JP2010117161A - 検査装置 - Google Patents

検査装置 Download PDF

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Publication number
JP2010117161A
JP2010117161A JP2008288794A JP2008288794A JP2010117161A JP 2010117161 A JP2010117161 A JP 2010117161A JP 2008288794 A JP2008288794 A JP 2008288794A JP 2008288794 A JP2008288794 A JP 2008288794A JP 2010117161 A JP2010117161 A JP 2010117161A
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JP
Japan
Prior art keywords
film thickness
thickness distribution
unit
substrate
inspection apparatus
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Pending
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JP2008288794A
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English (en)
Japanese (ja)
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JP2010117161A5 (enExample
Inventor
Kazuhiko Fukazawa
和彦 深澤
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Nikon Corp
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Nikon Corp
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Priority to JP2008288794A priority Critical patent/JP2010117161A/ja
Publication of JP2010117161A publication Critical patent/JP2010117161A/ja
Publication of JP2010117161A5 publication Critical patent/JP2010117161A5/ja
Pending legal-status Critical Current

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JP2008288794A 2008-11-11 2008-11-11 検査装置 Pending JP2010117161A (ja)

Priority Applications (1)

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JP2008288794A JP2010117161A (ja) 2008-11-11 2008-11-11 検査装置

Applications Claiming Priority (1)

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JP2008288794A JP2010117161A (ja) 2008-11-11 2008-11-11 検査装置

Publications (2)

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JP2010117161A true JP2010117161A (ja) 2010-05-27
JP2010117161A5 JP2010117161A5 (enExample) 2012-07-12

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JP2008288794A Pending JP2010117161A (ja) 2008-11-11 2008-11-11 検査装置

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9036895B2 (en) 2012-05-10 2015-05-19 Samsung Electronics Co., Ltd. Method of inspecting wafer
JPWO2020250868A1 (enExample) * 2019-06-10 2020-12-17
CN114659451A (zh) * 2020-12-22 2022-06-24 松山湖材料实验室 膜厚测量方法及测量装置
JP2022179471A (ja) * 2021-05-21 2022-12-02 浜松ホトニクス株式会社 膜厚測定装置及び膜厚測定方法
EP4431867A1 (de) * 2023-03-17 2024-09-18 Confovis GmbH Verfahren zum erstellen eines schichtdickenvariationsprofils einer oberflächenschicht eines substrates
JP7788358B2 (ja) 2021-05-21 2025-12-18 浜松ホトニクス株式会社 膜厚測定装置及び膜厚測定方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61182507A (ja) * 1985-02-08 1986-08-15 Nec Kansai Ltd 膜厚測定装置
JPS6457107A (en) * 1987-08-28 1989-03-03 Hitachi Ltd Measuring method of distribution of film thickness and apparatus therefor
JPH1047926A (ja) * 1996-08-07 1998-02-20 Dainippon Screen Mfg Co Ltd 膜厚測定装置および膜厚測定方法
JP2001091222A (ja) * 1999-09-17 2001-04-06 Dainippon Screen Mfg Co Ltd 膜厚測定装置の校正方法および膜厚測定装置および校正用部材
JP2002039718A (ja) * 2000-07-19 2002-02-06 Olympus Optical Co Ltd 薄膜の合否判定方法および装置
JP2005221401A (ja) * 2004-02-06 2005-08-18 Dainippon Printing Co Ltd 膜厚測定方法および装置
JP2008139065A (ja) * 2006-11-30 2008-06-19 Nikon Corp 膜評価装置及び膜評価方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61182507A (ja) * 1985-02-08 1986-08-15 Nec Kansai Ltd 膜厚測定装置
JPS6457107A (en) * 1987-08-28 1989-03-03 Hitachi Ltd Measuring method of distribution of film thickness and apparatus therefor
JPH1047926A (ja) * 1996-08-07 1998-02-20 Dainippon Screen Mfg Co Ltd 膜厚測定装置および膜厚測定方法
JP2001091222A (ja) * 1999-09-17 2001-04-06 Dainippon Screen Mfg Co Ltd 膜厚測定装置の校正方法および膜厚測定装置および校正用部材
JP2002039718A (ja) * 2000-07-19 2002-02-06 Olympus Optical Co Ltd 薄膜の合否判定方法および装置
JP2005221401A (ja) * 2004-02-06 2005-08-18 Dainippon Printing Co Ltd 膜厚測定方法および装置
JP2008139065A (ja) * 2006-11-30 2008-06-19 Nikon Corp 膜評価装置及び膜評価方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9036895B2 (en) 2012-05-10 2015-05-19 Samsung Electronics Co., Ltd. Method of inspecting wafer
CN113994199B (zh) * 2019-06-10 2024-10-18 东京毅力科创株式会社 基板处理装置、基板检查方法和存储介质
JPWO2020250868A1 (enExample) * 2019-06-10 2020-12-17
WO2020250868A1 (ja) * 2019-06-10 2020-12-17 東京エレクトロン株式会社 基板処理装置、基板検査方法、及び記憶媒体
CN113994199A (zh) * 2019-06-10 2022-01-28 东京毅力科创株式会社 基板处理装置、基板检查方法和存储介质
US20220252507A1 (en) * 2019-06-10 2022-08-11 Tokyo Electron Limited Substrate processing apparatus, substrate inspecting method, and storage medium
JP7282171B2 (ja) 2019-06-10 2023-05-26 東京エレクトロン株式会社 基板処理装置、基板検査方法、及び記憶媒体
TWI848121B (zh) * 2019-06-10 2024-07-11 日商東京威力科創股份有限公司 基板處理裝置、基板檢查方法及記錄媒體
CN114659451A (zh) * 2020-12-22 2022-06-24 松山湖材料实验室 膜厚测量方法及测量装置
CN114659451B (zh) * 2020-12-22 2025-01-28 松山湖材料实验室 膜厚测量方法及测量装置
JP2022179471A (ja) * 2021-05-21 2022-12-02 浜松ホトニクス株式会社 膜厚測定装置及び膜厚測定方法
JP7788358B2 (ja) 2021-05-21 2025-12-18 浜松ホトニクス株式会社 膜厚測定装置及び膜厚測定方法
EP4431867A1 (de) * 2023-03-17 2024-09-18 Confovis GmbH Verfahren zum erstellen eines schichtdickenvariationsprofils einer oberflächenschicht eines substrates

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