JP2010084798A - Shock absorbing structure - Google Patents

Shock absorbing structure Download PDF

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JP2010084798A
JP2010084798A JP2008251665A JP2008251665A JP2010084798A JP 2010084798 A JP2010084798 A JP 2010084798A JP 2008251665 A JP2008251665 A JP 2008251665A JP 2008251665 A JP2008251665 A JP 2008251665A JP 2010084798 A JP2010084798 A JP 2010084798A
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adhesive foam
thickness
electronic component
foam
absorbing structure
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Katsunori Takahashi
克典 高橋
Ryosuke Takahashi
良輔 高橋
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a shock absorbing structure excellent in shock absorption property. <P>SOLUTION: The shock absorbing structure includes a shock absorbing material containing an adhesive foam 2 and arranged between an electronic component 13 and a protection member 14 protecting the electronic component 13. Therefore, even when an external force is applied to the protection member 14 to deform the protection member, the shock absorbing structure can smoothly absorb, by the shock absorbing material, a stress generated by deformation of a protection member 14 and prevent the stress from being transmitted to an electronic component 13, surely protect the electronic component 13 from the stress caused by the deformation of the protection member 14, and prevent in general a failure or malfunction of the electronic component 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、優れた衝撃吸収性を有する衝撃吸収構造に関する。   The present invention relates to a shock absorbing structure having excellent shock absorption.

今日では各種電子部品が様々な機器に用いられているが、電子部品は衝撃に弱いため、電子部品に外部から直接、応力が加わるのを防止するために、電子部品は筐体内に収められ、更に、筐体と電子部品との間には緩衝材が配設されている。   Today, various electronic components are used in various devices. Since electronic components are vulnerable to impact, the electronic components are housed in a housing in order to prevent stress from being applied directly to the electronic components from the outside. Further, a cushioning material is disposed between the housing and the electronic component.

上記緩衝材としては、一般的にゴムシートや結晶性オレフィン樹脂からなる独立気泡発泡体が用いられている。しかしながら、上記緩衝材は、電子部品に加わる衝撃力を十分に吸収できないという問題点があり、更に、圧縮時の反発力が大きいために電子部品に力が加わり、電子部品に歪みが生じるといった問題点を有している。   As the cushioning material, a closed cell foam made of a rubber sheet or a crystalline olefin resin is generally used. However, the cushioning material has a problem that the impact force applied to the electronic component cannot be sufficiently absorbed, and further, the repulsive force at the time of compression is large, so that the force is applied to the electronic component and the electronic component is distorted. Has a point.

そこで、圧縮時の柔軟性に優れた緩衝材として、特許文献1には、連続気泡構造を有するウレタン発泡体が開示され、特許文献2には、ゴム弾性を示すポリマーを用いた発泡体が開示されている。   Therefore, as a cushioning material having excellent flexibility during compression, Patent Document 1 discloses a urethane foam having an open cell structure, and Patent Document 2 discloses a foam using a polymer exhibiting rubber elasticity. Has been.

しかしながら、特許文献1、2に記載の発泡体は、気泡構造に基づく衝撃吸収力は発揮するものの、発泡体を構成している合成樹脂自体は衝撃吸収力に乏しいため、衝撃吸収性が低いという問題点を有している。   However, although the foams described in Patent Documents 1 and 2 exhibit the impact absorbing power based on the cell structure, the synthetic resin itself constituting the foam is poor in the shock absorbing power, so that the shock absorbing property is low. Has a problem.

又、多くの電子部品はコネクタを使って基板に取り付けられているが、電子機器の筐体に外部から周期的に衝撃が加わり、筐体に歪み、曲がり、捩れなどの変形が周期的に生じると、この筐体の変形に伴って生じる応力が電子部品に伝わってコネクタが外れるという問題がある。   In addition, many electronic components are attached to a board using a connector. However, an external impact is periodically applied to the housing of the electronic device, and the housing is periodically deformed, bent, twisted, and the like. Then, there is a problem that the stress caused by the deformation of the casing is transmitted to the electronic component and the connector is detached.

しかしながら、ゴムシートや結晶性オレフィン樹脂からなる独立気泡発泡体などの一般的な緩衝材では、電子機器の筐体が変形することにより生じる周期的な応力を十分に緩和することができず、上述したコネクタの離脱を防止することができない。   However, a general cushioning material such as a closed-cell foam made of a rubber sheet or a crystalline olefin resin cannot sufficiently relieve the periodic stress caused by the deformation of the casing of the electronic device. It is impossible to prevent the detached connector from being detached.

特許第3903244号公報Japanese Patent No. 3903244 特開2006−110773号公報JP 2006-110773 A

本発明は、衝撃吸収性に優れた衝撃吸収構造を提供する。   The present invention provides an impact-absorbing structure excellent in impact absorption.

本発明の衝撃吸収構造は、電子部品と、この電子部品を保護する保護部材との間に粘着性発泡体を含む衝撃吸収材が配設されている。   In the shock absorbing structure of the present invention, a shock absorbing material including an adhesive foam is disposed between an electronic component and a protective member that protects the electronic component.

上記電子部品としては、外部からの衝撃によって破壊し或いは機能を失う虞れのある電子部品であればよく、例えば、フローセンサや傾斜センサなどのセンサ、プリント基板用コネクタなどのコネクタ、液晶セル、有機ELセルなどの表示デバイスなどが挙げられる。   The electronic component may be any electronic component that may be destroyed or lose its function due to an external impact. For example, a sensor such as a flow sensor or a tilt sensor, a connector such as a connector for a printed circuit board, a liquid crystal cell, Examples thereof include display devices such as organic EL cells.

そして、上記電子部品を保護するために電子部品は、ガラス板や合成樹脂板などの保護板や筐体などの保護部材によって覆われている。しかるに、保護部材は外部に露出した状態が多く、しかも、近年、軽量性の観点から、保護板や筐体を構成している部材の厚みが薄く形成されている。   And in order to protect the said electronic component, the electronic component is covered with protective members, such as protective plates, such as a glass plate and a synthetic resin board, and a housing | casing. However, the protective member is often exposed to the outside, and in recent years, the thickness of the members constituting the protective plate and the housing is thin from the viewpoint of light weight.

従って、保護部材は外部から加えられる衝撃によって歪み、曲がり、捻じれなどの変形を生じ易く、この保護部材の変形に起因した応力が電子部品に伝わり、電子部品の故障或いは誤作動の原因となる虞れがある。   Accordingly, the protective member is likely to be deformed, bent, twisted, or the like due to an external impact, and the stress resulting from the deformation of the protective member is transmitted to the electronic component, causing failure or malfunction of the electronic component. There is a fear.

又、保護部材に周期的に衝撃が加わり、保護部材に上述した変形が周期的に生じ、この保護部材の変形に起因した応力が原因となって電子部品に取り付けたコネクタが外れてしまう虞れがある。   Further, a shock is periodically applied to the protective member, and the deformation described above is periodically generated in the protective member, and the connector attached to the electronic component may be disconnected due to the stress caused by the deformation of the protective member. There is.

そこで、本発明では、保護部材の外部応力による変形に起因した応力が電子部品に伝達するのを防止或いは緩和し、上述の問題点を解消するべく、保護部材と電子部品との間に粘着性発泡体を配設し、保護部材からの応力が電子部品に伝わるのを阻止し或いは緩和している。   Therefore, in the present invention, in order to prevent or alleviate the stress caused by the deformation due to the external stress of the protective member to the electronic component, and to eliminate the above-mentioned problems, the adhesive between the protective member and the electronic component A foam is provided to prevent or relieve the stress from the protective member from being transmitted to the electronic component.

上記粘着性発泡体は、粘着剤に空気を混合して発泡させてなる。粘着剤としては、特に限定されず、例えば、ウレタン系粘着剤、アクリル系粘着剤などが挙げられ、アクリル系粘着剤を含有していることが好ましい。   The above-mentioned adhesive foam is formed by mixing air with an adhesive and foaming. It does not specifically limit as an adhesive, For example, a urethane type adhesive, an acrylic adhesive, etc. are mentioned, It is preferable that the acrylic adhesive is contained.

アクリル系粘着剤のなかでも、tanδのピ−ク値が0.4以上であるアクリル系粘着剤が衝撃吸収剤の衝撃吸収性を向上させることができて好ましい。なお、tanδとは、粘弾性測定装置を用い、常温、測定周波数1Hz、測定試料の歪み1%の条件下にて、せん断モードで動的粘弾性を測定したときの損失弾性率(G”)と貯蔵弾性率(G’)との比(G”/ G’)である。   Among the acrylic pressure-sensitive adhesives, an acrylic pressure-sensitive adhesive having a tan δ peak value of 0.4 or more is preferable because it can improve the shock absorption of the shock absorber. Note that tan δ is a loss elastic modulus (G ″) when dynamic viscoelasticity is measured in a shear mode using a viscoelasticity measuring device at normal temperature, a measurement frequency of 1 Hz, and a strain of a measurement sample of 1%. And the storage elastic modulus (G ′) ratio (G ″ / G ′).

そして、粘着性発泡体を構成している粘着剤中において、tanδのピ−ク値が0.4以上であるアクリル系粘着剤の含有量は、衝撃吸収剤の衝撃吸収性が向上するので、50重量%以上が好ましく、70重量%以上がより好ましい。   And in the pressure-sensitive adhesive constituting the pressure-sensitive adhesive foam, the content of the acrylic pressure-sensitive adhesive having a peak value of tan δ of 0.4 or more improves the shock absorption of the shock absorber. 50 weight% or more is preferable and 70 weight% or more is more preferable.

tanδのピ−ク値が0.4以上であるアクリル系粘着剤としては、例えば、ガラス転移温度が0℃以下であるアクリル系樹脂、ロジン系粘着付与剤などの粘着付与剤を含有するアクリル系樹脂が挙げられる。なお、ガラス転移温度は、示差走査熱量測定によって測定されたものをいう。又、ロジン系粘着付与剤としては、例えば、「ペンセル」(荒川化学工業株式会社)などが挙げられる。   Examples of the acrylic pressure-sensitive adhesive having a peak value of tan δ of 0.4 or more include an acrylic resin containing a tackifier such as an acrylic resin having a glass transition temperature of 0 ° C. or lower and a rosin-based tackifier. Resin. The glass transition temperature is measured by differential scanning calorimetry. Examples of the rosin-based tackifier include “Pencel” (Arakawa Chemical Industries, Ltd.).

粘着性発泡体の製造方法としては、例えば、粘着剤のエマルジョンに空気を混合して発泡させた後、この発泡粘着剤エマルジョンを任意の面に所定厚みで塗布して乾燥させる方法が挙げられる。   Examples of the method for producing a pressure-sensitive adhesive foam include a method in which air is mixed with an emulsion of a pressure-sensitive adhesive and foamed, and then this foamed pressure-sensitive adhesive emulsion is applied to an arbitrary surface with a predetermined thickness and dried.

更に、粘着剤のエマルジョンに架橋剤を含有させて粘着性発泡体を架橋させることによって、粘着性発泡体の衝撃吸収性を維持しつつ粘着性発泡体の寸法精度を向上させることができる。このような架橋剤としては、粘着性発泡体を架橋させることができれば、特に限定されず、例えば、エポキシ系架橋剤、アミン系架橋剤、シラン系架橋剤などが挙げられる。   Further, by incorporating a crosslinking agent into the adhesive emulsion to crosslink the adhesive foam, it is possible to improve the dimensional accuracy of the adhesive foam while maintaining the impact absorption of the adhesive foam. Such a crosslinking agent is not particularly limited as long as the adhesive foam can be crosslinked, and examples thereof include an epoxy crosslinking agent, an amine crosslinking agent, and a silane crosslinking agent.

又、粘弾性発泡シート中における架橋剤の含有量としては、多いと、粘着性発泡体の架橋密度が高くなり過ぎて、粘着性発泡体の衝撃吸収性が低下することがあるので、粘着性発泡体を構成している樹脂成分100重量部に対して6重量部以下が好ましく、1〜4重量部がより好ましい。   In addition, as the content of the crosslinking agent in the viscoelastic foam sheet, if the amount is large, the crosslinking density of the adhesive foam becomes too high, and the impact absorbability of the adhesive foam may be lowered. The amount is preferably 6 parts by weight or less, more preferably 1 to 4 parts by weight, based on 100 parts by weight of the resin component constituting the foam.

そして、粘着性発泡体の密度は、粘着性発泡体の衝撃吸収性に優れていることから、0.05〜1g/cm3が好ましく、0.1〜1g/cm3がより好ましく、0.15〜1g/cm3が特に好ましい。 And since the density of an adhesive foam is excellent in the impact-absorbing property of an adhesive foam, 0.05-1 g / cm < 3 > is preferable, 0.1-1 g / cm < 3 > is more preferable, and 0.1. 15-1 g / cm 3 is particularly preferred.

更に、粘着性発泡体には無機充填材が含有されていてもよい。このような無機充填剤としては、例えば、珪藻土、軟質無水ケイ酸、ホワイトカーボンなどのケイ酸、カオリン、タルクなどのケイ酸塩、炭酸カルシウム、炭酸マグネシウム、酸化亜鉛(亜鉛華)、酸化チタン、硫酸バリウム、硫酸カルシウムなどが挙げられる。   Furthermore, the adhesive foam may contain an inorganic filler. Examples of such inorganic fillers include diatomaceous earth, soft anhydrous silicic acid, silicic acid such as white carbon, silicates such as kaolin and talc, calcium carbonate, magnesium carbonate, zinc oxide (zinc white), titanium oxide, Examples thereof include barium sulfate and calcium sulfate.

又、粘着性発泡体は下記の要領で測定した跳ね返り高さが4mm以下であることが衝撃吸収性に優れており好ましい。先ず、粘着性発泡体をその厚みが5mmのシート状に形成する。そして、表面粗さRaが50μm以下で且つ厚みが5cmの鉄板を用意し、この鉄板を水平面上に載置した上で、鉄板上に粘着性発泡体を敷設する。次に、粘着性発泡体の表面(上面)から垂直方向に20mmの高さ位置から直径が1インチで且つ66.71gの鉄球を粘着性発泡体に向かって自由落下させる。次に、鉄球が粘着性発泡体上に落下して上方に向かって跳ねた時の鉄球の下端と粘着性発泡体の表面との垂直方向の最大距離を測定し、この最大距離を跳ね返り高さとする。   In addition, the adhesive foam preferably has a rebound height of 4 mm or less as measured in the following manner because of excellent shock absorption. First, an adhesive foam is formed into a sheet having a thickness of 5 mm. Then, an iron plate having a surface roughness Ra of 50 μm or less and a thickness of 5 cm is prepared, and this iron plate is placed on a horizontal plane, and then an adhesive foam is laid on the iron plate. Next, an iron ball having a diameter of 1 inch and 66.71 g is dropped freely from the height position of 20 mm in the vertical direction from the surface (upper surface) of the adhesive foam toward the adhesive foam. Next, measure the maximum vertical distance between the bottom of the iron ball and the surface of the adhesive foam when the iron ball falls onto the adhesive foam and bounces upward, and this maximum distance is bounced back. The height.

ここで、本発明において、鉄板の表面粗さRaは下記の要領で測定される。鉄板の表面を非接触式のレーザー顕微鏡を用いて表面高さをデータとして取り込み、JIS B0601に準拠して表面粗さを計算すればよい。   Here, in the present invention, the surface roughness Ra of the iron plate is measured in the following manner. What is necessary is just to take in the surface height as data using the non-contact-type laser microscope, and to calculate the surface roughness based on JIS B0601.

なお、鉄板の表面粗さRaは、例えば、キーエンス社から市販されているVK形状解析装置、商品名が「VK−8500」のレーザー顕微鏡、及び、その解析ソフト(商品名「VK−PC」)を用いて下記手順で測定することができる。   The surface roughness Ra of the iron plate is, for example, a VK shape analyzer commercially available from Keyence Corporation, a laser microscope with a trade name “VK-8500”, and an analysis software thereof (trade name “VK-PC”). Can be measured by the following procedure.

具体的には、鉄板の表面に焦点を合わせる。なお、測定範囲を一辺が2mmの正方形よりも大きな大きさとする。   Specifically, the focus is on the surface of the iron plate. Note that the measurement range is larger than a square having a side of 2 mm.

次に、レーザー光の上下限を設定した後、鉄板の表面上にレーザー光を照射して鉄板の表面の高さをレーザーによってスキャンする。そして、画像データを解析ソフトに取り込み、JIS B0601に準拠してスキン層の表面粗さRaを解析すればよい。   Next, after setting the upper and lower limits of the laser beam, the surface of the iron plate is irradiated with the laser beam and the height of the surface of the iron plate is scanned with the laser. Then, the image data is taken into analysis software, and the surface roughness Ra of the skin layer may be analyzed according to JIS B0601.

更に、粘着性発泡体は、鉄球を20mmの高さ位置の代わりに40mmの高さ位置から自由落下させたこと以外は上記と同様の要領で測定した跳ね返り高さが8mm以下であることが好ましく、4mm以下がより好ましい。   Furthermore, the adhesive foam may have a rebound height of 8 mm or less measured in the same manner as described above except that the iron ball is dropped freely from a height position of 40 mm instead of a height position of 20 mm. Preferably, 4 mm or less is more preferable.

又、粘着性発泡体は、下記の要領で測定した鉄球の加速度と鉄球の重量との積で表される衝撃力の最大値が400N以下であることが好ましく、200N以下であることがより好ましい。先ず、粘着性発泡体をその厚みが5mmのシート状に形成する。そして、表面粗さRaが50μm以下で且つ厚みが5cmの鉄板を用意し、この鉄板を水平面上に載置した上で、鉄板上に粘着性発泡体を敷設する。次に、粘着性発泡体の表面(上面)から垂直方向に20mmの高さ位置から直径が1インチで且つ66.71gの鉄球を粘着性発泡体に向かって自由落下させる。そして、鉄球が粘着性発泡体上に到達するまでにおいて、鉄球の加速度の最大値を測定し、この鉄球の加速度と鉄球の重量との積を衝撃力の最大値とする。   The adhesive foam preferably has a maximum impact force represented by the product of the acceleration of the iron ball and the weight of the iron ball measured in the following manner of 400 N or less, preferably 200 N or less. More preferred. First, an adhesive foam is formed into a sheet having a thickness of 5 mm. Then, an iron plate having a surface roughness Ra of 50 μm or less and a thickness of 5 cm is prepared, and this iron plate is placed on a horizontal plane, and then an adhesive foam is laid on the iron plate. Next, an iron ball having a diameter of 1 inch and 66.71 g is dropped freely from the height position of 20 mm in the vertical direction from the surface (upper surface) of the adhesive foam toward the adhesive foam. Then, until the iron ball reaches the adhesive foam, the maximum value of the acceleration of the iron ball is measured, and the product of the acceleration of the iron ball and the weight of the iron ball is set as the maximum value of the impact force.

更に、粘着性発泡体は、鉄球を20mmの高さ位置の代わりに40mmの高さ位置から自由落下させたこと以外は上記と同様の要領で測定した衝撃力の最大値は、800N以下が好ましく、500N以下がより好ましい。   Furthermore, the adhesive foam has a maximum impact force of 800 N or less measured in the same manner as described above except that the iron ball is allowed to fall freely from a height position of 40 mm instead of a height position of 20 mm. Preferably, 500 N or less is more preferable.

又、粘着性発泡体は、厚さ0.5mmのシート状に形成された上で25℃にて厚み方向に50%圧縮された状態で周波数100Hzにて測定された歪み0.01〜5%の範囲における動的せん断複素弾性率は、1.0×106Pa以上であることが好ましく、1.1×106〜1.6×106Paがより好ましい。粘着性発泡体の動的せん断複素弾性率が上記範囲であると、粘着性発泡体が充分なせん断強度を有しており、優れた衝撃吸収性を有するからである。 Further, the adhesive foam was formed into a sheet having a thickness of 0.5 mm, and the strain measured at a frequency of 100 Hz in a state compressed at 50 ° C. in the thickness direction at 25 ° C. was 0.01 to 5%. The dynamic shear complex modulus in the range is preferably 1.0 × 10 6 Pa or more, and more preferably 1.1 × 10 6 to 1.6 × 10 6 Pa. This is because when the dynamic shear complex modulus of the adhesive foam is in the above range, the adhesive foam has sufficient shear strength and has excellent impact absorbability.

そして、粘着性発泡体は、厚さ0.5mmのシート状に形成された上で25℃にて厚み方向に40%圧縮された状態で周波数100Hzにて測定された歪み0.01〜5%の範囲における動的せん断複素弾性率は、8.0×105Pa以上であることが好ましく、1.0×106〜1.5×106Paがより好ましい。粘着性発泡体の動的せん断複素弾性率が上記範囲であると、粘着性発泡体が充分なせん断強度を有しており、優れた衝撃吸収性を有するからである。 The adhesive foam was formed into a sheet having a thickness of 0.5 mm, and was subjected to a strain of 0.01 to 5% measured at a frequency of 100 Hz in a state compressed by 40% in the thickness direction at 25 ° C. The dynamic shear complex elastic modulus in the range is preferably 8.0 × 10 5 Pa or more, and more preferably 1.0 × 10 6 to 1.5 × 10 6 Pa. This is because when the dynamic shear complex modulus of the adhesive foam is in the above range, the adhesive foam has sufficient shear strength and has excellent impact absorbability.

更に、粘着性発泡体は、厚さ0.5mmのシート状に形成された上で25℃にて厚み方向に30%圧縮された状態で周波数100Hzにて測定された歪み0.01〜5%の範囲における動的せん断複素弾性率は、6.5×105Pa以上であることが好ましく、8.0×105〜1.4×106Paがより好ましい。粘着性発泡体の動的せん断複素弾性率が上記範囲であると、粘着性発泡体が充分なせん断強度を有しており、優れた衝撃吸収性を有するからである。 Further, the adhesive foam was formed into a sheet having a thickness of 0.5 mm, and was subjected to a strain of 0.01 to 5% measured at a frequency of 100 Hz while being compressed 30% in the thickness direction at 25 ° C. The dynamic shear complex modulus in the range is preferably 6.5 × 10 5 Pa or more, and more preferably 8.0 × 10 5 to 1.4 × 10 6 Pa. This is because when the dynamic shear complex modulus of the adhesive foam is in the above range, the adhesive foam has sufficient shear strength and has excellent impact absorbability.

又、粘着性発泡体は、厚さ0.5mmのシート状に形成された上で25℃にて非圧縮状態で周波数100Hzにて測定された歪み0.01〜5%の範囲における動的せん断複素弾性率は、5.0×105Pa以上であることが好ましく、6.5×105〜1.2×106Paがより好ましい。粘着性発泡体の動的せん断複素弾性率が上記範囲であると、粘着性発泡体が充分なせん断強度を有しており、優れた衝撃吸収性を有するからである。 The adhesive foam was formed into a sheet having a thickness of 0.5 mm, and was subjected to dynamic shear in the range of 0.01 to 5% strain measured at a frequency of 100 Hz in an uncompressed state at 25 ° C. The complex elastic modulus is preferably 5.0 × 10 5 Pa or more, and more preferably 6.5 × 10 5 to 1.2 × 10 6 Pa. This is because when the dynamic shear complex modulus of the adhesive foam is in the above range, the adhesive foam has sufficient shear strength and has excellent impact absorbability.

本発明の衝撃吸収構造は、電子部品とこの電子部品を保護している保護部材との間に粘着性発泡体を含む衝撃吸収材が配設されていることから、保護部材に外力が加わって変形を生じた場合にあっても、保護部材の変形に伴う応力を衝撃吸収材が円滑に吸収して電子部品に伝達するのを概ね防止することができる。よって、本発明の衝撃吸収構造によれば、電子部品を保護部材の変形に起因した応力から確実に保護することができ、電子部品の故障や誤作動を概ね防止することができる。   In the shock absorbing structure of the present invention, since the shock absorbing material including the adhesive foam is disposed between the electronic component and the protective member protecting the electronic component, an external force is applied to the protective member. Even when deformation occurs, it is possible to generally prevent the shock absorber from smoothly absorbing and transmitting the stress accompanying the deformation of the protective member to the electronic component. Therefore, according to the shock absorbing structure of the present invention, the electronic component can be reliably protected from the stress caused by the deformation of the protective member, and the failure and malfunction of the electronic component can be generally prevented.

そして、本発明の衝撃吸収構造は、保護部材に周期的な外力が加えられて保護部材が周期的に変形を生じた場合にあっても、この保護部材の変形に起因した応力は衝撃吸収材が円滑に吸収し電子部品に伝達するのを概ね防止することができ、電子部品に接続したコネクタが外れるといった問題は殆ど発生することがない。   And even if a periodic external force is applied to the protective member and the protective member is periodically deformed, the shock absorbing structure of the present invention is free from the stress caused by the deformation of the protective member. Can be generally prevented from being smoothly absorbed and transmitted to the electronic component, and the problem that the connector connected to the electronic component is disconnected hardly occurs.

(実施例1)
水−アクリル系粘着剤エマルジョン(大日本インキ化学社製 商品名「ボンコート350」、アクリル系粘着剤成分(樹脂成分):50重量%、アクリル系粘着剤のtanδのピ−ク値:0.43、アクリル系粘着剤のガラス転移温度:−10℃)90重量部、水−ウレタン系粘着剤エマルジョン(大日本インキ化学社製 商品名「ハイドランHW−930」、ウレタン系粘着剤成分(樹脂成分):50重量%)10重量部、塩化アンモニウム系気泡剤(大日本インキ化学社製 商品名「F−1」)5重量部、エポキシ系架橋剤(大日本インキ化学社製 商品名「CR−5L」)2重量部、シリコーン系整泡剤(大日本インキ化学社製 商品名「ボンコートNBA−1」)0.5重量部及びカルボキシメチルセルロース水溶液(ダイセル化学工業社製、カルボキシメチルセルロース:4重量%)6重量部を均一に混合後に濾過して粘着剤エマルジョンを作製し、この粘着剤エマルジョンに泡立て器を用いて空気を混合して発泡させ、発泡粘着剤エマルジョンを作製した。なお、アクリル系粘着剤のtanδのピ−ク値は、水−アクリル系粘着剤エマルジョンを平滑面に塗布して乾燥させ、水分を除去した上で測定した。
Example 1
Water-acrylic adhesive emulsion (Dainippon Ink Chemical Co., Ltd., trade name “Boncoat 350”, acrylic adhesive component (resin component): 50% by weight, peak value of tan δ of acrylic adhesive: 0.43 Glass transition temperature of acrylic adhesive: -10 ° C. 90 parts by weight, water-urethane adhesive emulsion (trade name “Hydran HW-930” manufactured by Dainippon Ink & Chemicals), urethane adhesive component (resin component) : 50% by weight) 10 parts by weight, ammonium chloride foaming agent (trade name “F-1” manufactured by Dainippon Ink Chemical Co., Ltd.), epoxy crosslinker (trade name “CR-5L, manufactured by Dainippon Ink and Chemicals, Inc.) 2) parts by weight, 0.5 parts by weight of a silicone-based foam stabilizer (trade name “Boncoat NBA-1” manufactured by Dainippon Ink & Chemicals, Inc.) and an aqueous solution of carboxymethyl cellulose (manufactured by Daicel Chemical Industries, Ltd.) , Carboxymethylcellulose: 4% by weight) 6 parts by weight are uniformly mixed and then filtered to prepare a pressure-sensitive adhesive emulsion, and this pressure-sensitive adhesive emulsion is foamed by mixing with air using a whisk. did. The peak value of tan δ of the acrylic pressure-sensitive adhesive was measured after the water-acrylic pressure-sensitive adhesive emulsion was applied to a smooth surface and dried to remove moisture.

次に、一面が離型処理面とされたポリエチレンテレフタレートフィルムを用意し、このポリエチレンテレフタレートフィルムの離型処理面に上記発泡粘着剤エマルジョンを均一な厚みとなるように塗布した後、発泡粘着剤エマルジョンの水分を蒸発、除去させて、ポリエチレンテレフタレートフィルム上に厚み0.5mmのシート状の粘着性発泡体(密度:0.2g/cm3)を得た。 Next, after preparing a polyethylene terephthalate film with one surface being a release treatment surface, and applying the foamed adhesive emulsion to the release treatment surface of the polyethylene terephthalate film so as to have a uniform thickness, the foamed adhesive emulsion The water was evaporated and removed to obtain a sheet-like adhesive foam (density: 0.2 g / cm 3 ) having a thickness of 0.5 mm on a polyethylene terephthalate film.

一方、図1に示したような、外寸が縦44mm、横36mm、厚み4mmの直方体形状の液晶表示モジュール1を用意した。液晶表示モジュールの筐体11には正面に縦40mm、横32mmの液晶セルの配設部12が形成されており、この配設部12内に液晶セル13が配設されていた。そして、液晶セル13上には透明な合成樹脂からなる保護部材14が配設されていた。なお、液晶セル13は、図示しないケーブル及びコネクタを介して基板に接続されていた。   On the other hand, a rectangular parallelepiped liquid crystal display module 1 having outer dimensions of 44 mm in length, 36 mm in width, and 4 mm in thickness as shown in FIG. 1 was prepared. The housing 11 of the liquid crystal display module is provided with a liquid crystal cell arrangement portion 12 having a length of 40 mm and a width of 32 mm on the front, and the liquid crystal cell 13 is arranged in the arrangement portion 12. A protective member 14 made of a transparent synthetic resin was disposed on the liquid crystal cell 13. The liquid crystal cell 13 was connected to the substrate via a cable and a connector (not shown).

又、得られたシート状の粘着性発泡体を長方形の枠状に打ち抜いた。枠状の粘着性発泡体は、外寸が縦44mm、横36mmで且つ内寸が縦40mm、横32mmであって厚みが0.5mmであった。この枠状の粘着性発泡体2を上記液晶表示モジュール1の筐体11における正面の枠部15とこれに対向する保護部材14との間に厚みが0.25mmの圧縮状態で配設して衝撃吸収構造Aを形成した(図2参照)。   The obtained sheet-like adhesive foam was punched into a rectangular frame. The frame-like adhesive foam had an outer dimension of 44 mm in length and 36 mm in width, an inner dimension of 40 mm in length and 32 mm in width, and a thickness of 0.5 mm. The frame-like adhesive foam 2 is disposed in a compressed state with a thickness of 0.25 mm between the front frame portion 15 of the casing 11 of the liquid crystal display module 1 and the protective member 14 opposed thereto. A shock absorbing structure A was formed (see FIG. 2).

(比較例1)
シート状の粘着性発泡体の代わりに、厚みが0.5mmで且つ密度が0.4g/cm3である連続気泡ウレタン発泡シートを用いて実施例1と同様にして衝撃吸収構造を形成した。
(Comparative Example 1)
An impact absorbing structure was formed in the same manner as in Example 1 using an open-cell urethane foam sheet having a thickness of 0.5 mm and a density of 0.4 g / cm 3 instead of the sheet-like adhesive foam.

(比較例2)
シート状の粘着性発泡体の代わりに、厚みが0.5mmで且つ密度が0.15g/cm3である連続気泡ウレタン発泡シートを用いて実施例1と同様にして衝撃吸収構造を形成した。
(Comparative Example 2)
An impact absorbing structure was formed in the same manner as in Example 1 using an open-cell urethane foam sheet having a thickness of 0.5 mm and a density of 0.15 g / cm 3 instead of the sheet-like adhesive foam.

(比較例3)
シート状の粘着性発泡体の代わりに、厚みが0.5mmで且つ密度が0.1g/cm3である独立気泡ポリエチレン発泡シートを用いて実施例1と同様にして衝撃吸収構造を形成した。
(Comparative Example 3)
An impact absorbing structure was formed in the same manner as in Example 1 using a closed cell polyethylene foam sheet having a thickness of 0.5 mm and a density of 0.1 g / cm 3 instead of the sheet-like adhesive foam.

(比較例4)
シート状の粘着性発泡体の代わりに、厚みが0.5mmで且つ密度が0.05g/cm3であるエチレン−プロピレン−ジエン共重合体発泡シートを用いて実施例1と同様にして衝撃吸収構造を形成した。
(Comparative Example 4)
Impact absorption was carried out in the same manner as in Example 1 using an ethylene-propylene-diene copolymer foam sheet having a thickness of 0.5 mm and a density of 0.05 g / cm 3 instead of the sheet-like adhesive foam. A structure was formed.

得られた衝撃吸収構造の衝撃吸収性を下記の要領で測定し、その結果を表1に示した。又、実施例1で得られたシート状の粘着性発泡体、並びに、比較例で用いた連続ウレタン発泡シート、独立気泡ポリエチレン発泡シート及びエチレン−プロピレン−ジエン共重合体発泡シートについて、上述の要領で、高さ20mm及び40mmから鉄球を自由落下させた時の跳ね返り高さ及び衝撃力の最大値、厚み方向に50%、40%及び30%圧縮した状態及び非圧縮状態での動的せん断複素弾性率を測定し、その結果を表1に示した。   The impact absorbability of the obtained impact absorbing structure was measured in the following manner, and the results are shown in Table 1. In addition, the above-described procedure for the sheet-like adhesive foam obtained in Example 1, and the continuous urethane foam sheet, closed-cell polyethylene foam sheet, and ethylene-propylene-diene copolymer foam sheet used in Comparative Examples. The maximum value of the rebound height and impact force when the iron ball is freely dropped from heights of 20 mm and 40 mm, dynamic shear in a compressed state of 50%, 40% and 30% and in an uncompressed state The complex elastic modulus was measured and the result is shown in Table 1.

(衝撃吸収性)
液晶表示モジュールを用いた携帯電話を用意した。この携帯電話を高さ4mの位置からコンクリート上に自由落下させて、携帯電話の液晶表示面をコンクリート上に衝突させた。携帯電話の液晶セル及びコネクタの状況を目視にて確認した。
(Shock absorption)
A mobile phone using a liquid crystal display module was prepared. The mobile phone was dropped freely on the concrete from a height of 4 m, and the liquid crystal display surface of the mobile phone was made to collide with the concrete. The state of the liquid crystal cell and connector of the mobile phone was confirmed visually.

液晶セルについて、実施例1では液晶セルに不具合は発生しなかったが、比較例1〜4では液晶セルに割れが発生していた。コネクタの状況について、実施例1では液晶セルからコネクタの外れはなかったが、比較例1〜4ではコネクタが液晶セルから外れていた。   Regarding the liquid crystal cell, no defect occurred in the liquid crystal cell in Example 1, but cracks occurred in the liquid crystal cell in Comparative Examples 1 to 4. Regarding the state of the connector, in Example 1, the connector did not come off from the liquid crystal cell, but in Comparative Examples 1 to 4, the connector was detached from the liquid crystal cell.

Figure 2010084798
Figure 2010084798

実施例及び比較例で形成した衝撃吸収構造の分解斜視図である。It is a disassembled perspective view of the impact-absorbing structure formed in the Example and the comparative example. 実施例及び比較例で形成した衝撃吸収構造の縦断面図である。It is a longitudinal cross-sectional view of the impact-absorbing structure formed in the Example and the comparative example.

符号の説明Explanation of symbols

1 液晶表示モジュール
11 筐体
12 配設部
13 液晶セル
14 保護部材
2 粘着性発泡体
A 衝撃吸収構造
1 LCD module
11 Enclosure
12 Installation section
13 LCD cell
14 Protective member 2 Adhesive foam A Shock absorbing structure

Claims (6)

電子部品と、この電子部品を保護する保護部材との間に粘着性発泡体を含む衝撃吸収材が配設されていることを特徴とする衝撃吸収構造。 An impact absorbing structure comprising: an impact absorbing material including an adhesive foam disposed between an electronic component and a protective member that protects the electronic component. 粘着性発泡体は、tanδのピ−ク値が0.4以上であるアクリル系粘着剤を含有していることを特徴とする請求項1に記載の衝撃吸収構造。 The impact-absorbing structure according to claim 1, wherein the adhesive foam contains an acrylic adhesive having a peak value of tan δ of 0.4 or more. 粘着性発泡体は、厚さ0.5mmのシート状に形成された上で厚み5cmの鉄板上に敷設された状態で、上記粘着性発泡体の表面から垂直方向に高さ20mmの位置より上記粘着性発泡体上に直径1インチで且つ66.71gの鉄球を自由落下させた時の上記鉄球の跳ね返り高さが4mm以下であることを特徴とする請求項1又は請求項2に記載の衝撃吸収構造。 The pressure-sensitive adhesive foam is formed in a sheet shape having a thickness of 0.5 mm and is laid on an iron plate having a thickness of 5 cm. From the position of the height of 20 mm in the vertical direction from the surface of the pressure-sensitive adhesive foam, 3. The rebound height of the iron ball when the iron ball having a diameter of 1 inch and 66.71 g is freely dropped on the adhesive foam is 4 mm or less. 3. Shock absorption structure. 粘着性発泡体は、厚さ0.5mmのシート状に形成された上で厚み5cmの鉄板上に敷設された状態で、上記粘着性発泡体の表面から垂直方向に高さ20mmの位置より上記粘着性発泡体上に直径1インチで且つ66.71gの鉄球を自由落下させた時の鉄球の加速度と鉄球の重量との積で表される衝撃力の最大値が400N以下であることを特徴とする請求項1又は請求項2に記載の衝撃吸収構造。 The pressure-sensitive adhesive foam is formed in a sheet shape having a thickness of 0.5 mm and is laid on an iron plate having a thickness of 5 cm. From the position of the height of 20 mm in the vertical direction from the surface of the pressure-sensitive adhesive foam, The maximum value of the impact force expressed by the product of the acceleration of the iron ball and the weight of the iron ball when an iron ball having a diameter of 1 inch and 66.71 g is freely dropped on the adhesive foam is 400 N or less. The shock absorbing structure according to claim 1 or 2, wherein 粘着性発泡体は、厚さ0.5mmのシート状に形成された上で25℃にて厚み方向に50%圧縮された状態で周波数100Hzにて測定された動的せん断複素弾性率が歪み0.01〜5%において1.0×106Pa以上であることを特徴とする請求項1又は請求項2に記載の衝撃吸収構造。 The adhesive foam was formed into a sheet having a thickness of 0.5 mm, and the dynamic shear complex elastic modulus measured at a frequency of 100 Hz in a state compressed at 50 ° C. in the thickness direction at 25 ° C. was distorted to 0. The shock absorbing structure according to claim 1, wherein the shock absorbing structure is 1.0 × 10 6 Pa or more at 0.01 to 5%. 粘着性発泡体は、厚さ0.5mmのシート状に形成された上で25℃にて非圧縮状態で周波数100Hzにて測定された動的せん断複素弾性率が歪み0.01〜5%において5.0×105Pa以上であることを特徴とする請求項1又は請求項2に記載の衝撃吸収構造。 The adhesive foam was formed into a sheet having a thickness of 0.5 mm, and the dynamic shear complex elastic modulus measured at a frequency of 100 Hz in an uncompressed state at 25 ° C. was a strain of 0.01 to 5%. It is 5.0 * 10 < 5 > Pa or more, The shock absorption structure of Claim 1 or Claim 2 characterized by the above-mentioned.
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