JP2010135615A - 屋外設置電子機器用気密端子およびその製造方法 - Google Patents
屋外設置電子機器用気密端子およびその製造方法 Download PDFInfo
- Publication number
- JP2010135615A JP2010135615A JP2008311050A JP2008311050A JP2010135615A JP 2010135615 A JP2010135615 A JP 2010135615A JP 2008311050 A JP2008311050 A JP 2008311050A JP 2008311050 A JP2008311050 A JP 2008311050A JP 2010135615 A JP2010135615 A JP 2010135615A
- Authority
- JP
- Japan
- Prior art keywords
- stainless steel
- glass
- stem base
- sealing
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000011521 glass Substances 0.000 claims abstract description 53
- 238000007789 sealing Methods 0.000 claims abstract description 52
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 52
- 239000010935 stainless steel Substances 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 11
- 229910002555 FeNi Inorganic materials 0.000 claims description 7
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical group [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 5
- 229910052788 barium Inorganic materials 0.000 claims description 5
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 16
- 238000007747 plating Methods 0.000 abstract description 15
- 238000003466 welding Methods 0.000 abstract description 15
- 230000007797 corrosion Effects 0.000 abstract description 13
- 239000000428 dust Substances 0.000 abstract description 7
- 230000000149 penetrating effect Effects 0.000 abstract description 4
- 150000003839 salts Chemical class 0.000 description 11
- 239000007921 spray Substances 0.000 description 9
- 239000005394 sealing glass Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- -1 chlorine ions Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008311050A JP2010135615A (ja) | 2008-12-05 | 2008-12-05 | 屋外設置電子機器用気密端子およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008311050A JP2010135615A (ja) | 2008-12-05 | 2008-12-05 | 屋外設置電子機器用気密端子およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010135615A true JP2010135615A (ja) | 2010-06-17 |
| JP2010135615A5 JP2010135615A5 (https=) | 2011-12-08 |
Family
ID=42346597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008311050A Pending JP2010135615A (ja) | 2008-12-05 | 2008-12-05 | 屋外設置電子機器用気密端子およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010135615A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020107575A (ja) * | 2018-12-28 | 2020-07-09 | ショット日本株式会社 | 気密端子 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59141179A (ja) * | 1983-01-31 | 1984-08-13 | 日本電気ホームエレクトロニクス株式会社 | 気密端子 |
| JP2001068691A (ja) * | 1999-08-30 | 2001-03-16 | Kyocera Corp | 光素子収納用パッケージ |
| JP2005191088A (ja) * | 2003-12-24 | 2005-07-14 | Mitsubishi Electric Corp | 半導体用パッケージ及び半導体デバイス |
| JP2005353291A (ja) * | 2004-06-08 | 2005-12-22 | Fuji Denka:Kk | 気密端子及びその製造方法 |
| JP2008124163A (ja) * | 2006-11-10 | 2008-05-29 | Nec Schott Components Corp | 気密端子およびその製造方法 |
-
2008
- 2008-12-05 JP JP2008311050A patent/JP2010135615A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59141179A (ja) * | 1983-01-31 | 1984-08-13 | 日本電気ホームエレクトロニクス株式会社 | 気密端子 |
| JP2001068691A (ja) * | 1999-08-30 | 2001-03-16 | Kyocera Corp | 光素子収納用パッケージ |
| JP2005191088A (ja) * | 2003-12-24 | 2005-07-14 | Mitsubishi Electric Corp | 半導体用パッケージ及び半導体デバイス |
| JP2005353291A (ja) * | 2004-06-08 | 2005-12-22 | Fuji Denka:Kk | 気密端子及びその製造方法 |
| JP2008124163A (ja) * | 2006-11-10 | 2008-05-29 | Nec Schott Components Corp | 気密端子およびその製造方法 |
Non-Patent Citations (1)
| Title |
|---|
| JPN6013020858; 社団法人日本金属学会: 金属便覧 , 19710625, １６５４頁-１６５６頁, 丸善株式会社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020107575A (ja) * | 2018-12-28 | 2020-07-09 | ショット日本株式会社 | 気密端子 |
| JP7132120B2 (ja) | 2018-12-28 | 2022-09-06 | ショット日本株式会社 | 気密端子 |
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| A521 | Written amendment |
Effective date: 20111026 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
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| A621 | Written request for application examination |
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