JP2010089442A - Transfer pattern forming method, transfer pattern forming plate, method of manufacturing transfer pattern forming plate, and transfer device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately transfer an ink pattern onto a blanket, even when transfer patterns different in widths are mixed. <P>SOLUTION: This transfer pattern forming method includes the first transfer process for carrying out transfer while remaining ink 2 of portions corresponding to recesses 31a, 31b of a plate 3 in a blanket 1 side, by facing the plate 3 to the blanket 1 each other, and by bringing those into pressure contact, using the plate 3 provided with the recesses 31a, 31b in a position of a forming pattern, in which the recess 31b is provided to be deeper than the recess 31a, in the recess 31a having the first width and the recess 31b having the second width wider than the first width; and the second transfer process for transferring the ink 2 remained on the blanket 1 onto a substrate 4, by facing each other the blanket 1 after the first transfer process to the substrate 4 for forming the pattern, and by bringing those into pressure contact. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a transfer pattern forming method, a transfer pattern forming plate, a transfer pattern forming plate manufacturing method, and a transfer apparatus.

  As a pattern forming method using reverse offset printing, techniques disclosed in Patent Documents 1 to 3 are disclosed. In either case, press the blanket coated with ink and the plate with the recess corresponding to the pattern under pressure, leave only the ink corresponding to the pattern on the blanket side, and press contact with the substrate to press the blanket side. The remaining ink pattern is transferred to the substrate.

JP 2006-281486 A JP 2007-160769 A JP 2007-261144 A

  However, when the blanket coated with ink is brought into pressure contact with the transfer pattern forming plate so as to leave only the ink pattern corresponding to the transfer pattern on the blanket, there are the following problems. That is, if the aspect ratio (depth / width of the recess) is a certain value or less as the recess of the transfer pattern forming plate, a defect occurs in the ink pattern to be transferred. Specifically, among the concave portions of the transfer pattern forming plate, when there are a narrow concave portion and a wide concave portion, in the wide concave portion, the blanket to be pressed and contacted with the bottom of the concave portion, This causes a loss of the ink pattern.

  An object of the present invention is to provide a technique capable of accurately transferring an ink pattern to a blanket even when transfer patterns having different widths coexist.

  The present invention uses a blanket in which a hard base material and a soft base material softer than the hard base material are bonded to each other, a coating process for applying ink to the surface of the soft base material, and a concave portion at the position of the pattern to be formed. A recess having a first width and a recess having a second width wider than the first width, the recess having the second width than the recess having the first width. Using a deeper one, the plate and the blanket face each other and are brought into pressure contact with each other, thereby transferring only the portion of the blanket ink corresponding to the concave portion of the plate on the blanket side. The transfer process, the blanket after the first transfer process, and the substrate on which the pattern is formed face each other and are brought into pressure contact with each other, whereby the ink remaining on the blanket Which is a transfer pattern forming method and a second transfer step of transferring onto a substrate.

  In the present invention, when the blanket and the plate are brought into pressure contact with each other, the concave portion having the second width is deeper than the concave portion having the first width provided in the plate. The blanket is not in contact with the bottom of the recess having the second width.

  Further, the present invention provides a first recess having a first width corresponding to the width of the pattern to be formed, and a second recess having a width wider than the first recess and deeper than the first recess. A transfer pattern forming plate having a recess.

  In the present invention, when the transfer pattern forming plate and the blanket are brought into pressure contact with each other, the concave portion having the second width than the concave portion having the first width provided on the transfer pattern forming plate is provided. Since the direction is deeper, the blanket does not contact the bottom of the recess having the second width.

  In the present invention, the photosensitive material formed on the surface of the substrate is exposed and developed to form a first opening and a second opening having an opening wider than the first opening. Etching the base material using the photosensitive material as a mask to form a recess corresponding to the first opening and the second opening; closing the first opening; and passing through the second opening And a step of further etching the concave portion.

  In such a present invention, in a transfer pattern forming plate comprising a first recess having a first width corresponding to the width of a pattern to be formed, and a second recess having a width wider than the first recess, The second recess can be formed deeper than the first recess.

  In the present invention, the first photosensitive material formed on the surface of the base material is exposed and developed, and a first opening formed by the first photosensitive material and a second opening wider than the first opening are provided. A step of etching the base material using the first photosensitive material as a mask, forming a recess corresponding to the first opening and the second opening, and a second surface on the entire surface of the base material. Forming a photosensitive material and etching to form a third opening only in the vicinity of the center of the recess formed corresponding to the second opening; and etching the substrate using the second photosensitive material as a mask; And a step of forming a concave portion corresponding to the third opening in the vicinity of the center of the concave portion formed corresponding to the second opening.

  In such a present invention, in a transfer pattern forming plate comprising a first recess having a first width corresponding to the width of a pattern to be formed, and a second recess having a width wider than the first recess, Second recesses deeper than the first recesses are formed in multiple stages along the depth direction.

  The present invention also includes a first stage for holding a blanket to which ink is applied, a second stage for holding a substrate to which a plate or ink pattern arranged opposite to the blanket is transferred, and a blanket. A pressing means for pressing in the direction of the plate, and as the plate, a first recess having a first width corresponding to the width of the pattern to be formed, a width wider than the first recess, A transfer device having a second recess provided deeper than the recess is used.

  In the present invention, when the blanket and the plate are brought into pressure contact with each other, the concave portion having the second width is deeper than the concave portion having the first width provided in the plate. The blanket is not in contact with the bottom of the recess having the second width.

  Moreover, the present invention uses a blanket in which a hard base material and a soft base material softer than the hard base material are bonded together, and an application process for applying ink to the surface of the soft base material, and a concave portion at the position of the pattern to be formed. A plate provided, comprising a recess having a first width and a recess having a second width wider than the first width, the bottom surface of the recess having the second width being smaller than the depth of the recess Using a plate provided with a conical protrusion of height, the plate and the blanket face each other, and these are brought into pressure contact, leaving only the portion of the blanket ink corresponding to the concave portion of the plate on the blanket side. The first transfer step to be transferred, the blanket after the first transfer step, and the substrate on which the pattern is formed face each other, and are brought into pressure contact with each other, so that The remaining ink is transferred pattern forming method and a second transfer step of transferring onto a substrate.

  In the present invention, when the blanket and the plate are brought into pressure contact with each other, the blanket comes into contact with the conical protrusion provided on the bottom surface of the concave portion having the second width of the plate. No contact with the bottom.

  The present invention also includes a first recess having a first width corresponding to the width of the pattern to be formed, and a recess having a width wider than the first recess, and having a height smaller than the depth of the recess on the bottom surface. A transfer pattern forming plate having a second recess provided with a conical protrusion.

  In the present invention, when the transfer pattern forming plate and the blanket are brought into pressure contact with each other, the blanket comes into contact with the conical protrusion provided on the bottom surface of the concave portion having the second width of the plate. The blanket does not contact the bottom surface of the recess.

  The present invention also exposes and develops the photosensitive material formed on the surface of the substrate to form a first opening and a second opening having an opening wider than the first opening. The step of forming a circular dummy pattern made of a photosensitive material in the second opening, and the substrate is etched using the photosensitive material as a mask to form recesses corresponding to the first opening and the second opening. And a step of forming a conical projection having a height smaller than the depth of the concave portion at a position corresponding to the dummy pattern.

  In the present invention, the first concave portion having the first width corresponding to the width of the pattern to be formed and the conical protrusion having a height smaller than the depth of the concave portion are formed on the bottom surface of the second concave portion. Can do.

  The present invention also includes a first stage for holding a blanket to which ink is applied, a second stage for holding a substrate to which a plate or ink pattern arranged opposite to the blanket is transferred, and a blanket. A pressing means for pressing in the direction of the plate, the plate having a first recess having a first width corresponding to the width of the pattern to be formed, a recess having a width wider than the first recess, and a bottom surface And a second concave portion provided with a conical protrusion having a height smaller than the depth of the concave portion.

  In the present invention, when the blanket and the plate are brought into pressure contact with each other, the blanket comes into contact with the conical protrusion provided on the bottom surface of the concave portion having the second width of the plate. No contact with the bottom.

  According to the present invention, it is possible to perform pattern transfer with high accuracy even when patterns having different widths such as a high-definition pattern and a low-definition pattern are mixed.

Hereinafter, the best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described. The description will be given in the following order.
1. Outline of transfer pattern formation (example of basic transfer pattern formation procedure)
2. First Embodiment (Plate Configuration and Manufacturing Method, Example of Transfer Pattern Formation Procedure)
3. Second Embodiment (Configuration and Manufacturing Method of Plate, Example of Transfer Pattern Formation Procedure)
4). Third Embodiment (Configuration and Manufacturing Method of Plate, Example of Transfer Pattern Formation Procedure)
5). Pattern transfer device

<1. Outline of transfer pattern formation>
[Basic transfer pattern formation procedure: comparative example]
Prior to describing the transfer pattern forming method of the present embodiment, a basic transfer pattern forming method procedure will be described as a comparative example. First, as shown in FIG. 1A, a blanket 1 and a plate (transfer pattern forming plate) 3 are prepared. In the blanket 1, a PDMS (polydimethylsiloxane) layer 12, which is a soft base material, is bonded to a hard base material 11, and the ink 2 is uniformly applied to the PDMS layer 12. On the other hand, the plate 3 is formed with a recess 31 that matches the shape of the pattern to be formed.

  Next, as shown in FIG. 1B, the blanket 1 and the plate 3 are brought into pressure contact. That is, the ink surface of the blanket 1 is brought into contact with the surface of the plate 3 and pressed. As a result, the ink 2 of the blanket 1 adheres to the periphery (convex portion) of the concave portion 31 of the plate 3. In this state, as shown in FIG. 1C, when the blanket 1 and the plate 3 are separated, the ink 2 adheres to the convex portion of the plate 3, and the ink 2 corresponding to the concave portion 31 of the plate 3 is placed on the blanket 1 side. The pattern remains. Here, the transfer in which the blanket 1 and the plate 3 are brought into pressure contact with each other to leave the ink 2 pattern on the blanket 1 is referred to as a first transfer step.

  Next, as shown in FIG. 2A, the blanket 1 in which the pattern of the ink 2 is left and the substrate 4 on which the adhesion layer 41 is formed on the surface face each other, and FIG. As shown in Fig. 4, press contact is performed in the aligned state. Then, as shown in FIG. 2C, when the blanket 1 and the substrate 4 are separated, the pattern of the ink 2 left on the blanket 1 is transferred onto the substrate 4. Here, the step of bringing the blanket 1 and the substrate 4 into pressure contact and transferring the ink pattern of the blanket 1 to the substrate is referred to as a second transfer step.

[Problems of comparative example]
In the pattern forming method using the reverse offset printing method as described above, the ink to be transferred at a place where the aspect ratio (depth D / width W) of the concave portion 31 of the pattern shape formed on the plate 3 is a certain value or less. Defects occur in the pattern.

  3A and 3B are diagrams illustrating the state of the concave portion of the plate, where FIG. 3A is a plan view, FIG. 3B is a cross-sectional view taken along line AA of FIG. It is an enlarged view of the dashed-dotted line frame of (b). The plate 3 is formed with a recess 31 corresponding to the shape of the target pattern. The width of the recess 31 corresponds to the width of the pattern to be formed. Accordingly, the plate 3 is provided with the concave portions 31 having a plurality of widths.

  Here, as shown in FIG. 3 (d), the plate 3 includes a first recess 31a having a first width W1 and a second recess having a second width W2 wider than the first width W1. It is assumed that 31b is provided. For example, the aspect ratio, which is the ratio of the depth and width of the recess 31a, is about 1 in depth D / width W1, and the aspect ratio of the recess 31b is about 0.25 in depth D / width W2.

  A plate 3 shown in FIG. 1 includes a recess 31a having an aspect ratio of about 1 shown in FIG. When the aspect ratio of the recess 31a is about 1, when the plate 3 and the blanket 1 are pressed and contacted in the reverse offset printing method, the elastic PDMS layer 12 is deformed, but the bottom of the recess 31 of the plate 3 is contacted. I do not.

  FIG. 4 is a schematic cross-sectional view illustrating transfer using a plate having a recess having a small aspect ratio. This plate 3 is provided with a recess 31b having an aspect ratio of about 0.25 shown in FIG. When the plate 3 and the blanket 1 are pressed and contacted by the reverse offset printing method using the plate 3, the elastic PDMS layer 12 is deformed and comes into contact with the bottom of the recess 31b.

  After that, when the blanket 1 is separated from the plate 3, a part of the ink pattern that should remain is transferred to the plate 3 in the portion of the blanket 1 that is in contact with the bottom of the recess 31 b in the PDMS layer 12. Will occur. Even if the blanket 1 and the substrate are brought into pressure contact with each other and the ink pattern is transferred in this state, a part of the target pattern is lost. Such a problem becomes more prominent as the aspect ratio of the concave portion of the plate 3 becomes smaller.

  Here, in order to cope with such a problem, it is conceivable to reduce the thickness of the PDMS layer 12 of the blanket 1. Thereby, the deformation amount of the PDMS layer 12 at the time of press contact is reduced, and the lower limit of the aspect ratio of the concave portion of the plate 3 where the pattern defect occurs can be reduced.

  However, in order to prevent uneven contact at the time of pressure contact between the plate 3 and the blanket 1 as the first transfer process and at the time of pressure contact between the blanket 1 and the substrate 4 as the second transfer process, a substrate with unevenness is also provided. 4, the thickness of the PDMS layer 12 needs to be about 5 to 10 μm. As described above, when the thickness of the PDMS layer 12 is about 5 to 10 μm, a printing defect occurs in the pattern portion where the aspect ratio of the concave portion of the plate 3 is small.

  In order to solve this problem, the aspect ratio of the concave portion 31 of the plate 3 may be increased, that is, deepened. FIG. 5 is a schematic cross-sectional view illustrating a manufacturing method when the aspect ratio of the recess is increased. In order to form a plate, first, as shown in FIG. 5A, a predetermined photoresist mask R is formed by photolithography on a base material 30 such as glass (for example, Corning glass # 1737). Then, a recess 31 is formed in the base material 30 by wet etching using hydrofluoric acid or the like through the photoresist mask R.

  Wet etching is further advanced to deepen the recess 31 (see FIG. 5C). However, in wet etching, etching proceeds isotropically, so-called side etching occurs, and the concave portion aspect ratio obtained is limited to about 1. Therefore, as the etching proceeds, the protrusions between the recesses 31 are etched as shown in FIG. For this reason, a high-definition concave pattern with a high aspect ratio cannot be obtained.

  FIG. 6 is a schematic cross-sectional view for explaining a method of manufacturing a plate using reactive ion etching (RIE). When the recess is formed by reactive ion etching, SiO2 is preferable as the material to be etched. As the substrate 30 of the plate 3, a quartz plate, or a substrate obtained by forming a SiO 2 film on a glass plate, a metal plate or the like by CVD, sputtering, vapor deposition or the like is used.

  In order to form a high-definition pattern with a high aspect ratio, a metal mask M (for example, Cr) is used as an etching mask (see FIG. 6A). Then, RIE is performed using a fluorocarbon gas (CF4, C4F8, etc.) to form the recess 31 (see FIG. 6B).

  As etching progresses, reaction products are formed on the sidewalls of the recesses, the recess 31 has a trapezoidal cross section, and the resulting aspect ratio is about 3. RIE provides a higher aspect ratio than wet etching, but as the etching time becomes longer, the reaction product that adheres strongly peels off during the first transfer step, etc., and becomes a foreign matter, resulting in a transfer defect. In addition, quartz is very expensive, and the reactive ion etching apparatus and the film forming apparatus are very expensive, and there is a problem that the production cost increases.

<2. First Embodiment>
[Structure of transfer pattern forming plate]
FIG. 7 is a schematic cross-sectional view illustrating the structure of a transfer pattern forming plate (simply referred to as “plate”) according to the first embodiment. The plate 3 according to the first embodiment includes concave portions 31a and 31b corresponding to the width of a pattern to be formed on a base material 30 made of glass or the like. Here, the recess 31a has a first width W1. Further, the recess 31b has a second width W2 that is wider than the first width W1.

  In such recesses 31a and 31b, the recess 31a has a first depth D1, and the recess 31b has a second depth D2 that is deeper than the first depth D1. That is, the depth is deeper as the width of the recess is wider. The depths D1 and D2 are depths that do not come into contact with the bottoms of the recesses even when the PDMS layer is elastically deformed when the blanket is brought into pressure contact with the plate 3 in the first transfer process.

  Here, the widths W1 and W2 that determine the depths D1 and D2 of the recesses 31a and 31b are the widths of the widest portions of the openings in the plan view of the recesses 31a and 31b.

[Method for Producing Transfer Pattern Forming Plate]
FIG. 8 is a schematic cross-sectional view illustrating a plate manufacturing method according to the first embodiment. First, as shown in FIG. 8A, a predetermined photoresist mask R is formed by photolithography on a base material 30 such as glass (for example, Corning glass # 1737). The opening of the photoresist mask R has a size corresponding to the openings of the recesses 31a and 31b to be formed (a size considering etching). Then, as shown in FIG. 8B, recesses 31a and 31b are formed in the base material 30 by wet etching using hydrofluoric acid or the like through the photoresist mask R. Here, in consideration of the amount of side etching, the etching is temporarily stopped at an etching depth at which the concave portion 31a to be a high definition portion can be formed.

  Next, as shown in FIG. 8C, a photoresist mask R 'having an opening in the recess 31b to be a low definition portion is formed, and additional etching is performed. Thereby, the concave portion 31b of the low definition portion is further etched, and the concave portion 31b deeper than the depth of the concave portion 31a of the high definition portion is formed. Thereafter, when the photoresist masks R and R ′ are removed, the plate 3 according to the first embodiment is formed as shown in FIG.

  In addition, although the example which forms in different depth about the 2 types of the recessed part 31a of a high-definition part and the recessed part 31b of a low-definition part was demonstrated here, in 3 or more types, it is different in depth (it is so deep that a width is wide). It may be formed. Moreover, the same plate | plate 3 can be formed even if it etches to each recessed part separately to the predetermined depth. Moreover, in the manufacturing method of the said plate 3, although the recessed parts 31a and 31b were formed in the base material 30 by wet etching, you may form the recessed parts 31a and 31b in dry etching (dry etching).

[Transfer pattern forming method]
FIG. 9 is a schematic cross-sectional view illustrating a transfer pattern forming procedure using the plate according to the first embodiment. First, as shown in FIG. 9A, a blanket 1 in which an ink 2 is applied to a PDMS layer 12 is prepared. As the ink 2, for example, a material containing silver, nickel, gold, copper, or other metal is used. Thereafter, the surface of the blanket 1 to which the ink 2 is applied and the plate 3 according to the first embodiment are arranged face to face.

  Next, as shown in FIG. 9B, the blanket 1 and the plate 3 are brought into pressure contact. That is, the ink surface of the blanket 1 is brought into contact with the surface of the plate 3 by pressure contact. The contact by pressurization uses a compressed gas pressurization method. In the compressed gas pressurization method, the blanket 1 and the plate 3 to be contacted are fixed on a predetermined stage while facing and approaching each other. In this state, the blanket 1 and the plate 3 are brought into contact with each other by injecting and extruding compressed gas from the back side of one of the blanket 1 and the plate 3.

  As a result, the ink 2 of the blanket 1 adheres to the periphery (convex portions) of the concave portions 31a and 31b of the plate 3. At this time, at the positions of the concave portions 31a and 31b of the plate 3, the PDMS layer 12 of the blanket 1 is pushed into the concave portions 31a and 31b and is in a curved state. This curvature increases as the width of the recess increases. In the example shown in FIG. 9B, there is a recess 31a and a recess 31b having a width wider than that of the recess 31a. However, the curvature of the recess 31b having a larger width is larger than that of the recess 31a. In this embodiment, since the depth of the recess 31b is deeper than that of the recess 31a, the PDMS layer 12 does not contact the bottom in any of the recesses 31a and 31b.

  Next, as shown in FIG. 9C, when the blanket 1 and the plate 3 are separated, the ink 2 adheres to the convex portions of the plate 3 and corresponds to the concave portions 31a and 31b of the plate 3 on the blanket 1 side. The ink 2 pattern remains. The steps shown in FIGS. 9A to 9C are the transfer process of the pattern of the ink 2 to the blanket 1 side, that is, the first transfer process.

  Next, as shown in FIG. 9D, the blanket 1 on which the pattern of the ink 2 is left and the substrate 4 having an adhesion layer (not shown) formed on the surface face each other and are added in an aligned state. Press contact.

  Thereafter, as shown in FIG. 9E, the blanket 1 and the substrate 4 are separated. As a result, the pattern of the ink 2 left on the blanket 1 is transferred onto the substrate 4. 9D to 9E is a pattern transfer process from the blanket 1 to the substrate 4, that is, a second transfer process.

  By using the plate 3 according to the first embodiment, no pattern defect occurs in any of the recesses 31a and 31b in the transfer of the pattern of the ink 2 to the blanket 1 in the first transfer process, and in the second transfer process. The pattern of the ink 2 can be accurately transferred to the substrate 4. Thereby, the transfer defect of the pattern of the ink 2 to the substrate 4 can be prevented.

<3. Second Embodiment>
[Structure of transfer pattern forming plate]
FIG. 10 is a schematic cross-sectional view illustrating the structure of a transfer pattern forming plate (simply referred to as “plate”) according to the second embodiment. The plate 3 according to the second embodiment includes concave portions 31a and 31b corresponding to the width of a pattern to be formed on a base material 30 made of glass or the like. Here, the recess 31a has a first width W1. Further, the recess 31b has a second width W2 that is wider than the first width W1.

  In such recesses 31a and 31b, the recess 31a has a first depth D1, and the recess 31b has a second depth D2 that is deeper than the first depth D1. That is, the depth is deeper as the width of the recess is wider. Moreover, the recessed part 31b is provided in multiple steps along the depth direction. Specifically, the depth of the first step from the opening of the recess 31b is the same depth D1 as the recess 31a, and the depth of the second step in the center is D2. The depths D1 and D2 are depths that do not come into contact with the bottoms of the recesses even when the PDMS layer is elastically deformed when the blanket is brought into pressure contact with the plate 3 in the first transfer process.

  In the example shown in FIG. 10, the first-stage recess 31 a and the two-stage recess 31 b are provided. However, any number of stages may be used as long as at least the deep-side recess has multiple stages. For example, it is conceivable that the shallow concave portion has one step and the deep concave portion has three steps, or the shallow concave portion has two steps and the deep concave portion has three steps. Further, the number of steps may increase as the width increases.

[Method for Producing Transfer Pattern Forming Plate]
FIG. 11 is a schematic cross-sectional view illustrating a plate manufacturing method according to the second embodiment. First, as shown in FIG. 11A, a predetermined photoresist mask R is formed on a base material 30 such as glass (for example, Corning glass # 1737) by photolithography. The opening of the photoresist mask R has a size corresponding to the openings of the recesses 31a and 31b to be formed (a size considering etching). Then, as shown in FIG. 11B, recesses 31a and 31b are formed in the base material 30 by wet etching using hydrofluoric acid or the like through the photoresist mask R. Here, in consideration of the amount of side etching, the etching is temporarily stopped at an etching depth at which the concave portion 31a to be a high definition portion can be formed.

  Next, after removing the photoresist mask R, as shown in FIG. 11C, a photoresist R ″ is newly applied by, for example, a spin coating method. At this time, the photoresist in the recess 31a to be a high-definition portion is formed. A phenomenon occurs in which the thickness becomes thicker than the thickness of the photoresist in the recess 31b that becomes a low-definition portion.

  Next, as shown in FIG. 11D, an oxygen plasma etching apparatus is used to etch the photoresist R ″ as a whole, so-called etch back is performed, and an opening is formed in the photoresist R ″ in the recess 31b that becomes a low-definition portion. Forming part. Next, when the second wet etching is performed, the base material 30 in the portion where the photoresist R ″ in the recess 31b serving as the low-definition portion is opened is etched. Then, when the photoresist R ″ is removed, FIG. As shown in e), it is possible to form the plate 3 in which the depth of the concave portion 31b of the low-definition portion is deeper than the depth of the concave portion 31a of the high-definition portion.

  In the manufacturing method of the plate 3, the recesses 31a and 31b are formed on the base material 30 by wet etching. However, the recesses 31a and 31b may be formed by dry etching (dry etching).

[Transfer pattern forming method]
FIG. 12 is a schematic cross-sectional view illustrating a transfer pattern forming procedure using a plate according to the second embodiment. First, as shown in FIG. 12A, the blanket 1 in which the ink 2 is applied to the PDMS layer 12 is prepared. As the ink 2, for example, a material containing silver, nickel, gold, copper, or other metal is used. Thereafter, the surface of the blanket 1 on which the ink 2 is applied and the plate 3 according to the second embodiment are arranged face to face.

  Next, as shown in FIG. 12B, the blanket 1 and the plate 3 are brought into pressure contact. That is, the ink surface of the blanket 1 is brought into contact with the surface of the plate 3 by pressure contact. The contact by pressurization uses a compressed gas pressurization method. In the compressed gas pressurization method, the blanket 1 and the plate 3 to be contacted are fixed on a predetermined stage while facing and approaching each other. In this state, the blanket 1 and the plate 3 are brought into contact with each other by injecting and extruding compressed gas from the back side of one of the blanket 1 and the plate 3.

  As a result, the ink 2 of the blanket 1 adheres to the periphery (convex portions) of the concave portions 31a and 31b of the plate 3. At this time, at the positions of the concave portions 31a and 31b of the plate 3, the PDMS layer 12 of the blanket 1 is pushed into the concave portions 31a and 31b and is in a curved state. This curvature increases as the width of the recess increases. In the example shown in FIG. 12B, there is a recess 31a and a recess 31b wider than the recess 31a, but the curvature of the wider recess 31b is larger than the curvature of the recess 31a. In the present embodiment, since the deep recesses 31b are multi-staged compared to the recesses 31a, the PDMS layer 12 does not contact the bottom in any of the recesses 31a and 31b.

  Next, as shown in FIG. 12C, when the blanket 1 and the plate 3 are separated, the ink 2 adheres to the convex portions of the plate 3 and corresponds to the concave portions 31a and 31b of the plate 3 on the blanket 1 side. The ink 2 pattern remains. The process shown in FIGS. 12A to 12C is a transfer process of the pattern of the ink 2 to the blanket 1 side, that is, a first transfer process.

  Next, as shown in FIG. 12 (d), the blanket 1 on which the ink 2 pattern is left and the substrate 4 having an adhesion layer (not shown) formed on the surface face each other and are added in an aligned state. Press contact.

  Thereafter, as shown in FIG. 12E, the blanket 1 and the substrate 4 are separated. As a result, the pattern of the ink 2 left on the blanket 1 is transferred onto the substrate 4. The process shown in FIGS. 12D to 12E is a pattern transfer process from the blanket 1 to the substrate 4, that is, a second transfer process.

  By using the plate 3 according to the second embodiment, the pattern transfer of the ink 2 to the blanket 1 in the first transfer process does not cause any pattern defect in either of the recesses 31a and 31b, and in the second transfer process. The pattern of the ink 2 can be accurately transferred to the substrate 4. Thereby, the transfer defect of the pattern of the ink 2 to the substrate 4 can be prevented.

<4. Third Embodiment>
[Structure of transfer pattern forming plate]
FIG. 13 is a schematic cross-sectional view illustrating the structure of a transfer pattern forming plate (simply called “plate”) according to the third embodiment. The plate 3 according to the third embodiment includes concave portions 31a and 31b corresponding to the width of a pattern to be formed on a base material 30 made of glass or the like. Here, the recess 31a has a first width W1. Further, the recess 31b has a second width W2 that is wider than the first width W1.

  In such recesses 31a and 31b, a conical protrusion T having a height smaller than the depth of the recess 31b is provided on the bottom surface of the recess 31b wider than the recess 31a. With such a conical protrusion T, when the blanket is brought into pressure contact with the plate 3 in the first transfer step, it contacts only the tip of the conical protrusion T provided on the bottom surface of the recess 31b even if the PDMS layer is elastically deformed. Thus, pattern defects are not generated.

[Method for Producing Transfer Pattern Forming Plate]
FIG. 14 is a schematic diagram illustrating a plate manufacturing method according to the third embodiment. First, as shown in FIG. 14B, a predetermined photoresist mask R is formed by photolithography on a base material 30 such as glass (for example, Corning glass # 1737). Here, FIG. 14B is a cross-sectional view taken along the line BB of the plan view shown in FIG. In the manufacture of the plate according to the third embodiment, a circular photoresist mask R ″ is formed at a position corresponding to the concave portion to be the low-definition portion along with the formation of the photoresist mask R.

  The size of the photoresist mask R ″ is such that the photoresist mask R ″ is removed by a side etching phenomenon by wet etching described later. In addition, the photoresist mask R ″ is arranged at, for example, a plurality of positions so as to be equidistant between the corresponding concave portions serving as the low-definition portions and the corresponding photoresist mask R. If necessary, the photoresist masks R ″ are arranged at a plurality of positions in a matrix form. Is done.

  Then, as shown in FIG. 14C, wet etching using hydrofluoric acid or the like is performed through the photoresist masks R and R ″. When wet etching is performed up to a predetermined depth, side etching phenomenon of wet etching causes The plate 3 having the conical protrusion T formed on the bottom surface of the concave portion 31b is formed, and the conical protrusion T formed by the side etching phenomenon is at a height smaller than the depth of the concave portion 31b, that is, at a position lower than the opening surface of the concave portion 31b. Since the tip of the conical protrusion T has a very small area, the ink pattern is not transferred in the first transfer process.

[Transfer pattern forming method]
FIG. 15 is a schematic cross-sectional view illustrating a transfer pattern forming procedure using a plate according to the third embodiment. First, as shown in FIG. 15A, the blanket 1 in which the ink 2 is applied to the PDMS layer 12 is prepared. As the ink 2, for example, a material containing silver, nickel, gold, copper, or other metal is used. Thereafter, the surface of the blanket 1 to which the ink 2 is applied and the plate 3 according to the third embodiment are arranged face to face.

  Next, as shown in FIG. 15B, the blanket 1 and the plate 3 are brought into pressure contact. That is, the ink surface of the blanket 1 is brought into contact with the surface of the plate 3 by pressure contact. The contact by pressurization uses a compressed gas pressurization method. In the compressed gas pressurization method, the blanket 1 and the plate 3 to be contacted are fixed on a predetermined stage while facing and approaching each other. In this state, the blanket 1 and the plate 3 are brought into contact with each other by injecting and extruding compressed gas from the back side of one of the blanket 1 and the plate 3.

  As a result, the ink 2 of the blanket 1 adheres to the periphery (convex portions) of the concave portions 31a and 31b of the plate 3. At this time, at the positions of the concave portions 31a and 31b of the plate 3, the PDMS layer 12 of the blanket 1 is pushed into the concave portions 31a and 31b and is in a curved state. This curvature increases as the width of the recess increases. In the example shown in FIG. 15B, there is a recess 31a and a recess 31b wider than the recess 31a, but the curvature of the wider recess 31b is larger than the curvature of the recess 31a. In this embodiment, the conical protrusion T is provided on the bottom surface of the recess 31b that is deeper than the recess 31a. As a result, even if the PDMS layer 12 is curved and pushed in, the PDMS layer 12 is supported by the tip of the conical protrusion T and does not reach the bottom surface. That is, the PDMS layer 12 does not come into contact with the bottom in any of the recesses 31a and 31b.

  Next, as shown in FIG. 15C, when the blanket 1 and the plate 3 are separated, the ink 2 adheres to the convex portion of the plate 3 and corresponds to the concave portions 31a and 31b of the plate 3 on the blanket 1 side. The ink 2 pattern remains. At this time, in the portion of the ink 2 of the blanket 1 that has been in contact with the conical protrusion T, the contact area with the conical protrusion T is very small, so that there is no defect in the transfer pattern. The processes shown in FIGS. 15A to 15C are the transfer process of the pattern of the ink 2 to the blanket 1 side, that is, the first transfer process.

  Next, as shown in FIG. 15D, the blanket 1 on which the ink 2 pattern is left and the substrate 4 having an adhesion layer (not shown) formed on the surface face each other and are added in an aligned state. Press contact.

  Thereafter, as shown in FIG. 15E, the blanket 1 and the substrate 4 are separated. As a result, the pattern of the ink 2 left on the blanket 1 is transferred onto the substrate 4. The process shown in FIGS. 15D to 15E is a pattern transfer process from the blanket 1 to the substrate 4, that is, a second transfer process.

  By using the plate 3 according to the third embodiment, no pattern defect occurs in any of the recesses 31a and 31b in the transfer of the pattern of the ink 2 to the blanket 1 in the first transfer process, and in the second transfer process. The pattern of the ink 2 can be accurately transferred to the substrate 4. Thereby, the transfer defect of the pattern of the ink 2 to the substrate 4 can be prevented.

<5. Pattern transfer device>
[Apparatus configuration: application example mainly in the first transfer step]
FIG. 16 is a schematic cross-sectional view showing an example of a pattern transfer apparatus. This pattern transfer apparatus is an apparatus that performs pressure contact by the compressed gas pressurization method described above. Pattern transfer by the pattern transfer apparatus can be used in either the first transfer process or the second transfer process.

  In the pattern transfer apparatus used in the first transfer process for transferring the pattern of the plate to the blanket, for example, as shown in FIG. 16A, the outer periphery of the blanket is placed on the lower stage 51, the O-rings 53A and 53B, and the fixed frame 54A. , 54B. Further, the plate 3 is fixed by the upper stage 52, and the blanket 1 is pushed out by injecting compressed gas from an opening 510 (which functions as a vacuum exhaust port and a compressed gas introduction port) provided near the center of the lower stage 51. To.

  For example, as shown in FIG. 16B, the outer periphery of the blanket 1 is vacuum-sucked by the openings 511A and 511B provided in the lower stage 51A as indicated by reference numerals P2 and P3 in the figure. May be fixed.

  Further, for example, as shown in FIG. 17, the plate 3 may be fixed on the lower stage 51. In this transfer device, the plate 3 is fixed on the lower stage 51, and the outer peripheral portion of the blanket 1 is fixed by the fixing frames 54C and 54D. Further, the stretchable film 55 that is inflatable and has flexibility is fixed by the O-rings 53A and 53B, the fixing frames 54A and 54B, and the upper stage 52A. Then, the stretchable film 55 and the blanket 1 are pushed out by injecting compressed gas from an opening 520 (which functions as a vacuum exhaust port and a compressed gas introduction port) provided near the center of the upper stage 52A. In this case, it is only necessary to mechanically fix the outer peripheral portion of the blanket 1.

  In these cases, the blanket 1 and the plate 3 are closely controlled with a distance of 1 μm to 1 mm and a transfer pressure of about 0.1 kPa to 100 kPa. Thereby, since it can control on the blanket 1 with uniform and low pressure, the ink can be transferred without being crushed. In these FIGS. 16 and 17, the illustration of ink is omitted.

[Example of application in the second transfer step]
When the pattern transfer device performs the transfer of the ink pattern from the blanket 1 to the substrate 4, that is, the second transfer step, the plate 3 is replaced with the substrate 4 in the pattern transfer device used in the first transfer step. You can do it.

  According to the above-described embodiment, in the plate used for the reverse offset printing method, both the high-definition and the low-definition pattern can be formed by making the recess depth of the low-definition portion deeper than the recess depth of the high-definition portion. can do. Further, in the plate used for the reverse offset printing method, it is possible to achieve both high-definition and low-definition pattern formation by forming dummy conical protrusions that are not transferred in the recesses that become the low-definition portions.

It is a schematic cross section explaining the procedure of basic transfer pattern formation (part 1). It is a schematic cross section explaining the procedure of basic transfer pattern formation (No. 2). It is a figure explaining the state of the recessed part of a plate. It is a schematic cross section explaining transfer using a plate having a recess having a small aspect ratio. It is a schematic cross section explaining the manufacturing method when enlarging the aspect ratio of a recessed part. It is a schematic cross section explaining the method of manufacturing a plate using reactive ion etching. It is a schematic cross section explaining the structure of the transfer pattern forming plate according to the first embodiment. It is a schematic cross section explaining the plate manufacturing method according to the first embodiment. It is a schematic cross section explaining the formation procedure of the transfer pattern using the plate according to the first embodiment. It is a schematic cross section explaining the structure of a transfer pattern forming plate according to a second embodiment. It is a schematic cross section explaining the plate manufacturing method according to the second embodiment. It is a schematic cross section explaining the formation procedure of the transfer pattern using the plate according to the second embodiment. It is a schematic cross section explaining the structure of the transfer pattern forming plate according to the third embodiment. It is a schematic diagram explaining the manufacturing method of the plate which concerns on 3rd Embodiment. It is a schematic cross section explaining the formation procedure of the transfer pattern using the plate according to the third embodiment. It is a schematic cross section which shows the example of a pattern transfer apparatus (the 1). It is a schematic cross section which shows the example of a pattern transfer apparatus (the 2).

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Blanket, 2 ... Ink, 3 ... Plate, 31 ... Recessed part, 4 ... Board | substrate, 11 ... Base material, 12 ... PDMS layer, 31a ... 1st recessed part, 31b ... 2nd recessed part

Claims (12)

Using a blanket in which a hard base material and a soft base material softer than the hard base material are bonded together, an application step of applying ink to the surface of the soft base material;
A plate in which a recess is provided at a position of a pattern to be formed, and a recess having a first width and a recess having a second width wider than the first width, than the recess having the first width. Using the concave portion having the second width provided deeper, the plate and the blanket face each other and brought into pressure contact with each other. A first transfer step in which only the corresponding part is left and transferred on the blanket side;
The second transfer step of transferring the ink remaining on the blanket onto the substrate by bringing the blanket after the first transfer step and the substrate on which the pattern is formed face each other and bringing them into pressure contact with each other A transfer pattern forming method comprising: The transfer pattern forming method according to claim 1, wherein the plate is provided with a plurality of recesses having at least the second width in a depth direction. A first recess having a first width corresponding to the width of the pattern to be formed;
A transfer pattern forming plate having a second recess having a width wider than the first recess and deeper than the first recess. The plate for forming a transfer pattern according to claim 3, wherein at least the second recesses are provided in multiple stages along the depth direction. Exposing and developing the photosensitive material formed on the surface of the base material to form a first opening and a second opening having an opening wider than the first opening;
Etching the base material using the photosensitive material as a mask to form a recess corresponding to the first opening and the second opening;
A step of closing the first opening and further etching the concave portion of the base material through the second opening. The first photosensitive material formed on the surface of the base material is exposed and developed to form a first opening by the first photosensitive material and a second opening having an opening wider than the first opening. Process,
Etching the substrate using the first photosensitive material as a mask to form a recess corresponding to the first opening and the second opening;
Forming a third opening only in the vicinity of the center of the recess formed corresponding to the second opening by forming a second photosensitive material on the entire surface of the substrate and etching;
Etching the base material using the second photosensitive material as a mask, and forming a recess corresponding to the third opening in the vicinity of the center of the recess formed corresponding to the second opening. A method for producing a pattern forming plate. A first stage holding a blanket coated with ink;
A second stage for holding a plate or a substrate to which the ink pattern is transferred arranged opposite to the blanket;
Pressurizing means for pressurizing the blanket in the direction of the plate,
As the edition,
A first recess having a first width corresponding to the width of the pattern to be formed;
A transfer device having a width wider than the first recess and a second recess provided deeper than the first recess is used. The transfer device according to claim 7, wherein at least the second recesses are provided in multiple stages along the depth direction. Using a blanket in which a hard base material and a soft base material softer than the hard base material are bonded together, an application step of applying ink to the surface of the soft base material;
A plate provided with a recess at a position of a pattern to be formed, the recess having a first width and a recess having a second width wider than the first width, the recess having the second width Of the blanket ink, the plate and the blanket face each other and are brought into pressure contact with each other by using a plate having a conical projection having a height smaller than the depth of the recess on the bottom surface of the plate. A first transfer step of transferring only the portion corresponding to the concave portion of the blanket side,
The second transfer step of transferring the ink remaining on the blanket onto the substrate by bringing the blanket after the first transfer step and the substrate on which the pattern is formed face each other and bringing them into pressure contact with each other A transfer pattern forming method comprising: A first recess having a first width corresponding to the width of the pattern to be formed;
A transfer pattern forming plate comprising: a second recess having a recess having a width wider than that of the first recess and having a conical protrusion having a height smaller than the depth of the recess on the bottom surface. The photosensitive material formed on the surface of the base material is exposed and developed to form a first opening by the photosensitive material and a second opening having an opening wider than the first opening. Forming a circular dummy pattern in plan view made of the photosensitive material in the opening;
The substrate is etched using the photosensitive material as a mask to form a recess corresponding to the first opening and the second opening, and at a position smaller than the depth of the recess at a position corresponding to the dummy pattern. Forming a conical protrusion;
A method for producing a transfer pattern forming plate having: A first stage holding a blanket coated with ink;
A second stage for holding a plate or a substrate to which the ink pattern is transferred arranged opposite to the blanket;
Pressurizing means for pressurizing the blanket in the direction of the plate,
As the edition,
A first recess having a first width corresponding to the width of the pattern to be formed;
A transfer device is used which has a recess having a width wider than that of the first recess, and a second recess having a conical protrusion having a height smaller than the depth of the recess on the bottom surface.

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