JP2010092906A - Suction head, spherical granule mounting device and spherical granule suction method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a suction head mounting solder balls on a body to be mounted with no shortage. <P>SOLUTION: The suction head has a head body for sucking a spherical granule to an edge of a suction hole through intake air from the suction hole, and the head body includes a fixed plate 42, suction pipes 32 which are fitted to the fixed plate 42 in such a way that tips 32b are protruded from the fixed plate 42 and openings 32c of the tips 32b function as suction holes, and a moving plate 33 which has insertion holes 51 into which the suction pipes 32 and solder balls 100 can be inserted and which is configured to contact and leave the fixed plate 42 in a state in which the suction pipes 32 are inserted into the insertion holes 51. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an adsorption head for adsorbing spherical particles at the edge of an air inlet, a spherical particle mounting apparatus equipped with the adsorption head, and a spherical particle adsorption method for adsorbing spherical particle adsorption using the adsorption head It is about.

As this kind of spherical particle mounting apparatus, a solder ball mounting apparatus disclosed in Japanese Patent Laid-Open No. 2003-1000078 is known. This solder ball mounting device includes an alignment mask having a plurality of suction holes formed on the suction surface, and a moving unit for moving the alignment mask, so that the solder balls sucked by the alignment mask can be mounted on the connection terminals of the package. Has been. In addition, the solder ball mounting device includes a detachment plate in which a plurality of through holes larger than the solder balls are formed in the same arrangement as the suction holes of the alignment mask and are movable relative to the alignment mask. When mounting the solder balls on the connection terminals of the package using this solder ball mounting device, the solder balls are detached into the solder ball container in which the solder balls are accommodated with the separation plate in contact with the suction surface of the alignment mask. Move the plate and alignment mask. At this time, one solder ball is adsorbed to the suction hole of the alignment mask through the through hole of the separation plate, and unnecessary air other than the solder ball is generated by the air current sucked from the gap between the solder ball and the suction hole. Solder balls are adsorbed. Next, the release plate is moved downward to be separated from the suction surface of the alignment mask. At this time, the above-described unnecessary solder balls are pulled away from the alignment mask as the detachment plate moves, and fall into the solder ball container. For this reason, in this solder ball mounting apparatus, it is possible to prevent unnecessary solder balls from being mounted on the connection terminals.
Japanese Unexamined Patent Publication No. 2003-1000078 (page 3-4, FIG. 1-6)

  However, the solder ball mounting apparatus has the following problems. That is, in this solder ball mounting apparatus, the solder ball that has passed through the through hole of the separation plate is adsorbed to the adsorption hole of the alignment mask while the separation plate is in contact with the adsorption surface of the alignment mask. In this case, in this configuration, for example, as shown in FIG. 11, when the separation plate 402 is in contact with the suction surface of the alignment mask 401, the suction hole 401 a is exposed at the back side of the separation plate 402. Therefore, the openings of the through holes 402a are blocked by the plurality of solder balls, and the solder balls may not be sucked into the suction holes 401a. For this reason, this solder ball mounting apparatus may have a suction hole 401a to which the solder ball is not sucked, and there is a problem that the solder ball to be mounted on the connection terminal is insufficient.

  The present invention has been made in view of such problems, and mainly provides an adsorption head, a spherical particle mounting apparatus, and a spherical particle adsorption method capable of mounting a solder ball on a mounting object without a shortage. Objective.

  In order to achieve the above object, the suction head according to claim 1 is a suction head including a head body that sucks spherical particles to the edge of the suction port by suction from the suction port. A fixed plate, an intake pipe that is attached to the fixed plate so that a tip end side of the fixed plate protrudes from the fixed plate, and an opening portion of the tip part functions as the intake port; and the intake pipe and the spherical particles are An insertion hole that can be inserted is formed, and a moving plate configured to be able to contact and separate from the fixed plate in a state where the intake pipe is inserted through the insertion hole.

  Further, the suction head according to claim 2 is the suction head according to claim 1, wherein the head main body has the tip of the intake pipe in contact with the fixed plate when one surface of the movable plate is in contact with the fixed plate. It is comprised so that it may be in the state which is the same as the other surface, or the state which protruded from the said other surface.

  Further, the suction head according to claim 3 is provided with a sliding mechanism that slides the sliding member while bringing the sliding member into contact with or close to the head main body in the suction head according to claim 1 or 2. The insertion hole is configured to accommodate the spherical particles that are adsorbed to the tip of the intake pipe in a separated state in which one surface of the moving plate is separated from the fixed plate, and the sliding mechanism includes: The sliding member is slid while being brought into contact with or close to the other surface of the moving plate in the separated state.

  Furthermore, the suction head according to a fourth aspect is the suction head according to the third aspect, wherein the sliding mechanism slides a squeegee as the sliding member.

  Further, the suction head according to claim 5 is the suction head according to claim 3 or 4, wherein the insertion hole is formed in the spherical particle body accommodated in the insertion hole in the separated state of the moving plate. The shortest length from the other surface side portion to the opening surface on the other surface side of the insertion hole is formed to be shorter than the radius of the spherical particles.

  In addition, a spherical particle mounting device according to a sixth aspect of the present invention is the suction head according to any one of the first to fifth aspects, a moving mechanism for moving the suction head, and the opening of the intake pipe in the suction head. An intake mechanism for performing intake air from, a process for controlling the moving mechanism to move the adsorption head to an adsorption position of the spherical particles, a process for controlling the intake mechanism to perform intake from the opening, A process of controlling the suction head to bring the moving plate into and out of contact with the fixed plate, and controlling the moving mechanism to target the suction head that sucks the spherical particles by suction from the opening. A control unit that executes a process of moving to a position and a process of controlling the intake mechanism at the target position to stop the intake from the opening, and mounting the spherical particles And it is configured to be mounted to the body.

  The spherical particle adsorbing method according to claim 7 is a method of fixing a spherical particle by suction from an opening of the fixed plate and the fixed plate, the tip of which is attached to the fixed plate so that the tip of the fixed plate protrudes from the fixed plate. An intake pipe capable of adsorbing a body to the tip, an insertion hole through which the intake pipe and the spherical particles can be inserted, and the intake pipe being inserted into the insertion hole with respect to the fixed plate A spherical particle adsorption method for adsorbing the spherical particles using an adsorption head having a movable plate configured to be able to contact and separate, wherein one surface of the movable plate is in contact with the fixed plate After the spherical particles are adsorbed on the tip of the intake pipe, the one surface is separated from the fixed plate and is attached to the spherical particles adsorbed on the tip. To the spherical granules of removing from said suction head.

  The spherical particle adsorption method according to claim 8 is the spherical particle adsorption method according to claim 7, wherein the tip of the intake pipe is moved when the one surface of the moving plate is brought into contact with the fixed plate. The moving plate is flush with the other surface or protrudes from the other surface.

  Furthermore, the spherical particle adsorption method according to claim 9 is the spherical particle adsorption method according to claim 7 or 8, wherein when the one surface of the moving plate is separated from the fixed plate, the spherical particle adsorption method is arranged at the tip of the intake pipe. Only one of the adsorbed spherical particles is accommodated in the insertion hole without protruding from the opening surface on the other surface side of the moving plate in the insertion hole, and in this state, the spherical particle is slid on the other surface of the moving plate. A sliding process is performed in which the sliding member is slid while the moving member is in contact with or close to the moving member, and the other spherical particles attached to the spherical particles accommodated in the insertion hole are adsorbed to the other spherical particles. Remove from the head.

  A spherical particle adsorbing method according to a tenth aspect is the spherical particle adsorbing method according to the ninth aspect, wherein the sliding process is executed using a squeegee as the sliding member.

  The spherical particle adsorption method according to claim 11 is the spherical particle adsorption method according to claim 9 or 10, wherein the other spherical particles adhering to the spherical particle accommodated in the insertion hole are used. A part of the body that exceeds half in volume is projected from the opening surface of the insertion hole, and the sliding process is executed in this state.

  In the suction head according to claim 1, the spherical particle mounting device according to claim 6, and the spherical particle suction method according to claim 7, the suction plate is inserted into the insertion hole of the moving plate to fix one surface of the moving plate. Spherical particles are adsorbed on the tip of the intake pipe in the state of being in contact with the plate. For this reason, in this suction head, spherical particle mounting device, and spherical particle suction method, conventional solder ball mounting that sucks the spherical particles with the suction holes located on the back side of the release plate and not exposed. Unlike the device, the spherical particles can be reliably adsorbed to the tip of each intake pipe. Therefore, according to the suction head, the spherical particle mounting device, and the spherical particle suction method, it is possible to reliably mount the spherical particles on the mounting target body without shortage. Further, in this adsorption head, spherical particle mounting device, and spherical particle adsorption method, after the spherical particles are adsorbed on the tip of the intake pipe, one end of the moving plate is separated from the fixed plate, and the tip of the intake pipe Unnecessary spherical particles adhering to the spherical particles adsorbed on the surface are removed from the adsorption head. For this reason, according to this adsorption head, spherical particle mounting apparatus, and spherical particle adsorption method, only the spherical particles to be mounted can be adsorbed by the adsorption head. Mounting, that is, excessive mounting of spherical particles on the mounting object can be reliably prevented.

  The suction head according to claim 2, the spherical particle mounting device according to claim 6, and the spherical particle suction method according to claim 8, wherein the tip of the intake pipe is brought into contact with one surface of the moving plate against the fixed plate. The portion is made flush with the other surface of the moving plate or protruded from the other surface. For this reason, according to this adsorption head, a spherical particle mounting apparatus, and a spherical particle adsorption method, a spherical particle can be more reliably adsorbed to the tip of each intake pipe.

  The suction head according to claim 3, the spherical particle mounting device according to claim 6, and the spherical particle suction method according to claim 9, wherein the tip of the intake pipe is used when one surface of the moving plate is separated from the fixed plate. Only one spherical particle adsorbed on the part is accommodated in the insertion hole without protruding from the opening surface, and in this state, the sliding process is performed while the sliding member is in contact with or close to the other surface of the moving plate Then, unnecessary spherical particles adhering to the spherical particles accommodated in the insertion hole are removed (discarded) from the suction head. For this reason, in this adsorption head, spherical particle mounting device, and spherical particle adsorption method, even if there is an unnecessary spherical particle that was not removed by the movement of the moving plate, a part of the spherical particle (volume Or the entire portion protrudes outward from the opening surface of the insertion hole, and can be reliably removed from the suction head by a sliding process. Therefore, according to the suction head and the spherical particle suction method, it is possible to more reliably prevent excessive mounting of the spherical particles on the mounting target body.

  Further, in the suction head according to claim 4, the spherical particle mounting device according to claim 6, and the spherical particle suction method according to claim 10, the sliding process is executed using a squeegee as a sliding member. Therefore, according to the suction head, the spherical particle mounting device, and the spherical particle suction method, for example, unlike the configuration and method in which the sliding process is performed using a brush, the inside of the insertion hole in the sliding process. Thus, it is possible to reliably prevent the tip of the brush from entering and removing even the spherical particles to be mounted.

  Further, in the suction head according to claim 5, the spherical particle mounting device according to claim 6, and the spherical particle suction method according to claim 11, the adhesion to the spherical particles accommodated in the insertion hole. The sliding process is performed in a state in which a part exceeding half of the volume of the unnecessary spherical particles protrudes from the opening surface of the insertion hole. Therefore, according to the suction head, the spherical particle mounting device, and the spherical particle adsorption method, the sliding member can be reliably brought into contact with the unnecessary spherical particles during the sliding process. Spherical particles can be more reliably removed from the suction head.

  Hereinafter, the best mode of a suction head, a spherical particle mounting device, and a spherical particle suction method according to the present invention will be described with reference to the accompanying drawings.

  First, the configuration of the solder ball mounting apparatus 1 shown in FIG. 1 will be described. The solder ball mounting apparatus 1 is an example of a spherical particle mounting apparatus according to the present invention, and includes a suction head 11, a moving mechanism 12, an intake mechanism 13, and a control unit 14, as shown in FIG. The solder balls (microballs) 100 (see FIG. 4) as an example of the spherical particles in FIG. 4 can be mounted (placed) on the terminals 201 (see FIG. 10) of the substrate 200 as the mounting object. In this case, the solder ball 100 is formed in a spherical shape having a diameter L1 (see FIG. 4) of about 70 μm. Further, the solder balls 100 are mounted on the terminals 201 of the substrate 200 by the solder ball mounting apparatus 1 and then heated and melted to constitute a ball grid array (BGA) on the substrate 200.

  The suction head 11 is an example of the suction head according to the present invention, and includes a head body 21 and a squeezing mechanism (sliding mechanism in the present invention) 22 as shown in FIG. The solder balls 100 can be adsorbed according to the body adsorbing method. As shown in FIG. 3 and FIG. 3, the head main body 21 includes a casing 31, a plurality of intake pipes 32 (only four of them are shown in FIG. 3), a moving plate 33, and a plate moving portion 34. It is prepared for. As an example, the casing 31 is configured in a box shape having a gap 41 formed therein, as shown in FIG. In this case, the bottom plate of the casing 31 corresponds to the fixed plate in the present invention, and is hereinafter also referred to as “fixed plate 42”. The casing 31 is formed with an exhaust hole 43 for exhausting the air in the gap 41.

  As shown in FIG. 3, the intake pipe 32 has a base end 32a side protruding into the gap 41 of the casing 31, and a tip end 32b side below the fixing plate 42 of the casing 31 (outside the casing 31). It is attached to the fixing plate 42 so as to protrude. In addition, the opening part 32c of the front-end | tip part 32b in the intake pipe 32 functions as an inlet port in this invention. In this case, as shown in FIG. 4, the diameter L2 of the intake pipe 32 is defined to be about 90 μm, which is longer than the diameter L1 of the solder ball 100 (70 μm in this example). The diameter L3 of the opening 32c in the intake pipe 32 (inner diameter of the intake pipe 32) is defined to be about 50 μm, which is shorter than the diameter L1 of the solder ball 100 (70 μm in this example). Further, the protruding length L4 of the housing 31 from the fixed plate 42 on the front end 32b side is defined to be about 130 μm, which is longer than the thickness L5 of the moving plate 33 described later. In the head main body 21, the inside of the air gap 41 is brought into a negative pressure state by the exhaust of air in the air gap 41 in the housing 31, and accordingly, intake air is performed from the opening 32 c of the air intake pipe 32, thereby The solder ball 100 is adsorbed to the portion 32b (the edge of the opening portion 32c at the tip end portion 32b) (see the figure).

  As an example, as shown in FIG. 3, the moving plate 33 is approximately the same size as the fixed plate 42, and its thickness L5 (see FIG. 4) is larger than the diameter L1 (70 μm in this example) of the solder ball 100. It is configured in a plate shape defined to be slightly thicker about 90 μm. Further, the same number of insertion holes 51 as the intake pipes 32 are formed in the moving plate 33. In this case, each insertion hole 51 is sized such that the intake pipe 32 can be inserted through, specifically, the diameter L6 of which is about 110 μm, which is longer than the diameter L2 of the intake pipe 32 (90 μm in this example). ing. The moving plate 33 is configured to be able to contact and separate from the fixed plate 42 in a state where the intake pipe 32 is inserted through the insertion hole 51. In this case, the movable plate 33 has a position where the upper surface (one surface in the present invention) 33a facing the fixed plate 42 is in contact with the fixed plate 42 (hereinafter also referred to as “first position P1”: FIG. 3), and the upper surface. A position (hereinafter also referred to as a “second position P2”) in which 33a is separated from the fixed plate 42 and the tip 32b of the intake pipe 32 is slightly inserted (inserted) into the insertion hole 51: FIG. (See FIG. 4).

  Here, in the suction head 11, as described above, the protrusion length L4 on the tip end 32b side of the intake pipe 32 is defined to be about 130 μm, which is longer than the thickness L5 (90 μm in this example) of the moving plate 33. . Therefore, as shown in FIG. 4, when the moving plate 33 is located at the first position P1, the tip 32b side of the intake pipe 32 is 40 μm from the lower surface (the other surface in the present invention) 33b of the moving plate 33. Protrusively. Further, since the thickness L5 of the moving plate 33 is defined to be slightly thicker than the diameter L1 of the solder ball 100, the length (depth) of the insertion hole 51 is also the diameter L1 of the solder ball 100 (70 μm in this example). It is about 90 μm, which is slightly longer than that. Therefore, as shown in FIG. 5, in a state where the moving plate 33 is located at the second position P2 (separated state in the present invention), the solder ball 100 adsorbed on the tip 32b of the intake pipe 32 is inserted. Only one hole 51 can be accommodated without protruding from the opening surface 51a on the lower surface 33b side. Further, since the length of the insertion hole 51 is slightly longer than the diameter L1 of the solder ball 100 (that is, the thickness L5 of the moving plate 33 is slightly thicker than the diameter L1), as shown in FIG. 2, in a state where only one solder ball 100 adsorbed to the tip end portion 32 b of the intake pipe 32 is accommodated in the insertion hole 51, from the portion on the lower surface 33 b side of the solder ball 100. The shortest length L7 to the opening surface 51a of the insertion hole 51 is shorter than the radius L8 of the solder ball 100 (in this example, 35 μm) (in this example, for example, about 30 μm).

  The plate moving unit 34 is moved to the first position P1 and the second position P2 described above, that is, in the direction in which the plate moving unit 34 is in contact with or separated from the fixed plate 42 (the direction of the arrow A shown in FIG. 3). The moving plate 33 is moved along.

  The squeezing mechanism 22 includes a squeegee (sliding member according to the present invention) 61 and, as shown in FIG. A squeegeeing process (sliding process in the present invention) is performed in which the squeegee 61 is slid along the lower surface 33b of the moving plate 33 in a state where the tip of the squeegee 61 is in contact with (or close to) the lower surface 33b.

  The movement mechanism 12 controls the arrangement position (suction position in the present invention) of the tray 300 (see FIGS. 1 and 6) in which the solder balls 100 are accommodated and the arrangement position (target position in the present invention) of the substrate 200 according to the control of the control unit 14. ) To move the suction head 11. The intake mechanism 13 includes, for example, a vacuum pump (not shown) connected to the exhaust hole 43 of the housing 31 through a pipe, and is inside the gap 41 of the housing 31 according to the control of the control unit 14. Intake from the opening 32c of the intake pipe 32 is performed by setting a negative pressure state.

  The control unit 14 includes a CPU and a memory (both not shown), and controls the plate moving unit 34 and the squeezing mechanism 22 of the suction head 11. The control unit 14 also controls the moving mechanism 12 to move the suction head 11 to the arrangement position of the tray 300 (hereinafter also referred to as “first moving process”), and controls the intake mechanism 13 to perform intake. Processing (hereinafter also referred to as “intake processing”), processing for controlling the moving mechanism 12 and moving the suction head 11 that is sucking the solder balls 100 to the position where the substrate 200 is disposed (hereinafter referred to as “second movement processing”). And a process of controlling the intake mechanism 13 to stop intake at the position where the substrate 200 is disposed (hereinafter also referred to as “intake stop process”).

  Next, using the solder ball mounting apparatus 1, the process of causing the adsorption head 11 to adsorb the solder ball 100 according to the spherical particle adsorption method according to the present invention and mounting the solder ball 100 on the terminal 201 of the substrate 200, The operation of the solder ball mounting apparatus 1 will be described with reference to the drawings. In the initial state, it is assumed that the moving plate 33 is located at the first position P1 as shown in FIG.

  In this solder ball mounting apparatus 1, when a start operation is performed, the control unit 14 executes the first movement process. In the first movement process, the control unit 14 controls the moving mechanism 12 to move the suction head 11 above the position where the tray 300 is disposed, and then the control unit 14 is accommodated in the tray 300. The suction head 11 is lowered so as to be close to the solder ball 100. Subsequently, the control unit 14 executes an intake process. In this intake process, the control unit 14 controls the intake mechanism 13 to exhaust the air in the gap 41 of the housing 31 in the suction head 11 to bring the inside of the gap 41 into a negative pressure state, thereby causing the intake pipe 32 to be in a negative pressure state. Intake from the opening 32c is performed. At this time, as shown in FIG. 6, the solder balls 100 housed in the tray 300 are drawn toward the opening 32 c by the suction force accompanying the intake air from the opening 32 c of the intake pipe 32. Next, as shown in the figure, the solder ball 100 drawn toward the opening 32c is adsorbed to the tip 32b of the intake pipe 32 (the edge of the opening 32c in the tip 32b).

  Here, since the solder ball 100 is very small as described above, the force with which the solder balls 100 attract each other due to static electricity or intermolecular force is relatively large with respect to the weight of the solder ball. For this reason, as shown in FIG. 6, the solder ball 100 adsorbed by the tip 32 b of the intake pipe 32 (hereinafter, this solder ball 100 is also referred to as “solder ball 100 to be mounted”) and another solder ball 100. (Hereinafter, this solder ball 100 is also referred to as “unnecessary solder ball 100”) adheres.

  Subsequently, the control unit 14 controls the moving mechanism 12 to raise the suction head 11, and then controls the plate moving unit 34 of the suction head 11 to move the moving plate 33 to the first position as shown in FIG. 2 is moved to position P2. At this time, unnecessary solder balls 100 are removed (moved off) by the movement of the moving plate 33. On the other hand, in this suction head 11, as described above, when the moving plate 33 is located at the second position P <b> 2, only one solder ball 100 is accommodated in the insertion hole 51 of the moving plate 33. Is possible. Therefore, as shown in FIG. 8, only the solder ball 100 to be mounted is accommodated in the insertion hole 51, and even if there is an unnecessary solder ball 100 that was not removed by the movement of the moving plate 33, The solder ball 100 is attached to the solder ball 100 in a state where a part (volume part) or the whole of the solder ball 100 protrudes outward (downward) from the opening surface 51 a of the insertion hole 51. In this state, as described above, the shortest length L7 from the portion on the lower surface 33b side of the solder ball 100 to be mounted to the opening surface 51a of the insertion hole 51 is shorter than the radius L8 of the solder ball 100. Therefore, the unnecessary solder ball 100 has a portion exceeding half of its volume protruding outward from the opening surface 51a.

  Subsequently, the control unit 14 controls the squeezing mechanism 22 to execute a squeezing process. In this squeezing process, as shown in FIG. 8, the squeegee mechanism 22 brings the tip of the squeegee 61 into contact (or close proximity) to the lower surface 33b of the moving plate 33 located at the second position P2. In this state, the squeegee 61 is slid along the lower surface 33b of the moving plate 33 from one end (for example, the left end in the figure) to the other end (the right end in the figure) of the lower surface 33b. At this time, an unnecessary solder ball 100 that has not been removed by the movement of the moving plate 33 protrudes outward from the opening surface 51a of the insertion hole 51, and the tip of the squeegee 61 contacts the unnecessary solder ball 100. Touch. For this reason, even if there is an unnecessary solder ball 100 that has not been removed by the movement of the moving plate 33 and the solder ball 100 to be mounted and the unnecessary solder ball 100 attract each other strongly, the unnecessary solder ball 100 is unnecessary. The solder ball 100 is forcibly separated from the solder ball 100 to be mounted and reliably removed from the suction head 11. In this case, since a portion exceeding half of the volume of the unnecessary solder ball 100 protrudes outside the opening surface 51a, the unnecessary solder when the tip of the squeegee 61 contacts the unnecessary solder ball 100. The situation where the ball 100 is deformed and enters the insertion hole 51 is reliably prevented. In addition, since the entire outer shape of the solder ball 100 to be mounted is not exposed and is accommodated on the upper surface 33a side (inside the insertion hole 51) of the insertion hole 51, the solder ball 100 to be mounted is also included. Is reliably prevented from being removed together with unnecessary solder balls 100.

  Next, the control unit 14 controls the plate moving unit 34 of the suction head 11 to move the moving plate 33 to the first position P1 as shown in FIG. At this time, the tip 32b side of the intake pipe 32 protrudes from the lower surface 33b of the moving plate 33 together with the solder ball 100 to be mounted, so that the solder ball 100 to be mounted is exposed.

  Subsequently, the control unit 14 executes a second movement process. In the second movement process, the control unit 14 controls the moving mechanism 12 to move the suction head 11 above the substrate 200, and then the position where the tip of the solder ball 100 is close to the terminal 201 of the substrate 200. The suction head 11 is moved down to (arrangement position of the substrate 200). Subsequently, the control unit 14 performs an intake air stop process. In this intake air stop process, the control unit 14 controls the intake mechanism 13 to stop the exhaust of the air in the gap 41 in the housing 31 of the suction head 11, whereby the intake air from the opening 32 c of the intake pipe 32 is stopped. Stop. At this time, as shown in FIG. 10, the suction by the suction from the opening 32c is released, and the solder ball 100 is placed on the terminal 201 of the substrate 200 (on the solder flux applied to the surface of the terminal 201). Is done. Thus, the mounting of the solder ball 100 on the terminal 201 of the substrate 200 is completed. In this case, in the suction head 11, as described above, the unnecessary solder ball 100 is reliably removed by the movement of the moving plate 33 to the second position P 2 and the squeezing process by the squeezing mechanism 22, and mounting. Since only the target solder ball 100 is sucked by the suction head 11 (the tip 32b of the intake pipe 32), unnecessary mounting of the solder ball 100 on the terminal 201 is reliably prevented. Further, in the suction head 11, as described above, in the squeezing process by the squeezing mechanism 22, it is possible to reliably prevent even the solder ball 100 to be mounted together with the unnecessary solder ball 100 from being removed. Therefore, a situation in which the solder ball 100 to be mounted on the terminal 201 is insufficient is surely prevented.

  As described above, in the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, the intake pipe 32 is inserted into the insertion hole 51 of the moving plate 33 and the upper surface 33 a of the moving plate 33 is brought into contact with the fixed plate 42. In this state, the solder ball 100 is attracted to the tip 32b of the intake pipe 32. For this reason, in this suction head 11, the solder ball mounting device 1 and the spherical particle suction method, a conventional solder ball that sucks the solder ball 100 in a state where the suction hole is located behind the release plate and is not exposed. Unlike the mounting device, the solder ball 100 can be reliably adsorbed to the tip 32b of each intake pipe 32. Therefore, according to the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, the solder ball 100 can be reliably mounted on the terminal 201 without being insufficient. In the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, after the solder ball 100 is attracted to the tip 32 b of the intake pipe 32, the upper surface 33 a of the moving plate 33 is separated from the fixed plate 42. Then, the unnecessary solder ball 100 adhering to the solder ball 100 adsorbed to the tip end portion 32 b of the intake pipe 32 is removed from the adsorption head 11. Therefore, according to the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, only the solder ball 100 to be mounted can be sucked by the suction head 11. Mounting, that is, excessive mounting of the solder balls 100 on the terminals 201 can be reliably prevented.

  Further, in the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, when the upper surface 33 a of the moving plate 33 is brought into contact with the fixed plate 42, the tip 32 of the intake pipe 32 is moved from the lower surface 33 b of the moving plate 33. Let it protrude. For this reason, according to the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, the solder ball 100 can be more reliably suctioned to the distal end portion 32 of each intake pipe 32.

  Further, in the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, the solder ball 100 sucked by the tip 32 b of the intake pipe 32 when the upper surface 33 a of the moving plate 33 is separated from the fixed plate 42. Is inserted into the insertion hole 51 without protruding from the opening surface 51a, and in this state, the squeegee 61 is brought into contact with or close to the lower surface 33b of the moving plate 33, and the squeegeeing process is executed. Unnecessary solder balls 100 adhering to the solder balls 100 housed in are removed from the suction head 11 (discarded). Therefore, in this suction head 11, solder ball mounting apparatus 1, and spherical particle suction method, even if there is an unnecessary solder ball 100 that has not been removed by the movement of the moving plate 33, a part of the solder ball 100 is present. (Part of the volume) or the whole can be protruded outward from the opening surface 51a of the insertion hole 51, and can be reliably removed from the suction head 11 by the squeezing process. Therefore, according to the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, it is possible to more reliably prevent the solder ball 100 from being excessively mounted on the terminal 201.

  Further, in the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, a squeegeeing process (sliding process) is performed using a squeegee 61 as a sliding member. For this reason, for example, unlike the configuration and method in which the sliding process is performed using a brush, the tip of the brush enters the insertion hole 51 during the sliding process, and even the solder ball 100 to be mounted is removed. Can be reliably prevented.

  Further, in the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, the insertion hole 51 in the moving plate 33 from the part on the lower surface 33 b side in the solder ball 100 to be mounted accommodated in the insertion hole 51. The insertion hole 51 is formed so that the shortest length L7 to the opening surface 51a is shorter than the radius L8 of the solder ball 100, and the volume in the unnecessary solder ball 100 attached to the solder ball 100 to be mounted. In particular, the squeezing process is executed in a state in which a portion exceeding half is protruded from the opening surface 51 a of the insertion hole 51. Therefore, according to the suction head 11, the solder ball mounting device 1, and the spherical particle suction method, the tip of the squeegee 61 can be reliably brought into contact with the unnecessary solder ball 100 during the squeezing process. Unnecessary solder balls 100 can be more reliably removed from the suction head 11.

  In addition, this invention is not limited to said structure. For example, by making the protrusion length L4 on the distal end portion 32b side of the intake pipe 32 longer than the thickness L5 of the movable plate 33, the distal end of the intake pipe 32 in a state where the movable plate 33 is located at the first position P1. Although the configuration example in which the portion 32b side protrudes from the lower surface 33b of the moving plate 33 has been described above, the distal end portion 32b of the intake pipe 32 and the moving plate 33 in a state where the moving plate 33 is located at the first position P1. It is also possible to adopt a configuration in which the lower surface 33b of the first and second lower surfaces 33b are flush with each other. Further, by defining the thickness L5 of the moving plate 33 to be slightly thicker than the diameter L1 of the solder ball 100, the moving plate 33 can be moved from the portion on the lower surface 33b side of the solder ball 100 adsorbed to the tip 32b of the intake pipe 32 to the moving plate 33. The example in which the insertion hole 51 is formed so that the shortest length L7 to the opening surface 51a of the insertion hole 51 is shorter than the radius L8 of the solder ball 100 has been described above. As long as only one solder ball 100 to be mounted can be accommodated in the insertion hole 51, the length (depth) of the insertion hole 51, that is, the thickness L5 of the movable plate 33 can be arbitrarily defined.

  Further, the example of performing the squeegeeing process using the squeegee 61 as an example of the sliding member has been described above. However, the sliding member in the present invention includes various members that can remove unnecessary solder balls 100 such as a brush. included. Furthermore, the structure which is not provided with the squeezing mechanism 22 is also employable.

  Further, instead of the configuration in which the solder ball 100 is dropped (placed) on the solder flux applied to the surface of the terminal 201 of the substrate 200, the solder in which the tip of the solder ball 100 adsorbed by the adsorption head 11 is accommodated in the tray. It is also possible to adopt a configuration in which the solder ball 100 is dropped (placed) on the terminal 201 to which the solder flux is not applied after being immersed in the flux and attached to the tip.

1 is a configuration diagram showing a configuration of a solder ball mounting device 1. 2 is a configuration diagram showing a configuration of a suction head 11. FIG. 3 is a cross-sectional view of the suction head 11. FIG. FIG. 4 is an enlarged cross-sectional view of the suction head 11 in a state where a moving plate 33 is positioned at a first position P1. FIG. 6 is an enlarged cross-sectional view of the suction head 11 in a state where the moving plate 33 is positioned at a second position P2. FIG. 4 is a cross-sectional view of the suction head 11 in a state where an intake process is executed by a control unit 14. It is sectional drawing of the adsorption head 11 in the state which moved the movement plate 33 to the 2nd position P2. It is sectional drawing of the adsorption head 11 and the squeegee 61 in the state which is performing the squeezing process. It is sectional drawing of the adsorption head 11 in the state which moved the movement plate 33 to the 1st position P1. 2 is a cross-sectional view of the suction head 11 in a state where the solder ball 100 is placed on the terminal 201 of the substrate 200. FIG. It is the 1st explanatory view for explaining operation of the conventional solder ball mounting device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder ball mounting apparatus 11 Adsorption head 12 Movement mechanism 13 Intake mechanism 14 Control part 21 Head main body 22 Squeezing mechanism 32 Intake pipe 32b Tip part 32c Opening part 33 Moving plate 33a Upper surface 33b Lower surface 42 Fixed plate 51 Insertion hole 51a Opening surface 61 Squeegee 100 Solder ball 200 Substrate 201 Terminal L7 Length L8 Radius P1 First position P2 Second position

Claims (11)

An adsorption head comprising a head body that adsorbs spherical particles to the edge of the intake port by intake air from the intake port,
The head body includes a fixed plate, an intake pipe that is attached to the fixed plate so that a tip end side thereof protrudes from the fixed plate, and an opening portion of the tip part functions as the intake port, the intake pipe, An insertion hole through which the spherical particles can be inserted is formed, and a moving plate configured to be able to contact and separate from the fixed plate in a state where the intake pipe is inserted through the insertion hole. Suction head.   The head body is configured such that the tip of the intake pipe is flush with or protrudes from the other surface of the moving plate when one surface of the moving plate is in contact with the fixed plate. The suction head according to claim 1, which is configured. A sliding mechanism for sliding the sliding member while contacting or approaching the sliding member to the head body;
The insertion hole is configured to accommodate the spherical particles that are adsorbed to the tip of the intake pipe in a separated state in which one surface of the moving plate is separated from the fixed plate,
The suction head according to claim 1, wherein the sliding mechanism slides the sliding member while bringing the sliding member into contact with or close to the other surface of the moving plate in the separated state.   The suction head according to claim 3, wherein the sliding mechanism slides a squeegee as the sliding member.   The insertion hole is the shortest length from the other surface side portion of the spherical particle accommodated in the insertion hole in the separated state of the moving plate to the opening surface on the other surface side of the insertion hole. The suction head according to claim 3 or 4, wherein the suction head is formed to be shorter than a radius of the spherical particles. A suction head according to any one of claims 1 to 5;
A moving mechanism for moving the suction head;
An intake mechanism that performs intake from the opening of the intake pipe in the suction head;
A process for controlling the moving mechanism to move the suction head to the suction position of the spherical particles, a process for controlling the suction mechanism to perform suction from the opening, and a movement for controlling the suction head A process of moving the plate to and away from the fixed plate, a process of controlling the moving mechanism to move the suction head that is sucking the spherical particles by suction from the opening, and the target And a control unit that executes a process of controlling the intake mechanism to stop intake from the opening at a position, and configured to mount the spherical particle on a mounting target body . A fixed plate, an intake pipe that is attached to the fixed plate so that a tip end side thereof protrudes from the fixed plate, and is capable of adsorbing spherical particles to the tip portion by suction from the opening of the tip end; and An insertion hole through which the intake pipe and the spherical particles can be inserted is formed, and a moving plate configured to be able to contact and separate from the fixed plate in a state where the intake pipe is inserted through the insertion hole. A spherical particle adsorption method for adsorbing the spherical particles using an adsorption head,
After the spherical particles are adsorbed to the tip of the intake pipe in a state where one surface of the moving plate is in contact with the fixed plate, the one surface is separated from the fixed plate and adsorbed to the tip. A spherical particle adsorption method for removing other spherical particles adhered to the spherical particles from the adsorption head.   The spherical shape according to claim 7, wherein when the one surface of the moving plate is brought into contact with the fixed plate, the tip portion of the intake pipe is in a state of being flush with or protruding from the other surface of the moving plate. Granule adsorption method.   When the one surface of the moving plate is separated from the fixed plate, the spherical particles adsorbed at the tip of the intake pipe do not protrude from the opening surface on the other surface side of the moving plate in the insertion hole. Only one is accommodated in the insertion hole, and in that state, a sliding process is performed in which the sliding member is slid while contacting or approaching the other surface of the moving plate, The spherical particle adsorbing method according to claim 7 or 8, wherein the other spherical particles adhering to the spherical particles accommodated in the container are removed from the adsorption head.   The spherical particle adsorption method according to claim 9, wherein the sliding process is performed using a squeegee as the sliding member.   A part of the other spherical particles adhering to the spherical particles accommodated in the insertion hole is projected from the opening surface of the insertion hole, and the sliding treatment is performed in that state. The spherical particle adsorption method according to claim 9 or 10, wherein:

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