JP2010110708A - Wiping tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiping tool which sufficiently suppresses dust occurrence without coating the surface of a wiping part with foamed resin or silicone rubber. <P>SOLUTION: The wiping tool 10 has a shaft 20 and a wiping part 30 provided at least one end of the shaft 20. The wiping part includes a fiber-joined body formed by assembling fibers and joining at least some parts of spaces among the fibers. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wiping tool.

As a wiping tool used for various types of wiping, application of medicines and cosmetics, etc., it has a cotton ball part with cotton (cotton) or extra fine synthetic fiber wrapped around at least one end of a rod-shaped shaft ( So-called cotton swabs) are known.
However, when conventional wiping tools are used for industrial purposes, especially for precision machinery, semiconductors, optical communications, etc., dust generated from fibers (lint (cotton dust), fiber scraps, etc.) becomes a problem. .

In view of this, a material in which a cotton ball part is covered with foamed resin or silicone rubber (for example, Patent Documents 1 and 2) has been proposed.
However, these wiping tools have a problem that the eluate (plasticizer, surfactant, silicone compound, sodium ion, etc.) from the foamed resin or silicone rubber is transferred to the object to be wiped. In particular, wiping tools that elute silicone compounds and sodium ions cannot be used for semiconductor-related wiping.
JP 2005-349296 A JP 09-047377 A

  The present invention provides a wiping tool in which dust generation is sufficiently suppressed without covering the surface of the wiping portion with foamed resin or silicone rubber.

  The wiping tool of the present invention is a wiping tool having a shaft and a wiping portion provided at at least one end portion of the shaft, the wiping portion collects fibers, and It includes a fiber joined body in which at least a part of the fiber is joined.

The wiping portion is preferably composed of an outermost layer made of the fiber bonded body and an inner layer provided inside the outermost layer.
The bonding between the fibers is preferably performed by welding the fibers or bonding using a binder resin.
It is preferable that the fiber which comprises the said fiber joined body contains a polyacrylonitrile.

  In the wiping tool of the present invention, dust generation is sufficiently suppressed without covering the surface of the wiping portion with foamed resin or silicone rubber.

(Wiping tool)
The wiping tool of the present invention has a shaft and a wiping portion provided at at least one end of the shaft.
1 and 2 are views showing an example of the wiping tool of the present invention. The wiping tool 10 includes a shaft 20 and a wiping portion 30 provided at at least one end of the shaft 20.

As the shaft 20, a paper or film coated with an adhesive on one side is wound around a core; a paper or film coated with an adhesive on one side is wound around a core; a plastic shaft (polypropylene shaft, etc.), Examples include a wood axis, a metal axis (such as an aluminum axis), and a carbon fiber axis.
The diameter of the shaft 20 is usually about 0.5 mm to 3.0 mm. The length of the shaft 20 is usually about 100 mm to 200 mm.

The wiping unit 30 includes the fiber bonded body (A), and at least the surface is covered with the fiber bonded body (A).
The fiber joined body (A) is obtained by assembling the fibers (a) and joining at least a part between the fibers (a). Bonding between the fibers (a) is preferably performed by welding the fibers (a). Moreover, you may carry out by adhesion | attachment using binder resin.

The average fiber diameter of the fiber (a) is preferably 0.001 μm to 10 μm, more preferably 0.01 μm to 10 μm, and still more preferably 0.01 μm to 1 μm. When the average fiber diameter is less than 0.001 μm, the fiber (a) itself may be unstable, and the fiber (a) itself may be unstable. When the average fiber diameter exceeds 10 μm, the oil film and dust having a size of 10 μm or less cannot be sufficiently wiped off.
The average fiber diameter of the fiber (a) was obtained by photographing the fiber joined body (A) with a scanning electron microscope, measuring the fiber diameters of 20 fibers (a) randomly selected from the electron micrograph, Is obtained by averaging.

The material of the fiber (a) is preferably a polymer (thermoplastic polymer, biodegradable polymer, etc.), a polymer blend, a composite obtained by blending one or more kinds of inorganic substances, and the like.
Examples of the thermoplastic polymer include polystyrene, polycarbonate, polymethyl methacrylate, polyvinyl chloride, polyethylene terephthalate, nylon 66, nylon 6, nylon 46, polyamide, polyacrylonitrile, and the like.
Examples of the biodegradable polymer include polyurethane, polyvinyl alcohol, polylactic acid, polycaprolactone, polyethylene glycol, polylactic glycol, polyethylene / vinyl acetate, polyethylene / vinyl alcohol, polyethylene oxide, and collagen.
Polymer blends include polyethylene vinyl alcohol and polylactic acid, polymethyl methacrylate and acrylonitrile, polyaniline and polyethylene oxide, collagen and polyethylene oxide, silk and polyethylene oxide, A combination of polyaniline and polystyrene is exemplified.
Examples of composites include a combination of polyvinyl alcohol and silica, a combination of nylon 6 and montmorillonite, a combination of polyacrylonitrile and titanium oxide, a combination of polycaprolactone and calcium carbonate, and a combination of polycaprolactone and carbon nanotubes. It is done.

A fiber (a) may be used individually by 1 type, and 2 or more types may be mixed and used for it.
The fiber (a) is preferably polyacrylonitrile (hereinafter referred to as PAN) from the viewpoint of solvent resistance. When PAN is immersed in a solvent such as acetone, isopropyl alcohol, water, etc., the amount of eluate eluted is very small compared to other polymers.

The length of the wiping unit 30 in the axial direction is usually about 12 to 16 mm. The thickness of the wiping part 30 is usually about 2 to 10 mm.
Examples of the shape of the wiping unit 30 include a water droplet shape, a conical shape, and a spiral shape in addition to the elliptical sphere (ellipsoidal shape) in the illustrated example.

  As shown in FIG. 1, the wiping unit 30 may be a fiber lump composed only of the fiber joined body (A) provided at the end of the shaft 20, and as shown in FIG. 2, The surface of the inner layer 32 provided at the end may be covered with the outermost layer 34 made of the fiber joined body (A).

As the inner layer 32, a foamed resin (olefin resin, urethane resin, etc.) or silicone rubber molded body; a fiber mass (cotton ball portion) made of a fiber assembly (B) other than the fiber joined body (A) is used as a shaft. 20 provided at the end of the fiber; those obtained by further covering the surface of the fiber block with foamed resin or silicone rubber. Examples of the fiber aggregate (B) include a collection of cotton and synthetic fibers.
By providing the inner layer 32, elasticity is imparted to the wiping portion 30. Moreover, the usage-amount of a fiber conjugate (A) can be saved. In the wiping part 30 of FIG. 2, since it has the outermost layer 34 which consists of a fiber conjugate | bonded_body (A), the elution of the elution from the resin etc. which form the inner layer 32, the dust caused by fiber waste etc. Generation etc. are suppressed.

(Manufacturing method of wiping tool)
The wiping tool 10 can be manufactured by winding the fiber joined body (A) around at least one end of the shaft 20 or the inner layer 32 formed at the end to form the wiping portion 30.
When the fiber joined body (A) is wound, an adhesive or the like may be applied in advance to the surface of the end portion of the shaft 20, the surface of the inner layer 32, or a part of the fiber joined body (A).

Examples of the method for producing the fiber (a) constituting the fiber joined body (A) include a melt spinning method, a self-assembly method, a phase separation method, and an electrospinning method.
Hereinafter, the electrospinning method will be described.

An apparatus used for the electrospinning method includes a plus electrode (capillary tube or nozzle; hereinafter referred to as a nozzle) having a sharp point and a minus electrode (ground electrode) such as a flat plate. Examples of pointed nozzles include syringe needles, glass capillaries with electrodes inserted, and the like.
In this apparatus, a positive voltage is applied to a polymer solution tank having a nozzle attached to the tip, or to a syringe or needle in the case of a syringe, and the charged polymer solution discharged from the nozzle is negative in the electric field. Sucked towards the electrode. At this time, if the polymer is a low molecule, it is sprayed into particles and the fiber shape cannot be maintained. If the polymer is a polymer, a plurality of divided fibers are sucked toward the minus electrode, and the fibers (a) are accumulated on the surface of the minus electrode.

  In the electrospinning method, the polymer that is the raw material of the fiber (a) must be in a state dissolved in a solvent. The concentration of the polymer is preferably 1 to 30% by mass in 100% by mass of the polymer solution. If the concentration of the polymer is 1% by mass or more, it is difficult to be sprayed in the form of particles and the fiber shape can be maintained. When the concentration of the polymer exceeds 30% by mass, fibers having an average fiber diameter of more than 10 μm are obtained, or the viscosity of the polymer solution becomes too high, and spinning becomes difficult.

When the polymer is PAN, the mass average molecular weight of PAN is preferably 50,000 to 200,000, more preferably 100,000 to 150,000.
The mass average molecular weight is a styrene-converted mass average molecular weight measured by gel permeation chromatography (GPC).

The viscosity of the polymer solution is 100 mPa.s. s to 20,000 mPa.s s is preferable, and 1,000 mPa.s. s to 15,000 mPa.s. s is more preferable, and 1,000 mPa.s. s to 10,000 mPa.s s is more preferable. The viscosity is 100 mPa.s. If it is s or more, it is difficult to be sprayed in the form of particles, and the fiber shape can be sufficiently maintained. The viscosity is 20,000 mPa.s. If it is less than s, fluidity | liquidity will become favorable and will be discharged stably from a nozzle and it will be easy to obtain a uniform fiber.
The viscosity of the polymer solution is measured using a B-type viscometer under the conditions of temperature: 25 ° C. and rotation speed: 30 rpm.

  The solvent may be any solvent that can dissolve the polymer uniformly. Solvents include highly polar solvents (water, formic acid, N, N-dimethylformamide, N, N-dimethylacetamide, etc.), alcohol solvents (ethyl alcohol, methyl alcohol, isopropyl alcohol, etc.), chlorine solvents (tetrachloride). Carbon, chloroform, etc.), ketone solvents (acetone, methyl ethyl ketone, etc.), aromatic solvents (toluene, benzene, etc.) and the like. The solvent may be a mixture of two or more.

Additives (light resistance improvers, antioxidants, plasticizers, etc.) may be added to the polymer solution as long as they do not adversely affect the object to be wiped. Examples of the light resistance improver include hindered amines and benzotriazoles. Examples of the antioxidant include dibutylhydroxytoluene (BHT). Examples of the plasticizer include epoxidized soybean oil.
Coloring agents (pigments, dyes, etc.), conductive carbon, surfactants, etc. may be added to the polymer solution as long as they do not adversely affect the object to be wiped. By adding conductive carbon or a surfactant having an antistatic effect, antistatic performance is imparted to the wiping portion 30.

  The applied voltage is usually 5 kV to 30 kV. The strength of the applied voltage is also related to the distance from the nozzle to the negative electrode. If the distance is short, a small voltage may be used, and if the distance is long, the voltage needs to have a magnitude corresponding to the distance. In addition, since the optimum voltage varies depending not only on the distance but also on the discharge amount from the nozzle, the concentration and viscosity of the polymer solution, the type and molecular weight of the polymer, the fiber diameter and quality of the fiber (a), the fiber to be manufactured ( It is necessary to select a voltage according to a).

  The solvent of the charged polymer solution leaving the nozzle usually evaporates before reaching the negative electrode, but may not evaporate depending on the conditions. In this case, the solvent may be evaporated by changing the atmospheric pressure, temperature, humidity, or the like of the environment in which spinning is performed, or by generating an air flow. In addition, since the temperature and viscosity of the polymer solution affect the evaporation of the solvent, it is important to set optimum conditions.

  The shape of the negative electrode need not be flat, and may be any shape. For example, a belt shape, a roll shape, a disk shape, etc. are mentioned. If it is a belt shape, the accumulated fibers (a) can be wound up while rotating the electrodes. If it is roll shape, the fiber (a) integrated | stacked in the cylinder shape can be obtained. If it is a disk shape, the axis | shaft which passes along the center of a disk is arrange | positioned perpendicularly | vertically with respect to a nozzle, and the fiber (a) integrated | stacked in the state with the uniform direction can be obtained by rotating a disk at high speed.

Further, when a collecting member (for example, a mesh) is inserted between the nozzle and the negative electrode, the fibers (a) are accumulated on the collecting member. The collecting member does not need to have a mesh shape, and may have a shape that does not hinder the movement of charges between the nozzle and the negative electrode.
Furthermore, productivity may be increased by increasing the number of nozzles. When the number of nozzles is increased, the polymer solution may be one type or two or more types.

  The obtained fiber (a) is made into a fiber joined body (A) by, for example, the following method (I) to method (IV).

Method (I):
By not completely evaporating the solvent of the polymer solution before reaching the negative electrode, at least a part of the fibers can be welded and bonded together by the remaining solvent. The remaining solvent evaporates over time after spinning, but in some cases, it may be evaporated by a fan such as a fan or a drying device such as an oven.

Method (II):
After spinning, the obtained fiber (a) is immersed in a solvent for a certain period of time, then washed with water and dried, so that at least a part of the fibers can be welded and bonded. Examples of the solvent used include the same solvents as those used for the polymer solution. The solvent may be a mixture of two or more. It is preferable to select a fiber having a solubility that can dissolve a small amount of the surface of the fiber (a) according to the type of polymer.
The immersion time is usually less than 1 minute. If it is less than 1 minute, the intensity | strength fall of a fiber will be suppressed and the dust generation by a fiber piece will be suppressed. Further, the fiber is not completely dissolved.
Drying is performed using a known drying apparatus.

Method (III):
When the polymer is a thermoplastic polymer, at least a part of the fibers can be welded and joined by heating.

Method (IV):
By applying a binder resin solution on the minus electrode in advance and accumulating the fibers (a) thereon, at least a part of the fibers can be bonded and bonded with the binder resin.
The binder resin is preferably the same as the polymer that is the raw material of the fiber (a). Moreover, when coat | covering the cotton ball part surface of a commercially available cotton swab with a fiber conjugate (A), you may use resin, such as polyvinyl alcohol currently used for the cotton ball part of a commercially available cotton swab, as a binder.
Examples of the solvent for the binder resin solution include the same solvents as those used for the polymer solution.
After the fibers (a) are accumulated on the binder resin solution, drying is performed with a known drying apparatus. However, when an organic solvent is used as a solvent for the binder resin, it is preferable to immerse in water for about 1 to 10 minutes before drying to remove the solvent and then dry.

  Wiping to be wiped by charging the wipe (30) containing the obtained fiber (a), the fiber joined body (A) composed of the fiber (a), or the fiber joined body (A) by electret processing You may remove the dust of an object by adsorption.

In the wiping tool of the present invention described above, since the fiber joined body (A) contained in the wiping part is obtained by joining at least part of the fibers (a), the fiber (a) The strength of the fiber (a) is improved and fiber waste due to fiber breakage or the like is less likely to occur than in a case where the fibers are simply assembled. Also, lint is less likely to occur. Therefore, the dust generation from the wiping portion can be sufficiently suppressed without covering the surface of the wiping portion with foamed resin or silicone rubber. And since the surface of the wiping part is not covered with foamed resin or silicone rubber, the eluate from the foamed resin or silicone rubber is eluted from the surface of the wiping part or dust (due to self-dusting) is generated. There is nothing.
Therefore, the wiping tool of the present invention is suitably used for wiping precision machines, semiconductors, optical communications, and the like. It can also be used for normal cotton swab applications.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.

(Average fiber diameter)
The fiber joined body was photographed with a scanning electron microscope at a magnification of 2000 times, the fiber diameters of 20 randomly selected fibers were measured, and these were averaged to obtain an average fiber diameter.

(Solvent resistance test)
After measuring the mass of the fiber assembly (or fiber joined body) (for one wiping tool) of the wiping part of the obtained wiping tool at room temperature of 20 ° C., the wiping part was weighed with 10 mL of solvent. It was placed in a bottle and immersed for 24 hours at room temperature. As the solvent, four kinds of acetone, isopropyl alcohol, xylene, and water were used. The fiber assembly (or fiber bonded body) is taken out, the solvent in the weighing bottle is evaporated at room temperature, and the residue in the weighing bottle is dried in an oven at 120 ° C. (150 ° C. when immersed in xylene) for 60 minutes, and then at room temperature. And the mass of the residue was measured.

[Example 1]
PAN (mass average molecular weight: 150,000) was dissolved in N, N-dimethylformamide (hereinafter referred to as DMF) as a solvent to prepare a 15 mass% PAN solution (viscosity: 11,000 mPa.s).
The obtained PAN solution was put into a syringe, and the spinning was performed by electrospinning for 3 hours under the conditions of applied voltage: 20 kV, distance between nozzle and negative electrode: 200 mm, room temperature: 20 ° C., humidity: 40% RH, PAN fibers were accumulated on an aluminum foil placed on the negative electrode. The obtained PAN fiber was immersed in a solution in which DMF as a solvent and methyl ethyl ketone (hereinafter referred to as MEK) were mixed at a mass ratio of 7: 3 for 1 second, washed with water, and then dried in an oven. When the fiber assembly was observed with a scanning electron microscope, the average fiber diameter of the PAN fibers was 0.68 μm, and a plurality of some fibers were welded to form a fiber joined body.

After applying an adhesive to both ends of a polypropylene shaft having a length of 73 mm and a diameter of 1.5 mm, the obtained fiber joined body is wound around both ends, and the length is 12 mm and the maximum thickness is 2.7 mm. A wiping tool having an elliptical wiping part was prepared.
When the surface of the semiconductor wafer was wiped using the wiping tool, fine dust could be wiped off and no dust was generated due to self-dusting.

[Example 2]
The fiber bonded body obtained in Example 1 is wrapped around a cotton ball part of a commercially available cotton swab (trade name “P752S” manufactured by Japan Cotton Swab Co., Ltd.), and the entire surface of the cotton ball part (inner layer) is bonded to the fiber bonded body. A wiping tool having an elliptical wiping portion covered with an outermost layer made of was prepared.
The wiping tool was subjected to a solvent resistance test. As shown in Table 1, the mass of residue per wiping tool was very small.

  Moreover, when the surface of the semiconductor wafer was wiped using the obtained wiping tool, fine dust could be wiped off, and lint was removed from the cotton swab of the original swab, or due to self-dusting. There was no dust. Moreover, since elasticity is imparted by the presence of the cotton ball part, the wiping property is further improved in both performance and feel.

Example 3
PAN (mass average molecular weight: 150,000) was dissolved in DMF as a solvent to prepare a 10 mass% PAN solution (viscosity: 1,400 mPa.s).
The obtained PAN solution was put into a syringe, and the spinning was performed by electrospinning for 3 hours under the conditions of applied voltage: 20 kV, distance between nozzle and negative electrode: 200 mm, room temperature: 20 ° C., humidity: 40% RH, PAN fibers were accumulated on an aluminum foil placed on the minus electrode to obtain a fiber assembly.

The obtained fiber assembly is wrapped around a cotton ball part of a commercially available cotton swab (trade name “P752S” manufactured by Japan Cotton Swab Co., Ltd.), and the entire surface of the cotton ball part (inner layer) is made of the fiber assembly. A wiping tool having an elliptical spherical wiping portion coated with a sliver was obtained.
The wiping part of the obtained wiping tool was immersed for 1 second in a solution in which DMF and MEK as solvents were mixed at a mass ratio of 7: 3, washed with water, and then dried in an oven. When the fiber assembly of the wiping part was observed with a scanning electron microscope, the average fiber diameter of the PAN fiber was 0.54 μm, and a plurality of some fibers were welded to form a fiber joined body.
When the surface of the semiconductor wafer was wiped using the resulting wiping tool, fine dust could be wiped off, lint was removed from the cotton ball part of the original swab, and dust caused by self-dusting It did not occur. Moreover, since elasticity is imparted by the presence of the cotton ball part, the wiping property is further improved in both performance and feel.

Example 4
PAN (mass average molecular weight: 150,000) was dissolved in DMF as a solvent to prepare a 10 mass% PAN solution (viscosity: 1,400 mPa.s).
The obtained PAN solution was put into a syringe, and the spinning was performed by electrospinning for 3 hours under the conditions of applied voltage: 20 kV, distance between nozzle and negative electrode: 200 mm, room temperature: 20 ° C., humidity: 40% RH, PAN fibers were accumulated on an aluminum foil placed on the negative electrode. At this time, a 5 mass% PAN solution in which PAN was dissolved in DMF as a solvent was applied in advance on the aluminum foil. The obtained fiber assembly was immersed in a water bath for 3 minutes to remove the solvent, and dried in an oven. When the fiber aggregate was observed with a scanning electron microscope, the average fiber diameter of the PAN fibers was 0.55 μm, and some of the fibers were bonded together with PAN as a binder resin to form a fiber joined body.

The obtained fiber joined body is wrapped around the cotton ball part of a commercially available cotton swab (trade name “P752S” manufactured by Japan Cotton Swab Co., Ltd.), and the entire surface of the cotton ball part (inner layer) is made of the fiber joined body. A wiping tool having an oval spherical wiping portion coated with was prepared.
When the surface of the semiconductor wafer was wiped using the resulting wiping tool, fine dust could be wiped off, lint was removed from the cotton ball part of the original swab, and dust caused by self-dusting It did not occur. Moreover, since elasticity is imparted by the presence of the cotton ball part, the wiping property is further improved in both performance and feel.

Example 5
Polyurethane (mass average molecular weight: 87,800, hereinafter referred to as PU) was dissolved in DMF as a solvent to prepare a 15 mass% PU solution (viscosity: 1,830 mPa.s).
The obtained PU solution was put into a syringe, and spinning was performed by electrospinning for 3 hours under the conditions of applied voltage: 20 kV, distance between nozzle and negative electrode: 200 mm, room temperature: 20 ° C., humidity: 40% RH, PU fibers were accumulated on an aluminum foil placed on the minus electrode to obtain a fiber assembly.

The obtained fiber assembly is wrapped around a cotton ball part of a commercially available cotton swab (trade name “P752S” manufactured by Japan Cotton Swab Co., Ltd.), and the entire surface of the cotton ball part (inner layer) is made of the fiber assembly. And a wiping tool was obtained.
The obtained wiping tool was heated in an oven at 160 ° C. for 30 seconds to melt some of the fibers forming the outermost fiber assembly and bonded together by welding the fibers. When the fiber aggregate was observed with a scanning electron microscope, the average fiber diameter of the PU fibers was 0.34 μm, and the fibers were thermally welded.
When the surface of the semiconductor wafer was wiped using the resulting wiping tool, fine dust could be wiped off, lint was removed from the cotton ball part of the original swab, and dust caused by self-dusting It did not occur. Moreover, since elasticity is imparted by the presence of the cotton ball part, the wiping property is further improved in both performance and feel.

Example 6
PAN (mass average molecular weight: 150,000) was dissolved in DMF as a solvent to prepare a 15 mass% PAN solution (viscosity: 11,000 mPa.s).
The obtained PAN solution is put into a syringe, and electrospinning is performed in a closed space where no airflow is generated under the conditions of applied voltage: 20 kV, distance between the nozzle and the negative electrode: 200 mm, room temperature: 20 ° C., humidity: 40% RH Spinning was performed for 3 hours, and PAN fibers were accumulated on an aluminum foil placed on the negative electrode to obtain a fiber assembly. The solvent was not completely evaporated from the fiber assembly, and it was dried by blowing with a fan for 1 hour in an open space of room temperature: 20 ° C. and humidity: 40% RH.

The obtained fiber assembly is wrapped around a cotton ball part of a commercially available cotton swab (trade name “P752S” manufactured by Japan Cotton Swab Co., Ltd.), and the entire surface of the cotton ball part (inner layer) is made of the fiber assembly. And a wiping tool was obtained. When the fiber assembly was observed with a scanning electron microscope, the average fiber diameter of the PAN fibers was 2.8 μm, and the fibers were welded together with the remaining solvent to form a fiber joined body.
When the surface of the semiconductor wafer was wiped using the resulting wiping tool, fine dust could be wiped off, lint was removed from the cotton ball part of the original swab, and dust caused by self-dusting It did not occur. Moreover, since elasticity is imparted by the presence of the cotton ball part, the wiping property is further improved in both performance and feel.

  The wiping tool of the present invention is useful as an industrial cleaning tool for precision machinery, semiconductors, optical communications, and the like.

It is a side view of the edge part vicinity which shows an example of the wiping tool of this invention. It is the side view of the edge part which shows the other example of the wiping tool of this invention, and a partial sectional view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Wiping tool 20 Shaft 30 Wiping part 32 Inner layer 34 Outermost layer

Claims (5)

A wiping tool having a shaft and a wiping portion provided on at least one end of the shaft,
A wiping tool, wherein the wiping portion includes a fiber joined body in which fibers are gathered and at least a part of the fibers is joined.   The wiping tool according to claim 1, wherein the wiping portion includes an outermost layer made of the fiber joined body and an inner layer provided inside the outermost layer.   The wiping tool according to claim 1 or 2, wherein the bonding between the fibers is performed by welding the fibers.   The wiping tool according to claim 1 or 2, wherein bonding between the fibers is performed by adhesion using a binder resin.   The wiping tool according to claim 1 or 2, wherein the fibers constituting the fiber joined body contain polyacrylonitrile.

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