has a diameter of the through hole longer than a diameter of the spherical body and shorter than twice a diameter of the spherical body.   The suction head according to claim 1, wherein the pressurized container is formed such that a length from the opening surface to an inner surface of the bottom wall is shorter than a diameter of the spherical body.   The suction head according to any one of claims 1 to 3, wherein the pressurized container is formed such that a length from the opening surface to an outer surface of the bottom wall in the mounted state is shorter than a diameter of the spherical body. A suction head according to any one of claims 1 to 4,
A moving mechanism for moving the suction head;
An intake mechanism for performing intake from the intake port;
An air supply mechanism for supplying the gas;
A process of controlling the moving mechanism to move the suction head to the suction position of the spherical body, a process of controlling the intake mechanism to perform intake from the intake port, and a control of the air supply mechanism to A control unit that performs a process of supplying the gas to the internal space of the pressure vessel, and a process of controlling the moving mechanism to move the suction head that sucks the spherical body to a target position. A spherical body mounting device. A spherical body adsorption method for adsorbing a spherical body to an edge of an air inlet formed on a suction surface of a head body in a suction head,
A pressure vessel formed in a box shape having a bottom wall is formed on the bottom wall of the pressure vessel in a state where the pressure vessel is mounted on the head body so that the opening surface thereof faces the suction surface of the head body. The one spherical body that has passed through the through-hole is adsorbed to the head main body and the passage of the other spherical body excluding the one through the through-hole is restricted by the edge of the through-hole, and the adsorption The internal space is pressurized by supplying gas to the internal space of the pressurized container formed in combination with the surface, and the other gas is ejected from the through-hole due to the pressurization to the internal space. The spherical body adsorption | suction method of removing the spherical body of this from the said adsorption | suction head.   The method for adsorbing a spherical body according to claim 6, wherein the pressure vessel is formed such that the diameter of the through hole is longer than the diameter of the spherical body and shorter than twice the diameter of the spherical body.   The spherical body adsorption | suction method of Claim 6 or 7 using the said pressurized container formed in the length from the said opening surface to the inner surface of the said bottom wall shorter than the diameter of the said spherical body.   The method for adsorbing a spherical body according to any one of claims 6 to 8, wherein the pressurized container is used in which the length from the opening surface to the outer surface of the bottom wall is shorter than the diameter of the spherical body.

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