JP2010082631A - Laser processing apparatus - Google Patents

Laser processing apparatus Download PDF

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JP2010082631A
JP2010082631A JP2008251342A JP2008251342A JP2010082631A JP 2010082631 A JP2010082631 A JP 2010082631A JP 2008251342 A JP2008251342 A JP 2008251342A JP 2008251342 A JP2008251342 A JP 2008251342A JP 2010082631 A JP2010082631 A JP 2010082631A
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laser
workpiece
positioning
positioning optical
pair
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JP4717916B2 (en
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Yasushi Ito
靖 伊藤
Akihiro Kubota
晃弘 久保田
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Via Mechanics Ltd
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Hitachi Via Mechanics Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser processing apparatus capable of reducing running cost without allowing a laser beam passing through a workpiece to damage a laser oscillator. <P>SOLUTION: The laser processing apparatus includes a pair of positioning optical systems 20a, 20b for positioning the laser beam 2 outputted from the laser oscillator 1 at the predetermined position on the workpiece 30. The pair of the positioning optical systems 20a, 20b are oppositely arranged, and the surface side of the workpiece 30 and the rear surface of the workpiece 30 are processed by one positioning optical system 20a and the other positioning optical system 20b, respectively. The positioning optical systems 20a, 20b are configured of scanner parts 7a, 7b and fθ lenses 8a, 8b. The fθ lenses 8a, 8b are shifted to a direction orthogonal to main axes so that a laser beam positioning area (processing area) may not be superposed in the main axis directions of the fθ lenses 8a, 8b. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、レーザ発振器から出力されたレーザを位置決めする一対の位置決め光学系を備え、ワークの表面側と裏面側を一度に加工するようにしたレーザ加工装置に関する。   The present invention relates to a laser processing apparatus including a pair of positioning optical systems for positioning a laser output from a laser oscillator, and processing a front surface side and a back surface side of a workpiece at a time.

例えば、配線パターンが表面側と裏面側に形成されたいわゆる両面プリント基板を加工するため、レーザ発振器とレーザ発振器から出力されたレーザをワーク上の所望の位置に位置決めする一対の位置決め光学系を備え、ワークである両面プリント基板を挟むようにして２つの位置決め光学系を対向させて配置させておき、ワークの表面側と裏面側を一度に加工するようにしたレーザ加工装置が知られている（特許文献１参照）。   For example, in order to process a so-called double-sided printed circuit board with wiring patterns formed on the front and back sides, a laser oscillator and a pair of positioning optical systems that position the laser output from the laser oscillator at a desired position on the workpiece are provided. In addition, there is known a laser processing apparatus in which two positioning optical systems are arranged facing each other so as to sandwich a double-sided printed circuit board that is a workpiece, and the front surface side and the back surface side of the workpiece are processed at once (Patent Document). 1).

この技術によれば、ワーク裏面の加工を行う際にワークを裏返しにする必要がなく、また、ワークの位置決めも一度行えばよいので、段取り時間を短縮でき、加工能率を向上させることができるものである。   According to this technology, it is not necessary to turn the workpiece upside down when machining the back side of the workpiece, and it is only necessary to position the workpiece once, so the setup time can be shortened and the machining efficiency can be improved. It is.

特表２００２−５２０１６３号公報Japanese translation of PCT publication No. 2002-520163

しかしながら、両面プリント基板等のワークをレーザで加工する場合、止まり穴だけでなく、貫通孔を加工する場合がある。上記従来技術の場合、ワークの表面側を加工する位置決め光学系と裏面側を加工する位置決め光学系とが同軸上に対向して配置されているため、貫通孔を加工すると、ワークを貫通した一方のレーザが他方の位置決め光学系を介して他方のレーザ発振器に戻り、他方のレーザ発振器を損傷させる場合があった。   However, when a workpiece such as a double-sided printed circuit board is processed with a laser, not only a blind hole but also a through hole may be processed. In the case of the above prior art, the positioning optical system for processing the front surface side of the workpiece and the positioning optical system for processing the back surface side are disposed so as to be coaxially opposed to each other. This laser may return to the other laser oscillator via the other positioning optical system and damage the other laser oscillator.

本発明の目的は、上記課題を解決し、ワークを貫通したレーザがレーザ発振器を損傷させることがなく、ランニングコストを低減することができるレーザ加工装置を提供することにある。   An object of the present invention is to solve the above-mentioned problems, and to provide a laser processing apparatus capable of reducing running costs without causing a laser penetrating a workpiece to damage a laser oscillator.

本発明は（例えば、図１及び図２参照）、レーザ発振器（１）から出力されたレーザを板状のワーク（３０）上の所定の位置に位置決めする一対の位置決め光学系（２０ａ，２０ｂ）を備え、前記一対の位置決め光学系（２０ａ，２０ｂ）を対向させて配置し、前記一対の位置決め光学系の一方（２０ａ）により前記ワーク（３０）の表面側を、前記一対の位置決め光学系の他方（２０ｂ）により前記ワーク（３０）の裏面側を、それぞれ加工するようにしたレーザ加工装置において、
前記各位置決め光学系（２０ａ，２０ｂ）は、前記ワーク（３０）の面に沿う第１の軸方向（Ｘ軸方向）及び前記第１の軸方向と直交し、前記ワーク（３０）の面に沿う第２の軸方向（Ｙ軸方向）にレーザを走査するスキャナ部（７ａ，７ｂ）と、前記スキャナ部（７ａ，７ｂ）を通過したレーザを集光して前記ワーク（３０）に照射するｆθレンズ（８ａ，８ｂ）と、を有し、
前記各位置決め光学系（２０ａ，２０ｂ）の前記ｆθレンズ（８ａ，８ｂ）から照射されるレーザの位置決め領域（１２ａ，１２ｂ）が前記ｆθレンズ（８ａ，８ｂ）の主軸方向に重ならないように、前記各ｆθレンズ同士（８ａ，８ｂ）を前記主軸方向と直交する方向にずらして配置した、
ことを特徴とするレーザ加工装置（１００）にある。 In the present invention (see, for example, FIGS. 1 and 2), a pair of positioning optical systems (20a, 20b) for positioning a laser output from a laser oscillator (1) at a predetermined position on a plate-like workpiece (30). The pair of positioning optical systems (20a, 20b) are arranged to face each other, and the surface side of the workpiece (30) is placed on the surface side of the workpiece (30) by one of the pair of positioning optical systems (20a). In the laser processing apparatus in which the back side of the workpiece (30) is respectively processed by the other (20b),
Each positioning optical system (20a, 20b) is orthogonal to the first axial direction (X-axis direction) and the first axial direction along the surface of the workpiece (30), and is on the surface of the workpiece (30). The scanner unit (7a, 7b) that scans the laser in the second axial direction (Y-axis direction) along the beam and the laser beam that has passed through the scanner unit (7a, 7b) are condensed and irradiated onto the workpiece (30). fθ lenses (8a, 8b),
The positioning regions (12a, 12b) of the laser irradiated from the fθ lenses (8a, 8b) of the positioning optical systems (20a, 20b) do not overlap in the main axis direction of the fθ lenses (8a, 8b). The fθ lenses (8a, 8b) are shifted in the direction perpendicular to the principal axis direction.
There exists in the laser processing apparatus (100) characterized by the above-mentioned.

また、上記レーザ加工装置（１００）において、前記ワーク（３０）の表面と裏面に対向させる一対の遮蔽板（１３ａ，１３ｂ）を備え、
一方の前記遮蔽板（１３ａ）を、他方の前記位置決め領域（１２ｂ）と対向するように前記一対の位置決め光学系の一方（２０ａ）側に配置し、他方の前記位置決め光学系（２０ｂ）より照射されて前記ワーク（３０）を貫通したレーザを遮蔽すると共に、
他方の前記遮蔽板（１３ｂ）を、一方の前記位置決め領域（１２ａ）と対向するように前記一対の位置決め光学系の他方（２０ｂ）側に配置し、一方の前記位置決め光学系（２０ａ）より照射されて前記ワーク（３０）を貫通したレーザを遮蔽する、
ことを特徴とするものである。 The laser processing apparatus (100) further includes a pair of shielding plates (13a, 13b) opposed to the front surface and the back surface of the workpiece (30).
One shielding plate (13a) is disposed on one (20a) side of the pair of positioning optical systems so as to face the other positioning region (12b), and irradiated from the other positioning optical system (20b). And shielding the laser penetrating the workpiece (30),
The other shielding plate (13b) is disposed on the other (20b) side of the pair of positioning optical systems so as to face one positioning region (12a), and is irradiated from one positioning optical system (20a). And shielding the laser penetrating the workpiece (30),
It is characterized by this.

なお、上記カッコ内の符号は、図面と対照するためのものであるが、これは、発明の理解を容易にするための便宜的なものであり、特許請求の範囲の構成に何等影響を及ぼすものではない。   In addition, although the code | symbol in the said parenthesis is for contrast with drawing, this is for convenience for making an understanding of invention easy, and has no influence on the structure of a claim. It is not a thing.

本発明によれば、レーザ発振器が破損することがなく、ランニングコストを低減することができる。   According to the present invention, the running cost can be reduced without damaging the laser oscillator.

以下、本発明を実施するための最良の形態を図面を参照しながら詳細に説明する。   Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

図１は本発明の実施の形態におけるレーザ加工装置１００の構成図であり、（ａ）は正面図、（ｂ）は要部側面図である。また、図２は図１におけるＡ−Ａ矢視図である。   1A and 1B are configuration diagrams of a laser processing apparatus 100 according to an embodiment of the present invention, in which FIG. 1A is a front view and FIG. Moreover, FIG. 2 is an AA arrow view in FIG.

図１に示すように、レーザ加工装置１００は、レーザ発振器１と、光路を切り換える音響光学素子３と、コラム４０と、を備えている。   As shown in FIG. 1, the laser processing apparatus 100 includes a laser oscillator 1, an acoustooptic device 3 that switches an optical path, and a column 40.

レーザ発振器１は、門形のコラム４０に載置されている。レーザ発振器１の光軸上には、レーザ２の光路を第１の光路４ａまたは第２の光路４ｂに切り換える音響光学素子３が配置されている。   The laser oscillator 1 is placed on a portal column 40. On the optical axis of the laser oscillator 1, an acousto-optic element 3 for switching the optical path of the laser 2 to the first optical path 4a or the second optical path 4b is disposed.

そして、レーザ加工装置１００は、プリント基板等の板状のワーク３０の表面をレーザ２で加工するために、ミラー５ａ，６ａ及び位置決め光学系２０ａを備えている。更に、レーザ加工装置１００は、ワーク３０の裏面をレーザ２で加工するために、ミラー５ｂ，６ｂ及び位置決め光学系２０ｂを備えている。これら一対の位置決め光学系２０ａ，２０ｂの内、一方の位置決め光学系２０ａは、ワーク３０の表面側に配置され、他方の位置決め光学系２０ｂは、ワーク３０の裏面側に配置される。各位置決め光学系２０ａ，２０ｂは、レーザ発振器１から出力されたレーザ２をワーク３０上の所定の位置に位置決めするものである。   The laser processing apparatus 100 includes mirrors 5a and 6a and a positioning optical system 20a in order to process the surface of a plate-like workpiece 30 such as a printed board with the laser 2. Further, the laser processing apparatus 100 includes mirrors 5b and 6b and a positioning optical system 20b in order to process the back surface of the work 30 with the laser 2. Of the pair of positioning optical systems 20 a and 20 b, one positioning optical system 20 a is disposed on the surface side of the workpiece 30, and the other positioning optical system 20 b is disposed on the back surface side of the workpiece 30. Each of the positioning optical systems 20 a and 20 b positions the laser 2 output from the laser oscillator 1 at a predetermined position on the work 30.

一方の位置決め光学系２０ａは、不図示の一対のミラーを回転自在に位置決めし、ワーク３０の表面に沿うＸ軸方向（第１の軸方向）及びＸ軸方向と直交し、ワーク３０の表面に沿うＹ軸方向（第２の軸方向）にレーザ２を走査するスキャナ部７ａと、スキャナ部７ａを通過したレーザ２を集光してワーク３０に照射するｆθレンズ８ａと、を有している。   One positioning optical system 20 a rotatably positions a pair of mirrors (not shown), is in the X-axis direction (first axis direction) along the surface of the work 30 and is orthogonal to the X-axis direction, and is on the surface of the work 30. A scanner unit 7 a that scans the laser 2 in the Y-axis direction (second axis direction) along the line and a fθ lens 8 a that focuses the laser 2 that has passed through the scanner unit 7 a and irradiates the workpiece 30. .

他方の位置決め光学系２０ｂは、不図示の一対のミラーを回転自在に位置決めし、ワーク３０の裏面に沿うＸ軸方向（第１の軸方向）及びＸ軸方向と直交し、ワーク３０の裏面に沿うＹ軸方向（第２の軸方向）にレーザ２を走査するスキャナ部７ｂと、スキャナ部７ｂを通過したレーザ２を集光してワーク３０に照射するｆθレンズ８ｂと、を有している。   The other positioning optical system 20b rotatably positions a pair of mirrors (not shown), is orthogonal to the X-axis direction (first axial direction) and the X-axis direction along the back surface of the work 30, and is on the back surface of the work 30. A scanner unit 7b that scans the laser 2 in the Y-axis direction (second axis direction) along, and an fθ lens 8b that condenses the laser 2 that has passed through the scanner unit 7b and irradiates the workpiece 30 with it. .

そして、第１の光路４ａ上には、ミラー５ａ，６ａ、スキャナ部７ａ及びｆθレンズ８ａが順次配置され、また、第２の光路４ｂ上には、ミラー５ｂ，６ｂ、スキャナ部７ｂ及びｆθレンズ８ｂが順次配置されている。   The mirrors 5a and 6a, the scanner unit 7a, and the fθ lens 8a are sequentially disposed on the first optical path 4a, and the mirrors 5b and 6b, the scanner unit 7b, and the fθ lens are disposed on the second optical path 4b. 8b are sequentially arranged.

これら一対の位置決め光学系２０ａ，２０ｂにより、ワーク３０の表裏面を加工することができる。   The front and back surfaces of the workpiece 30 can be processed by the pair of positioning optical systems 20a and 20b.

ここで、ｆθレンズ８ａとｆθレンズ８ｂの直径は同一である。また、ｆθレンズ８ａ，８ｂの直径をＤとするとき、レーザ２の位置決め領域である加工領域（走査エリア）は、直径Ｄの円に内接する正方形、すなわち、１辺の長さがＤ／√２角以下の大きさであり、通常５０ｍｍまたは３０ｍｍ角である。本実施の形態では、図１に示すように、ｆθレンズ８ａとｆθレンズ８ｂの主軸のＸ座標（第１の軸方向）は同一、Ｙ座標（第２の軸方向）はＬ（ただし、Ｌ＞Ｄ／√２）だけずれている。   Here, the diameters of the fθ lens 8a and the fθ lens 8b are the same. Further, when the diameter of the fθ lenses 8a and 8b is D, the processing area (scanning area) that is the positioning area of the laser 2 is a square inscribed in a circle with the diameter D, that is, the length of one side is D / √. The size is 2 or less and is usually 50 mm or 30 mm square. In the present embodiment, as shown in FIG. 1, the X coordinate (first axial direction) of the principal axes of the fθ lens 8a and the fθ lens 8b is the same, and the Y coordinate (second axial direction) is L (however, L > D / √2).

スキャナ部７ａ（７ｂ）は、構成が同じである２個のスキャナ７ａｘ，７ａｙ（７ｂｘ、７ｂｙ）からなり、スキャナ７ａｘ（７ｂｘ）におけるモータの出力軸の軸線とスキャナ７ａｙ（７ｂｙ）におけるモータの出力軸の軸線は、直交方向（いわゆるねじれの方向）に配置されている。そして、スキャナ７ａｘ（７ｂｘ）はプリント基板等のワーク３０上の加工領域（走査エリア）においてレーザ２をＸ軸方向に走査し、スキャナ７ａｙ（７ｂｙ）はレーザ２をＹ軸方向に走査する。   The scanner unit 7a (7b) includes two scanners 7ax, 7ay (7bx, 7by) having the same configuration, and the axis of the motor output shaft in the scanner 7ax (7bx) and the motor output in the scanner 7ay (7by). The axis of the shaft is arranged in an orthogonal direction (so-called twist direction). The scanner 7ax (7bx) scans the laser 2 in the X-axis direction in a processing region (scanning area) on the workpiece 30 such as a printed board, and the scanner 7ay (7by) scans the laser 2 in the Y-axis direction.

位置決め光学系２０ａ，２０ｂはそれぞれ加工ヘッド９ａ、９ｂに支持されている。   The positioning optical systems 20a and 20b are supported by the processing heads 9a and 9b, respectively.

加工ヘッド９ａのワーク３０と対向する側には、断面が角パイプ状のサポート１０ａが配置されている。図２に示すように、サポート１０ａの中空部１１ａの１辺の長さは、ｆθレンズ８ａの直径で定まる図２中２点鎖線で示す加工領域１２ａの１辺の長さよりも長い。サポート１０ａは中空部１１ａの軸線がｆθレンズ８ａの主軸と同軸、かつ、加工領域１２ａを包含するようにして加工ヘッド９ａに固定されている。   On the side of the machining head 9a facing the workpiece 30, a support 10a having a square pipe cross section is arranged. As shown in FIG. 2, the length of one side of the hollow portion 11a of the support 10a is longer than the length of one side of the processing region 12a indicated by a two-dot chain line in FIG. 2 determined by the diameter of the fθ lens 8a. The support 10a is fixed to the processing head 9a so that the axis of the hollow portion 11a is coaxial with the main axis of the fθ lens 8a and includes the processing region 12a.

同様に、加工ヘッド９ｂのワーク３０と対向する側には、断面が角パイプ状のサポート１０ｂが配置されている。サポート１０ｂの中空部１１ｂ（図２）の１辺の長さは、ｆθレンズ８ｂの直径で定まる図２中２点鎖線で示す加工領域１２ｂの１辺の長さよりも長い。サポート１０ｂは中空部１１ｂの軸線がｆθレンズ８ｂの主軸と同軸、かつ、加工領域１２ｂを包含するようにして加工ヘッド９ｂに固定されている。   Similarly, a support 10b having a square pipe cross section is disposed on the side of the machining head 9b facing the workpiece 30. The length of one side of the hollow portion 11b (FIG. 2) of the support 10b is longer than the length of one side of the processing region 12b indicated by a two-dot chain line in FIG. 2 determined by the diameter of the fθ lens 8b. The support 10b is fixed to the processing head 9b so that the axis of the hollow portion 11b is coaxial with the main axis of the fθ lens 8b and includes the processing region 12b.

ところで、本実施の形態では、各位置決め光学系２０ａ，２０ｂのｆθレンズ８ａ，８ｂから照射されるレーザ２の位置決め領域としての加工領域１２ａ，１２ｂがｆθレンズ８ａ，８ｂの主軸方向に重ならないように、各ｆθレンズ８ａ，８ｂ同士を主軸方向と直交する方向（Ｙ軸方向）にずらして配置している。   By the way, in the present embodiment, the processing areas 12a and 12b as the positioning areas of the laser 2 irradiated from the fθ lenses 8a and 8b of the positioning optical systems 20a and 20b do not overlap with the main axis direction of the fθ lenses 8a and 8b. Further, the fθ lenses 8a and 8b are arranged so as to be shifted in a direction (Y-axis direction) orthogonal to the main axis direction.

具体的に説明すると、位置決め光学系２０ａ，２０ｂ及びサポート１０ａ，１０ｂを支持している加工ヘッド９ａ，９ｂ同士を互いに主軸方向と直交する方向（Ｙ軸方向）にずらして配置している。   More specifically, the processing heads 9a and 9b supporting the positioning optical systems 20a and 20b and the supports 10a and 10b are shifted from each other in a direction (Y-axis direction) perpendicular to the main axis direction.

そして、本実施の形態のレーザ加工装置１００は、ワーク３０の表面と裏面に対向させる一対の平板状の遮蔽板１３ａ，１３ｂを備えている。   The laser processing apparatus 100 of the present embodiment includes a pair of flat shield plates 13a and 13b that are opposed to the front and back surfaces of the workpiece 30.

一方の位置決め光学系２０ａ側のサポート１０ａのワーク３０と対向する側には、一方の遮蔽板１３ａが配置されている。遮蔽板１３ａには貫通孔１４ａが形成されている。貫通孔１４ａの１辺の長さは一方の加工領域１２ａの１辺の長さよりも長い。つまり、遮蔽板１３ａには、加工領域１２ａよりも大きい貫通孔１４ａが形成されている。遮蔽板１３ａは、貫通孔１４ａの軸線がｆθレンズ８ａの主軸と同軸、かつ、加工領域１２ａを包含するようにしてサポート１０ａに固定されている。遮蔽板１３ａのＹ軸方向の長さは、少なくともｆθレンズ８ｂの直径で定まる図２に２点鎖線で示す加工領域１２ｂを覆う長さである。つまり、一方の遮蔽板１３ａは、他方の加工領域１２ｂと対向している。   One shielding plate 13a is disposed on the side of the support 10a on the one positioning optical system 20a side facing the work 30. A through hole 14a is formed in the shielding plate 13a. The length of one side of the through hole 14a is longer than the length of one side of one processed region 12a. That is, the shielding plate 13a is formed with a through hole 14a larger than the processing region 12a. The shielding plate 13a is fixed to the support 10a so that the axis of the through hole 14a is coaxial with the main axis of the fθ lens 8a and includes the processing region 12a. The length in the Y-axis direction of the shielding plate 13a is a length that covers the processing region 12b indicated by a two-dot chain line in FIG. 2 determined by at least the diameter of the fθ lens 8b. That is, one shielding plate 13a is opposed to the other processing region 12b.

同様に、他方の位置決め光学系２０ｂ側のサポート１０ｂのワーク３０と対向する側には、他方の遮蔽板１３ｂが配置されている。遮蔽板１３ｂには貫通孔１４ｂが形成されている。貫通孔１４ｂの１辺の長さは他方の加工領域１２ｂの１辺の長さよりも長い。つまり、遮蔽板１３ｂには、加工領域１２ｂよりも大きい貫通孔１４ｂが形成されている。遮蔽板１３ｂは、貫通孔１４ｂの軸線がｆθレンズ８ｂの主軸と同軸、かつ、加工領域１２ｂを包含するようにしてサポート１０ｂに固定されている。遮蔽板１３ｂのＹ軸方向の長さは、少なくともｆθレンズ８ａの直径で定まる加工領域１２ａを覆う長さである。つまり、他方の遮蔽板１３ｂは、一方の加工領域１２ａと対向している。   Similarly, the other shielding plate 13b is disposed on the side of the support 10b on the other positioning optical system 20b side facing the workpiece 30. A through hole 14b is formed in the shielding plate 13b. The length of one side of the through hole 14b is longer than the length of one side of the other processed region 12b. That is, the shielding plate 13b is formed with a through hole 14b larger than the processing region 12b. The shielding plate 13b is fixed to the support 10b so that the axis of the through hole 14b is coaxial with the main axis of the fθ lens 8b and includes the processing region 12b. The length of the shielding plate 13b in the Y-axis direction is a length that covers at least the processing region 12a determined by the diameter of the fθ lens 8a. That is, the other shielding plate 13b is opposed to the one processing region 12a.

ワーク３０は図示を省略するワーク支持装置に支持され、図示を省略する駆動装置により、Ｘ，Ｙ軸方向に移動自在である。   The workpiece 30 is supported by a workpiece support device (not shown), and is movable in the X and Y axis directions by a driving device (not shown).

次に、本実施の形態のレーザ加工装置１００の動作を説明する。   Next, the operation of the laser processing apparatus 100 of the present embodiment will be described.

レーザ発振器１から出力されたレーザ２は、音響光学素子３により光路を交互に変更されてミラー５ａ，６ａまたはミラー５ｂ，６ｂを介してスキャナ部７ａまたはスキャナ部７ｂに入射し、それぞれ光路をＸ，Ｙ軸方向に位置決めされ、ｆθレンズ８ａまたはｆθレンズ８ｂを透過してワーク３０に入射し、ワーク３０を加工する。なお、このレーザ加工装置は、ワーク３０の一方の面だけを加工することもできる。   The laser 2 output from the laser oscillator 1 has its optical path alternately changed by the acousto-optic device 3 and enters the scanner unit 7a or the scanner unit 7b via the mirrors 5a and 6a or the mirrors 5b and 6b. , Positioned in the Y-axis direction, passes through the fθ lens 8a or the fθ lens 8b, enters the workpiece 30, and processes the workpiece 30. In addition, this laser processing apparatus can also process only one surface of the workpiece 30.

一方の位置決め光学系２０ａのｆθレンズ８ａを透過し、さらにワーク３０を透過（貫通）したレーザ２は、他方の遮蔽板１３ｂに入射して吸収される（熱に変換される）。同様に、他方の位置決め光学系２０ｂのｆθレンズ８ｂを透過し、さらにワーク３０を透過（貫通）したレーザ２は、一方の遮蔽板１３ａに入射して吸収される（熱に変換される）。   The laser 2 transmitted through the fθ lens 8a of one positioning optical system 20a and further transmitted (penetrated) through the work 30 is incident on the other shielding plate 13b and absorbed (converted into heat). Similarly, the laser 2 transmitted through the fθ lens 8b of the other positioning optical system 20b and further transmitted (penetrated) through the work 30 is incident on one shielding plate 13a and absorbed (converted into heat).

つまり、一方の位置決め光学系２０ａのｆθレンズ８ａを透過し、さらにワーク３０を貫通したレーザ２は、他方の遮蔽板１３ｂで遮蔽され、他方の位置決め光学系２０ｂのｆθレンズ８ｂを透過し、さらにワーク３０を貫通したレーザ２は、一方の遮蔽板１３ａで遮蔽される。   That is, the laser 2 that has passed through the fθ lens 8a of one positioning optical system 20a and further penetrated the workpiece 30 is shielded by the other shielding plate 13b, passes through the fθ lens 8b of the other positioning optical system 20b, and The laser 2 penetrating the workpiece 30 is shielded by one shielding plate 13a.

このように、それぞれの加工領域１２ａ，１２ｂが主軸方向に重ならないように、２個のｆθレンズ８ａ，８ｂの主軸を当該主軸と直交する方向にずらせて配置しているので、一方のｆθレンズ８ａから照射されたレーザ２がワーク３０を貫通した際に他方のｆθレンズ８ｂを介してレーザ発振器１に戻ることはなく、他方のｆθレンズ８ｂから照射されたレーザ２がワーク３０を貫通した際に一方のｆθレンズ８ａを介してレーザ発振器１に戻ることはない。したがって、レーザ発振器１を損傷させることがなく、また、ワーク３０を裏返しにすることなくワーク３０の両面を加工できるので、ランニングコストを低減することができる。   In this way, the main axes of the two fθ lenses 8a and 8b are shifted in the direction orthogonal to the main axis so that the respective processing regions 12a and 12b do not overlap in the main axis direction. When the laser 2 irradiated from 8a passes through the workpiece 30, it does not return to the laser oscillator 1 via the other fθ lens 8b, and when the laser 2 irradiated from the other fθ lens 8b penetrates the workpiece 30. In this case, the laser oscillator 1 is not returned via the one fθ lens 8a. Therefore, since both sides of the workpiece 30 can be processed without damaging the laser oscillator 1 and without turning the workpiece 30 upside down, the running cost can be reduced.

さらに、各遮蔽板１３ａ，１３ｂでワーク３０を貫通したレーザ２が遮蔽されるので、レーザ発振器１以外の機器も損傷させることはない。   Furthermore, since the laser 2 penetrating the workpiece 30 is shielded by the shielding plates 13a and 13b, equipment other than the laser oscillator 1 is not damaged.

なお、加工領域１２ａ、１２ｂ内の加工が終了したら、ワーク３０を移動させ、次の被加工領域を加工領域１２ａ、１２ｂに一致させる。   When the machining in the machining areas 12a and 12b is completed, the workpiece 30 is moved so that the next machining area coincides with the machining areas 12a and 12b.

以上、上記実施の形態に基づいて本発明を説明したが、本発明はこれに限定されるものではない。   As mentioned above, although this invention was demonstrated based on the said embodiment, this invention is not limited to this.

上記実施の形態では、１つのレーザ発振器１を用いて各位置決め光学系２０ａ，２０ｂにレーザを振り分ける場合について説明したが、レーザ加工装置が各位置決め光学系に対応するように一対のレーザ発振器を備える場合であってもよい。   In the above-described embodiment, the case where the laser is distributed to each positioning optical system 20a, 20b using one laser oscillator 1 has been described. However, the laser processing apparatus includes a pair of laser oscillators so as to correspond to each positioning optical system. It may be the case.

また、上記実施の形態では、ｆθレンズ８ａ，８ｂの主軸をＹ軸方向にずらす場合について説明したが、Ｘ軸方向にずらすようにしてもよい。   In the above-described embodiment, the case where the main axes of the fθ lenses 8a and 8b are shifted in the Y-axis direction has been described. However, they may be shifted in the X-axis direction.

本発明の実施の形態におけるレーザ加工装置の構成図である。It is a block diagram of the laser processing apparatus in embodiment of this invention. 図１におけるＡ−Ａ矢視図である。It is an AA arrow line view in FIG.

符号の説明Explanation of symbols

１ レーザ発振器
７ａ，７ｂ スキャナ部
８ａ，８ｂ ｆθレンズ
１２ａ，１２ｂ 位置決め領域（加工領域）
１３ａ，１３ｂ 遮蔽板
２０ａ，２０ｂ 位置決め光学系
３０ ワーク
１００ レーザ加工装置 1 Laser oscillators 7a and 7b Scanner portions 8a and 8b fθ lenses 12a and 12b Positioning region (processing region)
13a, 13b Shielding plates 20a, 20b Positioning optical system 30 Workpiece 100 Laser processing apparatus

Claims (2)

レーザ発振器から出力されたレーザを板状のワーク上の所定の位置に位置決めする一対の位置決め光学系を備え、前記一対の位置決め光学系を対向させて配置し、前記一対の位置決め光学系の一方により前記ワークの表面側を、前記一対の位置決め光学系の他方により前記ワークの裏面側を、それぞれ加工するようにしたレーザ加工装置において、
前記各位置決め光学系は、前記ワークの面に沿う第１の軸方向及び前記第１の軸方向と直交し、前記ワークの面に沿う第２の軸方向にレーザを走査するスキャナ部と、前記スキャナ部を通過したレーザを集光して前記ワークに照射するｆθレンズと、を有し、
前記各位置決め光学系の前記ｆθレンズから照射されるレーザの位置決め領域が前記ｆθレンズの主軸方向に重ならないように、前記各ｆθレンズ同士を前記主軸方向と直交する方向にずらして配置した、
ことを特徴とするレーザ加工装置。 A pair of positioning optical systems for positioning a laser output from a laser oscillator at a predetermined position on a plate-like workpiece, the pair of positioning optical systems are arranged to face each other, and one of the pair of positioning optical systems In the laser processing apparatus configured to process the front side of the work, the back side of the work by the other of the pair of positioning optical systems,
Each of the positioning optical systems includes a scanner unit that scans a laser in a first axial direction along the surface of the workpiece and a first axial direction that is perpendicular to the first axial direction and along the surface of the workpiece; and An fθ lens that focuses the laser beam that has passed through the scanner unit and irradiates the workpiece,
The fθ lenses are arranged so as to be shifted in a direction orthogonal to the main axis direction so that the laser positioning region irradiated from the fθ lens of each positioning optical system does not overlap the main axis direction of the fθ lens.
The laser processing apparatus characterized by the above-mentioned. 前記ワークの表面と裏面に対向させる一対の遮蔽板を備え、
一方の前記遮蔽板を、他方の前記位置決め領域と対向するように前記一対の位置決め光学系の一方側に配置し、他方の前記位置決め光学系より照射されて前記ワークを貫通したレーザを遮蔽すると共に、
他方の前記遮蔽板を、一方の前記位置決め領域と対向するように前記一対の位置決め光学系の他方側に配置し、一方の前記位置決め光学系より照射されて前記ワークを貫通したレーザを遮蔽する、
ことを特徴とする請求項１に記載のレーザ加工装置。 A pair of shielding plates facing the front and back surfaces of the workpiece;
One of the shielding plates is disposed on one side of the pair of positioning optical systems so as to face the other positioning region, and shields the laser that is irradiated from the other positioning optical system and penetrates the workpiece. ,
The other shielding plate is disposed on the other side of the pair of positioning optical systems so as to face one of the positioning regions, and shields the laser that is irradiated from the one positioning optical system and penetrates the workpiece;
The laser processing apparatus according to claim 1.
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