JP2010090970A - Heat-insulating structure and exhaust gas treatment device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-insulating structure which can be applied to high temperature (600-800°C), and is reduced in thickness and cost, compared with a heat-insulating material having a heat insulating effect nearly equal thereto. <P>SOLUTION: The heat-insulating structure 11 includes a high temperature-side wall 22 disposed on a high temperature space 21 side; a low temperature-side wall 26 disposed on a low temperature space 27 side to form a heat insulating area 20 between the high temperature-side wall 22; a barrier wall 24 disposed between the high temperature-side wall 22 and the low temperature-side wall 26, which divides the heat insulating area 20 to form a high temperature area 23 with the high temperature-side wall 22 and to form a low temperature area 25 with the low temperature-side wall 26; and a reflecting plate 41 disposed in the high temperature area 23, which reflects radiant heat from the high temperature-side wall 2 to reduce heat conduction to the barrier wall 24. The high temperature area 23 is evacuated, and the low temperature area 25 is evacuated or a low-heat conductivity gas is encapsulated therein. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a heat insulating structure that improves heat insulating properties. In particular, the present invention relates to a heat insulating structure in which the heat insulating property is improved by dividing the heat insulating structure into two regions and adopting a heat insulating structure suitable for each temperature region, and an exhaust gas treatment apparatus using the heat insulating structure.

  The exhaust gas discharged in the semiconductor manufacturing process contains a hardly decomposable gas containing fluorine. In order to decompose this hardly decomposable gas, an exhaust gas treatment apparatus such as a catalytic type, a thermal decomposition type, or a dry type is used, but the inside of the reaction tank of these apparatuses reaches 600 to 800 ° C. For this reason, a heat insulating material having a thickness of 60 mm or more is arranged around the reaction tank to insulate the heat transfer.

As an example of high-temperature heat insulation, in a combustion exhaust gas treatment apparatus, the temperature in the furnace is heated to about 1300 ° C., but outside the furnace, as a porous ceramic heat insulating material, inorganic fiber (SiO ₂ 55%, Al Ceramic powder reinforced with ₂ O ₃ 15%, CaO 17%, B ₂ O ₃ 8%, other oxide 5% (SiO ₂ 60-65%, TiO 20-35%, Al ₂ O ₃ 2-3%, others Oxides <1%) are used. In this case, the thickness of the porous ceramic heat insulating material is about 30 mm, but it is expensive. Further, in order to enhance the cooling effect, purge air is supplied between the outer cylinder of the apparatus and the heat insulating material (see, for example, Patent Document 1).

On the other hand, the heat insulation structure using vacuum heat insulation and low thermal conductivity gas such as xenon is proposed in, for example, Patent Document 2 or Patent Document 3, but in Patent Document 2, the heat inside the thermos is transmitted to the outside. Patent Document 3 relates to a heat insulating structure suitable for a wall of a refrigerated freezer, a thermostatic chamber or the like or a structure. Therefore, in a heat insulating body using vacuum heat insulation or a low thermal conductivity gas, there has been no disclosure of a technique for insulating heat of 600 to 800 ° C. and suppressing the temperature of the outer surface to about 50 ° C.
International Publication No. 00/32990 Pamphlet Fig1 JP-A-8-224178 JP 2001-311233 A

  An object of this invention is to provide the heat insulation structure which can be applied to high temperature (600-800 degreeC), and can suppress the temperature after heat insulation to about 50 degreeC. Moreover, it aims at providing the heat insulation structure which can be made thinner than the heat insulating material which has the heat insulation effect of the same grade, and an inexpensive heat insulation structure. Furthermore, it aims at providing the waste gas processing apparatus provided with this heat insulation structure.

  In order to solve the above problems, the heat insulating structure according to the first aspect of the present invention insulates heat from the high temperature space 21 to the low temperature space 27 having a temperature lower than that of the high temperature space 21, as shown in FIG. A high-temperature side wall 22 disposed on the high-temperature space 21 side, a low-temperature side wall 26 disposed on the low-temperature space 27 side and forming the heat-insulating region 20 between the high-temperature side wall 22 and the high-temperature side wall A partition wall 24 disposed between the low temperature side wall 26 and the low temperature side wall 26, separating the heat insulating region 20 to form a high temperature region 23 between the high temperature side wall 22 and forming a low temperature region 25 between the low temperature side wall 26; And a reflector 41 that reflects radiant heat from the high temperature side wall 22 and suppresses heat transfer to the partition wall 24, and the high temperature region 23 is evacuated and the low temperature region 25 is evacuated or has low heat conduction. Rate gas is enclosed.

  If comprised in this way, it can suppress that the heat | fever transmitted from the high temperature space to the high temperature side wall is transmitted to a partition by a thermal radiation with the reflecting plate arrange | positioned in a high temperature area | region. Furthermore, by maintaining the inside of the high-temperature region in a vacuum, it is possible to suppress heat from being transferred to the partition due to heat transfer or heat conduction by gas convection. Furthermore, since the low temperature region is maintained in a vacuum or a low thermal conductivity gas is enclosed, the heat transferred from the high temperature region through the partition wall is transferred to the low temperature side wall by heat transfer or heat conduction by gas convection. Can be suppressed. As described above, it is possible to effectively insulate by making the high temperature region and the low temperature region different from each other, and it is possible to configure an inexpensive and thin heat insulating structure. “Vacuum” refers to a case where the internal pressure is 1 to 10 Torr (absolute pressure, 1 Torr≈133.322 Paabs). The “low thermal conductivity gas” refers to any gas selected from the group consisting of xenon, krypton, chlorine, methyl bromide, boron trichloride, and a mixed gas obtained by mixing two or more thereof.

  Moreover, the heat insulation structure according to the second aspect of the present invention is, for example, as shown in FIG. 4, the heat insulation structure 11 that insulates heat from the high temperature space 21 to the low temperature space 27 whose temperature is lower than that of the high temperature space 21. The high temperature side wall 22 disposed on the high temperature space 21 side, the low temperature side wall 26 disposed on the low temperature space 27 side and forming the heat insulating region 20 between the high temperature side wall 22, and the high temperature side wall 22 and the low temperature side wall 26. And a partition wall 24 that separates the heat insulating region 20 to form a high temperature region 23 between the high temperature side wall 22 and forms a low temperature region 25 between the low temperature side wall 26 and a high temperature region 23. And a heat insulating material 61 that insulates heat from the high temperature side wall 22 and suppresses heat transfer to the partition wall 24, the high temperature region 23 is filled with a low thermal conductivity gas, and the low temperature region 25 is evacuated or the low thermal conductivity gas is Enclosed.

  If comprised in this way, it can suppress that a heat insulating material arrange | positioned in a high temperature area | region transfers heat to a partition from a high temperature side wall, and since low thermal conductivity gas is enclosed in the high temperature area | region. It is possible to suppress the heat from being transmitted by the heat conduction of the gas. Since the low-temperature region is evacuated or filled with low thermal conductivity gas, the heat transferred from the high-temperature region through the partition is prevented from being transferred to the low-temperature side wall due to heat transfer or heat conduction by gas convection. be able to. As described above, it is possible to effectively insulate by making the high temperature region and the low temperature region different from each other, and it is possible to configure an inexpensive and thin heat insulating structure.

  Further, in the heat insulating structure according to the third aspect of the present invention, in the heat insulating structure 11 according to the first or second aspect of the present invention, the low thermal conductivity gas is xenon, krypton, chlorine, methyl bromide. , Boron trichloride, and any gas selected from the group consisting of a mixed gas of two or more thereof.

  In the heat insulation structure according to the fourth aspect of the present invention, as shown in FIG. 2, for example, in the heat insulation structure 11 according to any one of the first to third aspects of the present invention, the low temperature The region 25 includes a convection prevention plate 51 that suppresses heat transfer due to convection in the low temperature region 25.

  If comprised in this way, it can suppress that the heat transmitted to the partition is transmitted to a low temperature side wall by the heat transfer by a convection by the convection prevention board arrange | positioned in a low temperature area | region. Even if the inside of the low temperature region is evacuated, heat transfer by convection occurs due to the slight remaining gas, so heat transfer can be suppressed by installing a convection prevention plate.

  Moreover, in the heat insulation structure which concerns on the 5th aspect of this invention, the convection prevention board 51 is formed in bellows shape, and each top of the bellows-like wave arrange | positioned at the low temperature side wall 26 side, and the partition 24 side. The tops of the bellows-like waves to be arranged are arranged at a distance of 1 mm or less from each of the cold side wall 26 and the partition wall 24. Here, the corrugated plate formed in a bellows shape is arranged such that the ridge line corresponding to the top of the wave is directed in the horizontal direction.

  In the exhaust gas treatment apparatus according to the sixth aspect of the present invention, for example, as shown in FIG. 1, a reaction tank 12 for treating exhaust gas at 600 to 800 ° C. and a reaction tank 12 are provided so as to surround the reaction tank 12. The heat insulation structure 11 which concerns on any one aspect of the said 1st thru | or 5th aspect of this invention which insulates the heat | fever transmitted from 12 to the outside, and suppresses heat transfer is provided.

  If comprised in this way, in the exhaust gas processing apparatus which processes exhaust gas, even when the temperature in a reaction tank is 600-800 degreeC, it can thermally insulate effectively with the heat insulation effect of a heat insulation structure, and it is outside the low temperature side wall. The surface temperature can be about 50 ° C.

  According to the present invention, the heat insulating structure is divided into a high temperature region and a low temperature region so as to separate the direction in which the temperature gradient occurs. In the high temperature region, heat radiation is mainly suppressed and heat transfer by heat conduction and convection is performed. In a low temperature region, a structure that suppresses heat transfer mainly by heat conduction and convection is used to insulate heat of 600 to 800 ° C., and to reduce the temperature of the outer surface of the low temperature side wall to about 50. Can be lowered to ° C. Further, the thickness can be reduced as compared with the case where a heat insulating material having the same effect is used, and the heat insulating structure can be configured at a low cost.

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same or corresponding members are denoted by the same or similar reference numerals, and redundant description is omitted. Further, the present invention is not limited to the following embodiments.

  Fig.1 (a) is a longitudinal cross-sectional view of the exhaust gas processing apparatus 10 which concerns on embodiment of this invention. The exhaust gas treatment apparatus 10 includes a reaction tank 12 therein, and includes a heat insulating structure 11 around the reaction tank 12. The heat insulating structure 11 is installed in order to insulate heat from being transmitted from the reaction vessel 12 having an internal temperature of 600 to 800 ° C. to the outside. In FIG. 1A, the heat insulating structure 11 is disposed so as to surround the entire side surface of the reaction tank 12. Therefore, as shown in FIG. 1B, the heat insulating structure 11 in the horizontal section (BB section) has a donut shape surrounding the reaction tank 12. However, the heat insulation structure 11 is not limited to the above shape as long as it can insulate heat transmitted from the reaction tank 12 to the outside. In the upper space in the reaction tank 12, a disk-shaped upper heater 15 is provided to heat the gas to be processed. A sheath heater (not shown) is put on the lower surface of the heater 15.

  FIG. 2 is a view showing the heat insulating structure 11 according to the first embodiment of the present invention. The heat insulation structure 11 includes a reaction vessel wall 22 as a high temperature side wall, an outer wall 26 as a low temperature side wall, and an upper surface 28 and a lower surface as upper and lower surfaces of a heat insulation region 20 which is a space formed by the reaction vessel wall 22 and the outer wall 26. 29. Furthermore, the partition 24 which divides the heat insulation area | region 20 into the high temperature area | region 23 and the low temperature area | region 25 is provided. The high temperature region 23 formed by the reaction vessel wall 22 and the partition wall 24 is provided with a reflector 41 (three in this embodiment), and the high temperature region 23 is evacuated. The low temperature region 25 formed by the outer wall 26 and the partition wall 24 is evacuated or filled with a low thermal conductivity gas. The reaction tank wall 22 is formed integrally with the outer wall of the reaction tank 12 shown in FIG. This saves material. Alternatively, the reaction tank wall 22 may be separately formed around the outer wall of the reaction tank 12. If it does so, the heat insulation effect can be heightened more.

The reaction tank wall 22 of the heat insulating structure 11 is disposed on the high temperature space 21 side that becomes high temperature by heat transmitted from the reaction tank 12 (see FIG. 1). The outer wall 26 of the heat insulating structure 11 is arranged on the low temperature space 27 side that is separated from the high temperature space 21 by the heat insulating structure 11 and that is at a lower temperature than the high temperature space 21. The partition wall 24 is disposed between the reaction vessel wall 22 and the outer wall 26 so as to separate the heat insulating region 20, which is a space formed by the reaction vessel wall 22 and the outer wall 26, from the direction in which the temperature gradient is generated.
The reaction vessel wall 22 is preferably a nickel-based alloy having high heat resistance and corrosion resistance. The partition wall 24, the outer wall 26, the upper surface 28, and the lower surface 29 are preferably made of stainless steel having excellent heat resistance and corrosion resistance. However, the material is not particularly limited as long as it has the same effect.

The reflection plate 41 is configured in an annular shape so as to surround the entire circumference of the side surface of the reaction vessel wall 22. Moreover, the reflection plate 41 may be one sheet or a plurality of sheets. The reflecting plate 41 is preferably an alloy plate such as stainless steel whose surface is mirror-finished. In addition, the heat reflectivity can be further increased by mirror finishing. However, the reflection plate 41 may be any structure / material that reflects the heat radiation of the heat transmitted to the reaction tank wall 22 and suppresses the heat from being transmitted to the partition wall 24. Alternatively, the surface may be plated with a metal having a high heat reflectance such as gold, silver or aluminum alloy instead of mirror finishing.
Further, the reflecting plates 41 (for example, three in FIG. 2) are arranged so as to be separated from each other, and the vertical upper and lower ends thereof are connected and fixed to the upper surface 28 and the lower surface 29 by the reflecting plate fixing pins 42. As a result, the contact area between the reflecting plate 41 and the upper surface 28 and the lower surface 29 can be made as small as possible, so that heat conduction from the reflecting plate 41 to the upper and lower surfaces can be suppressed. For this reason, it is preferable that the number of reflection plate fixing pins 42 is smaller. The reflecting plate fixing pin 42 is preferably made of stainless steel having excellent heat resistance and corrosion resistance. However, the material is not particularly limited as long as it has the same effect.

Further, the high temperature region 23 is evacuated. “Vacuum” refers to a case where the internal pressure is 1 to 10 Torr (absolute pressure, 1 Torr≈133.322 Paabs). In the case where the internal pressure is less than 1 Torr, in the space formed by the metal wall, 1. 1. separation of gas adsorbed on the metal surface; 2. Diffuse release of gas dissolved and absorbed in metal material Gas permeation occurs. For this reason, it is difficult to keep the space in a state of less than 1 Torr, and measures such as processing of the metal surface are required.
In the heat insulating structure 11 according to the present embodiment, instead of maintaining each region in a state of less than 1 Torr, the gas in each region is temporarily replaced with a low thermal conductivity gas, and thereafter or while replacing, 1 to 10 Torr By making a vacuum, it is possible to obtain the same heat insulation effect as in the state of less than 1 Torr. Note that the use of a low thermal conductivity gas can be saved by evacuating while replacing.

  The low temperature region 25 formed by the outer wall 26 and the partition wall 24 is evacuated. Alternatively, a low thermal conductivity gas is enclosed. “Low thermal conductivity gas” refers to any gas selected from the group consisting of xenon, krypton, chlorine, methyl bromide, boron trichloride, and a mixed gas of two or more thereof. In view of chemical stability and safety, xenon and krypton are preferable.

In addition, thermal conductivity (kappa) (mW / (m * K) (25 degreeC, 1 atm)) of various gas is xenon: 5.54, methyl bromide: 7.66, chlorine: 8.9, boron trichloride: 8.95, krypton: 9.35. On the other hand, the thermal conductivity κ of air is 26 (mW / (m · K) (25 ° C., 1 atm)).
In addition, according to the study by the present inventors, it was found that the heat insulating effect at 300 ° C. is higher in the order of xenon, argon, and nitrogen. This order is consistent with the numerical order of the thermal conductivity of these materials (lowest order). Furthermore, it was found that the heat insulation effect almost equal to the state of less than 1 Torr can be obtained by enclosing xenon at 300 ° C. even in the state of about 1 to about 10 Torr.

  When the high-temperature region 23 and the low-temperature region 25 are evacuated or filled with low thermal conductivity gas, as shown in FIG. 2, at least two ports for connecting the pipes 72 are provided in each region and connected to the ports. Two sealing valves 71 are attached on the pipe 72 thus formed. In each region, one of the pipes 72 is connected to a vacuum pump, and the other is connected to a low thermal conductivity gas supply source, whereby each region can be brought into a desired state such as vacuum, low thermal conductivity gas sealing, or the like. it can. Note that after the respective regions are evacuated or filled with the low thermal conductivity gas, the port to which the pipe 72 is connected may be sealed and the pipe 72 may be crushed.

As shown in FIGS. 1A and 2, in the exhaust gas treatment apparatus 10, a ceramic fiber mold or an ultrafine fumed silica powder component is used for the upper heat insulating material 31 that covers the reaction tank 12 and the heat insulating structure 11. It is preferable. Further, a high-functional heat insulating material 32 is disposed on the upper heat insulating material upper surface 31 a of the upper heat insulating material 31. As the high-functional heat insulating material 32, an alumina-based or silica-based heat insulating board having a thickness of 10 mm is preferable. However, the material and thickness of these heat insulating materials are not particularly limited as long as they have a similar heat insulating effect. In FIG. 2, the upper heat insulating material 31 is in contact with only the upper surface of the low temperature region 25, but is disposed not only on the upper surface of the low temperature region 25 but also with part or all of the upper surface of the high temperature region 23. May be.
In addition, the heat insulating material 33 covering the reaction tank 12 and the lower portion of the heat insulating structure 11 is similar to the upper heat insulating material 31 and the high-functional heat insulating material 32, ceramic fiber mold, ultrafine fumed silica powder component, alumina. It is preferable to use a heat insulating board based on silica or silica.

  As shown in FIG. 1B and FIG. 3, the external heater 14 of the reaction tank 12 may be installed in the high temperature region 23 of the heat insulating structure 11. In that case, it is preferable that the heaters 14 are arranged in such a manner that a plurality of rod-shaped heaters are uniformly dispersed in the circumferential direction so that heating is performed uniformly (see FIG. 1B). The heater 14 is preferably fixed to the heat insulating structure 11 with a stainless steel casing.

  In order to further enhance the heat insulating effect, a thinner heat insulating material 13 may be provided on the outer periphery of the heat insulating structure 11 as shown in FIG. As the heat insulating material 13, it is preferable to use a ceramic fiber mold, an ultrafine fumed silica powder component body, an alumina-based or silica-based heat insulating board.

  As described above, when the heat insulating structure 11 according to the first embodiment of the present invention is configured, the heat transmitted from the reaction vessel wall 22 by heat radiation is reflected by the reflection plate 41 and transmitted to the partition wall 24. Can be suppressed. Moreover, since the inside of the high temperature region 23 is a vacuum, it is possible to suppress heat from being transferred to the partition wall 24 by heat conduction of gas in the high temperature region or heat transfer by convection. Therefore, even if the internal temperature of the reaction vessel 12 is 600 to 800 ° C., the ambient temperature of the partition wall 24 in the high temperature region 23 can be set to about 300 ° C.

  Further, since the low temperature region 25 is evacuated or filled with a low thermal conductivity gas, it is possible to suppress the heat transmitted to the partition wall 24 from being transmitted to the outer wall 26 by heat transfer or heat conduction by convection. it can. Therefore, even if the temperature of the partition wall is about 300 ° C., the temperature near the outer surface of the outer wall 26 can be set to about 50 ° C.

  Thus, by combining different heat insulation structures in the high temperature region 23 and the low temperature region 25, heat of 600 to 800 ° C. can be insulated and the temperature near the outer surface of the low temperature side wall 26 can be set to about 50 ° C. Furthermore, the thickness of the high temperature region 23 can be about 30 mm or less, and the thickness of the low temperature region 25 can be about 5 mm. As a result, a thinner heat insulating structure can be configured than when a heat insulating material having a similar heat insulating effect is used.

  As shown in FIG. 4, in the heat insulating structure 11 according to the second embodiment of the present invention, the heat insulating material 61 is disposed in the high temperature region 23 in the first embodiment. As the heat insulating material 61, it is preferable to use a ceramic fiber mold, an ultrafine fumed silica powder component, and an alumina or silica heat insulating board. However, any heat insulating material that suppresses heat transmitted through the reaction vessel wall 22 from being transmitted to the partition wall 24 may be used, and the material is not particularly limited. In addition, the alumina-based or silica-based heat insulating board, which is a high-functional heat insulating material, has a higher heat insulating effect than air, and is installed so as to be in contact with and surround the reaction vessel wall 22. In addition, the high-performance heat insulating material and the partition wall 24 are spaced apart (1 mm or less) in order to suppress heat conduction. Further, the low thermal conductivity gas is sealed in the high temperature region 23. As a result, heat conduction of heat transmitted from the reaction vessel wall 22, heat transfer by convection, and heat radiation can be suppressed. Further, similarly to the first embodiment, the thickness of the high temperature region 23 can be set to about 30 mm or less.

  As described above, when the heat insulating structure 11 according to the second embodiment of the present invention is configured, heat transfer from the reaction vessel wall 22 to the partition wall 24 can be insulated by the heat insulating material 61. Moreover, since the low thermal conductivity gas is enclosed in the high temperature region 23, it is possible to suppress heat from being transmitted to the partition wall 24 due to heat conduction of the gas in the high temperature region 23. Therefore, even if the internal temperature of the reaction vessel 12 is 600 to 800 ° C., the temperature near the surface of the partition wall 24 in the high temperature region 23 can be set to about 300 ° C.

As shown in FIGS. 2 to 4, the heat insulating structure 11 according to the third embodiment of the present invention includes the convection prevention plate 51 in the low temperature region 25 in the first or second embodiment. The convection prevention plate 51 is preferably a stainless metal plate having excellent temperature resistance. The convection prevention plate 51 is formed in a bellows and is disposed so as to surround the partition wall 24. In that case, as shown in FIGS. 2 to 4, the convection prevention plate 51 is disposed so that the longitudinal section thereof is wavy. With this arrangement, convection can be effectively prevented. Or you may arrange | position so that the cross section of the convection prevention plate 51 may become wavy. With this arrangement, the partition wall 24 can be easily surrounded by the bellows-shaped convection prevention plate 51, and the manufacture becomes easy.
The convection prevention plate 51 is not particularly limited as long as it can prevent heat transfer due to convection in the low temperature region 25.
Further, the convection prevention plate 51 has the tops of the bellows-like waves arranged on the outer wall 26 side and the tops of the bellows-like waves arranged on the partition wall 24 side from the outer wall 26 and the partition wall 24, respectively. It is preferable to arrange them at intervals of 1 mm or less. When the distance is 1 mm or less, heat transfer due to convection can be more effectively suppressed.

Further, the convection prevention plate 51 is fixed to the outer wall 26 and the partition wall 24 by a plurality of convection prevention plate fixing pins 52. As a result, the contact area between the outer wall 26 and the partition wall 24 becomes as small as possible, so that heat conduction via the convection prevention plate fixing pin 52 can be suppressed. For this reason, it is preferable that the number of convection prevention plate fixing pins 52 is smaller.
As shown in FIG. 5, the convection prevention plate 51 may be fixed in contact with the outer wall 26. In this case, if the thickness of the convection prevention plate is sufficiently thin (for example, 0.1 to 0.5 mm), heat transfer due to heat conduction can be suppressed to a low level, and manufacture is facilitated. Considering that heat is transferred from the convection prevention plate 51 to the outer wall 26 by heat conduction, a part of the outer wall 26 may be made of a low heat conductive material. Or you may install a low heat conductive material (heat insulating material 13) further in the outer side of the outer wall 26 (refer FIG.1 (b)). As the low heat conductive material, a ceramic fiber mold, an ultrafine fumed silica powder component, and an alumina-based or silica-based heat insulating board are preferable.

  As described above, when the heat insulating structure 11 according to the third embodiment of the present invention is configured, heat transfer due to convection in the low temperature region 25 can be suppressed, and heat transfer from the partition wall 24 to the outer wall 26 can be suppressed. Can be further suppressed. Even when the convection prevention plate 51 is provided in the low temperature region 25, the thickness of the low temperature region 25 can be about 5 mm.

Furthermore, when the heat insulation structure 11 according to the embodiment of the present invention is used in an exhaust gas treatment device, for example, a dry exhaust gas treatment device, the thickness of the heat insulation structure can be reduced, so that the installation area of the entire device is changed. In addition, the capacity of the internal reaction tank can be increased. Therefore, it was possible to fill a large amount of the exhaust gas treatment agent, and as a result, it became possible to increase the treatment efficiency of the exhaust gas treatment device.
Moreover, in the heat insulation structure 11 which concerns on embodiment of this invention, since water is not used at all for a heat insulation means, the heat insulation suitable for high temperature is attained without using water which is a valuable resource. Even if the factory layout cannot use water, it can be effectively insulated.

It is sectional drawing of the waste gas processing apparatus provided with the heat insulation structure which is embodiment of this invention, (a) is a longitudinal cross-sectional view, (b) is sectional drawing of the heat insulation structure in BB cross section of Fig. (A). . It is a figure which shows the heat insulation structure which is embodiment of this invention, and expands the part of the heat insulation structure of FIG. It is a figure which shows the heat insulation structure which is embodiment of this invention, and the heater is further added to the heat insulation structure of FIG. It is a figure which shows the heat insulation structure which is embodiment of this invention, and has arrange | positioned the heat insulating material in the high temperature area | region. It is a figure which shows the heat insulation structure which is embodiment of this invention, and expands the part of a convection prevention board.

Explanation of symbols

10 Exhaust gas treatment equipment
11 Thermal insulation structure
12 Reaction layer
13 Heat Insulation Material, Low Thermal Conductivity Material 14 Heater 15 Upper Heater
20 Thermal insulation area
21 High temperature space
22 High temperature side wall, reaction vessel wall 23 High temperature region
24 Bulkhead 25 Low temperature region
26 Low temperature side wall, outer wall 27 Low temperature space
28 Upper surface 29 Lower surface 31 Upper heat insulating material
31a Upper insulation top surface
32 High-performance heat insulating material 33 Heat insulating material 41 Reflecting plate 42 Reflecting plate fixing pin
51 Convection Prevention Plate 52 Convection Prevention Plate Fixing Pin 61 Heat Insulating Material 71 Sealing Valve
72 Piping

Claims (6)

A heat insulating structure for insulating heat from a high temperature space to a low temperature space having a temperature lower than that of the high temperature space;
A high temperature side wall disposed on the high temperature space side;
A low temperature side wall which is disposed on the low temperature space side and forms a heat insulating region with the high temperature side wall;
A partition wall disposed between the high temperature side wall and the low temperature side wall, separating the heat insulating region to form a high temperature region between the high temperature side wall and forming a low temperature region between the low temperature side wall;
A reflective plate disposed in the high temperature region and reflecting radiant heat from the high temperature side wall to suppress heat transfer to the partition;
The hot zone is evacuated;
The cold region is evacuated or encapsulated with a low thermal conductivity gas;
Thermal insulation structure. A heat insulating structure for insulating heat from a high temperature space to a low temperature space having a temperature lower than that of the high temperature space;
A high temperature side wall disposed on the high temperature space side;
A low temperature side wall which is disposed on the low temperature space side and forms a heat insulating region with the high temperature side wall;
A partition wall disposed between the high temperature side wall and the low temperature side wall, separating the heat insulating region to form a high temperature region between the high temperature side wall and forming a low temperature region between the low temperature side wall;
A heat insulating material that is disposed in the high temperature region and that insulates heat from the high temperature side wall and suppresses heat transfer to the partition;
The high temperature region is filled with a low thermal conductivity gas;
The cold region is evacuated or encapsulated with a low thermal conductivity gas;
Thermal insulation structure. The low thermal conductivity gas is any gas selected from the group consisting of xenon, krypton, chlorine, methyl bromide, boron trichloride, and a mixed gas in which two or more thereof are mixed;
The heat insulation structure of Claim 1 or Claim 2. The low temperature region includes a convection prevention plate that suppresses heat transfer due to convection in the low temperature region;
The heat insulation structure of any one of Claim 1 thru | or 3. The convection prevention plate is formed in a bellows shape, and the tops of the bellows waves disposed on the low temperature side wall and the tops of the bellows waves disposed on the partition side are the low temperature. Disposed at a distance of 1 mm or less from each of the side wall and the partition;
The heat insulating structure according to claim 4. A reaction vessel for treating exhaust gas at 600-800 ° C .;
The heat insulating structure according to any one of claims 1 to 5, wherein the heat insulating structure is installed so as to surround the reaction tank, and heat transmitted from the reaction tank to the outside is insulated to suppress heat transfer.
Exhaust gas treatment equipment.

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