JP2010110896A - Packaging material used in isotropic hydrostatic pressure forming method - Google Patents
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本発明は、積層セラミック電子部品等を製造する際の一工程として用いられる等方静水圧成形法において、被成形物を包装するために用いる包装材フィルム、袋、及びその製造方法に関する。 The present invention relates to a packaging material film, a bag, and a method for producing the same, which are used for packaging an object to be molded in an isotropic isostatic pressing method used as a step in producing a multilayer ceramic electronic component or the like.
積層セラミックス電子部品の製造において、セラミックシートを圧着成形する工程があり、その圧着方法として、等方静水圧成形法（静水圧プレス方式）が好まれている（特許文献１）。
静水圧プレス方式では、圧着成形したいセラミックシートの積層体をプラスチックフィルムのような柔軟材の袋等で真空包装した後に、温水ラミネーター等に入れて静水圧プレスを行う。この際に用いる柔軟材として、可撓性のある素材、たとえばゴム（特許文献２）、ポリエチレン（特許文献３）、ナイロン（特許文献４）等からなるフィルムが用いられてきた。
しかしながら、通常の静水圧プレスでは、約30〜400Mpaもの圧力がかかり、またセラミックシートに角や凹凸があるため、前述のフィルムではプレス中にピンホールが開くトラブルが起こりやすかった。フィルムに穴が開くとそこから水が入り、セラミック電子部品が濡れて不良品となるため、歩留まり低下を起こす。
In the production of multilayer ceramic electronic components, there is a step of pressure-molding a ceramic sheet, and an isotropic hydrostatic pressure molding method (hydrostatic pressure press method) is preferred as the pressure-bonding method (Patent Document 1).
In the hydrostatic press method, a laminate of ceramic sheets to be pressure-molded is vacuum-packed with a flexible material bag such as a plastic film, and then placed in a hot water laminator or the like to perform hydrostatic press. As a soft material used in this case, a flexible material, for example, a film made of rubber (Patent Document 2), polyethylene (Patent Document 3), nylon (Patent Document 4) or the like has been used.
However, in a normal hydrostatic pressure press, a pressure of about 30 to 400 MPa is applied, and the ceramic sheet has corners and irregularities, so that the above-mentioned film is likely to have a problem that pinholes are opened during the press. When a hole is made in the film, water enters from the hole, and the ceramic electronic components become wet and become defective, resulting in a decrease in yield.
耐ピンホール性と離型性を向上させるため、内容物と直接触れる層に、直鎖状低密度ポリエチレン層を有するフィルムを用いた包装材フィルムも開発された（特許文献５）が、耐ピンホール性はまだ十分とは言えず、実用レベルに耐ピンホール性を上げるためには、フィルムを厚くしなければならなかった。特に、厚みのある積層体を包装した場合は、角部がフィルムに強く当たってピンホールが開きやすいため、あまり厚い物の静水圧プレスには用いることができなかった。
また、セラミック電子部品等を袋で包装して静水圧プレスを行った場合、プレス後に袋を作業者が手で開封して内容物を取り出すが、上記のフィルムからなる袋は開封しにくいため作業効率が悪く、またフィルムが厚いため大量の廃棄物が発生し、環境の面からもより好ましい包材が求められていた。
In order to improve pinhole resistance and releasability, a packaging material film using a film having a linear low-density polyethylene layer as a layer in direct contact with the contents has also been developed (Patent Document 5). The hole property was not yet sufficient, and the film had to be thickened to increase the pinhole resistance to a practical level. In particular, when a thick laminate is packaged, the corners strongly hit the film and pinholes are likely to open, so that it cannot be used for a hydrostatic press of a very thick object.
In addition, when ceramic electronic parts etc. are wrapped in a bag and hydrostatic press is performed, the bag is manually opened by the operator after the press and the contents are taken out, but it is difficult to open the bag made of the above film. Since the efficiency is poor and the film is thick, a large amount of waste is generated, and a more preferable packaging material is demanded from the viewpoint of the environment.
一方、静水圧プレス以外の用途の包材として、二軸延伸直鎖状低密度ポリエチレンは用いられてきたが、延伸したフィルムは比較的シーラントになりにくいことから、袋の最内層に用いることは一般的には行われていなかった。 On the other hand, biaxially stretched linear low-density polyethylene has been used as a packaging material for applications other than isostatic pressing, but stretched films are relatively less likely to become sealants, so it can be used for the innermost layer of bags. In general it was not done.
本発明は、薄くても静水圧プレスに耐えうる耐ピンホール性を有する、静水圧プレス用の包装材、およびその包装材を用いる静水圧プレスの方法を提供することを課題とする。 It is an object of the present invention to provide a hydrostatic press packaging material having pinhole resistance that can withstand the hydrostatic press even if it is thin, and a hydrostatic press method using the packaging material.
本発明者らは、静水圧プレス用の包装材として、二軸延伸直鎖状低密度ポリエチレン層をラミネートしたフィルムからなる包装材を用いることで課題を解決できることを見出し、本発明を完成するに至った。
すなわち本発明は、
（１）二軸延伸直鎖状低密度ポリエチレンフィルム層を有する積層フィルムからなる等方静水圧成形法用の包装材、
（２）ナイロン層及び又はポリエチレンテレフタレート層を有するフィルムに二軸延伸直鎖状低密度ポリエチレンフィルム層を積層して製した積層フィルムからなる等方静水圧成形法用の包装材、
（３）前記二軸延伸直鎖状低密度ポリエチレンフィルム層が被包装物と接する側の表層である上記（１）または（２）に記載の包装材、
（４）前記包装材の形態が袋である、上記（１）〜（３）のいずれか一つに記載の包装材、
（５）上記（１）〜（４）いずれか一つに記載の包装材を用いて被包装物を圧着することを特徴とする等方静水圧成形法
を提供するものである。
The present inventors have found that the problem can be solved by using a packaging material made of a film laminated with a biaxially stretched linear low-density polyethylene layer as a packaging material for an isostatic press, and to complete the present invention. It came.
That is, the present invention
(1) A packaging material for an isotropic isostatic pressing method comprising a laminated film having a biaxially stretched linear low density polyethylene film layer,
(2) A packaging material for an isotropic hydrostatic pressing method comprising a laminated film made by laminating a biaxially stretched linear low density polyethylene film layer on a film having a nylon layer and / or a polyethylene terephthalate layer,
(3) The packaging material according to the above (1) or (2), wherein the biaxially stretched linear low-density polyethylene film layer is a surface layer on the side in contact with the package object.
(4) The packaging material according to any one of (1) to (3), wherein the packaging material is a bag.
(5) The present invention provides an isotropic isostatic pressing method characterized in that a packaged article is pressure-bonded using the packaging material according to any one of (1) to (4) above.
本発明によると、薄くても十分な耐ピンホール性を有する静水圧プレス用の包装材が得られる。その結果、包装材のピンホール発生率を下げることができ、積層セラミックス電子部品等の歩留まりを向上させることができる。また、本発明の包装材は、延伸フィルムであり、温水中で被包装物の形への追随性が良いため、被包装物が中でずれにくい。さらに、本発明の包装材は、プレス後開封の際に、手で縦横自在に簡単に破ることができ、被包装物からの離型性にも優れているため、作業効率を大幅に改善することができる。またさらに、本発明の包装材は、他のフィルムからなる包装材と比べて、同等の耐ピンホール性を出すのに薄いフィルムですむため、プレス後の包装材廃棄物の量が少なくなり、環境への負荷も軽減される。 According to the present invention, a packaging material for isostatic pressing that has sufficient pinhole resistance even when thin can be obtained. As a result, the pinhole occurrence rate of the packaging material can be reduced, and the yield of multilayer ceramic electronic components and the like can be improved. In addition, the packaging material of the present invention is a stretched film and has good followability to the shape of the package in warm water, so that the package is not easily displaced. Furthermore, the packaging material of the present invention can be easily broken vertically and horizontally by hand when opened after pressing, and is excellent in releasability from a packaged object, thus greatly improving work efficiency. be able to. Furthermore, since the packaging material of the present invention requires a thin film to provide the same pinhole resistance as compared with other film packaging materials, the amount of packaging material waste after pressing is reduced. Environmental burden is also reduced.
以下、本発明を詳細に説明する。
本発明の包装材は、積層セラミックス電子部品等の圧着工程である、等方静水圧成形法に用いるものである。
Hereinafter, the present invention will be described in detail.
The packaging material of the present invention is used for an isotropic isostatic pressing method, which is a crimping process for laminated ceramic electronic components and the like.
本発明の包装材は、二軸延伸直鎖状低密度ポリエチレンフィルム層を有する積層フィルムからなる。
当該二軸延伸直鎖状低密度ポリエチレンフィルムは、直鎖状低密度ポリエチレンフィルムを二軸延伸して得られるフィルムであり、延伸温度は９０〜１２０℃、延伸倍率は縦横それぞれ１．５〜７倍、望ましくは３．０〜５．０倍である。延伸方法としては、チューブラー方式、テンター方式による同時二軸延伸、逐次二軸延伸が挙げられる。また、延伸されたフィルムは必要に応じてアニーリング処理を行うこともできる。
二軸延伸直鎖状低密度ポリエチレンフィルムの厚さは、10〜50μmが望ましく、さらに望ましくは20〜30μmである。10μmより薄いと十分な耐ピンホール性が得られにくい。
二軸延伸直鎖状低密度ポリエチレンフィルムとしては、「KOHJIN BOLS」（（株）興人製）を用いることができる。
The packaging material of the present invention comprises a laminated film having a biaxially stretched linear low-density polyethylene film layer.
The biaxially stretched linear low-density polyethylene film is a film obtained by biaxially stretching a linear low-density polyethylene film, the stretching temperature is 90 to 120 ° C., and the stretching ratio is 1.5 to 7 respectively in length and width. Times, desirably 3.0 to 5.0 times. Examples of the stretching method include simultaneous biaxial stretching and sequential biaxial stretching by a tubular method and a tenter method. Moreover, the stretched film can also be subjected to an annealing treatment as necessary.
The thickness of the biaxially stretched linear low density polyethylene film is desirably 10 to 50 μm, and more desirably 20 to 30 μm. If it is thinner than 10 μm, it is difficult to obtain sufficient pinhole resistance.
As the biaxially stretched linear low density polyethylene film, “KOHJIN BOLS” (manufactured by Kojin Co., Ltd.) can be used.
本発明においては、前述の二軸延伸直鎖状低密度ポリエチレンフィルムを、他のフィルムにラミネートして、積層フィルムとする。
他のフィルムとしては、単層でも多層でもよく、あらゆる樹脂フィルム、金属箔などが使用可能であるが、ポリエチレンテレフタレート（PET）層および／またはナイロン層を有するフィルムを用いると、より高い耐ピンホール性が得られる。ナイロン層に使用するナイロンは、６−ナイロン、６，６−ナイロン、６，１０−ナイロン、６−６，６−ナイロン、７−ナイロン、９−ナイロン、１１−ナイロン等が挙げられ、このフィルムは延伸フィルムでも未延伸フィルムでもよい。
二軸延伸直鎖状低密度ポリエチレンフィルムを、他のフィルムにラミネートする方法は、 ポリサンドやドライラミネート等があり、ポリサンド用接着層としては、低密度ポリエチレン、直鎖状低密度ポリエチレン、EVA等の樹脂を、ドライラミネート用接着剤としては、エステル系接着剤、エーテル系接着剤等が用いられる。
In the present invention, the above-mentioned biaxially stretched linear low density polyethylene film is laminated to another film to obtain a laminated film.
The other film may be a single layer or multiple layers, and any resin film, metal foil, etc. can be used. However, if a film having a polyethylene terephthalate (PET) layer and / or a nylon layer is used, higher pinhole resistance Sex is obtained. Examples of nylon used for the nylon layer include 6-nylon, 6,6-nylon, 6,10-nylon, 6-6,6-nylon, 7-nylon, 9-nylon, and 11-nylon. May be a stretched film or an unstretched film.
The method of laminating a biaxially stretched linear low-density polyethylene film to other films includes polysand and dry laminate, and the adhesive layer for polysand includes low-density polyethylene, linear low-density polyethylene, EVA, etc. As an adhesive for dry lamination of the resin, an ester adhesive, an ether adhesive, or the like is used.
上述の積層フィルムの二軸延伸直鎖状低密度ポリエチレンフィルム層の上にさらに他のフィルムを積層することも可能であるが、二軸延伸直鎖状低密度ポリエチレンフィルムの耐ピンホール性、追随性、離型性といった特長を発揮するためには、同フィルムは使用時に被包装物と接することが望ましいため、二軸延伸直鎖状低密度ポリエチレンフィルム層を表層とすることが望ましい。
それぞれの層には、静水圧プレスに支障をきたさない範囲内で適宜、添加剤を含有させることができる。
Although other films can be laminated on the biaxially stretched linear low density polyethylene film layer of the above laminated film, the pinhole resistance of the biaxially stretched linear low density polyethylene film is followed. In order to exhibit the characteristics such as property and releasability, it is desirable that the film is in contact with an object to be packaged at the time of use. Therefore, it is desirable to use a biaxially stretched linear low density polyethylene film layer as a surface layer.
Each layer can appropriately contain an additive within a range that does not hinder hydrostatic pressing.
二軸延伸直鎖状低密度ポリエチレンフィルムと他のフィルムをラミネートした後の積層フィルムの厚さは、30〜120μmであることが望ましく、さらに望ましくは40〜90μmである。30μm未満では十分な耐ピンホール性が得られない可能性があり、また120μmを超えることは廃棄物量が増えることから好ましくない。
上記のようにして得られた積層フィルムを、等方静水圧成形法用の包装材に用いる。
The thickness of the laminated film after laminating the biaxially stretched linear low density polyethylene film and another film is desirably 30 to 120 μm, and more desirably 40 to 90 μm. If it is less than 30 μm, sufficient pinhole resistance may not be obtained, and if it exceeds 120 μm, the amount of waste increases, which is not preferable.
The laminated film obtained as described above is used for a packaging material for isotropic isostatic pressing.
本発明の包装材の形状としては、上記積層フィルムを袋状にしたもの、凹形状にして底材にするもの、フィルムのまま用いるものなど、静水圧プレス機械の仕様に合わせて適宜変えることができるが、一般的には袋状のものが汎用されている。
袋状に加工する際には、積層フィルムの二軸延伸直鎖状低密度ポリエチレンフィルム層を内側にしてシーラント層とし、開口部を残してヒートシールし、袋状にする。使用時には、当該袋状の包装材にセラミックシート等、圧着したい物を入れて、真空包装で開口部をヒートシールする。セラミックシート等被包装物の厚さが大きいとプレス時にピンホールが開きやすいため、従来の包装材では厚みのあるものは入れられなかったが、本発明の包装材は10mm厚さのものを包装しても、ほとんど問題ない。
The shape of the packaging material of the present invention can be appropriately changed in accordance with the specifications of the hydrostatic press machine, such as a bag-shaped laminate film, a concave shape used as a bottom material, or a film used as it is. However, in general, a bag-like one is widely used.
When processing into a bag shape, the biaxially stretched linear low-density polyethylene film layer of the laminated film is used as a sealant layer inside, heat-sealed leaving an opening, and formed into a bag shape. At the time of use, an article to be pressure-bonded, such as a ceramic sheet, is put into the bag-shaped packaging material, and the opening is heat sealed by vacuum packaging. If the thickness of the packaged object such as a ceramic sheet is large, pinholes will easily open during pressing, so it was not possible to insert a thick material in the conventional packaging material. However, the packaging material of the present invention is packed with a thickness of 10 mm. But there is almost no problem.
このようにして作製した包装物を、温水ラミネーター等の静水圧プレス機械にセットし、約30〜400Mpaの圧力をかけて、被包装物を圧着する。
本発明の包装材は、静水圧プレス中、被包装物の形状によく追随し、またピンホールの発生率が低い。
The package thus produced is set in a hydrostatic pressure press machine such as a hot water laminator, and a pressure of about 30 to 400 MPa is applied to crimp the package.
The packaging material of the present invention follows the shape of the package well during the isostatic pressing, and has a low incidence of pinholes.
静水圧プレス後、包装物を機械から取り出し、袋を破って開封し、圧着された積層セラミックス等の被包装物を取り出す。包装材として縦横に配向のある延伸フィルムを用いているため、袋を破る際には縦横自在に手で簡単に破るこ とができ、また、最内層が二軸延伸直鎖状低密度ポリエチレンフィルムであれば、離型性が優れていることから、被包装物を損傷することなく容易に取り出せる。
積層セラミックス等の被包装物を取り出した後の包装材は廃棄物となるが、本発明によるとフィルム厚さが薄くてよいため、廃棄物の量が少なくてすむ。
After the isostatic pressing, the package is taken out of the machine, the bag is broken and opened, and the packaged article such as the laminated ceramics is pressed. Since a stretched film with vertical and horizontal orientations is used as the packaging material, it can be easily broken by hand in the vertical and horizontal directions when the bag is torn, and the innermost layer is a biaxially stretched linear low-density polyethylene film. Then, since the release property is excellent, it can be easily taken out without damaging the package.
Although the packaging material after taking out the packaging object such as the laminated ceramics becomes waste, according to the present invention, since the film thickness may be thin, the amount of waste can be reduced.
以下、実施例及び比較例を用いて、本発明について具体的に説明する。
実施例、比較例で用いたフィルム及び樹脂は、以下の通り。
（１）二軸延伸直鎖状低密度ポリエチレン（BO-LL）： 「BOLS25」（（株）興人製）
（２）未延伸直鎖状低密度ポリエチレン（LL）： 「L４１０２」（東洋紡績社製）
（３）ポリエチレンテレフタレート（PET）： 「E5100」（東洋紡績社製）
（４）ナイロン（NY1）： 「BN-RX」（興人社製）
（５）二軸延伸ナイロン両面コロナ処理（NY2）： 「BN-W」（（株）興人製）
（６）二軸延伸ナイロン内面コロナ処理（NY3）： 「BN-SC」（（株）興人製）
（７）ポリエチレン（PE）： 「LC６００A」（日本ポリエチレン社製）
（８）二軸延伸ポリプロピレン（OPP）： 「FOR」（二村化学社製）
（９）エチレン−酢酸ビニル共重合体（EVA）： 「EVRN-０６０」（日本ユニカー社製）
（１０）接着剤：主剤「A９１０」硬化剤「A１２」（三井化学ポリウレタン社製）
Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples.
The films and resins used in the examples and comparative examples are as follows.
(1) Biaxially stretched linear low density polyethylene (BO-LL): “BOLS25” (manufactured by Kojin Co., Ltd.)
(2) Unstretched linear low density polyethylene (LL): “L4102” (manufactured by Toyobo Co., Ltd.)
(3) Polyethylene terephthalate (PET): “E5100” (manufactured by Toyobo)
(4) Nylon (NY1): "BN-RX" (manufactured by Kojinsha)
(5) Biaxially stretched nylon double-sided corona treatment (NY2): “BN-W” (manufactured by Kojin Co., Ltd.)
(6) Biaxially stretched nylon inner surface corona treatment (NY3): “BN-SC” (manufactured by Kojin Co., Ltd.)
(7) Polyethylene (PE): "LC600A" (Nippon Polyethylene)
(8) Biaxially oriented polypropylene (OPP): “FOR” (manufactured by Nimura Chemical Co., Ltd.)
(9) Ethylene-vinyl acetate copolymer (EVA): “EVRN-060” (manufactured by Nihon Unicar)
(10) Adhesive: Main agent “A910” curing agent “A12” (Mitsui Chemicals Polyurethanes)
＜実施例１〜６および比較例１〜４＞
表１に示す順に、それぞれのフィルムをラミネートして積層フィルムを作成した。括弧内の数字は各層の厚さ(μm）を示す。層間の／／は、接着剤は主剤「A９１０」硬化剤「A１２」（三井化学ポリウレタン社製）で貼り合わせていることを示す。
得られた積層フィルムから、３２cm×２３cmの長方形を切り、該長方形フィルム２枚を、表１の左側の層が外層、右側の層が内層になるように合わせ、短辺の１辺を開口部として外周を１０mm幅でヒートシールして三方袋とした。
それぞれの袋に１２０mm×１２０mm×厚さ1ｍｍの金属板を２枚入れて真空包装して開口部をヒートシールした。なお、実際の静水圧プレスにおいては、袋にセラミックシートを直接入れる方法や金属板に挟んで入れる方法があり、上記の通り金属板で試験を行うことは妥当であると考える。
上記の方法で、真空包装した包装体を各サンプル７個作製し、温水ラミネータ（日機装（株）製WIP9-10-30）にセットして、95℃で196Mpaの加圧を１分間かけた。加圧処理後、包装体を取り出して、ピンホールの有無を目視で確認した。
その後、包装体の一部にハサミで切り込みを入れて手で開封し、中の金属板を取り出した。開封作業のしやすさを次の通り評価した。
開封しやすい：○、 やや開封しやすい：△、 開封しにくい：×
表1に、各サンプルについての、ピンホール発生枚数、開封しやすさの評価結果を示した。
<Examples 1-6 and Comparative Examples 1-4>
Each film was laminated in the order shown in Table 1 to create a laminated film. The numbers in parentheses indicate the thickness (μm) of each layer. Interlayer // indicates that the adhesive is bonded with the main agent “A910” curing agent “A12” (manufactured by Mitsui Chemicals Polyurethanes).
Cut the rectangle of 32cm x 23cm from the obtained laminated film, and align the two rectangular films so that the left layer of Table 1 is the outer layer and the right layer is the inner layer, and one side of the short side is the opening. The outer periphery was heat sealed with a width of 10 mm to obtain a three-sided bag.
Two metal plates of 120 mm × 120 mm × 1 mm thickness were put in each bag, vacuum packaged, and the opening was heat sealed. In an actual hydrostatic press, there are a method of directly putting a ceramic sheet into a bag and a method of putting it between metal plates, and it is considered appropriate to perform the test with a metal plate as described above.
Seven samples of each vacuum-packed package were prepared by the above method, set in a warm water laminator (WIP9-10-30 manufactured by Nikkiso Co., Ltd.), and pressurized at 196 MPa for 1 minute at 95 ° C. After the pressure treatment, the package was taken out and visually checked for pinholes.
Thereafter, a part of the package was cut with scissors and opened by hand, and the metal plate inside was taken out. The ease of opening work was evaluated as follows.
Easy to open: ○, Slightly easy to open: △, Difficult to open: ×
Table 1 shows the evaluation results of the number of pinholes generated and ease of opening for each sample.
＜実施例７＞
実施例２の試験において、金属板１枚の代わりに金属板10枚（計約10mm厚）を入れて真空包装した以外は、実施例２と同様の試験を行い、ピンホールの有無を目視で確認した。
＜実施例８＞
実施例３の試験において、金属板１枚の代わりに金属板10枚（計約10mm厚）を入れて真空包装した以外は、実施例３と同様の試験を行い、ピンホールの有無を目視で確認した。それぞれの結果を、表２に示す。
<Example 7>
In the test of Example 2, the same test as in Example 2 was performed except that 10 metal plates (total thickness of about 10 mm) were put in place of one metal plate and vacuum-packed, and the presence or absence of pinholes was visually confirmed. confirmed.
<Example 8>
In the test of Example 3, the same test as in Example 3 was performed except that 10 metal plates (total thickness of about 10 mm) were put in place of one metal plate and vacuum-packed, and the presence or absence of pinholes was visually observed. confirmed. The respective results are shown in Table 2.
表１、表２に示したとおり、本発明の実施例１〜６のフィルムからなる包装材は、いずれも100μm以下の厚さで優れた耐ピンホール性を示し、開封のしやすさも概ね良好であった。また、実施例７、実施例８に示すとおり、厚みのある内容物の静水圧プレスにも耐えうる強度を有していた。 As shown in Tables 1 and 2, the packaging materials comprising the films of Examples 1 to 6 of the present invention have excellent pinhole resistance at a thickness of 100 μm or less, and are generally easy to open. Met. Moreover, as shown in Example 7 and Example 8, it had the intensity | strength which can be equal to the hydrostatic pressure press of the thick content.
以上説明した通り、本発明によると、積層セラミックス電子部品等の生産において、品質の良いものを作ることができ、従って歩留まりを上げることができる。
さらに、耐ピンホール性が優れていることから、積層セラミックスに限らず、より複雑な形状をした物品の静水圧プレス加工にも利用可能である。
As described above, according to the present invention, it is possible to produce a high-quality product in the production of multilayer ceramic electronic components and the like, and thus increase the yield.
Furthermore, since pinhole resistance is excellent, it can be used not only for laminated ceramics but also for isostatic pressing of articles having more complicated shapes.
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| JP2003340994A (en) * | 2002-05-31 | 2003-12-02 | Sumitomo Bakelite Co Ltd | Multi-layer film and packaging bottom material for ceramic chip capacitor |
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|---|---|---|---|---|
| JPS62255122A (en) * | 1986-03-26 | 1987-11-06 | ブリティッシュ・テクノロジー・グループ・リミテッド | Oriented polymer film |
| JPS63214445A (en) * | 1987-03-03 | 1988-09-07 | 株式会社興人 | Heat-shrinkable laminating packaging material |
| JPH0373310A (en) * | 1989-05-16 | 1991-03-28 | Toshiba Corp | Production of ceramic sintered body |
| JPH04221889A (en) * | 1990-12-25 | 1992-08-12 | Fujitsu Ltd | Manufacture of ceramic multilayer circuit board |
| JPH0564868A (en) * | 1991-07-08 | 1993-03-19 | Mitsubishi Kasei Polytec Co | Heat-sealable laminated film having high dimensional stability |
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| JP2003340994A (en) * | 2002-05-31 | 2003-12-02 | Sumitomo Bakelite Co Ltd | Multi-layer film and packaging bottom material for ceramic chip capacitor |
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