JP2010097962A - Semiconductor cooling structure - Google Patents

Semiconductor cooling structure Download PDF

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JP2010097962A
JP2010097962A JP2008264743A JP2008264743A JP2010097962A JP 2010097962 A JP2010097962 A JP 2010097962A JP 2008264743 A JP2008264743 A JP 2008264743A JP 2008264743 A JP2008264743 A JP 2008264743A JP 2010097962 A JP2010097962 A JP 2010097962A
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cooling
semiconductor
cooling structure
semiconductor cooling
portions
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Keiichi Sasaki
慶一 佐々木
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Yokogawa Electric Corp
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Yokogawa Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor cooling structure which can eliminate the precipitation of oil by using a thin heat release sheet, can improve cooling efficiency by eliminating the precipitation of oil, and can reduce stress on IC by compression. <P>SOLUTION: The semiconductor cooling structure configured so that one surface side thereof contacts with a semiconductor and the other surface side is connected to a cooling pipe includes, a cooling plate one surface side of which individually cools each semiconductor, and a connection part having one end connected to the other surface side of the cooling plate and the other end side vertically sliding in contact with the outer circumferential surface of the cooling pipe. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、半導体の冷却構造に関するものである。   The present invention relates to a semiconductor cooling structure.

半導体の冷却構造に関連する先行技術文献としては次のようなものがある。   Prior art documents related to the semiconductor cooling structure include the following.

特開平８−０９４７０６号公報JP-A-8-094706 特開２００１−００４７１８号公報JP 2001-004718 A 特開平１０−３０３５８６号公報JP-A-10-303586

図３は従来より一般に使用されている従来例の要部構成説明図で、狭いスペース内に配置できるようにされた構成の半導体の冷却構造である。
図において、ＩＣ １，２はプリント基板３に取付けられている。
放熱シート４，５は、それぞれ、ＩＣ １，２の片面に設けられている。 FIG. 3 is an explanatory view showing the structure of a main part of a conventional example that is generally used in the prior art, and shows a semiconductor cooling structure configured to be arranged in a narrow space.
In the figure, ICs 1 and 2 are attached to a printed circuit board 3.
The heat radiation sheets 4 and 5 are provided on one side of the ICs 1 and 2, respectively.

冷却プレート６は、放熱シート４，５の片面に設けられている。
接続部７，８は、一端側が冷却プレート６に接続され、他端側が冷却パイプ９，１１に取付けられ、冷却パイプ９，１１にカシメ１２，１３られて、接続されている。
連結ねじ１４は、冷却プレート６をプリント基板３にねじ止めする。 The cooling plate 6 is provided on one side of the heat radiation sheets 4 and 5.
One end side of the connection parts 7 and 8 is connected to the cooling plate 6, the other end side is attached to the cooling pipes 9 and 11, and the crimping pipes 12 and 13 are connected to the cooling pipes 9 and 11.
The connecting screw 14 screws the cooling plate 6 to the printed circuit board 3.

以上の構成において、プリント基板３上にＩＣ １，２が実装された状態で、ＩＣ １，２の高さ方向にバラツキがある場合、放熱シート４，５が高さ方向のバラツキ分を吸収した状態で、冷却プレート６とプリント基板３が連結ねじ１２で締結されている。   In the above configuration, when the ICs 1 and 2 are mounted on the printed circuit board 3 and there is a variation in the height direction of the ICs 1 and 2, the heat radiation sheets 4 and 5 absorb the variation in the height direction. In the state, the cooling plate 6 and the printed circuit board 3 are fastened by the connecting screw 12.

このような装置においては、以下の間題点がある。
ＩＣ １，２の高さ方向のバラツキを吸収する為に、放熱シート４，５は、最大圧縮率が定められている為、厚い放熱シート４，５が必要とされる場合がある。
厚い放熱シート４，５が使用されると、表裏の温度差が大きく、放熱シート４，５よりオイルが析出する。また、熱抵抗が増して冷却効率が悪い。
プリント基板３と冷却プレート６とが、連結ねじ１２で締結される為に、圧縮された放熱シート４，５によりＩＣ １，２が押し付けられストレスが加わる。 Such an apparatus has the following problems.
In order to absorb variations in the height direction of the ICs 1 and 2, the heat radiation sheets 4 and 5 have a maximum compression ratio, and thus the thick heat radiation sheets 4 and 5 may be required.
When the thick heat radiating sheets 4 and 5 are used, the temperature difference between the front and back is large, and oil is deposited from the heat radiating sheets 4 and 5. In addition, the thermal resistance increases and the cooling efficiency is poor.
Since the printed circuit board 3 and the cooling plate 6 are fastened by the connecting screw 12, the ICs 1 and 2 are pressed by the compressed heat radiating sheets 4 and 5, and stress is applied.

本発明の目的は、上記の課題を解決するもので、
薄い放熱シートを使用できるようにしてオイルの析出をなくす。また、冷却効率を向上できる半導体の冷却構造を提供することにある。
連結ねじ１２を廃止できるようにして、ＩＣに対する、圧縮によるストレスを軽減できる半導体の冷却構造を提供することにある。 The object of the present invention is to solve the above problems.
Allow the use of a thin heat dissipation sheet to eliminate oil precipitation. Another object of the present invention is to provide a semiconductor cooling structure capable of improving the cooling efficiency.
An object of the present invention is to provide a semiconductor cooling structure that can reduce the stress caused by compression on an IC by eliminating the connection screw 12.

このような課題を達成するために、本発明では、請求項１の半導体の冷却構造においては、
一面側が半導体に接し他面側が冷却パイプに接続される半導体の冷却構造において、一面側が放熱シートを介して半導体をそれぞれ個々に冷却する冷却プレートと、一方端がこの冷却プレートの他面側に接続され他方端側が前記冷却パイプの外周面に接触し鉛直方向に摺動する接続部と、を具備したことを特徴とする。 In order to achieve such a problem, in the present invention, in the semiconductor cooling structure of claim 1,
In the semiconductor cooling structure where one side is in contact with the semiconductor and the other side is connected to the cooling pipe, one side is connected to the other side of the cooling plate, and one end is connected to the other side of the cooling plate. The other end side contacts the outer peripheral surface of the cooling pipe, and has a connecting portion that slides in the vertical direction.

本発明の請求項２の半導体の冷却構造においては、請求項１記載の半導体の冷却構造において、
前記接続部は、前記冷却プレートに対応する箇所の前記冷却パイプを変形して設けられた摺動平面部と、前記接続部に設けられ前記摺動平面部を挟持して接触し鉛直方向に摺動する支持部とを具備したことを特徴とする。 In the semiconductor cooling structure according to claim 2 of the present invention, the semiconductor cooling structure according to claim 1,
The connecting portion includes a sliding flat portion provided by deforming the cooling pipe at a location corresponding to the cooling plate and a sliding flat portion provided in the connecting portion so as to sandwich and contact the sliding flat portion. And a supporting part that moves.

本発明の請求項３の半導体の冷却構造においては、請求項１又は請求項２記載の半導体の冷却構造において、
前記摺動平面部と前記支持部との間に設けられた潤滑剤を具備したことを特徴とする。 In the semiconductor cooling structure according to claim 3 of the present invention, in the semiconductor cooling structure according to claim 1 or 2,
A lubricant provided between the sliding flat part and the support part is provided.

本発明の請求項４の半導体の冷却構造においては、請求項１乃至請求項３の何れかに記載の半導体の冷却構造において、
前記潤滑剤は伝熱性グリスが使用されたことを特徴とする。 In the semiconductor cooling structure according to claim 4 of the present invention, in the semiconductor cooling structure according to any one of claims 1 to 3,
The lubricant is characterized in that heat transfer grease is used.

本発明の請求項１によれば、次のような効果がある。
薄い放熱シートが使用できるのでオイルの析出をなくすことができ、また、冷却効率を向上できる半導体の冷却構造が得られる。
高さ方向のバラツキを吸収できるようにしたので、放熱シートの種類を少なくでき、在庫管理コストが低減できる半導体の冷却構造が得られる。 According to claim 1 of the present invention, there are the following effects.
Since a thin heat dissipation sheet can be used, oil precipitation can be eliminated, and a semiconductor cooling structure that can improve cooling efficiency can be obtained.
Since the variation in the height direction can be absorbed, the type of the heat radiation sheet can be reduced, and a semiconductor cooling structure that can reduce the inventory management cost can be obtained.

連結ねじが廃止できるので、ＩＣに対する、圧縮によるストレスを軽減できる半導体の冷却構造が得られる。
現状の狭いスペ−ス内に配置できる半導体の冷却構造が得られる。 Since the connecting screw can be eliminated, a semiconductor cooling structure that can reduce stress due to compression on the IC can be obtained.
A semiconductor cooling structure that can be placed in the current narrow space can be obtained.

本発明の請求項２によれば、次のような効果がある。
冷却プレートに対応する箇所の、冷却パイプを変形して設けられた摺動平面部と、接続部に設けられ、摺動平面部を挟持して接触し鉛直方向に摺動する支持部とが設けられたので、熱伝達が確実にできる半導体の冷却構造が得られる。 According to claim 2 of the present invention, there are the following effects.
A sliding flat part provided by deforming the cooling pipe at a location corresponding to the cooling plate, and a support part provided in the connecting part and sandwiching the sliding flat part and sliding in the vertical direction are provided. Therefore, a semiconductor cooling structure capable of reliably transferring heat can be obtained.

本発明の請求項３によれば、次のような効果がある。
摺動平面部と支持部との間に潤滑剤が設けられたので、摺動平面部と支持部との摺動が滑らかにできる半導体の冷却構造が得られる。 According to claim 3 of the present invention, there are the following effects.
Since the lubricant is provided between the sliding flat surface portion and the support portion, a semiconductor cooling structure that can smoothly slide between the sliding flat surface portion and the support portion is obtained.

本発明の請求項４によれば、次のような効果がある。
潤滑剤は伝熱性グリスが使用されたので、摺動平面部と支持部との摺動が滑らかにできると共に伝熱が有効にできる半導体の冷却構造が得られる。 According to claim 4 of the present invention, there are the following effects.
Since the heat transfer grease is used as the lubricant, a semiconductor cooling structure can be obtained in which the sliding between the sliding flat portion and the support portion can be smoothly performed and heat transfer can be effectively performed.

以下本発明を図面を用いて詳細に説明する。
図１は本発明の一実施例の要部構成説明図、図２は図１の要部構成説明図である。
図において、図３と同一記号の構成は同一機能を表す。
以下、図３との相違部分のみ説明する。 Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is an explanatory diagram of the main part configuration of one embodiment of the present invention, and FIG. 2 is an explanatory diagram of the main part configuration of FIG.
In the figure, configurations with the same symbols as in FIG. 3 represent the same functions.
Only the difference from FIG. 3 will be described below.

図１において、冷却プレート２１，２２は、一面側が放熱シート２３，２４を介してＩＣ １，２をそれぞれ個々に冷却する。
接続部２５，２６は、一方端がこの冷却プレート２１，２２の他面側に接続され、他方端側が冷却パイプ２７，２８の外周面に接触し鉛直方向に摺動する。 In FIG. 1, the cooling plates 21 and 22 individually cool the ICs 1 and 2 through the heat dissipation sheets 23 and 24, respectively.
One end of each of the connection portions 25 and 26 is connected to the other surface side of the cooling plates 21 and 22, and the other end side contacts the outer peripheral surface of the cooling pipes 27 and 28 and slides in the vertical direction.

この場合は、接続部２５，２６は、冷却プレート２１，２２に対応する箇所の冷却パイプ２７，２８を変形して設けられた摺動平面部２５１，２６１と、接続部２５，２６に設けられ、摺動平面部２５１，２６１を挟持して接触し鉛直方向に摺動する支持部２５２，２６２とを有する。
この場合は、潤滑剤２９が摺動平面部２５１，２６１と支持部２５２，２６２との間に設けられ、伝熱性グリスが使用されている。 In this case, the connecting portions 25 and 26 are provided on the sliding flat portions 251 and 261 provided by deforming the cooling pipes 27 and 28 at locations corresponding to the cooling plates 21 and 22 and the connecting portions 25 and 26. , And supporting portions 252 and 262 which are in contact with each other while sandwiching the sliding flat portions 251 and 261 and slide in the vertical direction.
In this case, the lubricant 29 is provided between the sliding plane portions 251 and 261 and the support portions 252 and 262, and heat transfer grease is used.

以上の構成において、図１に示す如く、ＩＣ １個に対し１枚の冷却プレートを配置する。
接続部２５，２６は、冷却プレート２１，２２に対応する箇所の冷却パイプ２７，２８を変形して設けられた摺動平面部２５１，２６１と、接続部２５，２６に設けられ、摺動平面部２５１，２６１を挟持して接触し鉛直方向に摺動する支持部２５２，２６２とを有する。 In the above configuration, as shown in FIG. 1, one cooling plate is arranged for one IC.
The connecting portions 25 and 26 are provided on the sliding plane portions 251 and 261 provided by deforming the cooling pipes 27 and 28 at locations corresponding to the cooling plates 21 and 22 and the connecting portions 25 and 26, respectively. It has support parts 252 and 262 which sandwich and touch the parts 251 and 261 and slide in the vertical direction.

したがって、冷却プレート２１，２２自体の高さ方向のバラツキを、接続部２５，２６により吸収する構造となっている。
また、高さのバラツキを考慮する必要が無い為に、放熱シート２３，２４自体の厚みを薄くする。
図２に示す如く、摺動平面部２５１，２６１と支持部２５２，２６２との摺動部分には、伝熱性グリス２９を塗布して隙間を埋める。 Therefore, the connection in the height direction of the cooling plates 21 and 22 themselves is absorbed by the connecting portions 25 and 26.
Moreover, since it is not necessary to consider the variation in height, the thickness of the heat radiating sheets 23 and 24 is reduced.
As shown in FIG. 2, heat transfer grease 29 is applied to the sliding portions between the sliding flat portions 251 and 261 and the support portions 252 and 262 to fill the gaps.

この結果、
薄い放熱シート２３，２４が使用できるので、オイルの析出をなくすことができ、また、冷却効率を向上できる半導体の冷却構造が得られる。
高さ方向のバラツキを吸収できるようにしたので、放熱シート２３，２４の種類を少なくでき、在庫管理コストが低減できる半導体の冷却構造が得られる。 As a result,
Since thin heat dissipation sheets 23 and 24 can be used, oil precipitation can be eliminated, and a semiconductor cooling structure that can improve cooling efficiency can be obtained.
Since the variation in the height direction can be absorbed, the type of the heat radiating sheets 23 and 24 can be reduced, and a semiconductor cooling structure that can reduce the inventory management cost can be obtained.

連結ねじ１４が廃止できるので、ＩＣ １，２に対する、圧縮によるストレスを軽減できる半導体の冷却構造が得られる。
現状の狭いスペ−ス内に配置できる半導体の冷却構造が得られる。 Since the connection screw 14 can be eliminated, a semiconductor cooling structure that can reduce stress due to compression on the ICs 1 and 2 can be obtained.
A semiconductor cooling structure that can be placed in the current narrow space can be obtained.

冷却プレート２１，２２に対応する箇所の、冷却パイプを変形して設けられた摺動平面部２５１，２６１と、接続部に設けられ、摺動平面部２５１，２６１を挟持して接触し鉛直方向に摺動する支持部２５２，２６２とが設けられたので、熱伝達が確実にできる半導体の冷却構造が得られる。   The sliding flat portions 251 and 261 provided by deforming the cooling pipes at the locations corresponding to the cooling plates 21 and 22 and the connecting portions are provided in contact with the sliding flat portions 251 and 261 in the vertical direction. Since the support portions 252 and 262 that slide are provided, a semiconductor cooling structure capable of reliably transferring heat can be obtained.

摺動平面部２５１，２６１と支持部２５２，２６２との間に潤滑剤２９が設けられたので、摺動平面部２５１，２６１と支持部２５２，２６２との摺動が滑らかにできる半導体の冷却構造が得られる。   Since the lubricant 29 is provided between the sliding flat surface portions 251 and 261 and the support portions 252 and 262, the semiconductor cooling can smoothly slide between the sliding flat surface portions 251 and 261 and the support portions 252 and 262. A structure is obtained.

潤滑剤２９は伝熱性グリスが使用されたので、摺動平面部２５１，２６１と支持部２５２，２６２との摺動が滑らかにできると共に伝熱が有効にできる半導体の冷却構造が得られる。   Since the heat transfer grease is used for the lubricant 29, a semiconductor cooling structure can be obtained in which sliding between the sliding flat portions 251 and 261 and the support portions 252 and 262 can be performed smoothly and heat transfer can be effectively performed.

なお、以上の説明は、本発明の説明および例示を目的として特定の好適な実施例を示したに過ぎない。
したがって本発明は、上記実施例に限定されることなく、その本質から逸脱しない範囲で更に多くの変更、変形をも含むものである。 The above description merely shows a specific preferred embodiment for the purpose of explanation and illustration of the present invention.
Therefore, the present invention is not limited to the above-described embodiments, and includes many changes and modifications without departing from the essence thereof.

本発明の一実施例の要部構成説明図である。It is principal part structure explanatory drawing of one Example of this invention. 図１の要部構成説明図である。It is principal part structure explanatory drawing of FIG. 従来より一般に使用されている従来例の構成説明図である。It is structure explanatory drawing of the prior art example generally used conventionally.

符号の説明Explanation of symbols

１ ＩＣ
２ ＩＣ
３ プリント基板
４ 放熱シート
５ 放熱シート
６ 冷却プレート
７ 接続部
８ 接続部
９ 冷却パイプ
１１ 冷却パイプ
１２ カシメ
１３ カシメ
１４ 連結ねじ
２１ 冷却プレート
２２ 冷却プレート
２３ 放熱シート
２４ 放熱シート
２５ 接続部
２５１ 摺動平面部
２５２ 支持部
２６ 接続部
２６１ 摺動平面部
２６２ 支持部
２７ 冷却パイプ
２８ 冷却パイプ
２９ 潤滑剤 1 IC
2 IC
3 Printed Circuit Board 4 Heat Dissipation Sheet 5 Heat Dissipation Sheet 6 Cooling Plate 7 Connection Portion 8 Connection Portion 9 Cooling Pipe 11 Cooling Pipe 12 Caulking 13 Caulking 14 Connecting Screw 21 Cooling Plate 22 Cooling Plate 23 Heat Dissipating Sheet 24 Heat Dissipating Sheet 25 Connecting Portion 251 Sliding Plane Part 252 Support part 26 Connection part 261 Sliding plane part 262 Support part 27 Cooling pipe 28 Cooling pipe 29 Lubricant

Claims (4)

一面側が半導体に接し他面側が冷却パイプに接続される半導体の冷却構造において、
一面側が放熱シートを介して半導体をそれぞれ個々に冷却する冷却プレートと、
一方端がこの冷却プレートの他面側に接続され他方端側が前記冷却パイプの外周面に接触し鉛直方向に摺動する接続部と、
を具備したことを特徴とする半導体の冷却構造。 In a semiconductor cooling structure in which one side is in contact with a semiconductor and the other side is connected to a cooling pipe,
A cooling plate whose one side individually cools the semiconductor individually via a heat dissipation sheet;
A connecting portion whose one end is connected to the other surface of the cooling plate and the other end contacts the outer peripheral surface of the cooling pipe and slides in the vertical direction;
A cooling structure for a semiconductor, comprising: 前記接続部は、前記冷却プレートに対応する箇所の前記冷却パイプを変形して設けられた摺動平面部と、
前記接続部に設けられ前記摺動平面部を挟持して接触し鉛直方向に摺動する支持部と
を具備したことを特徴とする請求項１記載の半導体の冷却構造。 The connecting portion is a sliding flat portion provided by deforming the cooling pipe at a location corresponding to the cooling plate;
2. The semiconductor cooling structure according to claim 1, further comprising: a support portion that is provided in the connection portion and that is in contact with and sandwiches the sliding flat portion and slides in a vertical direction. 前記摺動平面部と前記支持部との間に設けられた潤滑剤
を具備したことを特徴とする請求項１又は請求項２記載の半導体の冷却構造。 The semiconductor cooling structure according to claim 1, further comprising a lubricant provided between the sliding flat portion and the support portion. 前記潤滑剤は伝熱性グリスが使用されたこと
を特徴とする請求項１乃至請求項３の何れかに記載の半導体の冷却構造。 The semiconductor cooling structure according to claim 1, wherein heat transfer grease is used as the lubricant.
JP2008264743A 2008-10-14 2008-10-14 Semiconductor cooling structure Pending JP2010097962A (en)

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Application Number Priority Date Filing Date Title
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JP2010097962A true JP2010097962A (en) 2010-04-30

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