JP2010094144A - Speed controller - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-weight speed controller having high cooling performance without increasing its scale. <P>SOLUTION: The speed controller includes: a switching element 50; a drive control circuit 4; a first circuit board 31; a flexible sheet-like first heat sink 10 in which first and second insulating layers 11 and 12 are laminated on the front and back of the intermediate layer 10c of an excellent heat conductor and the first insulating layer 11 is brought into contact with the exposed surface 50f of the switching element 50; a casing; and a second heat sink 20 of ceramic material, which is provided correspondingly to the opening of the casing, has a contact surface 21 to be in contact with the second insulating layer 12 of the first heat sink 10, is in contact with the second insulating layer 12 in an area wider than the exposed surface 50f of the switching element 50 mounted on a first mounting surface F1, and radiates heat from the opening. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a speed controller used for driving control of a motor mounted on a model that can be remotely controlled wirelessly.

  A speed controller is used as a control device for a motor that is a power source in a mobile object such as a model automobile or a motorcycle, a ship, or an airplane that is remotely controlled by radio. This speed controller controls the rotation speed of the motor, for example, by changing the energization time of the current flowing from the DC power source such as a battery to the motor using a switching element.

That is, the speed controller switches electric power from the DC power source, and controls the rotational speed of the motor by changing the ON / OFF duty ratio. Note that the duty ratio is a ratio of a period in which a phenomenon continues in a certain period in a periodic phenomenon, and the duty ratio D is obtained by the following equation (1).
D = τ / T (1)
However, τ: Period when the function is not zero (time when the speed controller is ON)
T: Function cycle

  As the switching element, for example, an FET (Field-Effect Transistor) is used. Since a large current for driving the motor flows through the switching element, and the switching element generates heat, the control of the motor may not be possible due to thermal runaway of the switching element.

Therefore, a heat radiating structure has been proposed in which a heat radiating member is brought into close contact with the switching element, or a fin is brought into close contact with the heat radiating member (see Patent Document 1).
An air cooling fan is provided above the switching element.
JP-A-62-214652 (FIGS. 2 and 8)

In recent years, there has been a great demand for high-power motors. For this reason, there is a tendency to use large fins and large air-cooling fans as the drive current to the motor increases.
However, when fins and air cooling fans are enlarged, the selectivity of the arrangement of the speed controller is narrowed and the weight of the model is increased.

  Accordingly, an object of the present invention is to provide a speed controller that is lightweight and has high cooling performance without increasing its size.

  In order to achieve the above object, the speed controller according to the first aspect of the present invention inputs a power supply path from the DC power source mounted on the model to the motor to control the motor mounted on the model that can be remotely controlled. In the speed controller to be turned off, a plurality of terminals connected in parallel for each terminal of the motor, a switching element for turning on and off the power feeding path, and a command signal for controlling the motor, A drive control circuit that controls the on / off timing, and a part or all of the switching elements corresponding to the one or more terminals of the motor are mounted in a predetermined region on the first mounting surface. 1 circuit board and first and second insulating layers are laminated on the front and back of the intermediate layer of the good thermal conductor, and the first insulating layer is in contact with the exposed surface of the switching element. A flexible sheet-like first heat sink, the predetermined area of the first circuit board, the switching element, and the drive control circuit are housed on the first mounting surface of the first circuit board. A casing provided with an opening at a position corresponding to the predetermined region; a contact surface provided corresponding to the opening of the casing and in contact with the second insulating layer of the first heat sink; Has a ceramic second heat sink that contacts the second insulating layer in a larger area than the exposed surface of the switching element mounted on the first mounting surface and radiates heat toward the outside of the casing. I have.

According to the first aspect of the invention, the first heat sink having the good heat conductor is in contact with the exposed surface of the switching element, and the heat of the switching element is transferred to the intermediate layer via the first insulating layer of the first heat sink. It is. Since the heat of the first heat sink is made uniform in the intermediate layer, temperature variations (heat spots) between the switching elements hardly occur.
A ceramic second heat sink is in contact with the first heat sink, and heat of the first heat sink is transferred from the intermediate layer to the second heat sink through the second insulating layer. The use of ceramic heat sinks with high thermal emissivity eliminates the need to use large fins and large fans, so the speed controller does not increase in size and is lightweight and small enough. Cooling effect can be obtained.

  Here, the thermal emissivity means a ratio of heat that is released (radiated) to the outside by the object among heat absorbed by the object. More specifically, the thermal radiation intensity of a black body is equal to E, showing the maximum thermal radiation at that temperature, and the thermal radiation intensity q of an actual solid surface is always smaller than the thermal radiation intensity E of a black body at the same temperature. Q / E define the thermal emissivity ε of a real object.

In the first invention, the first circuit board further has a second mounting surface on a surface opposite to the first mounting surface, and the one or more terminals of the motor are in a predetermined region of the second mounting surface. When a plurality of the switching elements corresponding to the above are mounted in an aligned manner, the first insulating layer of the first heat sink is in contact with the exposed surface of the switching element mounted on the second mounting surface. In addition, it is preferable that the first heat sink is bent along the first and second mounting surfaces of the first circuit board.
This aspect is applied when switching elements are mounted on both surfaces of a single circuit board, and the heat of the switching elements mounted on the second mounting surface is transferred to the intermediate layer via the first insulating layer. Heat is transferred between the first mounting surface and the second heat sink through the bent portion of the intermediate layer, and further transferred to the second heat sink through the second insulating layer.

In the first aspect of the present invention, the semiconductor device further includes a second circuit board disposed opposite to and substantially parallel to the first circuit board, the second circuit board having a third mounting surface, and the third circuit board. When a plurality of the switching elements corresponding to the one or more terminals of the motor are mounted in alignment within a predetermined region of the mounting surface, the second insulating layer of the first heat sink is the third mounting. The first heat sink is bent along the first mounting surface of the first circuit board and the third mounting surface of the second circuit board so as to contact the exposed surface of the switching element mounted on the surface. It is preferable.
This aspect is applied when the switching elements are respectively mounted on the two circuit boards, and the heat of the switching elements mounted on the third mounting surface is transferred to the intermediate layer via the second insulating layer, Heat is transferred between the first mounting surface and the second heat sink in the intermediate layer, and further transferred to the second heat sink.

According to a second aspect of the present invention, there is provided a speed controller for turning on and off a power supply path from a direct current power source mounted on the model to drive and control the motor mounted on the model that can be remotely controlled. A plurality of switching elements that are connected in parallel to each other and that turn on and off the power supply path; and a drive control circuit that controls the turning on and off timing of each switching element based on a command signal for controlling the motor; A first circuit board having a mounting surface on which a plurality of groups of the switching elements corresponding to the one or more terminals of the motor are aligned and mounted in one predetermined area; and in another predetermined area Another group of the switching elements corresponding to the one or more terminals of the motor has a different mounting surface that is mounted in alignment and faces the mounting surface. A first circuit board and a second circuit board arranged substantially parallel to and in close proximity to the first circuit board, and first and second insulating layers on the front and back of the intermediate layer of the good thermal conductor, And the second insulating layer is mounted on the other mounting surface so that the layer is in contact with the exposed surface of the group of the switching elements mounted on the one mounting surface. A flexible sheet-like first heat sink inserted between the pair of switching elements so as to come into contact with the exposed surface, the predetermined area of the first circuit board, the switching elements, and the drive control A casing having an opening provided at a position corresponding to the predetermined region on the mounting surface of the first circuit board, and a first circuit board provided corresponding to the opening of the casing. Fold along It was having a contact surface in contact with the second insulating layer of the first heat sink, and a second heat sink ceramic substance to radiate heat towards the outside of the casing.
This aspect can be applied when the switching elements are mounted on two circuit boards so as to face each other.

  The heat of the switching elements mounted on the first and second circuit boards is transferred to the intermediate layer through the first and second insulating layers, respectively. The heat of the intermediate layer is transferred to a portion between the first circuit board and the second heat sink through the bent portion of the first heat sink, and further transferred to the second heat sink through the second insulating layer. It is. The second heat sink of salamic quality releases heat by heat radiation.

The third aspect of the present invention is a speed controller for turning on and off a power supply path from a DC power source mounted on the model to drive and control a motor mounted on the model that can be remotely controlled. A plurality of switching elements that are connected in parallel to each other and that turn on and off the power supply path; and a drive control circuit that controls the turning on and off timing of each switching element based on a command signal for controlling the motor; A first mounting surface on which a plurality of first groups of the switching elements corresponding to the one or more terminals of the motor are mounted in a first predetermined region, and the first mounting surface. Second mounting in which a plurality of second groups of the switching elements corresponding to the one or more terminals of the motor are aligned and mounted in a second predetermined area on the opposite surface A plurality of third groups of the switching elements corresponding to the one or more terminals of the motor are mounted in a third predetermined region and face the second mounting surface. A second circuit board having a third mounting surface and disposed substantially parallel to and in close proximity to the first circuit board; and first and second insulating layers on the front and back of the intermediate layer of the good thermal conductor And the first insulating layer is in contact with the exposed surfaces of the first and second groups of switching elements mounted on the first and second mounting surfaces, and the second insulating layer is A flexible sheet that is bent along the first and second mounting surfaces of the first circuit board so as to contact the exposed surfaces of the third group of switching elements mounted on the third mounting surface. First heat sink, and each predetermined area of each circuit board and front A casing that accommodates the switching element and the drive control circuit and has an opening provided at a position corresponding to the first predetermined region on the first mounting surface of the first circuit board, and corresponds to the opening of the casing Provided in contact with the second insulating layer along the first mounting surface of the first heat sink, the contact surface of the switching element mounted on the first mounting surface A ceramic second heat sink that contacts the second insulating layer over a larger area than the exposed surface and radiates heat toward the outside of the casing;
This aspect can be applied when three layers of switching elements are mounted on two circuit boards.

The first to third groups of switching elements mounted on the first to third mounting surfaces are respectively in contact with the insulating layer, and therefore the heat of the element is transferred to the intermediate layer via the insulating layer. Since heat is made uniform in the intermediate layer, heat spots are unlikely to occur.
The heat of the intermediate layer between the two substrates is transferred to the intermediate layer between the first circuit board and the second heat sink through a bent portion in the intermediate layer, and the heat of the intermediate layer Is further transferred to the second heat sink via the second insulating layer.
The second heat sink releases heat by heat radiation.

The fourth aspect of the present invention is a speed controller for turning on and off a power supply path from a DC power source mounted on the model to drive and control the motor mounted on the remotely-controllable model. A plurality of switching elements that are connected in parallel to each other and that turn on and off the power supply path; and a drive control circuit that controls the turning on and off timing of each switching element based on a command signal for controlling the motor; A first mounting surface on which a plurality of first groups of the switching elements corresponding to the one or more terminals of the motor are mounted in a first predetermined region, and the first mounting surface. Second mounting in which a plurality of second groups of the switching elements corresponding to the one or more terminals of the motor are aligned and mounted in a second predetermined area on the opposite surface A plurality of third groups of the switching elements corresponding to the one or more terminals of the motor are mounted in a third predetermined region and face the second mounting surface. A third mounting surface and a plurality of fourth groups of the switching elements corresponding to the one or more terminals of the motor in a fourth predetermined area on a surface opposite to the third mounting surface. A second circuit board having a fourth mounting surface that is mounted in alignment and arranged substantially parallel to and in close proximity to the first circuit board, and on the front and back of the intermediate layer of the good heat conductor The first and second insulating layers are stacked, and the first insulating layer contacts the exposed surfaces of the first and second group switching elements mounted on the first and second mounting surfaces. Flexibility bent along first and second mounting surfaces of one circuit board The third and fourth insulating layers are laminated on one side of the sheet-shaped heat sink and the intermediate layer of the good thermal conductor, and the third insulating layer is mounted on the third and fourth mounting surfaces. The third and fourth mounting surfaces of the second circuit board are in contact with the exposed surfaces of the switching elements of the third group and the fourth group, and the fourth insulating layer is in contact with the second insulating layer. A flexible sheet-like heat sink that is bent along, the predetermined regions of the circuit boards, the switching elements, and the drive control circuit; and the first circuit board of the first circuit board. A casing provided with an opening at a position corresponding to the first predetermined region on the mounting surface, and the second along the first mounting surface of the one heat sink provided corresponding to the opening of the casing. Contact with insulating layer The contact surface is in contact with the second insulating layer of the one heat sink in an area larger than the exposed surface of the switching element mounted on the first mounting surface, and is outside the casing. And a ceramic heat sink that radiates heat toward.
This aspect can be applied when switching elements are mounted on both surfaces of two circuit boards, that is, when four layers of switching elements are mounted.

Heat of the switching elements of the first group to the fourth group is transferred to the intermediate layer through the first or third insulating layer. Since the intermediate layer is a good thermal conductor, heat spots are unlikely to occur in each switching element.
The heat of the switching elements of the third group and the fourth group is transferred from the fourth insulating layer of the other sheet-like heat sink to the intermediate layer of the one heat sink through the second insulating layer of the one sheet-like heat sink. Be heated. Further, the heat of the intermediate layer is transferred between the first circuit board and the ceramic heat sink through the bent portion of the one heat sink, and is radiated from the ceramic heat sink.

The speed controller on which the four-layer switching elements are mounted further includes a third circuit board on which the elements constituting the drive control circuit are mounted, and is provided between the third circuit board and the first circuit board. The third circuit board is provided so that the second circuit board is disposed, and the ceramic material is provided so as to obtain a pressure at which the sheet-like heat sink contacts the switching elements and the ceramic heat sink. The pair of sheet-like heat sinks and the first and second circuit boards may be sandwiched between a heat sink and the third circuit board.
In this case, the contact pressure at the interface can be easily obtained.

In the speed controller mounted so that the groups of the switching elements face each other, the switching elements disposed on the mounting surfaces facing each other of the circuit boards substantially parallel to each other have the same number, the same shape, and the same size. In addition, it is desirable that they are placed directly opposite each other.
According to this aspect, a uniform and large contact pressure can be reliably obtained over the entire surface of the switching element.

In the present invention, the contact surface of the ceramic heat sink is accommodated in the casing, and a radiation surface opposite to the contact surface, and each of four side surfaces between the contact surface and the radiation surface. It is preferable that at least a part of is exposed from the casing.
According to this aspect, heat radiation from the side surface of the ceramic heat sink can be expected.

In this case, a stepped portion in which at least a pair of upper edge portions facing each other are cut out is formed on the radiation surface of the ceramic heat sink, and an opening edge portion that forms the opening of the casing is in contact with the stepped portion. It is preferable.
In this case, the ceramic heat sink can be fixed to the casing without using screws or the like.

In the present invention, a part of the circuit board excluding the predetermined region further includes a protrusion protruding from the casing, and a plurality of terminals connected to the DC power source or the motor via the power feeding path are the protrusions. Is preferably provided.
According to this aspect, heat radiation can also be expected from the protruding portion protruding from the casing.

In a preferred example of the present invention, the circuit board or the group of circuit boards has a first edge and a second edge opposite to or adjacent to the first edge, in the vicinity of the first edge and the second edge of the circuit board. Are respectively provided with terminals for connecting cables connected to the DC power supply or the terminals of the motor.
According to this aspect, there is room between the terminals, and the connection work is facilitated.

In a preferred example of the present invention, two first terminals connected to the DC power supply are arranged in the vicinity of the first edge, and the DC power supply is arranged outside the first edge, A plurality of second terminals connected to the motor are connected to the second edge.
In this case, the DC power supply and the terminals can be arranged in a compact manner.

  In the present invention, the circuit board or the circuit board group has first to fourth edges that are adjacent to or opposed to each other, and the DC power supply or the motor terminal is provided in the vicinity of the first and second edges, respectively. A terminal for connecting a cable to be connected is disposed, an indicator for displaying a setting state of the speed controller is disposed in the vicinity of the third edge, and the first heat sink is bent at the fourth edge. May be.

  In the present invention, a third circuit board on which elements constituting the drive control circuit are mounted is further provided, and the second circuit board is disposed between the third circuit board and the first circuit board. The third circuit board may be provided.

In the present invention, the first heat sink preferably has a thermal conductivity in a plane direction along the intermediate layer larger than a thermal conductivity in an orthogonal direction orthogonal to the intermediate layer.
According to this aspect, it is possible to suppress the heat from diffusing due to the anisotropy of the thermal conductivity to locally increase the temperature.
“Thermal conductivity” refers to the value representing the ease of heat transfer within a single substance. Specifically, the heat flux density (thermal energy passing through a unit area per unit time) is a temperature gradient. Expressed as a physical quantity divided by.

In the present invention, the second heat sink preferably contains alumina (Al ₂ O ₃ ) as a main component.
According to this aspect, since the heat sink mainly composed of alumina is generally cheaper than the heat sink mainly composed of aluminum nitride, an increase in the cost of the speed controller can be suppressed.

Embodiments of the present invention will be described below with reference to the drawings. In each of the following embodiments, a case where the present invention is applied to a model vehicle will be described as an example.
1 to 9 show a first embodiment.

Equipment configuration:
As shown in FIG. 7, a vehicle (an example of a remotely maneuverable model) 1 can be steered by a driver by receiving radio waves transmitted from a transmitter 2 by a receiver 3 mounted on the vehicle 1. is there.
The vehicle 1 is equipped with the receiver 3, the speed controller C, the motor 6, the wheels 7, the DC power source (battery) 8, and the like.

  When the pilot transmits a radio signal using the transmitter 2, the receiver 3 receives the radio signal. Based on the received signal, the speed controller C feeds the power supply path 6 c from the DC power supply 8 to the motor 6. The motor 6 is driven and controlled by turning on and off.

Speed controller C:
As shown in FIG. 8, the speed controller C includes a drive control circuit 4, a switching circuit 5, an operation unit 61, a display circuit 62, a connector 63, and a power supply circuit 64. The operation unit 61 includes a slide switch for switching between the normal operation mode and the setting mode, and a switch for receiving an operation input for setting the speed controller C in the setting mode.
When the normal operation mode is selected by the slide switch, the speed controller C controls the switching circuit 5 with the drive control circuit 4 based on the signal received through the connector 63, so that the DC power source 8 The motor 6 is driven and controlled by turning on and off the power supply path 6 c to the motor 6.
When the setting mode is selected by the slide switch, the speed controller C notifies the display circuit 62 that the setting mode is selected and also notifies the setting state. It is configured such that gain / offset adjustment with respect to the operation amount can be performed, and the switching frequency of the switching circuit 5 can be switched and set. The switching setting of the switching frequency can be set to vary continuously or stepwise according to the operation amount of the operation lever, the operation speed of the operation lever or the rotation speed of the motor 6, or can be set to a predetermined fixed frequency. You may comprise so that it can set.

Switching circuit 5:
As shown in FIG. 9, the switching circuit 5 includes a plurality of switching elements 50 (50a, 50b) connected in parallel for each terminal 6a of the motor. In the first embodiment, the motor 6 is provided with a three-pole terminal 6a, and first to third switching element groups 51 to 53 corresponding to the terminal 6a are provided.
Moreover, the switching element groups 51 to 53 of the first to third groups respectively include a switching element 50a corresponding to the positive electrode of the DC power supply 8 (FIG. 9) and a switching element 50b corresponding to the negative electrode. In the first embodiment, the motor 6 to be driven and controlled is a three-phase brushless motor, and the above-described configuration is adopted to drive the motor 6 in full wave. However, when the three-phase brushless motor is driven in half wave Need only have one of the switching element 50a corresponding to the positive electrode or the switching element 50b corresponding to the negative electrode.

Drive control circuit 4:
The drive control circuit 4 controls the on / off timing of each switching element 50 based on a command signal for controlling the motor 6 transmitted from the receiver 3.

Three-layer element groups 51 to 53:
As shown in FIG. 2, the speed controller C includes first to third circuit boards 31 to 33, first and second heat sink sinks 10 and 20, and a casing 9 shown in FIG.

As shown in FIG. 1, a second circuit board 32 is provided above the third circuit board 33. A first circuit board 31 is provided above the second circuit board 32. A second heat sink 20 is provided above the first circuit board 31.
A first heat sink 10 bent along the first circuit board 31 is provided between the first and second circuit boards 31 and 32 and between the first circuit board 31 and the second heat sink 20.

First circuit board 31:
As shown in FIGS. 1 and 2, the first circuit board 31 includes first and second mounting surfaces F1 and F2.

First mounting surface F1;
The first mounting surface F1 is formed on the upper surface 31u of the first circuit board 31.
As shown in FIG. 3, a plurality of the switching elements 50 of the first group 51 corresponding to the one terminal 6a of the motor 6 (FIG. 9) are vertically and horizontally in the first predetermined area D1 of the first mounting surface F1. Individually mounted.

Second mounting surface F2;
As shown in FIG. 1, the second mounting surface F <b> 2 is formed on the lower surface 31 d of the first circuit board 31. That is, the second mounting surface F2 is formed on the surface of the first circuit board 31 that is opposite to the first mounting surface F1.
In the second predetermined area D2 of the second mounting surface F2 indicated by the broken line in FIG. 3, a plurality of the switching elements 50 of the second group 52 corresponding to the one terminal 6a of the motor 6 (FIG. 9) are arranged vertically and horizontally. Individually mounted.

Second circuit board 32:
As shown in FIG. 1, the second circuit board 32 is disposed substantially parallel to and in close proximity to the first circuit board 31.
Third mounting surface F3;
The third mounting surface F3 is formed on the upper surface 32u of the second circuit board 32. That is, the third mounting surface F3 is set at a position facing the second mounting surface F2.
As shown in FIG. 3, in the third predetermined area D3 of the third mounting surface F3, a plurality of switching elements 50 of the third group 53 corresponding to the one terminal 6a of the motor 6 (FIG. 9) are arranged vertically and horizontally. Individually mounted.

As shown in FIGS. 1, 2, and 3, the switching elements 50 disposed on the mounting surfaces F <b> 2 and F <b> 3 of the first and second circuit boards 31 and 32 that are substantially parallel to each other have the same number and the same shape. , Are the same size and are placed directly opposite each other.
The switching element 50 is preferably a surface-mounted substantially rectangular parallelepiped plate-shaped FET (field effect transistor). The mounting surface soldered to the circuit boards 31 and 32 and the exposed surface 50f on the opposite side are the other four. The heat radiation from the switching element 50 to the circuit boards 31 and 32 through the substrate wiring is sufficiently larger than the surface, and the heat radiation to the first heat sink 10 is efficiently performed at the exposed surface 50f.

First heat sink 10:
As shown in FIG. 1, the first heat sink 10 is formed by laminating first and second insulating layers 11 and 12 on the front and back of an intermediate layer 10c of a good heat conductor.
The first heat sink 10 has flexibility. Therefore, the first insulating layer 11 is in contact with the exposed surface 50f of the switching element 50 of the first group 51 and the second group 52 mounted on the first and second mounting surfaces F1, F2, and The second insulating layer 12 is in contact with the contact surface 21 of the second heat sink 20 and the exposed surface 50f of the switching element 50 of the third group 53 mounted on the third mounting surface F3. It is bent along the first and second mounting surfaces F1, F2.

A screw member 71 is inserted into the second heat sink 20 and the first and second circuit boards 31 and 32, and the screw member 71 is screwed into the nut 72, whereby the second heat sink 20 and the second circuit are connected. A first circuit board 31 is sandwiched between the board 32 and the substrate 32.
Therefore, the sheet-like first heat sink 10, the switching elements 50, and the thick plate block-like second heat sink 20 are brought into contact with each other and are brought into pressure contact with each other.

  Therefore, the contact surface 21 of the second heat sink 20 and the exposed surface 5f of each switching element 50 of the first group 51 are in pressure contact with the second insulating layer 12 and the first insulating layer 11 of the first heat sink 10, respectively. Similarly, the exposed surfaces 50f of the switching elements 50 of the second group 52 and the third group 53 are in pressure contact with the first insulating layer 11 and the second insulating layer 12 of the first heat sink 10, respectively.

Casing 9:
The casing 9 shown in FIG. 5 includes predetermined areas D1 to D3 of the circuit boards 31 to 33 shown in FIGS. 1 and 3, and switching elements 50 mounted in the first predetermined areas D1 to D3. The drive control circuit 4 shown in FIG. 1 is accommodated. At a position corresponding to the first predetermined area D1 on the first mounting surface F1 of the first circuit board 31 shown in FIG. 3, as shown in FIG. 5, an opening 9a having approximately the same size as the first predetermined area D1. Is provided.

Second heat sink 20:
The second heat sink 20 radiates heat toward the outside of the casing 9, and is provided corresponding to the opening 9 a of the casing 9.
As shown in FIG. 1, the second heat sink 20 has a contact surface 21 that contacts the second insulating layer 12 along the first mounting surface F <b> 1 of the first heat sink 10. The contact surface 21 is in contact with the second insulating layer 12 in an area larger than the exposed surface 50f of the switching element 50 of the first group 51 mounted on the first mounting surface F1, and the switching element of the first group 51 50 is in contact with the second insulating layer 12 of the first heat sink 10 in and around the entire exposed surface 50f.

  The contact surface 21 of the second heat sink 20 shown in FIG. 1 is accommodated in the casing 9 and opposite to the contact surface 21 (FIG. 1), as shown in FIGS. 5 and 6A and 6B. 1 and at least the top of each of the four side surfaces 23 between the contact surface 21 and the radiation surface 22 in FIG. 1 are exposed from the casing 9, as shown in FIGS. 6 (a) and 6 (b). is doing.

In the first circuit board 31 and the second circuit board 32 shown in FIG. 3, a part of the circuit board excluding the predetermined regions D1 to D3 is a protruding portion 31b, 32a, 32b protruding from the casing 9 shown in FIG. It has.
A plurality of terminals 41, 42 are provided on the protruding portions 31b, 32a, 32b. The terminals 41 and 42 are connected to the DC power source 8 or the motor 6 shown in FIG. 7 via power supply paths 8c and 6c.

  That is, the circuit board groups 31 to 33 shown in FIG. 3 have a first edge E1 and a second edge E2 facing the first edge E1. The protrusions 31b, 32a, 32b are formed in the vicinity of the first edge E1 and the second edge E2 of the circuit boards 31, 32, and the protrusions 31b, 32a, 32b are respectively shown in FIG. The terminals 41 and 42 (FIG. 5) for connecting the cables connected to the terminals 6a and 8a of the DC power supply 8 or the motor 6 are arranged.

Specifically, two first terminals 41 are provided on the protrusion 32 a on the first edge E 1 side of the second circuit board 32. The first terminal 41 is connected to a power cable constituting a power supply path 8c connected to the DC power source 8 shown in FIG.
A total of three second terminals 42 are provided on the protrusions 31b and 32b on the second edge E2 side of the first and second circuit boards 31 and 32 shown in FIG. The second terminals 42 are respectively connected to power supply cables that constitute the power supply path 6c connected to the motor 6 shown in FIG.

  Therefore, two first terminals 41 connected to the DC power supply 8 (FIG. 9) are arranged on the protruding portion 32a of the first edge E1 of the first circuit board 31 shown in FIG. 3, and the first edge E1. The DC power supply 8 shown in FIG. On the other hand, a plurality of second terminals 42 connected to the motor 6 (FIG. 9) are connected to the second edge E2 of the first and second circuit boards 31 and 32 of FIG.

  The casing 9 shown in FIG. 6 is divided into two parts in the vertical direction, and a cutout 90 is formed on the divided surface, from which the protruding portions 31b, 32a, 32b protrude.

The circuit board groups 31 to 33 have a first edge E1 to a fourth edge E4 that face each other or are adjacent to each other.
As described above, the terminals 41 and 42 are disposed in the vicinity of the first and second edges E1 and E2, and the terminals 41 and 42 are respectively connected to the DC power supply 8 or the motor of FIG. Cables 8c and 6c connected to the six terminals 8a and 6a (FIG. 9) are connected.
In the vicinity of the third edge E3 shown in FIG. 3, a display 45 for displaying the setting state of the speed controller C is arranged.
The display unit 45 is composed of blue, green, yellow, and red chip LEDs, and displays the setting state of the speed controller C by turning on / off or blinking of each chip LED.
The first heat sink 10 is bent at the fourth edge E4.
The vicinity of the third edge E3 where the display unit 45 is disposed is omitted, and the lead frame type LEDs of blue, green, yellow, and red are mounted on the lowermost circuit board 33, and the foot of the lead frame is mounted. May be arranged close to the top plate of the casing 9 at a height equivalent to or higher than the uppermost circuit board 31 by adjusting the length to a predetermined length. In this case, the first heat sink 10 may be bent on the third edge E3 side instead of being bent at the fourth edge E4.

As described above, the element 400 constituting the drive control circuit 4 (FIG. 7) is mounted on the upper surface 33u of the third circuit board 33 shown in FIG.
The third circuit board 33 is provided such that the second circuit board 32 is disposed between the third circuit board 33 and the first circuit board 31.

  As shown in FIG. 1, the distance H1 from the second circuit board 32 to the first circuit board 31 is set smaller than the distance H2 from the third circuit board 33 to the second circuit board 32.

First heat sink 10:
The first heat sink 10 is a sheet-like member having a thermal conductivity in the plane direction along the intermediate layer 10c that is greater than the thermal conductivity in the orthogonal direction perpendicular to the intermediate layer 10c.
Therefore, after being transferred by heat conduction or the like from the exposed surface 50f of the switching element 50, which is a heat source, to the intermediate layer 10c via the first insulating layer 11 or the second insulating layer 12 of the first heat sink 10, the intermediate layer Heat is transferred in the surface direction. Therefore, the temperature of each switching element 50 is averaged.
As described above, the temperature of all the switching elements 50 is made uniform by the first heat sink 10. For example, the overheating of the switching element 50 is detected, and the switching element 50 is forcibly turned off when the overheating occurs. The frequency of activation of the overheat prevention function for preventing damage can be reduced. In particular, when the switching element 50 is used in parallel as the switching element groups 51 to 53, the amount of heat generation increases in inverse proportion to the ON resistance of the switching element 50, so uneven heat generation is caused by variations in the ON resistance of the switching element 50. May occur, and due to the effect of temperature equalization by the first heat sink 10, overheating can be essentially mitigated and the frequency of activation of the overheat prevention function can be reduced.

  The intermediate layer 10c is composed of a laminate of a plurality of graphite sheets. The graphite sheet is formed by mixing graphite powder with a binder resin to form a sheet, or rolling expanded graphite to form a sheet. can get. The intermediate layer 10c preferably has a thickness of about 0.1 mm to 2.0 mm, for example.

  As the insulating layer, an adhesive layer such as a double-sided tape can be adopted in addition to a resin film such as PET or a resin coat.

In the present invention, the second heat sink 20 may be a ceramic heat radiation solid material mainly composed of alumina (Al ₂ O ₃ ). As the ceramic second heat sink 20 mainly composed of alumina, for example, a ceramic heat-radiating solid material disclosed in Japanese Patent Laid-Open No. 63-140292 can be used.
The ceramic heat-radiating solid material has, for example, an alumina content of 95.0% by weight or more, a thermal emissivity of 0.93 to 0.98, and a thermal conductivity of 30 to 60 W / m · k. Can be favorably adopted.
In addition, although it is expensive, you may employ | adopt the ceramic heat radiation solid substance which has aluminum nitride as a main component.

  In each embodiment described below, a different part from the first embodiment will be mainly described. In the following embodiments, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

10 to 15 show a second embodiment.
Speed controller C having four layers of elements:
As shown in FIG. 10, in the fourth embodiment, a plurality of switching elements 50 are mounted on both surfaces of the first and second circuit boards 31 and 32, and a pair of first heat sinks 10A and 10B are provided. It has been.

  A fourth predetermined region D4 is provided on the surface opposite to the third mounting surface F3 of the second circuit board 32, that is, on the lower surface 32d of the second circuit board 32. In the fourth predetermined region D4, a fourth mounting surface F4 is formed on which a plurality of fourth groups 54 of the switching elements 50 corresponding to the motor terminals (not shown) are mounted in alignment.

First heat sinks 10A, 10B;
The upper first heat sink (one heat sink) 10A is formed by laminating first and second insulating layers 11 and 12 on the front and back of the intermediate layer 10c of a good heat conductor. The lower first heat sink (another heat sink) 10B is formed by laminating third and fourth insulating layers 13 and 14 on the front and back of the intermediate layer 10c of a good heat conductor. That is, the same members as those of the first heat sink 10 (FIG. 1) are used as the upper and lower heat sinks 10A and 10B.

As shown in FIGS. 10 to 12, the first insulating layer 11 of the upper first heat sink 10 </ b> A is switched between the first group 51 and the second group 52 mounted on the first and second mounting surfaces F <b> 1 and F <b> 2. The first circuit board 31 is bent along the first and second mounting surfaces F1 and F2 so as to come into contact with the exposed surface 50f of the element 50.
The third insulating layer 13 of the lower first heat sink 10B contacts the exposed surface 50f of the switching elements 50 of the third group 53 and the fourth group 54 mounted on the third and fourth mounting surfaces F3, F4. In addition, the fourth insulating layer 14 is bent along the third and fourth mounting surfaces F3 and F4 of the second circuit board 32 so as to be in contact with the second insulating layer 12.

First and second terminals 41, 42;
As shown in FIG. 11, one first terminal 41 is provided on each of the protruding portions 31a and 32a on the first edge E1 side of the first and second circuit boards 31 and 32, respectively. The two first terminals 41 are connected to a power cable constituting a power supply path 8c connected to the DC power supply 8 shown in FIG.
As shown in FIG. 12, three second terminals 42 are provided on the protrusion 31 b on the second edge E <b> 2 side of the first and second circuit boards 31 and 32. The second terminal 42 is connected to a power supply cable constituting the power supply path 6c connected to the motor 6 shown in FIG.

The second terminals 42 of FIGS. 12, 14 and 15 connected to the motor 6 via the power supply cable are drawn out from the first and second circuit boards 31 and 32 in three places, and between the boards 31 and 32. Are connected by soldering. On the other hand, the first terminal 41 connected to the DC power supply 8 through the power cable has substrates 31 and 32 divided according to polarity.
That is, in the first embodiment, the switching element groups 51 to 53 of the first to third groups in FIG. 1 corresponding to the three-pole terminals 6a connected to the motor 6 in FIG. Although mounted on the circuit boards 31 and 32, in this embodiment, the switching element 50a of FIG. 10 corresponding to the positive electrode of the DC power source 8 of FIG. 13 and the switching element corresponding to the negative electrode of the DC power source 8 (FIG. 13). By mounting 50b on separate circuit boards 31, 32, a reduction in the pin connector for large current that bridges between the circuit boards 31, 32 is realized.

  In FIG. 10, the element 400 which comprises the drive control circuit 4 (FIG. 7) is provided in the lower surface 33d of the said 3rd circuit board 33. In FIG.

Casing 9;
As shown in FIG. 10, a stepped portion 24 is formed on the radiation surface 22 of the block-shaped heat sink 20 by notching a pair of upper edge portions facing each other. An opening edge portion 9 b that forms the opening 9 a of the casing 9 is in contact with the stepped portion 24.
Therefore, the second heat sink 20 is fixed between the casing 9 and the first circuit board 31 by pressing the step 24 of the second heat sink 20 against the opening edge 9 b of the casing 9.

Between the ceramic second heat sink 20 and the third circuit board 33 so as to obtain a pressure at which the sheet-shaped first heat sinks 10A and 10B come into contact with the switching elements 50 and the block-shaped second heat sink 20. The pair of first heat sinks 10A and 10B and the first and second circuit boards 31 and 32 are sandwiched.
The casing 9 is divided into two in the vertical direction, and a cutout 90 is formed on the divided surface, from which the protruding portions 31b, 32a, and 32b protrude, but the lower casing 9 faces the upper casing 9. A through hole may be formed, and the upper casing 9 may be provided with a female screw structure for screwing with a screw inserted from a through hole formed in the lower casing 9. By joining the upper casing 9 and the lower casing 9 using screws, the second heat sink 20 can be more firmly pressed and fixed to the second heat sink 20 and the first circuit board 31 by the upper casing 9.
The signal pin connector 49 that bridges the control signal to the switching element 50 between the first and second circuit boards 31 and 32 is soldered by the first and second circuit boards 31 and 32. The pair of first heat sinks 10A and 10B may be sandwiched and pressed by adjusting the position in the height direction of soldering to the signal pin connector 49 of each of the first and second circuit boards 31 and 32. Good. In this case, it is preferable that the signal pin connector 49 is provided on at least two edges of the circuit boards 31 and 32.

  In the second embodiment, the display unit 45 in FIG. 12 is mounted on the third edge E3 of the third circuit board 33 in the lowermost layer and is visible from the window 91 in FIGS.

FIG. 16 shows a third embodiment.
Speed controller C having a single layer element group:
As shown in FIG. 3, all the switching elements 50 are mounted on the upper surface 31 u of the first circuit board 31. The first heat sink 10 is interposed between the contact surface 21 of the second heat sink 20 and the exposed surface 50 f of the switching element 50. Therefore, the contact surface 21 of the second heat sink 20 and the first insulating layer 11 of the first heat sink 10 are in close contact with the second insulating layer 12 of the first heat sink 10 and the exposed surface 50f of the switching element 50, respectively.

FIG. 17 shows a fourth embodiment.
Speed controller C having two layers of elements:
As shown in FIG. 17, a first group 51 and a second group 52 including a plurality of switching elements 50 are mounted on the upper surface 31 u and the lower surface 31 d of the first circuit board 31, respectively.
The first heat sink 10 is interposed between the contact surface 21 of the second heat sink 20 and the exposed surface 50 f of the switching element 50 of the first group 51.

  A pressing plate 34 is provided below the first circuit board 31, and the first heat sink 10 is interposed between the upper surface 34 u of the pressing plate 34 and the exposed surface 50 f of the switching element 50 of the second group 52. It is inserted.

  That is, the first heat sink 10 is in contact with the exposed surface 50f of the switching element 50 mounted on the first and second mounting surfaces F1, F2 so that the first heat sink 10 contacts the first circuit board 31. Are bent along the first and second mounting surfaces F1 and F2.

FIG. 18 shows a fifth embodiment.
Speed controller C having two layers of elements:
As shown in FIG. 18, a plurality of switching elements 50 are mounted on the upper surface 31u of the first circuit board 31 and the upper surface 32u of the second circuit board 32, respectively.

  The first heat sink 10 is interposed between the contact surface 21 of the second heat sink 20 and the exposed surface 50 f of the switching element 50. The first heat sink 10 is interposed between the lower surface 31 d of the first circuit board 31 and the exposed surface 50 f of the switching element 50.

  The first heat sink 10 is connected to the exposed surface 50f of the switching element 50 mounted on the first and third mounting surfaces F1 and F3, respectively, so that the first heat sink 10 is in contact with the first circuit board. It is bent along the mounting surface F1 of 31 and the mounting surface F3 of the second circuit board 32.

FIG. 19 shows a sixth embodiment.
Speed controller C having two layers of elements:
As shown in FIG. 19, a plurality of switching elements 50 are mounted on the lower surface 31d of the first circuit board 31 and the upper surface 31u of the second circuit board 32, respectively.

  The first insulating layer 11 of the first heat sink 10 is in contact with the exposed surface 50f of the group of switching elements 50 mounted on one mounting surface F2, and the second insulating layer 12 of the first heat sink 10 is another mounting surface. It is inserted between the pair of switching elements 50 so as to be in contact with the exposed surface 50f of another group of switching elements 50 mounted on F3.

  The present invention can be applied to a speed controller used for drive control of a motor mounted on a wirelessly remotely operable model.

It is an enlarged side view which shows typically the mounting state of the switching element of the speed controller concerning Example 1 of this invention. It is the exploded side view which shows a heat sink and a circuit board. FIG. 3 is an exploded plan view showing a heat sink and a circuit board. It is the side view and top view which show the heat sink and circuit board of a mounting state. It is a top view which shows a speed controller. It is a side view which shows a speed controller. It is a schematic block diagram which shows the model and transmitter which mount a speed controller. It is a schematic block diagram which shows a speed controller. It is a schematic block diagram which shows a speed controller, a motor, a receiver, and DC power supply. It is an enlarged side view which shows typically the mounting state of the switching element of the speed controller concerning Example 2 of this invention. It is a perspective view which shows the heat sink and circuit board of a mounting state. It is a perspective view which shows the heat sink and circuit board of a mounting state. It is a perspective view which shows a speed controller. It is a perspective view which shows a speed controller. It is a perspective view which shows a speed controller. It is an enlarged side view which shows typically the mounting state of the switching element of the speed controller concerning Example 3 of this invention. It is an enlarged side view which shows typically the mounting state of the switching element of the speed controller concerning Example 4 of this invention. It is an enlarged side view which shows typically the mounting state of the switching element of the speed controller concerning Example 5 of this invention. It is an enlarged side view which shows typically the mounting state of the switching element of the speed controller concerning Example 6 of this invention.

Explanation of symbols

1: Vehicle (an example of a model)
4: Drive control circuit 6: Motor 6a: Motor terminal 6c, 8c: Power supply path 8: DC power supply (battery)
9: Casing 10: 1st heat sink 10A, 10B: Heat sink 10c: Intermediate layer 11: 1st insulating layer 12: 2nd insulating layer 20: 2nd heat sink 21: Contact surface 22: Radiation surface 23: Side surface 24: Step part 31 : First circuit board 31a, 31b, 32a, 32b: protrusion 33: third circuit board 41: first terminal 42: second terminal 50: switching element 51: first group 52: second group 53: third group 54: Fourth group C: Speed controller D1: First predetermined area D2: Second predetermined area D3: Third predetermined area D4: Fourth predetermined area E1: First edge E2: Second edge E3: Third edge E4: Fourth edge F1: First mounting surface F2: Second mounting surface F3: Third mounting surface F4: Fourth mounting surface

Claims (17)

In a speed controller that turns on and off a power supply path from a DC power source mounted on the model to drive and control a motor mounted on a remotely steerable model,
A plurality of switching elements that are provided in parallel for each terminal of the motor and turn on and off the power feeding path;
A drive control circuit for controlling on / off timing of each of the switching elements based on a command signal for controlling the motor;
A first circuit board on which a part or all of the switching elements corresponding to the one or more terminals of the motor are aligned and mounted in a predetermined region of the first mounting surface;
First and second insulating layers are laminated on the front and back of the intermediate layer of the good heat conductor, and a flexible sheet-like first heat sink in which the first insulating layer contacts the exposed surface of the switching element;
A casing that accommodates the predetermined area of the first circuit board, the switching element, and the drive control circuit, and that has an opening at a position corresponding to the predetermined area on the first mounting surface of the first circuit board. When,
A contact surface provided corresponding to the opening of the casing and in contact with the second insulating layer of the first heat sink, the contact surface being exposed of the switching element mounted on the first mounting surface A speed controller comprising: a second heat sink made of ceramic that contacts the second insulating layer in a larger area than a surface and radiates heat toward the outside of the casing. The first circuit board according to claim 1, further comprising a second mounting surface on a surface opposite to the first mounting surface,
A plurality of the switching elements corresponding to the one or more terminals of the motor are mounted in alignment within a predetermined region of the second mounting surface;
The first heat sink has first and second mounting surfaces of the first circuit board such that the first insulating layer of the first heat sink contacts an exposed surface of the switching element mounted on the second mounting surface. Speed controller that is bent along. The first circuit board according to claim 1, further comprising a second circuit board disposed substantially parallel to and in close proximity to the first circuit board,
The second circuit board has a third mounting surface;
A plurality of parts of the switching elements corresponding to the one or more terminals of the motor are mounted in a predetermined region of the third mounting surface,
The first heat sink is connected to the first mounting surface of the first circuit board and the first mounting surface so that the second insulating layer of the first heat sink contacts an exposed surface of the switching element mounted on the third mounting surface. A speed controller that is bent along the third mounting surface of the two-circuit board. In a speed controller that turns on and off a power supply path from a DC power source mounted on the model to drive and control a motor mounted on a remotely steerable model,
A plurality of switching elements that are provided in parallel for each terminal of the motor and turn on and off the power feeding path;
A drive control circuit for controlling on / off timing of each of the switching elements based on a command signal for controlling the motor;
A first circuit board having a mounting surface on which a plurality of groups of the switching elements corresponding to the one or more terminals of the motor are aligned and mounted in one predetermined region;
In another predetermined region, another group of the switching elements corresponding to the one or more terminals of the motor has a plurality of other mounting surfaces aligned and mounted to face the mounting surface. A second circuit board disposed substantially parallel to and close to one circuit board;
First and second insulating layers are laminated on the front and back of the intermediate layer of the good heat conductor, and the first insulating layer is in contact with the exposed surfaces of the group of the switching elements mounted on the one mounting surface. In addition, the second insulating layer is inserted between the pair of switching elements so as to come into contact with an exposed surface of the another group of switching elements mounted on the other mounting surface, and has flexibility. A sheet-like first heat sink;
A casing in which the predetermined area of each circuit board, the switching element, and the drive control circuit are accommodated, and an opening is provided at a position corresponding to the predetermined area on the mounting surface of the first circuit board;
The contact surface is provided corresponding to the opening of the casing and is bent along the first circuit board. The contact surface is in contact with the second insulating layer of the first heat sink, and heats toward the outside of the casing. And a second heat sink made of ceramic material that radiates light. In a speed controller that turns on and off a power supply path from a DC power source mounted on the model to drive and control a motor mounted on a remotely steerable model,
A plurality of switching elements that are provided in parallel for each terminal of the motor and turn on and off the power feeding path;
A drive control circuit for controlling on / off timing of each of the switching elements based on a command signal for controlling the motor;
A first mounting surface in which a plurality of first groups of the switching elements corresponding to the one or more terminals of the motor are mounted in a first predetermined region and opposite to the first mounting surface A first circuit having a second mounting surface on which a plurality of second groups of the switching elements corresponding to the one or more terminals of the motor are aligned and mounted in a second predetermined region A substrate,
A third mounting surface in which a plurality of third groups of the switching elements corresponding to the one or more terminals of the motor are mounted in alignment in a third predetermined region and facing the second mounting surface; A second circuit board disposed substantially parallel to and in close proximity to the first circuit board;
Switching elements of the first group and the second group in which first and second insulating layers are laminated on the front and back of the intermediate layer of the good heat conductor, and the first insulating layer is mounted on the first and second mounting surfaces. And the second insulating layer is in contact with the exposed surface of the third group of switching elements mounted on the third mounting surface. A flexible sheet-like first heat sink bent along the second mounting surface;
Each predetermined area of each circuit board, the switching element, and the drive control circuit are accommodated, and an opening is provided at a position corresponding to the first predetermined area on the first mounting surface of the first circuit board. A casing,
The contact surface is provided corresponding to the opening of the casing and contacts the second insulating layer along the first mounting surface of the first heat sink, and the contact surface is mounted on the first mounting surface. A speed controller comprising: a ceramic second heat sink that contacts the second insulating layer over a larger area than the exposed surface of the switching element and radiates heat toward the outside of the casing. In a speed controller that turns on and off a power supply path from a DC power source mounted on the model to drive and control a motor mounted on a remotely steerable model,
A plurality of switching elements that are provided in parallel for each terminal of the motor and turn on and off the power feeding path;
A drive control circuit for controlling on / off timing of each of the switching elements based on a command signal for controlling the motor;
A first mounting surface in which a plurality of first groups of the switching elements corresponding to the one or more terminals of the motor are mounted in a first predetermined region and opposite to the first mounting surface A first circuit having a second mounting surface on which a plurality of second groups of the switching elements corresponding to the one or more terminals of the motor are aligned and mounted in a second predetermined region A substrate,
A third mounting surface in which a plurality of third groups of the switching elements corresponding to the one or more terminals of the motor are mounted in alignment in a third predetermined region and facing the second mounting surface; and A fourth surface of the switching elements corresponding to the one or more terminals of the motor is mounted in an aligned manner on a surface opposite to the third mounting surface and in a fourth predetermined region. A second circuit board having a mounting surface, disposed substantially opposite to and substantially parallel to the first circuit board; and
Switching elements of the first group and the second group in which first and second insulating layers are laminated on the front and back of the intermediate layer of the good heat conductor, and the first insulating layer is mounted on the first and second mounting surfaces. A flexible sheet-like heat sink that is bent along the first and second mounting surfaces of the first circuit board so as to contact the exposed surface of the first circuit board;
Switching elements of the third group and the fourth group in which third and fourth insulating layers are laminated on the front and back of the intermediate layer of the good heat conductor, and the third insulating layer is mounted on the third and fourth mounting surfaces. And flexibly bent along the third and fourth mounting surfaces of the second circuit board so as to contact the exposed surface of the second circuit board and so that the fourth insulating layer contacts the second insulating layer. Another heat sink in sheet form with
Each predetermined area of each circuit board, the switching element, and the drive control circuit are accommodated, and an opening is provided at a position corresponding to the first predetermined area on the first mounting surface of the first circuit board. A casing,
The contact surface is provided corresponding to the opening of the casing and contacts the second insulating layer along the first mounting surface of the one heat sink, and the contact surface is mounted on the first mounting surface. A speed controller comprising: a ceramic heat sink that contacts the second insulating layer of the one heat sink over a larger area than the exposed surface of the switching element, and radiates heat toward the outside of the casing. In Claim 6, further comprising a third circuit board on which the elements constituting the drive control circuit are mounted,
The third circuit board is provided so that the second circuit board is disposed between the third circuit board and the first circuit board;
The pair of sheet-like heat sinks and the pair of heat sinks between the ceramic-like heat sink and the third circuit board so as to obtain a pressure at which the sheet-like heat sink contacts with each of the switching elements and the ceramic heat sink. A speed controller sandwiching the first and second circuit boards.   6. The speed controller according to claim 4, wherein the switching elements arranged on the mounting surfaces facing each other of the circuit boards substantially parallel to each other have the same number, the same shape, and the same size as each other, and are arranged directly opposite each other.   The contact surface of the ceramic heat sink according to any one of claims 1 to 6, wherein the contact surface of the ceramic heat sink is accommodated in the casing, and a radiation surface opposite to the contact surface, and the contact surface and the radiation surface. A speed controller in which at least a part of each of the four side surfaces is exposed from the casing.   In Claim 9, the radiation | emission surface of the said ceramic heat sink is formed with the step part which notched the pair of upper edge part which mutually opposes, The opening edge part which forms the opening of the said casing in this step part is formed Contacting speed controller.   11. The circuit board according to claim 1, wherein a part of the circuit board excluding the predetermined region further includes a protruding portion protruding from the casing, and is connected to the DC power source or the motor via the power supply path. A speed controller in which a plurality of terminals are provided on the protruding portion. The circuit board or circuit board group according to any one of claims 2 to 5, having a first edge and a second edge facing or adjacent to the first edge,
A speed controller in which a terminal for connecting a cable connected to the DC power supply or the terminal of the motor is disposed in the vicinity of the first edge and the second edge of the circuit board.   In Claim 9, the two 1st terminals connected to the DC power supply are arranged near the first edge, and the DC power supply is arranged outside the first edge, and the second edge A speed controller having a plurality of second terminals connected to the motor connected to the edge. The circuit board or the circuit board group according to any one of claims 2 to 5, wherein the circuit board or the circuit board group has first to fourth edges that are adjacent to or face each other.
In the vicinity of the first and second edges, terminals for connecting cables connected to the terminals of the DC power supply or the motor are arranged, respectively.
An indicator that displays the setting state of the speed controller is disposed in the vicinity of the third edge,
A speed controller in which the first heat sink is bent at the fourth edge. The third circuit board according to any one of claims 3 to 6, further comprising a third circuit board on which an element constituting the drive control circuit is mounted.
A speed controller in which the third circuit board is provided so that the second circuit board is disposed between the third circuit board and the first circuit board.   14. The speed controller according to claim 1, wherein the first heat sink has a larger thermal conductivity in a plane direction along the intermediate layer than in a perpendicular direction perpendicular to the intermediate layer.   15. The speed controller according to claim 1, wherein the second heat sink is composed mainly of alumina.

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