JP2010126176A - Loop pin connecting device and loop pin driving method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a loop pin connecting device that has an entanglement removing means for actively removing an entanglement if it occurs in a loop pin sheet on the loop pin connecting device. <P>SOLUTION: The loop pin connecting device 20 is provided with the entanglement removing means 50 near the driving part 56 of a socket part 15 or near the driving part 55 of an insertion head 13. The entanglement removing means 50 is configured so as to apply a pressing force to a part of the filament part 12 near the socket 15 or the insertion head 13 in a direction perpendicular to the axial direction of the filament part 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a loop pin coupling device and a loop pin that can bundle tags such as clothing labels, socks, etc., or insert one end of a loop pin into a product to attach a label such as a brand label, a price tag, a material description, or an instruction manual. It relates to the launch method.

In general, various loop pins and loop pin combinations have been used to bind all kinds of clothing items including ties and shirts, everyday items, umbrellas, sandals, shoes, etc., and to efficiently attach brand labels, price tags, etc. to the products. Devices have been used.
The configuration of a specific example of the loop pin 10 in the prior art will be described with reference to FIGS.

  That is, the loop pin 10 according to FIG. 9 includes a flexible filament portion 12, an insertion portion 13 having an appropriate engagement portion 16 provided at one end of the filament portion 12, and the filament portion 12. And having the insertion hole 14 for irreversibly passing the insertion portion 13 provided at the other end of the insertion portion, and engaging with the engagement portions 16 and 16 ′ of the insertion portion 13 in the insertion hole 14. A socket portion 15 provided with a pair of blade portions 17 and 17 'to be mated is provided. However, the above-described conventional loop pin 10 includes the insertion portion 13, the socket portion 15 and the socket portion 15. The filament portion 12 is usually integrally formed with a synthetic resin such as nylon, polypropylene, or polyester.

  Then, for example, as shown in FIG. 10, the loop pin 10 described above may pass, for example, an arbitrary product such as a bag 200 after passing the filament portion 12 through a hole 410 provided in advance in the labels 400. By inserting the filament part 12 in a loop between the handle 300 and the heel body 200 and passing the insertion part 13 through the hole part 14 of the socket part 15 having a function of holding the labels 400, The predetermined labels 400 are locked to the product 200.

  By the way, for example, as shown in FIG. 9, the loop pin 10 described above may be used alone, but in many cases, the loop pin 10 as shown in FIG. A loop pin sheet 600 in which a plurality of 10 are arranged in parallel is used.

  That is, a plurality of individual loop pins 10 shown in FIG. 11 and the filament portions 12 are arranged adjacent to each other in parallel, and the plurality of insertion portions 13 or the vicinity thereof arranged close to each other The plurality of socket portions 15 or the vicinity thereof have structures that are respectively connected to connection bar portions 24 and 24 ′ provided individually, and the vicinity of the insertion portion and the vicinity of the socket portion. Are further connected to the connection bar portions 24, 24 ′ by the connection portions 11, 11 ′.

The above-described loop pin sheet 600 is usually integrally formed of a synthetic resin such as nylon, polypropylene, polyester, etc., as with conventional loop pins.
The loop pin sheet 600 is mounted on a loop pin coupling device 20 as shown in FIG. 12, and each time the operation lever 22 is operated, the loop pin 10 is driven out one by one to attach labels to the product. I can do it.

  FIG. 12 shows a state in which the loop pin 600 is mounted so as to be inserted in the vicinity of a predetermined launching mechanism portion of the loop pin coupling device 20 together with the connection bar portions 24 and 24 ′.

  FIG. 13 is a top plan view of the loop pin coupling device 20. The loop pin coupling device 20 has longitudinal grooves 40 and 41 into which the connection bars 24 and 24 ′ of the loop pin sheet 600 are inserted on the left and right sides. Yes.

  Further, for example, a connection bar 24 ′ for connecting the socket portion 15 in each loop pin 10 constituting the loop pin sheet 600 is inserted into the vertical groove 40, and the insertion portion 13 is inserted into the vertical groove 41. The connecting bar 24 to be connected is inserted. Further, in the loop pin coupling device 20 which is a launching device, a first launching pin 42 which is a first feeding means which is driven by operating the lever 22 shown in the figure is disposed on the side of the longitudinal groove 41, The insertion part 13 is cut off from the connection part 11 ′ of the connection bar 24 and pushed forward one by one along the cylindrical hollow needle 21.

  On the other hand, the socket portion 15 is an appropriate second feeding means along the guide tube 43 constituting the curved hollow guide portion, for example, a second pushing pin or a flexible pushing means 25 by a gear / rack system. And the like, and is pushed out at the distal end portion 44 of the hollow guide portion 43 through the hollow guide portion 21 constituting the hollow needle by the first launch pin 42 described above and fitted into the insertion portion 13. It is configured.

  However, in the above-described conventional loop pin coupling device 20, as shown in FIG. 12, the loop pin sheet 600 is mounted on the loop pin coupling device 20 in a curved state, and the loop pins 10 are continuously connected one by one. When attaching to a specific product so as to form a closed loop together with a tag, label or price tag, the filament portion is greatly curved at the center of the filament portion 12 of each loop pin 10 As for the part which is connected, between the said filament parts in the other loop pin 10 arrange | positioned adjacent to each other, what connects and fixes each said filament parts mutually exists at all. In other words, it is in a free state, that is, in a state where the central part of each filament part can be arbitrarily displaced. It has been.

  Therefore, in this state, when some tension fluctuation or some abnormal force is applied to each filament part 12, the filament part 12 including the central curved part in the free fluctuation state can be easily As a result, displacement, deformation, or displacement occurs, and as a result, the filament portion 12 exhibiting the curved shape of the one loop pin 10 contacts the filament portion 12 exhibiting the curved shape of the other adjacent loop pin 10. The phenomenon of entanglement will occur.

  As a result, when the filament portions 12 of the adjacent loop pins are entangled or fixed in contact with each other, the punched loop pin 10 is not completely fitted into the socket portion 15 and the insertion portion 13, and thereafter When the connection of the loop pin 10 cannot be completed and the label is unsuccessfully attached, or when the next loop pin 10 is launched without knowing that the connection of the loop pin 10 has not been completed, Jam is generated in the hollow guide 21 or the curved guide portion 43, and a long time is required for the take-out operation. This causes a problem that the work efficiency is greatly reduced. This causes a problem that the loop pin coupling device 20 becomes unusable.

This also has adverse effects such as a decrease in reliability of the loop pin 10 and the loop pin coupling device 20, generation of defective products, and cost increase.
On the other hand, with respect to the loop pin coupling device 20, the connection bar portion 24, as shown in FIG. Whereas the upper front plane 70 of the loop pin coupling device provided with the insertion slits 41, 40 into which 24 'is inserted, the upper rear plane 71 of the loop pin coupling device is the front plane. It may be formed at a position higher than the surface of 70.

Furthermore, for example, a loop pin coupling device 20 having a structure as shown in FIG. 7 may be used.
In the loop pin coupling device 20 having such a structure, as shown in FIG. 7B, the width of the loop pin coupling device 20 is reduced to reduce the weight of the loop pin coupling device 20 and improve the operability. The operation when mounting the loop pin sheet on the apparatus 20 is configured so as to be easy and efficient.

However, in the loop pin coupling device 20 having such a structure, a side wall 72 is inevitably formed at the boundary portion between the front plane 70 and the rear plane 71 as shown in FIG. Will be done.
On the other hand, as for the loop pin 10, the thing from which the length of the said filament part 12 differs according to the goods to which it is attached is used normally.

  In that case, when the loop pin sheet is mounted on the loop pin coupling device 20, as shown in FIG. 8, the connection bar portions 24, 24 ′ provided in the vicinity of both ends of the filament portion 12. As a matter of course, the distance M between the position and the curved portion at the center changes depending on the type of the loop pin.

  On the other hand, since the structure of the loop pin coupling device 20 is specified, the distance L between the positions of the insertion slits 41 and 40 of the connection bar portion and the wall portion 72 is fixed to a specific length. Therefore, if the distance M when the loop pin sheet is bent and mounted on the loop pin coupling device 20 is shorter than the distance L, there is no problem. In the case where the distance M is longer than the distance L, the operation when the side wall portion 72 becomes a hindrance is complicated, and at the same time, the side wall portion 72 and the loop pin sheet constitute each of the loop pin seats. The curved tip portion of the loop pin 12 is in strong contact with the side wall portion 72, and the side wall portion 72 and the curved tip portion of the filament portion 12 of the loop pin 12 are rubbed even during the mounting operation. Since the force that is pushed out to the outside of the loop pin coupling device 20 is always received, the curved tip portion formed in the filament portion 12 of each loop pin 10 is displaced or curved. As a result, the twisted shape is deformed, and as a result, an entangled state is generated between the curved tip portions of the filament portions 12 arranged adjacent to each other.

  When the entanglement between the filament parts 12 occurs, when the respective loop pins 10 are driven out, the entangled part is often not eliminated, and therefore a problem that a formal loop cannot be formed is a problem. there were.

Further, as a user of the loop pin coupling device 20, it is inconvenient in terms of operation and cost increase to separately purchase and use a loop pin coupling device suitable for a loop pin having a specific filament length. There was a problem of being connected.
As a method for solving such a conventional problem, for example, a technique as disclosed in JP-A-2005-206171 (Patent Document 1) can be seen.

  That is, according to Patent Document 1, as shown in FIGS. 14 and 15, each loop pin constituting the loop pin sheet 600 mounted in a curved shape on a partial surface of the main body portion of the loop pin coupling device 20. 10 shows a loop pin coupling device in which a pressing member for applying pressing in a predetermined direction is arranged in the vicinity of the curved tip of each filament portion 12 formed in a curved shape, and its basic technical idea is The axial direction of the filament portion 12 of the loop pin 10 in contact with the curved portion of each loop pin 10 in the vicinity of the curved portion of the loop pin 10 in the loop pin sheet 600 in the vicinity of the curved portion. A pressing member 30 for applying a predetermined pressing in a direction orthogonal to the loop wall of each loop pin on the inner wall plane of the loop pin coupling device 20 It is intended to adopt a configuration that is disposed in a portion of the immediate vicinity of Jo the formed part.

However, even with the technique disclosed in Patent Document 1, the problem has not been completely solved.
That is, in the configuration of Patent Document 1, since a pressing force is applied only to the vicinity of the curved tip of the filament portion of the loop pin, the loop pin that has already been entangled. It was difficult to completely separate the filaments, and jamming could not be completely prevented.

Therefore, the inventor of the present application diligently studied the cause of the entanglement in the filament part of the loop pin and the method for eliminating the entangled part.
As a result, it has become clear that, as shown in FIG. 2 (A), the entangled structure is mounted on the loop pin coupling device, and the filament portion constituting the plurality of loop pins is included. FIG. 2B shows an inner entanglement type in which the loop portion of the filament portion 12L of the loop pin positioned on the lower side enters the inside of the loop portion of the filament portion 12U of the loop pin positioned immediately above the loop portion. Similarly, the loop portion of the filament portion 12U of the loop pin positioned immediately above is formed inside the loop portion of the filament portion 12L of the loop pin positioned on the lower side among the filament portions constituting the plurality of loop pins. As shown in FIG. 2 (C), the outer entanglement type is positioned on the lower side of the filament portion constituting the plurality of loop pins. It turns out that there is a double entanglement type in which the filament parts 12L1 and 12L2 of the two loop pins that enter into the loop part of the filament part 12U of the loop pin located immediately above the loop part did.

  Further, the entanglement between the filaments of the inner entanglement type shown in FIG. 2 (A) can be eliminated relatively easily by vibration or other pressing force, but as shown in FIG. 2 (B). It is difficult to easily eliminate the entanglement between the external entanglement type and the double entanglement type shown in FIG.

  In addition, the inner entanglement type mainly vibrates or swings the upper part of the loop pin sheet in which the filament portion is formed in a curved shape when mounted on the loop pin coupling device. It often occurs when the lower part of the loop pin sheet is fixed, and the upper part is bent by about 90 degrees in the direction in which the filament part on which the loop on the curve exists is present. It has been found that this is likely to occur even when the product is taken out from the packaging case.

  On the other hand, the external entanglement type is mainly generated by bending the lower part of the loop pin sheet in the direction in which the filament part in which the curved loop is formed is approximately 90 degrees in a state where the upper part of the loop pin sheet is fixed. In many cases, the situation is such that when the loop pin sheet is mounted on the loop pin coupling device, or the loop pin sheet mounted on the loop pin coupling device is gradually lowered in response to the launching operation. It turns out that it is easy to occur when moving to.

  In addition, the external entanglement type can be used while the loop pin sheet is being stored in the packaging case or taken out from the case, and during the operation of mounting the loop pin sheet on the loop pin coupling device. It turns out that it is easy to occur.

  On the other hand, the double entanglement type is particularly a loop pin coupling device of the type as shown in FIG. 7, and in particular, a filament portion in which the curved loop is formed in the loop pin coupling device in which the side wall portion 72 is formed. It has been found that this often occurs when mounting a loop pin sheet having a pin and during the operation of driving the loop pin sheet after mounting.

  The reason for this is that the tip of the filament portion of the loop pin formed in the curved shape is twisted in the loop portion that receives the force of being pushed horizontally in the lateral direction of the loop pin coupling device in the presence of the side wall portion 72. At the same time, the top end of the filament portion of the loop pin formed in the curved shape at the lowermost end abuts against the collar portion of the loop pin coupling device 300 and receives an upward bias force. It is considered that the double inner entangled structure is generated when the filament portions of the loop pins that have been uniformly formed are disturbed in the alignment.

Another factor is that in one loop pin sheet, the tip of the curved portion formed in each filament portion does not maintain a uniform curved shape, and a part of the curved pin shape has a curved shape. If the portion has a shape close to a V-shape, for example, it has been found that the above-described entanglement structure is likely to occur. For this purpose, the loop pin sheet is folded to have a curved portion. It has been found necessary to adopt a pressing method that forms a uniform curved portion when forming the filament portion.
JP 2005-206171 A

  Therefore, the present invention actively eliminates the entanglement portion at the same time when the entanglement as described above occurs in the loop pin sheet on the loop pin coupling device. The object is to give the loop pin coupling device a structure that does not generate the entanglement portion.

  In order to achieve the above-described object, the present invention basically employs a configuration as described below. That is, the first aspect of the present invention basically employs a configuration as described below.

  That is, the first aspect of the present invention includes a flexible filament part, an insertion head having an appropriate engagement part provided at one end of the filament part, and the other end of the filament part. A loop pin sheet formed such that a plurality of loop pins composed of a socket part having a hole part for irreversibly passing the insertion head provided in a part are arranged in parallel with each other; A loop pin coupling device that is configured to be inserted and mounted in a predetermined portion of the main body portion in a state where the filament portion is bent in a curved manner, and to sequentially eject the individual loop pins. The insertion head is sent out from the first portion of the main body portion of the loop pin coupling device to the front of the coupling device via the first feeding means, and the socket portion is connected to the coupling device. The second part different from the first part is fed to the front of the coupling device via the second feeding means, and both are fitted to each other in front of the loop pin coupling device. In the loop pin coupling device, at least in the vicinity of the launching part of the socket part or in the vicinity of the launching part of the insertion head, the proximity to the socket part or the insertion head A loop pin coupling device characterized in that a part of the filament part is provided with a tangle eliminating means configured to apply a pressing force in a direction crossing the axial direction of the filament part. The second aspect of the present invention is an insertion having a flexible filament portion and an appropriate engagement portion provided at one end of the filament portion. A plurality of loop pins each having a hole portion for irreversibly passing the insertion head provided at the other end of the filament portion and arranged in parallel with each other. The loop pin sheet formed as described above is inserted and mounted on a predetermined portion of the main body with the filament portion bent in a curved shape, and the loop pin coupling device is configured to sequentially eject the individual loop pins. When the feeding head is sent out from the first part of the main body portion of the loop pin coupling device to the front of the coupling device via the first feeding means, the socket portion is connected to the coupling device. The second part different from the first part is fed to the front of the coupling device via the second feeding means, and both are fitted to each other in front of the loop pin coupling device. When using the loop pin coupling device configured to tighten, at least one of the vicinity of the socket portion and the vicinity of the insertion portion of the insertion head is the socket portion or the insertion portion. The loop pin driving method is characterized in that a pressing force is applied to a part of the filament portion adjacent to the head in a direction crossing the axial direction of the filament portion.

  Since the present invention adopts the technical configuration as described above, it is possible to prevent the occurrence of jamming in advance by effectively removing the mutual entanglement in the filament portion of the loop pin that has frequently occurred in the past. Provided is a loop pin coupling device that can greatly improve the working efficiency and at the same time prevent the occurrence of the entanglement between the filament portions.

  A configuration of a specific example of the loop pin coupling device according to the present invention will be described in detail with reference to the drawings.

  That is, FIG. 1 is a diagram showing an example of the configuration of one specific example of the first aspect according to the present invention. In the drawing, a flexible filament portion 12 and one end portion of the filament portion 12 are shown. And a socket portion 15 having a hole for irreversibly passing the insertion head 13 provided at the other end of the filament portion 12. A loop pin sheet 600 formed such that a plurality of loop pins 10 constituted by the above are arranged in parallel with each other through an appropriate connection bar portion 24, and the filament portion 12 is bent in a curved shape. The loop pin coupling device 20 is configured to be inserted and mounted in a predetermined portion of the main body portion in a state and sequentially eject the individual loop pins 10, and the loop pin coupling device 20 The first pin 55 of the main body of the loop pin coupling device 20 is fed to the front of the coupling device 20 via the first feeding means 42, and the socket portion 15 is moved to the first portion of the coupling device 20. The second portion 56 different from the portion 55 is sent to the front of the coupling device 20 via the second feeding means 25, and both are fitted to each other in front of the loop pin coupling device 20. In the loop pin coupling device 20, the socket portion 15 or the insertion portion is at least in the vicinity of the launch portion 56 of the socket portion 15 or in the vicinity of the launch portion 55 of the insertion head 13. It is configured to apply a pressing force toward a direction intersecting the axial direction of the filament portion 12 to a part of the filament portion 12 adjacent to the head portion 13. And it is tangled eliminating means 50 is shown Rupupin coupling device 20 is provided.

  The inventor of the present application, as a result of diligent study to solve the above-mentioned problems, shows the loop pin sheet in which a plurality of loop pins having a filament portion bent in a curved shape are arranged in parallel on the loop pin coupling device. When mounted on the loop pin, at one end of each loop pin, in the vicinity of the loop pin launch position of the loop pin coupling device, the filament portion of each loop pin is substantially orthogonal to the arrangement direction of the filament portion. It is known that it is effective to apply a pressing force in the direction and to release the pressing force from the filament portion immediately before the loop pin is driven out.

  That is, in the present invention, in the inner side wall portions 60 and 61 of the loop pin coupling device 20, in the vicinity of the portions 55 and 56 where at least one end of the filament portion 12 is driven out, A pressing force is applied to the filament portion 12 in a direction substantially orthogonal to the arrangement direction of the filament portion 12, and the pressing force is released from the filament portion 12 immediately before the loop pin 10 is driven, that is, the pressing force is reduced. An entanglement eliminating means 50 configured to be removed from the filament portion is arranged.

  In the entanglement eliminating means 50, the pressing force applied to the filament portion 12 may be a constant or fixed pressing force. Preferably, the pressing force is the respective pressing force. It is desirable that the size of the loop pin gradually increase as the loop pin descends.

  In other words, while the individual loop pins 10 are gradually descending from above toward the portion 55 or 56 where the individual loop pins 10 are driven out by the entanglement eliminating means 50 according to the present invention, FIG. As shown, the amount X of displacement of the filament portion 12 in each loop pin 10 from the arrangement position P at the time of insertion and mounting to the loop pin coupling device 20 toward the inside of the bending portion gradually increases. It is configured as follows.

  In the present invention, the pressing force applied to each filament 12 operates to displace a part of the filament portion of each loop pin toward the inside of the curved shape portion of the filament portion 12. It has been deliberately deformed until then by removing the applied pressing force immediately before the loop pin is driven out, by changing the arrangement state, giving a predetermined displacement and twisting or twisting in advance. Since the filament portion 12 of the loop pin 10 performs an operation of returning to its original state by the reaction, the structure of the entangled portion can be eliminated by the repulsive force.

  That is, by applying the pressing force to each filament part 12 and the momentary release action of the pressing force, the position between the adjacent and intertwined filaments 12 is changed, and the loop shape is It is presumed that the entanglement is eliminated by a combination of slightly expanding.

  As described above, in the present invention, the entanglement eliminating unit 50 is configured so that the loop pin 10 in a state immediately before receiving the operation to be driven out from the loop pin coupling device 20 is from the pressing force applying member 51 of the entanglement eliminating unit 50. Even when the pressing force is released by sliding down, the filament portions 12 of the successive loop pins 10 are still left on the inclined surface of the pressing force application member 51 and receive the pressing force. It is important to create a situation that is structured to continue.

  The entanglement eliminating means 50 according to the present invention may be used in a loop pin coupling device having the structure shown in FIG. 7 as shown in FIG. It may be used for a loop pin coupling device having a structure as shown in FIG.

  The cross-sectional shape of the entanglement eliminating means 50 viewed along the axial direction of the filament portion 12 of the loop pin 10 mounted on the loop pin coupling device 20 is not particularly limited. It is desirable to have a shape that approximates a triangle.

  Further, when the entanglement eliminating means 50 used in the present invention has a triangular side cross-sectional shape, the third edge portion 91 joined to the inner side wall surfaces 60 and 61 of the loop pin coupling device 20 is used. And a first pressing force application member 51 composed of an inclined portion in which a plurality of the filament portions formed at a predetermined angle with respect to the third edge portion 91 can simultaneously engage and slide. And a steep slope for guiding the filament portion 12 formed from the end portion of the first edge portion 93 toward the third edge portion 91 toward the loop pin launching portions 55 and 56. It may be configured with a second edge portion 92 that functions as a pressing force release member 52 composed of a portion.

  The first edge portion 93 preferably has one shape selected from an uneven linear shape, a convex curved shape, and a concave curved shape, and the filament portion 12 easily slides on the surface thereof. Shape and structure.

  Further, the length of the first edge portion 93 needs to be such a length that the filament portions 12 constituting the plurality of loop pins 10 arranged continuously can be simultaneously engaged. .

  On the other hand, the height H from the third edge portion 91 of the intersection 94 of the first edge portion 93 and the second edge portion 92 is the filament portion 12 of the loop pin 10 immediately before receiving the punching operation. However, since the impact force received when the pressing force is released is determined, the height H is determined in consideration of the thickness, material, hardness, etc. of the filament portion 12 of the loop pin 10 to be used. It is possible to do.

The configuration of a specific example of the entanglement eliminating means 50 according to the present invention will be described in more detail with reference to FIGS.
That is, as shown in FIG. 3, the entanglement eliminating means 50 according to the present invention has at least a cross-sectional shape viewed from the arrangement direction of the filament portions 12, that is, the launch direction of the loop pins 10, at least. A pressing force applying member 51 for applying a pressing force in a direction substantially perpendicular to the direction, and a pressing force releasing member 52 having a function of releasing or removing the pressing force from the filament portion 12 immediately before the loop pin is driven out. It is configured.

  If a specific example of the configuration of the entanglement eliminating unit 50 according to the present invention is described more specifically, the configuration of the entanglement eliminating unit 50 is changed from the axial direction of the filament portion 12 as shown in FIG. 3 or FIG. When viewed, the first edge portion 93 functioning as the pressing force application member 51 of the filament portion 12 composed of an inclined portion having a predetermined angle and a predetermined length, and one of the pressing force application members 51 A second edge portion 92 that functions as the pressing force release member 52 that drops at an acute angle from the end portion toward the bottom edge portion 53, and a bottom edge portion that is joined to the appropriate inner side wall portions 60 and 61 of the loop pin coupling device 20 The cross section constituted by the third edge 91 constituting 53 has a substantially triangular shape.

The base 53 in the entanglement eliminating means 50 constitutes a joint surface that is joined and fixed to an appropriate inner side wall of the loop pin coupling device.
On the other hand, the shape in the thickness direction of the entanglement eliminating means 50 according to the present invention may be a plate having a uniform thickness as shown in FIG. 17, or the filament as shown in FIG. The shape seen from the direction orthogonal to the arrangement direction of the parts 12 may form, for example, a divergent isosceles triangle.

  Of course, the shape of the entanglement eliminating means 50 according to the present invention viewed from the direction orthogonal to the arrangement direction of the filament portions 12 is not limited to the isosceles triangle, and any shape can be used. Needless to say.

Further, the cross section of the entanglement eliminating means 50 viewed from the line AA in FIG. 5A has a cross-sectional shape such as a triangle, trapezoid, or semicircle as shown in FIG. 5B. It may be.
Therefore, as an example of the external shape of the entanglement eliminating means 50 according to the present invention, it may have a triangular pyramid shape.

  Furthermore, in the present invention, as shown in FIGS. 4 and 6, the entanglement eliminating means 50 is driven out by the insertion portion 13 or the socket portion 15 in each filament portion 12 of the loop pin sheet 600. Arranged on the surface of the inner side wall portions 60 and 61 of the loop pin coupling device formed in the vicinity of the portions 55 and 56 to be inserted and in the vicinity of the portion where the insertion portion 13 or the socket portion 15 is driven out It may be.

  The specific examples shown in FIGS. 4 and 6 show an example in which the entanglement eliminating means 50 is attached to the inner side wall surface 60 formed in the vicinity of the portion 56 where the socket portion 15 is driven out.

  The material of the entanglement eliminating means 50 in the present invention is not particularly limited, and any known metal, synthetic resin, wood material, or composite material can be used as long as the material can smoothly slide with the filament portion 12. Further, the entanglement eliminating means 50 may be bonded to the inner side wall 60 or 61 of the loop pin coupling device by using appropriate bonding means, or as appropriate. It may be attached detachably using the detachable means.

Furthermore, the entanglement eliminating means 50 according to the present invention may be formed integrally with the inner side wall 60 or 61 of the loop pin coupling device.
Various dimensions in the entanglement eliminating means 50 in the present invention are not particularly limited, but the pressing force application is considered in consideration of the material, hardness, strength, resilience, etc. of the loop pin used. The length of the member 51 and the inclination angle thereof, and the height H and the inclination angle of the pressing force release member 52 can be appropriately set.

The inclination angle of the pressing force release member 52 may be vertical.
More specifically, the bottom 53 of the entanglement eliminating means 50, that is, the length L1 of the third edge 91 shown in FIG. 3 is 12 mm to 16 mm, and the maximum height H of the entanglement eliminating means 50 is 7 It is preferable that the length L2 of the bottom 53 extended by the inclined edge 92 of the pressing force release member 52 is 0.5 to 1.5 mm.

On the other hand, the maximum width W1 shown in FIG. 5 of the entanglement eliminating means 50 in the present invention is preferably 8 to 12 mm.
Furthermore, the width W2 of the pressing force applying member 51 in the entanglement eliminating means 50 is preferably 0.5 to 2 mm, and the contact surface of the pressing force applying member 51 with the filament portion 12 is It may be a flat surface, or may be configured with a sharp end, and may further be provided with an R-shaped chamfer.

Next, the arrangement position of the entanglement eliminating means 50 in the present invention with respect to the loop pin coupling device will be described.
As described above, the entanglement eliminating means 50 is disposed in the inner side wall portion 60 or 61 of the loop pin coupling device in the vicinity of the portions 55 and 56 where the socket portion 15 or the insertion portion 13 is driven out. It is desirable to do.

  With such a configuration, a stronger and larger displacement force, twisting force, expansion force, and the like are applied to the entangled portion generated at the curved tip portion of the filament portion 12.

  More specifically, as shown in FIG. 6, when the entanglement eliminating means 50 is attached to the inner side wall portion 60 of the loop pin coupling device, the groove portion 40 from which the socket portion 15 of the loop pin 10 descends. The distance R1 from the edge 48 to the central portion 57 of the entanglement eliminating means 50 is preferably set to 7 to 8.5 mm, and the end of the pressing force applying member 51 of the entanglement eliminating means 50 The length R2 from 58 to the launch position of the socket portion 15 of the loop pin coupling device 20 is preferably set to 5.5 to 7.0 mm.

  Since the entanglement eliminating means 50 according to the present invention has the above-described configuration, the loop pin sheet 600 in which the loop pins 10 composed of a plurality of filament parts 12 bent in the curved shape are arranged in parallel. Even when the loop pins 10 are mounted and the respective loop pins 10 are gradually lowered, it is possible to eliminate the opportunity for the filament portions 12 of the adjacent loop pins to be entangled with each other as in the prior art. .

That is, the entanglement eliminating means 50 according to the present invention has a function of preventing in advance the occurrence of entanglement between filament parts, which has been a problem in the past.
Furthermore, as another specific example of the entanglement eliminating means 50 in the present invention, as shown in FIG. 16, the first edge portion 93 forms a dent-like loose curved surface 95. It is.

  With this configuration, the filament portion 12 slides while effectively descending the upper surface of the curved first edge portion 93, and at the same time, at the lower end portion 96 of the curved first edge portion 93. Thus, the filament portion 12 is once stopped reliably.

  As a result, the sliding movement of the filament portion 12 is efficiently executed, and at the same time, it is possible to clearly set the supply timing and the standby timing of the filament portion 12 to the launch site, thereby reducing the work efficiency. Will be improved.

  Further, since the entanglement eliminating means 50 according to the present invention has the second edge portion 92 that changes sharply, the operation of removing the loop pin sheet 600 from the loop pin coupling device in the middle for some reason. When necessary, the removal operation can be easily performed by pulling up the filament portion 12 along the second edge portion 92.

  Next, another specific example of the entanglement eliminating means 50 according to the present invention will be described. As shown in FIG. 18, the entanglement eliminating means 50 can be detachably attached to the loop pin coupling device 20. It may be configured to be fixed or detachably attached to a part of the regulation guide member 32 for the sheet 600.

  That is, for example, by using a regulation guide member for a loop pin sheet that can be detachably attached to the loop pin coupling device 20 already disclosed in Japanese Patent Laid-Open No. 2006-160367 by the applicant of the present application, the regulation guide member 32 is used. The entanglement eliminating means 50 according to the present invention is fixedly arranged on a part of the auxiliary leg 33 used for detachably fixing to a part of the loop pin coupling device 20. is there.

  In the second aspect of the present invention, a flexible filament portion, an insertion head having an appropriate engagement portion provided at one end of the filament portion, and the filament portion A loop pin formed in such a manner that a plurality of loop pins composed of a socket portion having a hole portion for irreversibly passing the insertion head portion provided at the other end portion are arranged in parallel to each other. A loop pin coupling device configured to insert and mount a sheet into a predetermined portion of a main body portion with the filament portion bent in a curved shape, and sequentially eject the individual loop pins, the insertion head portion Is sent out from the first part of the main body portion of the loop pin coupling device to the front of the coupling device via the first feeding means, and the socket portion is connected to the first portion in the coupling device. A loop pin coupling device configured to be fed out from the second part different from the part through the second feeding means to the front of the coupling device and to be fitted to each other in front of the loop pin coupling device Is used, at least one of the filament part adjacent to the socket part or the insertion head in the vicinity of the launch part of the socket part or the vicinity of the insertion part of the insertion head. The loop pin driving method is characterized in that a pressing force directed in a direction crossing the axial direction of the filament portion is applied to the portion.

  In the second aspect of the present invention, the pressing force is a predetermined number of consecutive loop pins approaching the launch position among the plurality of loop pins constituting the loop pin sheet. It is preferable to be configured to be applied to the filament portion of the loop pin, and furthermore, the pressing force applied to the filament portion is lowered toward the site where the individual loop pin is driven out. It is also desirable to be configured to gradually increase during

  Further, in the second aspect of the present invention, the pressing force applied to the filament portion of the individual loop pin is released immediately before the loop pin is subjected to an operation for driving out from the loop pin coupling device. It is one of the desirable specific examples to be configured as described above.

FIG. 1 is a diagram for explaining an arrangement position of the entanglement eliminating means 50 in the present invention. FIG. 2 is a diagram illustrating a state in which loop pins are entangled with each other in the loop pin coupling device according to the present invention. FIG. 3 is a diagram for explaining a specific example of the configuration of the entanglement eliminating means used in the present invention. FIG. 4 is a view showing one specific example of the attachment position of the entanglement eliminating means according to the present invention with respect to the loop pin coupling device. FIG. 5 is a diagram for explaining a specific example of the configuration of the entanglement eliminating means used in the present invention. FIG. 6 is a diagram showing one specific example of the attachment position of the entanglement eliminating means according to the present invention with respect to the loop pin coupling device. FIG. 7 is a perspective view showing an example of the configuration of a conventional loop pin coupling device. FIG. 8 is a diagram for explaining the engagement relationship between the loop pin bent in a curved shape and the loop pin coupling device. FIG. 9 is a side view for explaining the structure of the loop pin used in the present invention. FIG. 10 is a diagram for explaining a use state of the loop pin according to the present invention. FIG. 11 is a diagram illustrating the configuration of a specific example of the loop pin sheet used in the present invention. FIG. 12 is a diagram for explaining the configuration of one specific example of a conventional loop pin coupling device and the state of use thereof. FIG. 13 is a top plan view showing a configuration of a conventional loop pin coupling device. FIG. 14 is a perspective view showing an example of the configuration of a conventional loop pin coupling device. FIG. 15 is a top plan view showing an example of the configuration of a conventional loop pin coupling device. FIG. 16 is a side view showing the configuration of another specific example of the loop pin coupling device according to the present invention. FIG. 17 is a front view showing the configuration of another specific example of the loop pin coupling device according to the present invention. FIG. 18 is a perspective view showing the configuration of still another specific example of the loop pin coupling device according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Loop pin 11 Connection part 12 Filament part 13 Insertion part 14 Hole part 15 Socket part 16 Engagement part 17 Blade part 20 Loop pin coupling apparatus 20 Loop pin coupling apparatus 21 Hollow needle 22 Lever 24 Connection bar part 25 2nd sending means 40 Connection bar Part insertion groove part 41 longitudinal groove part 42 first feeding means 43 curved guide tube 48 edge part 50 of groove part 40 entanglement eliminating means 5
51 pressing force applying member 52 pressing force releasing member 53 bottom surface portion, joint portion 55 first launching portion 56 second launching portion 57 central portion of the entanglement eliminating means 58 end portion of the pressing force applying member 51 60 inside of the loop pin coupling device Side wall portion 61 Internal side wall portion of loop pin coupling device 91 Third edge portion 92 Second edge portion 93 First edge portion 200 Product 300 Part of product 400 Label, tag portion 600 Loop pin sheet

Claims (19)

  An insertion head having a flexible filament portion, an appropriate engagement portion provided at one end of the filament portion, and the insertion head provided at the other end of the filament portion A loop pin sheet formed such that a plurality of loop pins composed of a socket portion having a hole portion for irreversibly passing the wire is arranged in parallel with each other, and the filament portion is bent in a curved shape. The loop pin coupling device is configured to be inserted and mounted in a predetermined part of the main body in a state, and to sequentially eject the individual loop pins. The loop pin coupling device includes the insertion head portion of the loop pin coupling device. The first portion of the main body portion is fed forward of the coupling device via the first feeding means, and the socket portion is different from the first portion of the coupling device. In the loop pin coupling device configured to be fed out from the part through the second feeding means to the front of the coupling device and to be fitted to each other in front of the loop pin coupling device, at least the In either the vicinity of the launching part of the socket part or the vicinity of the launching part of the insertion head, a part of the filament part adjacent to the socket part or the insertion head is attached to the filament part. A loop pin coupling device, characterized in that entanglement eliminating means configured to apply a pressing force in a direction crossing the axial direction is provided.   The pressing force applied to the filament portion by the entanglement eliminating means is a predetermined number of continuous ones that are approaching at least the projecting portion of the loop pin among the plurality of loop pins constituting the loop pin sheet. The loop pin coupling device according to claim 1, wherein the loop pin coupling device is configured to be applied to the filament portion of the loop pin.   The pressing force applied by the entanglement eliminating means is applied to a part of the filament part adjacent to the insertion head or the socket part of the loop pin, and a part of the filament part is applied to the filament part. 3. The loop pin coupling device according to claim 1, wherein the loop pin coupling device operates so as to be displaced toward an inner direction of the curved shape portion.   The entanglement eliminating means is characterized in that the pressing force applied to the filament portion is configured to gradually increase while the individual loop pins are lowered toward the portion to be driven out. The loop pin coupling device according to any one of claims 1 to 3.   The entanglement eliminating means is configured so that the filament portion of each loop pin is moved from the arrangement position at the time of insertion mounting to the loop pin coupling device while the individual loop pins are lowered toward the portion to be driven out. The loop pin coupling device according to claim 3 or 4, wherein the amount of displacement toward the inside of the bending portion is gradually increased.   The said pressing force is comprised so that it may apply with respect to the said filament part in the direction substantially orthogonal to the center axis line of the said filament part, The Claim 1 thru | or 5 characterized by the above-mentioned. Loop pin coupling device.   The entanglement eliminating means is configured to release the pressing force applied to the filament portion of the individual loop pin from the filament portion immediately before receiving the operation of driving the loop pin from the loop pin coupling device. The loop pin coupling device according to any one of claims 1 to 6, wherein   Even when the pressing force is released from the loop pin in a state immediately before receiving the operation to be punched out from the loop pin coupling device, the entanglement eliminating means still keeps the filament portions of the subsequent continuous plural loop pins. The loop pin coupling device according to claim 7, wherein the loop pin coupling device is configured to continue to receive a pressing force.   The entanglement eliminating means has a cross-sectional shape viewed along the axial direction of the filament portion of the loop pin mounted on the loop pin coupling device having a shape approximated to a triangular shape or a substantially triangular shape. The loop pin coupling device according to any one of claims 1 to 8,   The entanglement eliminating means includes a third edge joined to the inner side wall surface of the loop pin coupling device, and a plurality of filament parts formed at a predetermined angle with respect to the third edge at the same time. A first edge portion having an inclined portion that can be engaged and slid, and the filament portion formed from the end portion of the first edge portion toward the third edge portion is directed to the loop pin launching portion. The loop pin coupling device according to any one of claims 1 to 9, wherein the loop pin coupling device comprises a second edge portion formed of a steep inclined portion that is guided.   11. The loop pin coupling device according to claim 10, wherein the first edge portion has one shape selected from an uneven linear shape, a convex curved shape, and a concave curved shape.   11. The length of the first edge portion is such that at least the filament portions constituting the plurality of loop pins arranged continuously can be simultaneously engaged. Or the loop pin coupling device according to 11.   The height of the intersection of the first edge and the second edge from the third edge is that the filament part of the loop pin immediately before receiving the punching operation is released from the pressing force. The loop pin coupling device according to any one of claims 10 to 12, wherein an impact force received at the time is determined.   The loop pin coupling device according to any one of claims 1 to 13, wherein the first edge portion forms a curved portion of a concave line.   The loop pin coupling device according to any one of claims 1 to 14, wherein the entanglement eliminating means is configured to be detachably attached to the loop pin coupling device.   An insertion head having a flexible filament portion, an appropriate engagement portion provided at one end of the filament portion, and the insertion head provided at the other end of the filament portion A loop pin sheet formed such that a plurality of loop pins composed of a socket portion having a hole portion for irreversibly passing the wire is arranged in parallel with each other, and the filament portion is bent in a curved shape. A loop pin coupling device that is configured to be inserted and mounted in a predetermined portion of the main body portion in a state, and to sequentially eject the individual loop pins. When feeding from the part to the front of the coupling device through the first feeding means, the socket part is moved from the second part different from the first part in the coupling device to the second part. When using a loop pin coupling device configured to feed the coupling device forward through the feeding means and to fit both of them together in front of the loop pin coupling device, at least the launching portion of the socket portion In a direction intersecting the axial direction of the filament part in the socket part or a part of the filament part adjacent to the insertion head in the vicinity of the insertion part or the vicinity of the launching part of the insertion head A method of driving a loop pin, characterized in that a pressing force directed toward the surface is applied.   The pressing force is configured to be applied to the filament portions of a predetermined number of the loop pins that are continuously approaching the launch position among the plurality of loop pins constituting the loop pin sheet. The loop pin driving method according to claim 14, wherein:   16. The pressing force applied to the filament portion is configured to gradually increase while the individual loop pins are descending toward the portion to be driven out. Loop pin launching method described in 1.   15. The structure according to claim 14, wherein the pressing force applied to the filament portion of each individual loop pin is released immediately before the loop pin is subjected to an operation of driving out from the loop pin coupling device. The loop pin driving method according to any one of 1 to 16.

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