JP2010135547A - Surface mounting led - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure a sufficient attraction area on the top of a package without enlarging the package and deteriorating light-emitting performance, even in an oblique emission type surface mounting LED having a cut plane for oblique emission on the top of the package. <P>SOLUTION: The surface mounting LED has the package 2 having a mounted electrode 3, a cavity 4 provided in the upper part and opened obliquely upward, and an electrode 5 for an LED, an LED chip 10 carried in the cavity and electrically connected to the electrode for the LED to emit light from the opening part, and a translucent sealing resin part 15 filled in the cavity. A flat plane 2a attractable by an attraction pad is formed on the top of the package, and an inclined surface 2b is provided at a location which is the end of the flat plane and corresponds to the opening part of the cavity. A translucent additional member 20 having an attractable plane continuous with the flat plane is fixed to the inclined surface. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an improvement in an oblique light-emitting surface-mounted LED, and more particularly, to a surface-mounted LED having improved suction retention when a chip-type LED is sucked by a suction pad and mounted on a printed board.

The LED is frequently used as a light source for electric decoration in a gaming machine such as a pachinko gaming machine, and is often used for an effect on the progress of the game by being assembled on a game board or a board component such as an accessory. .
There are two types of LEDs: a bullet-type LED that is relatively large and capable of increasing brightness, and a surface-mount type (chip-type) LED that can reduce the size of rice grains. The surface-mount type LED is small and requires a small area. Therefore, it is advantageous in terms of layout, and is often used for gaming machines in which a large number of board parts are mounted within a limited area.
The surface-mounted LED has a cavity for housing an LED chip (LED element) on the top surface, a mounting electrode for surface mounting on the bottom, and a package having an LED electrode in conduction with the mounting electrode in the cavity; An LED chip that is electrically connected to the LED electrode while being fixed in the cavity, and a molding material made of a light-transmitting material filled in the cavity are provided.
Patent Documents 1, 2, and 3 disclose such surface mount LEDs.

By the way, in recent years, oblique light-emitting surface-mounted LEDs have been used as light sources for electrical decorations in various gaming machines such as pachinko machines. Diagonal light emitting type surface-mounted LEDs are widely used because they are useful when the light emission direction from a game board surface or board surface components is desired to be set in an oblique direction.
6A and 6B are a perspective view and a longitudinal sectional view showing a configuration of a conventional oblique light-emitting surface-mounted LED.
This oblique light-emitting surface-mounted LED 100 is formed with a cavity 103 extending in an oblique direction for accommodating an LED chip (LED element) 110 on an inclined surface 102 provided at an upper corner, and a mounting electrode for surface mounting at the bottom. 104, a substantially cubic package 101 having an LED electrode 105 electrically connected to the mounting electrode 104 in the cavity, and an LED chip 110 wire-connected to the LED electrode 105 while being fixed in the cavity 103. And a molding material 106 made of a translucent material filled in the cavity.
The smallest surface-mount type LED 100 has vertical and horizontal dimensions of about the size of rice grains.
When mounting the surface-mounted LED 100 on the printed circuit board 120 with a mounter, the surface-mounted LED 100 arranged on a tray (not shown) is sucked by the suction pad 130 one by one and placed on the electrode 121 on the printed circuit board 120. The transfer operation is performed, and soldering by reflow or the like is performed after mounting.
The suction pad 130 has a structure that sucks the flat surface (suction surface) 101a on the upper surface of the package 101 by supplying a negative pressure from a suction hole provided on the lower surface thereof.
However, since there is an inclined surface 102 at a position along one end of the flat surface 101a of the miniaturized surface mount LED, the flat surface is an extremely narrow space, and even if the suction pad lower surface is slightly displaced. There were many problems that caused adsorption failure or dropped during the adsorption.
JP 2007-294963 A JP 2008-016647 A JP 2008-034799 A

Conventionally, when mounting an oblique light emitting surface-mount type LED on a printed circuit board, a suction pad using negative pressure is sucked using a flat suction surface on the upper surface of the package and transferred onto an electrode on the board. Although it was mounted, the edge of the upper surface of the package was cut obliquely in order to emit light from the LED chip diagonally, so the adsorption surface became narrow and difficult to stably adsorb by the adsorption pad .
The present invention has been made in view of the above, and is an oblique light-emitting surface-mounted LED having a cut-out surface for oblique light emission on the upper surface of the package, but does not increase the package shape and emits light. The object is to secure a sufficient adsorption area on the upper surface of the package without degrading the performance.

In order to achieve the above object, a surface-mounted LED according to the invention of claim 1 includes a mounting electrode provided at the bottom, a cavity provided at the top and opened obliquely upward, and an LED electrode provided in the cavity. And an LED chip that is mounted in the cavity and is electrically connected to the LED electrode and emits light from the cavity opening. A surface-mount type LED having an inclined surface at a portion corresponding to the cavity opening, which is an end portion of the flat surface, A translucent addition member having a flat surface and an adsorbable flat surface is fixed.
The surface-mounted LED is configured such that a flat surface is provided on the upper surface of the package, the flat surface is vacuum-sucked by a suction pad, transferred, and mounted on a printed board. However, in the oblique light emitting surface-mount type LED, the upper part of the package is notched because it is necessary to provide a cavity for accommodating the LED chip, and the flat surface of the upper surface of the package is equivalent to the inclined surface formed by the notch. The area of is narrow. For this reason, the adsorptivity by the suction pad is unstable. In the present invention, by fixing the translucent additional member having translucency to the inclined surface, it is possible to increase the adsorption area without hindering the emitted light from the LED chip.

The surface-mounted LED according to the invention of claim 2 is characterized in that the inner wall of the cavity is a reflecting surface.
It becomes possible to efficiently emit light from the LED in an oblique direction.
The surface mount type LED according to the invention of claim 3 has a translucent encapsulating resin portion filled in the cavity, and the encapsulating resin portion and the translucent addition member are integrally formed of the same material. It has the structure comprised.
When forming the encapsulating resin portion by filling the cavity with a translucent resin in a molten state, simultaneously forming the translucent additional member reduces the number of manufacturing steps and improves the continuity of both members. The light transmittance can be increased by securing.
A surface-mounted LED according to a fourth aspect of the present invention includes a substantially rectangular parallelepiped package having a mounting electrode at the bottom, an obliquely upward inclined surface at one upper corner, and an LED electrode; An LED chip that is mounted on an inclined surface and is electrically connected to the LED electrode and emits light obliquely upward. The upper surface of the package excluding the inclined surface can be adsorbed by an adsorption pad. A surface-mounted LED in which a flat surface is formed, wherein a light-transmitting additional member having an adsorbable flat surface continuous with the flat surface is fixed to the inclined surface.
Instead of providing an obliquely upward cavity at the top of the package, an LED chip may be arranged on an inclined surface provided at the corner of the package, and this LED chip may be covered with a translucent additional member.

In the surface-mount type LED according to the invention of claim 5, the translucent addition member is formed of a non-translucent material except a region corresponding to an emission path from the LED chip, and the emission path The inner wall of the corresponding region is a reflective surface.
The surface-mount type LED according to the invention of claim 6 is characterized in that the translucent addition member constitutes a lens having a light condensing property or a diffusing property.
The surface-mount type LED according to the invention of claim 7 is characterized in that the translucent addition member is covered with a light-shielding film on an outer surface excluding a region corresponding to an emission path from the LED chip.

As described above, according to the present invention, the light emitting performance is reduced without increasing the package shape even though the light emitting surface mounted LED has a notch surface for oblique light emission on the upper surface of the package. It is possible to ensure a sufficient adsorption area on the upper surface of the package without the need for any.
That is, by fixing the translucent additional member having translucency to the inclined surface, it is possible to increase the adsorption area without disturbing the light emitted from the LED chip.

Hereinafter, the present invention will be described in detail with reference to embodiments shown in the accompanying drawings.
1A and 1B are a perspective view and a longitudinal sectional view showing a configuration of an oblique light emitting surface-mount type LED according to an embodiment of the present invention.
The oblique light-emitting surface-mounted LED 1 is generally configured by a package 2, an LED chip 10, an encapsulating resin portion 15, and a translucent adding member 20.
That is, the surface-mounted LED 1 includes a package 2 having a mounting electrode 3 provided at the bottom, a cavity 4 provided from the outer top to the inside and opening obliquely upward, and an LED electrode 5 disposed in the cavity 4. The LED chip 10 mounted in the cavity 4 and electrically connected to the LED electrode 5 to emit light from the cavity opening, and the light-transmitting encapsulating resin filled in the cavity if necessary Part 15 and translucent addition member 20 fixed to the cavity opening. Each LED electrode 5 is disposed inside the cavity 4 and is electrically connected to each mounting electrode 3.
A flat surface 2a that can be sucked by a suction pad is formed on the upper surface of the package 2, and a portion corresponding to the cavity opening at the end of the flat surface 2a is cut obliquely (including a curve). It becomes the inclined surface 2b. Light from the LED chip 10 is emitted obliquely upward from the cavity opening via the encapsulating resin 15. In addition, the inclined surface 2b does not need to be a pure flat surface, but includes a curved surface and a concave surface.

The characteristic configuration of the present invention is that the light transmitting additional member 20 having the adsorbable flat surface 20a continuous with the flat surface 2a is fixed to the inclined surface 2b of the package, thereby increasing the size of the package. Without hindering the emission of light from the LED chip, the suction area by the suction pad is enlarged to improve the suction stability during LED mounting.
When mounting the surface-mounted LED 1 on the printed circuit board 30 with the mounter, the surface-mounted LED 1 arranged on a tray (not shown) is sucked one by one by the suction pad 40 and transferred onto the electrode 31 on the printed circuit board. The mounting work is performed, and soldering by reflow or the like is performed after mounting.
The lower surface of the suction pad 40 has a limited suction area that is assumed to be sucked to the flat surface 2a. However, the flat surface 2a of the ultra-small package has a limited narrow area, Adsorption by the pad is not stable, and adsorption failure due to misalignment, part dropping, etc. are likely to occur.

In the present invention, since the area of the flat surface to be attracted is increased by the area of the flat surface 20a of the translucent additional member, the suction stability due to the suction pad 40 is increased and the suction failure due to the suction position shift, It becomes possible to prevent the fall.
The translucent addition member 20 has a right triangular prism shape made of a resin material having translucency, and the joint surface 20b corresponding to the hypotenuse is formed on the inclined surface 2b of the package (and the outer surface of the encapsulating resin 15). The flat surface 20a forms a flat surface (suction surface) continuous with the flat surface 2a. In this case, the light-transmitting additional member as a separate member may be fixed to the inclined surface after the cavity is filled with the encapsulating resin. The inclined surface 2b and the bonding surface 20b are integrated by a translucent adhesive or the like.

Alternatively, the encapsulating resin portion 15 and the translucent addition member 20 may be integrally formed of the same material. Specifically, the translucent addition member may be integrally formed of the same material at the same time when the encapsulating resin portion 15 is filled in the cavity. That is, the cavity is filled with a translucent resin in a state where the package is accommodated in a mold having a molding space corresponding to the translucent addition member, and the filling of the encapsulating resin portion 15 and the translucent addition member are performed. These moldings may be performed simultaneously.
When forming the encapsulating resin portion by filling the cavity with the translucent resin in a molten state in this way, the translucent additional member is simultaneously formed, thereby reducing the number of manufacturing steps and It is possible to ensure continuity and increase light transmittance.
Further, if necessary, the directivity of the emitted light can be enhanced by using the inner wall 4a of the cavity 4 as a reflecting surface.
As shown in FIG. 2, the inner wall of the cavity 4 is tapered so that the diameter increases toward the opening, thereby diffusing the light emitted from the LED chip over an arbitrary range. Also good.

Next, FIGS. 3A and 3B are cross-sectional views of a main part of a surface-mounted LED according to another embodiment. In the embodiment shown in FIG. 3A, the light emitted from the LED chip 10 is condensed by forming the tip of the translucent addition member 20 into a curved convex portion (convex lens), and (b) In this embodiment, the tip of the translucent addition member 20 is formed as a curved concave portion (concave lens) so that light emitted from the LED chip 10 is diffused. It becomes possible to select any configuration according to the intended electrical decoration effect.
In this case, since the flat surface 20a on the upper surface of the translucent addition member 20 is a flat surface obtained by extending the flat surface 2a of the package, it contributes to increase the suction stability by the suction pad.

Next, FIGS. 4A and 4B are cross-sectional views of a main part of a surface-mounted LED according to another embodiment of the present invention.
In the embodiment of FIG. 4A, the translucent addition member 20 is formed of a non-translucent material 22 except for the region 21 corresponding to the emission path from the LED chip 10 and corresponds to the emission path. The inner wall 21a of the region 21 is a reflecting surface.
In the embodiment of FIG. 4B, the light-transmitting additional member 20 is covered with a light shielding film 23 on the outer surface of the portion excluding the region 21 corresponding to the emission path from the LED chip 10.
In any of the above embodiments, a cavity that accommodates an LED chip is provided in the upper part of the package. However, a configuration in which no cavity is provided as in the embodiment of FIG. 5 can be realized.
That is, the oblique light-emitting surface-mounted LED 1 shown in FIG. 5A has the mounting electrode 3 at the bottom, and the inclined surface 2b that is obliquely upward and the LED electrode 5 at one upper corner. It has a substantially rectangular parallelepiped package 2 and an LED chip 10 which is mounted on the inclined surface 2b and is electrically connected to the LED electrode 5 by a wire and emits light obliquely upward. Further, a flat surface 2a that can be adsorbed by an adsorption pad is formed on the upper surface of the package excluding the inclined surface 2b, and a transparent surface 20a that can adsorb to the inclined surface 2b and is continuous with the flat surface 2a. A configuration in which the optical addition member 20 is fixed is provided.
As a manufacturing method of fixing the translucent addition member to the inclined surface so as to cover the LED chip, the translucent addition member is obtained by housing the package in a mold and pouring molten resin into a molding cavity in the mold. The method of forming is preferable.

Also in this embodiment, the translucent addition member 20 may be configured by a translucent area 21 corresponding to an emission path from the LED chip 10 and a light shielding area 25 surrounding the translucent area 21. According to this, the emission range from the LED chip 10 can be controlled.
Further, a reflective film may be formed on the inner wall of the light shielding region 25.
Alternatively, as shown in FIG. 5B, the light shielding film 26 may be formed on the outer surface of the translucent addition member 20.
Furthermore, as shown in the embodiment of FIG. 5 (c), the tip of the translucent addition member 20 is formed as a curved convex portion (convex lens) so that the emitted light from the LED chip 10 is condensed. Alternatively, the light emitted from the LED chip 10 may be diffused by making the tip of the translucent addition member 20 a curved concave portion (concave lens) as in the embodiment of (d). .
In the surface-mounted LED 1 according to the embodiment of FIG. 5 as well, the flat surface 20a of the translucent additional member can be used as the suction surface by the suction pad in addition to the flat surface 2a having a narrow area. It becomes possible to improve the efficiency and to make the mounting work more efficient.

(A) And (b) is the perspective view and longitudinal cross-sectional view which show the structure of the diagonally light-emitting surface-mount type LED which concerns on one Embodiment of this invention. It is principal part sectional drawing which shows the modification of this invention. (A) And (b) is principal part sectional drawing of the surface mount type LED which concerns on other embodiment. (A) And (b) is principal part sectional drawing of the surface mount type LED which concerns on other embodiment of this invention. (A) thru | or (d) are sectional drawings of the surface mount type LED which concerns on other embodiment of this invention. (A) And (b) is explanatory drawing of a prior art example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Surface mount type LED, 2 package, 2a flat surface, 2b inclined surface, 3 mounting electrode, 4 cavity, LED for LED, 10 LED chip, 15 encapsulating resin part, 20 translucent additional member, 20a plane, 20b bonding Surface, 22 non-translucent material, 23 light shielding film, 30 printed circuit board, 31 electrode

Claims (7)

A mounting electrode provided at the bottom, a cavity provided at the top and opening obliquely upward, and a package having an LED electrode provided in the cavity, and mounted in the cavity and electrically connected to the LED electrode An LED chip connected to the cavity opening to emit light from the cavity opening,
A flat surface capable of being sucked by a suction pad is formed on the upper surface of the package,
A surface-mount type LED having an inclined surface at a portion corresponding to the cavity opening at the end of the flat surface,
A surface-mount type LED, wherein a translucent additional member having an adsorbable flat surface continuous with the flat surface is fixed to the inclined surface.   The surface-mount type LED according to claim 1, wherein the inner wall of the cavity is a reflective surface.   It has a translucent encapsulating resin portion filled in the cavity, and the encapsulating resin portion and the translucent addition member have a configuration integrally formed of the same material. The surface mount type LED according to claim 1 or 2. A substantially rectangular parallelepiped package having a mounting electrode at the bottom and an obliquely upward inclined surface at one upper corner, and an LED electrode, and the LED electrode and the electric electrode mounted on the inclined surface LED chips that are connected to each other and emit light obliquely upward,
A surface-mounted LED in which a flat surface capable of being sucked by a suction pad is formed on the upper surface of the package excluding the inclined surface,
A surface-mount type LED, wherein a translucent additional member having an adsorbable flat surface continuous with the flat surface is fixed to the inclined surface.   The translucent additional member is made of a non-translucent material except for the region corresponding to the emission path from the LED chip, and the inner wall of the region corresponding to the emission path is a reflective surface. The surface-mounted LED according to claim 1, wherein   The surface-mount type LED according to claim 1, wherein the translucent addition member constitutes a lens having a light collecting property or a diffusing property.   7. The surface according to claim 1, wherein an outer surface of the translucent addition member excluding a region corresponding to an emission path from the LED chip is covered with a light shielding film. Mounting type LED.

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