JP2010081765A - A plurality of power converters arranged in row, and method of installing the power converters - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of installing a plurality of power converters arranged laterally to be almost stuck to each other (side-by-side arrangement), by which the power converters are miniaturized and the natural air cooling capability is improved. <P>SOLUTION: A power converter is constituted of: a cooling fin which dissipates heat from a power semiconductor module; a circuit board having a drive circuit driving the power semiconductor module disposed between the cooling fin and the circuit board; a casing which covers the cooling fin and has a cutout in which the power semiconductor module is inserted; a cooling fan which sends air to flow it through the cooling fin; a cover which is joined to the casing to cover the circuit board; and ventilation openings formed on the top face, both side faces, and bottom face of the cover. According to the method of installing the plurality of power converters arranged laterally to be almost stuck to each other (side-by-side arrangement), convection gaps are formed on both side faces of the power converters facing each other in the close lateral arrangement. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a power conversion device suitable for installation in which a plurality of power conversion devices are installed in a side-by-side manner (side-by-side installation) and an installation method thereof.

  Inverters, which are power conversion devices, are widely used as speed control devices for AC motors in industry. However, power semiconductors for power conversion such as IGBTs and rectifier diodes used in power converters generate a large amount of heat due to electrical loss during power conversion.

  Usually, an operating limit temperature is set for these power semiconductors, and if the power semiconductors still generate heat even if they exceed the operating limit temperature of the power semiconductor, the power semiconductors may not operate. For this reason, in a power converter, it is necessary to employ | adopt the structure which cools this power semiconductor. In other words, it is equipped with cooling fins, and either a natural air cooling system that conducts heat from the power semiconductor, which is a heating element, to the cooling fins, or a cooling fin and a cooling fan, heat conduction from the power semiconductor, which is a heating element, to the cooling fins. In general, a forced air cooling method in which heat is exchanged by a cooling fan and heat is radiated by air cooling is generally used.

  The paragraph (0019) of Patent Document 1 states that “a shielding plate 7 as a shielding member is provided between the main circuit portion 4 and the logic portion 5 so as to minimize gaps and prevent mutual air from flowing. In order to have a heat insulation effect and a magnetic shield effect on the plate 7, the main circuit side is composed of the insulating material 9 and the logic part side is composed of the iron plate 8 etc. Further, it has a heat insulating effect, whereby the main circuit unit 4 and the logic unit 5 are provided in a room independent from each other. "

Japanese Patent Laid-Open No. 9-237992

In the above prior art, in an installation method in which a plurality of power converters are installed in a side-by-side manner (side-by-side installation), it cannot be said that sufficient consideration has been given to the efficiency of the cooling action by natural air cooling, There is a problem that sufficient suppression of temperature rise and miniaturization cannot be achieved.
In other words, when the mounting density of elements on the circuit board is increased in order to reduce the size of the device, the cooling action by the cooling fan is not sufficiently obtained in the conventional technology, and the element rises due to the temperature rise inside the device. There was a possibility that the life of the product would be shortened.

Further, in the above-described conventional technology, a shielding member is provided between the main circuit unit and the logic unit so that the heat of the main circuit unit does not flow to the logic unit vulnerable to heat. In the installation method that is mounted in a side-by-side manner (side-by-side installation), there is a problem that the rated current of the power converter must be derated because a sufficient cooling effect cannot be secured.
An object of the present invention is to improve the cooling capacity by natural air cooling while reducing the size of an apparatus in an installation method in which a plurality of power converters are mounted in a substantially lateral manner (side-by-side installation).

Specific embodiments of the present invention for solving the above object are as follows.
A cooling fin, a power semiconductor module installed on the cooling fin to dissipate heat, a circuit board disposed on the opposite side of the cooling fin and the power semiconductor module, and having a drive circuit for driving the power semiconductor; A plurality of power converters that are installed side by side with a cover that joins the cooling fin and covers the circuit board; in the state where the power converters are installed side by side, the power converters have openings for ventilation on the top and bottom surfaces of the cover The cover is formed with a first opening at the top of one side and a second opening at the bottom of the other side, and air flows from the outside through the opening. A structure that circulates inside the power converter is adopted.
Furthermore, in the above aspect, protrusions are provided on both side surfaces of the cover, and when the power converters are installed side by side, the adjacent power converters are separated from each other by a predetermined distance. It is desirable that the protrusion and the protrusion on one side surface of the power conversion device disposed next to each other be joined.
As another aspect of the present invention for solving the above-mentioned object, there are a cooling fin, a power semiconductor module installed on the cooling fin to dissipate heat, and on the opposite side to the cooling fin and the power semiconductor module. In a plurality of power converters arranged side by side, provided with a circuit board having a drive circuit that is arranged and having a drive circuit that drives a power semiconductor, and a cover that joins the cooling fin and covers the circuit board, The power conversion device has a structure in which openings for ventilation are provided in the upper surface, both side surfaces, and the bottom surface of the cover, and a metal heat conduction plate is provided between the power conversion devices arranged next to each other.

  Furthermore, as another aspect of the present invention for solving the above-described object, there are a cooling fin, a power semiconductor module installed on the cooling fin and radiating heat, an opposite side to the cooling fin and the power semiconductor module. In a plurality of power converters installed side by side, the circuit board having a drive circuit that drives the power semiconductor and a cover that is joined to the cooling fin and covers the circuit board is arranged side by side The power conversion device has a structure in which openings for ventilation are provided in the top surface, both side surfaces, and the bottom surface of the cover, and a metal pipe in which a refrigerant is sealed is provided between the power conversion devices arranged adjacent to each other. To do.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to improve the cooling capability by natural air cooling, aiming at size reduction of a power converter device in the power converter device by which multiple units | sets are installed in close contact (side-by-side installation).

  Specific embodiments of the present invention will be described below with reference to FIGS.

  Hereinafter, embodiments of the present invention will be described. In addition, this embodiment is only an example for implementing this invention, and does not limit the technical scope of this invention. In addition, the same reference numerals are given to common configurations in the respective drawings.

  FIG. 1 shows a main circuit configuration diagram of a power conversion device according to the present embodiment. 1 is a forward converter that converts AC power into DC power, 2 is a smoothing capacitor in a DC intermediate circuit, 3 is an inverse converter that converts DC power into AC power of an arbitrary frequency, and 4 is an AC motor. Further, 11 is a cooling fin for cooling the power module in the forward converter and the reverse converter, and 7 is a digital operation panel which can set, change, abnormal state and monitor display of various control data of the power converter. .

  5 is a control circuit that controls the switching element of the reverse converter and controls the entire power converter. A control circuit equipped with a microcomputer (control arithmetic unit) is input from the digital operation panel 7. It is configured to perform necessary control processing according to various control data.

  The control circuit 5 controls the switching elements of the inverse converter 3 based on various control data input from the digital operation panel 7, and performs control processes necessary for the entire apparatus. Although an internal configuration is omitted, a microcomputer (control arithmetic unit) that performs an operation based on information from storage data of a storage unit in which various control data is stored is mounted. Reference numeral 8 denotes a driver circuit that drives a switching element of the inverse converter. The driver circuit 8 drives the switching element of the inverse converter 3 based on a command from the control circuit 5. In addition, the abnormality is displayed on the digital operation panel 7.

  In addition, a switching regulator circuit (DC / DC converter) is mounted in the driver circuit 8, and each DC voltage necessary for the operation of the power converter is generated by the switching transformer TR and the MOS-FET. Supply for the configuration. Reference numeral 9 denotes a power conversion device composed of a forward converter and an inverse converter. In the inverse converter 3, an IGBT is mounted as a typical switching element. Of course, this element is not limited to the IGBT, and any element having a form as a switching element may be used.

Various control data of the power conversion device can be set and changed from the operation panel 7.
The operation panel 7 is provided with a display unit capable of displaying an abnormality, and when an abnormality is detected in the power conversion device, the display is displayed on the display unit.

  The type of the operation panel 7 of the present embodiment is not particularly limited, but the digital operation panel is configured so that the operation can be performed while viewing the display on the display unit in consideration of the operability of the apparatus user. . Note that the display unit is not necessarily configured integrally with the operation panel 7, but it is desirable that the display unit be configured integrally so that an operator of the operation panel 7 can operate while viewing the display.

  Various control data of the power converter input from the operation panel 7 is stored in a storage unit (not shown). Since the inverter which is a power converter is a well-known technique, detailed description is omitted.

  FIG. 2 is a diagram for explaining the appearance of the power conversion device according to this embodiment. This is an example of a natural air cooling method in which heat from the power semiconductor module 10 that is a heating element is conducted to the cooling fins 11 and radiated by air cooling. Of course, whether to use the forced air cooling method in which the heat from the power semiconductor module is conducted to the cooling fin and radiated by the cooling fan depends on the amount of heat generated from the power semiconductor module. The driver circuit 8 drives the switching element of the inverse converter 3 based on a command from the control circuit 5.

  The power semiconductor module 10 is located between the cooling fins 11 and the circuit board 8 and is covered with a cover 12 fitted into the cooling fins 11, and both sides and a bottom surface of the cover 12 are used for ventilation. An opening 13 is provided. Although not shown, the cover 12 is naturally provided with a ventilation opening 13U through which warm air inside the apparatus flows out.

  Arrows indicate the inflow and outflow directions of air during natural convection. For the ventilation openings on the top surface, both side surfaces, and bottom surface of the cover 12 provided in the power converter, cool air is mainly sucked from the opening 13 around the device from both side surfaces and bottom surface of the cover, and the cover top surface Warm air inside the apparatus is discharged from the opening 13U. That is, the cooling system inside the power converter has a structure in which natural convection circulation is formed by a temperature difference between the outside and the inside of the power converter.

  FIG. 3 is another diagram for explaining the external appearance of the power conversion device according to this embodiment. The difference from FIG. 2 is that the power semiconductor module 10 is located between the cooling fin 11 and the circuit board 8, but the casing 14 and the circuit board 8 that cover the cooling fin 11 are the same. It is in the point comprised with the cover 15 which covers. A front cover 16 and a terminal block cover 17 are attached to the cover 15 by two screws, as shown by attachment lines C21 to C22 and C23 to C24.

  Further, the front cover 16 has a structure in which the digital operation panel 7 is attached after the blind cover 18 is attached. Ventilation openings 13 are provided on both side surfaces and the bottom surface of the cover 15, and a ventilation opening 13U through which warm air inside the apparatus flows out is provided on the upper surface of the cover 15, although not shown. It has been. Arrows indicate the inflow and outflow directions of air during natural convection.

  Also in the present embodiment, cold air is sucked from the openings 13 around the apparatus mainly from the both side surfaces and bottom surface of the cover with respect to the openings for ventilation on the top surface, both side surfaces, and the bottom surface provided in the cover 15. Warm air inside the apparatus is caused to flow out from the opening 13U on the upper surface. After all, it has a structure in which a circulation by natural convection is formed.

  FIG. 4 is another view for explaining the external appearance of the power conversion device of this embodiment. Ventilation openings 13 are provided on both side surfaces and the bottom surface of the cover 15, and although not shown, ventilation openings 13U are provided on the upper surface of the cover 15 to allow warm air inside the apparatus to flow out. This is the same as FIG. The difference is that the ventilation openings 13 provided on both side surfaces of the cover 15 do not exist at symmetrical positions.

  In FIG. 4 (a), the ventilation opening 13-L provided on the left side surface of the cover 15 is on the downstream side (upstream side of the convection) of the cover 15, and is provided on the right side surface. The opening 13-R is on the upstream side of the cover 15 (downstream side of the convection).

  The reason why the openings 13-L and 13-R for ventilation provided on both side surfaces of the cover 15 do not exist in a symmetrical position is that a plurality of power converters are substantially In the case of an installation method that is closely mounted (side-by-side installation), ventilation openings 13-L and 13- provided on both sides of the cover 15 in each power converter installed on the left and right This is to prevent cold air flowing in from R from interfering.

  The right side surface of the cover 15 of the power conversion device A when the ventilation openings 13 provided on both side surfaces of the cover 15 in each power conversion device installed on the left and right do not exist in symmetrical positions. Ventilation opening 13-R (upstream side of cover 15: downstream of convection) and ventilation opening 13-L (cover 15) provided on the left side of cover 15 of power converter B The downstream side of the convection: the upstream side of the convection does not exist at the same position.

  For this reason, all of the cold air flowing in from the ventilation opening 13-R (upstream side of the cover 15) provided on the right side surface of the cover 15 of the power converter A is only inside the casing of the power converter A. The cold air that flows in and flows from the ventilation opening 13-L (on the downstream side of the cover 15) provided on the left side surface of the cover 15 of the power converter B is only inside the casing of the power converter B. Since it can be made to flow in, circulation by natural convection is effectively formed without interference of cold air that flows in.

  In this example, the ventilation opening 13-L provided on the left side surface of the cover 15 is on the downstream side (upstream side of the convection) of the cover 15, and the ventilation opening 13 provided on the right side surface. -R has been described for the upstream side of the cover 15 (downstream of the convection), but the ventilation opening 13-L provided on the left side surface of the cover 15 is upstream of the cover 15 (convection) The target effect is the same even if the ventilation opening 13-R provided on the right side is on the downstream side (upstream side of the convection) of the cover 15.

  In FIG. 4B, the ventilation opening 13-LD provided on the left side surface of the cover 15 is the downstream side of the cover 15 (upstream side of convection), and 13-LU is the upstream side of the cover 15 (The downstream side of the convection), the ventilation opening 13-RU provided on the right side is the downstream side of the cover 15 (the upstream side of the convection), and 13-RD is the upstream side of the cover 15 (the convection side Each of the structures is provided on the downstream side.

  Even in this case, the reason why the openings 13-LD and 13-LU and 13-RD and 13-RU for ventilation provided on both side surfaces of the cover 15 are not symmetrically positioned is provided. In the case of an installation method in which a plurality of power converters are mounted in a substantially horizontal manner (side-by-side installation), ventilation provided on both sides of the cover 15 in each power converter installed on the left and right This is to prevent the cold air flowing from the openings 13-LD and 13-LU and 13-RD and 13-RU from interfering with each other.

  The effect similar to that of FIG. 4 (a) is obtained in that the structure is such that circulation by natural convection is effectively formed without interference of the inflowing cold air.

  The ventilation openings 13 provided on both side surfaces of the cover 15 interfere with the inflowing cold air in the case of an installation method in which a plurality of power converters are installed in a substantially lateral manner (side-by-side installation). The left and right asymmetrical positions are not limited, and the positions of the ventilation openings provided on the left and right are not limited to the upstream side and the downstream side.

  FIG. 5 shows a conventional example when a plurality of power converters are installed in a freestanding board. An inverter, which is a power conversion device, generally has a wall-hanging structure, is vertically attached to an iron plate such as a panel, and is required to be a device that is as small and compact as possible. Then, using a die-cast case or the like in which a cooling fin is formed on the inner surface of a box-shaped member having a side wall, a power semiconductor module is attached thereto, and a circuit device such as a drive circuit unit is mounted thereon. Therefore, the die-cast case is forcibly air-cooled to reduce the size so as to suppress the temperature rise inside the power converter.

  And since heat is normally conducted from the lower side to the upper side inside the apparatus, the higher the temperature is on the downstream side of the apparatus cooling air (the upper side of the apparatus), the higher the temperature becomes. ) The lower it is. In this sense as well, the upper part of the apparatus becomes a place for heat accumulation, and the temperature tends to increase inside the apparatus. For this reason, the cover of the inverter device 9 is provided with openings for ventilation on the top surface, both side surfaces and bottom surface of the cover, mainly sucking in cool air around the device from both side surfaces and bottom surface of the cover, and opening portions on the top surface of the cover The natural convection method is adopted so that the warm air inside the device flows out of the device so as to prevent the generation of heat accumulation as much as possible.

  In this sense, when installing a plurality of inverter devices that are power converters in a self-supporting panel, make sure that the ventilation openings on both sides of the cover of each inverter device 9 are not blocked. Is generally installed with a gap of a distance d shown in FIG. 5, and is usually described in the instruction manual so that d = 50 mm is provided.

  When a plurality of inverter devices 9 are installed with a gap of the distance d in this way, the ventilation openings on both sides of the cover of each inverter device are not blocked, so the rating of each inverter device It is possible to use it with a rating without derating current.

  FIG. 6 shows an embodiment of an installation method in which a plurality of power converters are installed in a substantially horizontal manner in a self-standing panel (side-by-side installation). The great merit of this installation method is that only 4 inverter devices can be installed inside a self-supporting panel of the same size (in the case of Fig. 5). It can be installed and stored.

  Here, the abbreviation of the substantially horizontal mounting of the plurality of units suggests a case where the gaps between the individual inverter devices 9 are not zero but are about several mm (generally, about 2 mm or less). Of course, it does not limit the method of attaching the plurality of units in close contact (gap = 0). However, in the case of horizontal and close contact mounting, the ventilation openings on both sides of the cover in each inverter device 9 are blocked, so the cold air around the device cannot be sucked in from both sides of the cover, and natural convection As a result, the warm air inside the apparatus does not flow out from the opening on the upper surface of the cover, and a heat accumulating field is generated. For this reason, it becomes necessary to derate the rated current of the inverter device 9 and the like, and there arises a problem that the individual inverter devices cannot be used with ratings.

  Derating the rated current of the inverter device specifically means that when an inverter device having a rated current of 25 (A) is mounted in close contact with each other, the rated current of the inverter device that can actually be used is 0.8X25 (A) = 20 (A) (derating 80%), meaning that only 20 (A) can be used instead of 25 (A).

Examples of the present invention made in view of the above problems will be described below.
FIG. 7 shows an embodiment of an installation method in which a plurality of power converters are installed in a substantially horizontal manner (side-by-side installation) in a self-supporting panel according to the present invention. When multiple inverters are installed in close contact with each other, the inverter device is installed so that a gap of distance d1 can be secured in each inverter device 9, so that cold air around the device can be sucked in from both sides of the cover It is. In this case, since the air sucked from the ventilation hole slits provided on both side surfaces of the cover can flow through the inside of the inverter device 9, the warm air inside the device can flow out from the opening on the upper surface of the cover. Heat accumulation can be eliminated, and smooth reflux by natural convection is performed.

  Therefore, when the inverter device 9 of the present invention is used, it is not necessary to derate the rated current of the inverter device, and the rated current 25 (A) can be fully used.

  FIG. 8 is an example of a bottom view of the structure of the power conversion device according to the present invention, which is an inverter device 9 having a structure capable of ensuring a gap of distance d1 in each inverter device described in FIG. Protrusions 21 are provided at locations avoiding the opening vent hole slits 13 provided on both side surfaces of the cover 12 of the inverter device.

  By adopting such a structure, the ventilation hole slits 13 provided on both side surfaces of the cover are not blocked, so the air sucked from the ventilation hole slits 13 provided on the both side surfaces The warm air inside the apparatus can flow out from the opening 13 on the upper surface of the cover, and the heat accumulation field is eliminated and the reflux by natural convection is performed.

  FIG. 9 shows another embodiment of the bottom view of the structure of the power conversion device according to the present invention, which is an inverter device 9 having a structure in which a gap of distance d1 can be secured in each inverter device described in FIG. Projections 22 are provided on both sides of the cooling fin 11 of the inverter device, and the air sucked from the ventilation hole slits provided on both sides of the cover flows through the inside of the inverter device 9 and opens on the upper surface of the cover. Since the warm air inside the device can be discharged from the section, there is a similar effect in that it is not necessary to derate the rated current of the inverter device.

FIG. 12 is a diagram for explaining a simulation example of the temperature distribution inside the apparatus according to the present invention. It is an example of the simulation which shows the effect of this invention at the time of the installation at which multiple power converters are installed in the independence board side by side close contact (side-by-side installation).
(A) is the case where the inverter device 9 having a structure in which the gap of the distance d1 cannot be secured is installed in each inverter device in FIG. 7, and in this installation method, the interior of the inverter device housing when d1 = 0.4 mm is shown. It is an example of temperature distribution simulation.
(B) is an embodiment according to the present invention, in which an inverter device 9 having a structure capable of ensuring a gap of distance d1 is installed in each inverter device in FIG. 7, and in this installation method, d1 = 7 mm. It is an example of temperature distribution simulation inside the inverter apparatus housing | casing in a case.

  In the case of (b) of the present invention, the temperatures of the IC, switching transformer TR, MOS-FET 24, and smoothing capacitor 2 components mounted on the upper side inside the inverter device are uniformly lowered. It can be seen that heat stagnation can be eliminated by efficient natural convection even when multiple power converters are installed in a side-by-side installation (side-by-side installation).

  Although this is a correlation with the temperature rise inside the apparatus, this is a simulation example when the gap d1 is 7 mm, and the dimension of the gap d1 is not limited. Naturally, if the gap d1 is narrowed, the effect of reducing the maximum temperature inside each inverter device will be reduced, but the temperature margin inside each inverter device when multiple units are installed in close contact with each other or when multiple units are installed in close contact with a freestanding board What is necessary is just to judge comprehensively by a dimension margin.

  FIG. 13 is a diagram for explaining quantitative numerical values in a temperature distribution simulation example inside the apparatus according to the present invention. The maximum temperature inside the inverter device according to the present invention is about 7 ° C. (−10%) when comparing the case where the gap d1 between the inverter devices is 7 mm and the case where the gap d1 is 0.4 mm (horizontal close contact). It was found that it can be reduced.

  Unlike the forced air cooling method, which can quantify the wind speed and air volume, it is not easy to reduce the temperature inside the equipment housing by 10 ° C by natural convection, which cannot quantify the air speed and air volume. In this sense, the effect of the present invention is significant. I understand. In order to reduce the size of the device, it is necessary to increase the mounting density of elements on the circuit board, but this tends to increase the temperature inside the device.

  Therefore, in the present embodiment, a structure in which a gap of distance d1 can be secured in each inverter device 9 even in the installation in which a plurality of power converters are installed in a side-by-side manner (side-by-side installation) in a self-supporting panel. By using the inverter device described above, it is possible to suppress the occurrence of heat stagnation inside each inverter device 9. For this reason, it is possible to improve the cooling capacity while reducing the size of the power conversion device, and to use the individual inverter devices 9 with rated power.

  As described above, according to the present embodiment, in an apparatus that can supply AC power of variable voltage and variable frequency to an AC motor, a plurality of power converters are installed in a side-by-side manner (side-by-side). Also in the installation that is installed on the side, it is possible to provide a power conversion device that sufficiently obtains a cooling action and can be miniaturized sufficiently without causing a rise in temperature.

Example 2 will be described with reference to the drawings.
FIG. 10 shows another embodiment of the installation method in which a plurality of power converters are installed in a substantially horizontal manner in a self-standing panel (side-by-side installation). As described above, the problem of how to improve the cooling efficiency for the power converter is very important from the viewpoint of reliability. Since this determines how much the device can be made smaller, it eventually leads to the solution of the problem of downsizing the device.

  For this reason, in this embodiment as well, a ventilation hole is provided in the cover of the power conversion device so that air circulates inside. However, when air from the outside enters, dust, dust, etc. are also inside the device. There is a possibility of inflow. In particular, since the power conversion device may be installed in a poor environment, there is a case where dust or the like mixed inside cannot be ignored. It is necessary to prevent the occurrence of electrical shorts and other failures due to mixed dust from the viewpoint of reliability, but this problem is to install ventilation openings necessary for cooling the above-mentioned devices. This is a conflicting issue.

Therefore, in this embodiment, a metal heat conduction plate having a high heat transfer coefficient is provided between the opposite side surfaces of the power conversion device that is mounted in close contact with each other, and the power conversion device is provided on the metal heat conduction plate. Conducts heat inside and discharges it to the top with cold air. This metal thermoelectric plate plays a role not only in cooling the power conversion device but also in preventing dust or the like, which is the above-mentioned problem, from being mixed with air.
As a result, not only the cooling efficiency of the power conversion device can be improved, but also problems such as a failure caused by dust and the like can be prevented and reliability can be improved.

  Although the metal heat conduction plate is arranged in accordance with the bottom surface of each inverter device, it is arranged so as to protrude from the top surface and bottom surface of each inverter device even if it is arranged in conformity with the top surface of each inverter device. May be.

  In addition, although the metal heat conduction plates are not arranged on the left side and the right side in the inverter devices located on both sides in the freestanding board, the metal heat conduction plates are also arranged on the left side and the right side, respectively. Of course it is good. The present embodiment describes the point of installing a metal heat conduction plate having a high heat transfer coefficient, and is not limited to the dimensions of the inverter device and the metal heat conduction plate.

  FIG. 11 shows another embodiment 2 of the installation method in which a plurality of power converters are installed in a substantially horizontal manner in a self-standing panel (side-by-side installation). Instead of the metal heat conduction plate, a metal pipe filled with a gas having a higher heat transfer coefficient is provided between the opposite side surfaces of the power converter. In the above description, the metal heat conduction plate or the metal pipe is described as an example. However, the metal heat conduction plate or the metal pipe is not limited to metal, and any material having good heat conduction can be substituted.

An example of the main circuit block diagram of the power converter device in this invention. The figure explaining the external appearance of the power converter device in this invention. The other figure explaining the external appearance of the power converter device in this invention. FIG. 6 is still another view illustrating the appearance of the power conversion device according to the present invention. Conventional example when multiple power converters are installed in a freestanding panel. An embodiment of an installation method in which a plurality of power converters are mounted in a substantially self-supporting manner in a side-by-side manner. FIG. 4 is an example of an installation method in which a plurality of power converters are installed in a side-by-side manner (side-by-side installation) in a self-supporting panel according to the present invention. An example of the bottom view of the structure of the power converter in the present invention. The other Example of the structure bottom view of the power converter device in this invention. Another embodiment 1 of an installation method in which a plurality of power converters are mounted in a substantially self-standing manner in a side-by-side manner (side-by-side installation). Another embodiment 2 of the installation method in which a plurality of power converters are mounted in a substantially self-standing manner in a side-by-side manner (side-by-side installation). The figure explaining the temperature distribution simulation example inside the apparatus in this invention. The figure which shows the quantitative result of the temperature distribution simulation example inside the apparatus in this invention.

Explanation of symbols

1 ... Forward converter, 2 ... Smoothing capacitor, 3 ... Inverter, 4 ... AC motor, 5 ... Control circuit, 6 ... Metal pipe, 7 ... Digital operation panel, 8 ... Drive circuit, 9 ... Power converter ( Inverter device), 10 ... power semiconductor module, 11 ... cooling fin, 12 ... body cover (cover), 13 ... opening for ventilation, 13-R ... opening for ventilation on the right side of the cover, 13-L ... left side of the cover Ventilation opening on the surface, 13U ... Ventilation opening on the upper surface of the cover, 14 ... Body case (casing), 15 ... Body cover (cover), 16 ... Surface cover, 17 ... Terminal block cover, 18 ... Blind cover, 19 ... Wire drawing plate, TM1 ... Control circuit terminal block, TM2 ... Main circuit terminal block, 20 ... Free standing board, 21 ... Protrusion provided on the cover, 22 ... Protrusion provided on the cooling fin, 23 ... Metal heat conduction Plate, TR ... switching transformer, 24 ... MOS-FET.

Claims (8)

Cooling fins,
A power semiconductor module that is installed in the cooling fins to dissipate heat;
A circuit board disposed on the opposite side of the cooling fin and the power semiconductor module and having a drive circuit for driving the power semiconductor;
In a plurality of power converters installed side by side with a cover that covers the circuit board by joining with the cooling fins,
In the state of being installed side by side, the power converter is provided with openings for ventilation on the top and bottom surfaces of the cover,
The cover is formed with a first opening at the upper part of one side and a second opening at the lower part of the other side, and air flows from the outside through the opening and the inside of the power converter A plurality of power conversion devices characterized by circulating the power.   In Claim 1, the both sides | surfaces of the said cover are equipped with the protrusion, and when the power converters are installed side by side, the adjacent power converters are separated from the protrusions on one side by a predetermined distance. A plurality of power conversion devices, wherein the projections on one side surface of the power conversion device arranged on the side are joined. Cooling fins,
A power semiconductor module that is installed in the cooling fins to dissipate heat;
A circuit board disposed on the opposite side of the cooling fin and the power semiconductor module and having a drive circuit for driving the power semiconductor;
In a plurality of power converters installed side by side with a cover that covers the circuit board by joining with the cooling fins,
In the state of being installed side by side, the power conversion device is provided with openings for ventilation on the upper surface, both side surfaces, and the bottom surface of the cover,
A plurality of power converters, wherein a metal heat conduction plate is provided between the power converters arranged adjacent to each other. Cooling fins,
A power semiconductor module that is installed in the cooling fins to dissipate heat;
A circuit board disposed on the opposite side of the cooling fin and the power semiconductor module and having a drive circuit for driving the power semiconductor;
In a plurality of power converters installed side by side with a cover that covers the circuit board by joining with the cooling fins,
In the state of being installed side by side, the power conversion device is provided with openings for ventilation on the upper surface, both side surfaces, and the bottom surface of the cover,
A plurality of power converters, wherein a metal pipe in which a refrigerant is sealed is provided between the power converters arranged adjacent to each other. Cooling fins,
A power semiconductor module that is installed in the cooling fins to dissipate heat;
A circuit board disposed on the opposite side of the cooling fin and the power semiconductor module and having a drive circuit for driving the power semiconductor;
In the installation method of the power converter, the power converter provided with a cover that joins the cooling fin and covers the circuit board is arranged side by side.
In the state of being installed side by side, the power converter is provided with openings for ventilation on the top and bottom surfaces of the cover,
The cover is formed with a first opening at the upper part of one side and a second opening at the lower part of the other side, and air flows from the outside through the opening and the inside of the power converter A method for installing a power conversion device characterized by circulating the power.   6. The projection according to claim 5, wherein protrusions are provided on both side surfaces of the cover, and when the power converters are installed side by side, the adjacent power converters are separated from each other by a predetermined distance. A method for installing a power converter, wherein a protrusion on one side surface of the power converter arranged in the joint is joined. Cooling fins,
A power semiconductor module that is installed in the cooling fins to dissipate heat;
A circuit board disposed on the opposite side of the cooling fin and the power semiconductor module and having a drive circuit for driving the power semiconductor;
In the installation method of the power converter, the power converter provided with a cover that joins the cooling fin and covers the circuit board is arranged side by side.
In the state of being installed side by side, the power conversion device is provided with openings for ventilation on the upper surface, both side surfaces, and the bottom surface of the cover,
A method for installing a power converter, comprising: providing a metal heat conduction plate between the power converters disposed adjacent to each other. Cooling fins,
A power semiconductor module that is installed in the cooling fins to dissipate heat;
A circuit board disposed on the opposite side of the cooling fin and the power semiconductor module and having a drive circuit for driving the power semiconductor;
In a plurality of power converters installed side by side with a cover that covers the circuit board by joining with the cooling fins,
In the state of being installed side by side, the power conversion device is provided with openings for ventilation on the upper surface, both side surfaces, and the bottom surface of the cover,
A method of installing a power converter, comprising: providing a metal pipe in which a refrigerant is sealed between the power converters arranged adjacent to each other.

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