JP2010080616A - High-frequency component, and method and apparatus for processing the same - Google Patents

High-frequency component, and method and apparatus for processing the same Download PDF

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Publication number
JP2010080616A
JP2010080616A JP2008246174A JP2008246174A JP2010080616A JP 2010080616 A JP2010080616 A JP 2010080616A JP 2008246174 A JP2008246174 A JP 2008246174A JP 2008246174 A JP2008246174 A JP 2008246174A JP 2010080616 A JP2010080616 A JP 2010080616A
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frequency component
masking jig
lead wire
abrasive
hole
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Ryota Suzuki
亮太 鈴木
Masahiro Tanabe
正宏 田邊
Yusuke Yamashita
雄介 山下
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Toshiba Corp
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Toshiba Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for processing a high-frequency component at low cost without applying thermal stress because the high-frequency component is not heat-treatment and also provide a high-frequency component manufactured with the same processing method and apparatus. <P>SOLUTION: The processing method of high-frequency component includes the steps of engaging the high-frequency component with a component fixing jig provided with a recess in the shape of the high-frequency component including a gold-plated lead wire, setting a masking jig, which is provided with a through-hole at the location of lead wire of the high-frequency component engaged in the above step, to the high-frequency component, and blowing a polishing agent to the through-hole of the masking jig from a polishing agent blowing nozzle that can be moved in parallel to the front surface of the masking jig. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、金メッキされたリード線を有する高周波部品の加工方法に関する。   The present invention relates to a method for processing a high-frequency component having a gold-plated lead wire.

一般に、高周波部品はセラミックパッケージの凹形状の内部にＭＭＩＣ等の半導体部品およびこれらを接続する基板等を実装した後、シールカバーを取り付けるハーメチック構造を有しており、組み立てる際に金ボンディングおよびロウ付けが必要である。それゆえ、高周波部品のメタライズ部分には、通常、厚さ約１．０μｍ以上の金メッキが施される。   In general, high-frequency components have a hermetic structure in which a semiconductor cover such as an MMIC and a substrate for connecting these components are mounted inside a concave shape of a ceramic package, and then a seal cover is attached. During assembly, gold bonding and brazing are performed. is required. Therefore, the metallized portion of the high-frequency component is usually subjected to gold plating having a thickness of about 1.0 μm or more.

しかし、このような構造の高周波部品を基板上に実装するに際して、そのまま半田接合を行うと、半田接合部分に施された金メッキ中の金成分が半田の中に拡散し、接合強度が著しく低下してしまう。   However, if solder bonding is performed as it is when mounting a high-frequency component having such a structure on a substrate, the gold component in the gold plating applied to the solder bonding portion diffuses into the solder, and the bonding strength is significantly reduced. End up.

そこで、このような半田接合部分における脆化を避けるために、従来は表面実装電子部品の実装工程の前に、半田接合を行う部分に予備半田を施す（例えば特許文献１参照）。そして、その後その半田を除去することにより金メッキを除去していた。   Therefore, in order to avoid embrittlement at the solder joint portion, conventionally, preliminary solder is applied to the portion to be soldered before the surface mounting electronic component mounting step (see, for example, Patent Document 1). Then, the gold plating is removed by removing the solder.

しかし、このような方法では、半田接合部分の予備半田の半田付け及びその半田の除去という、２つの工程が必要となり、高周波部品の実装コストの上昇を招いていた。また、この予備半田を行うときには、高周波部品を加熱することになるので、これが熱ストレスとなり、高周波電子部品の故障率を増加させていた。更に、半田の濡れ性により、高周波電子部品のメタライズ部分の一部について、選択的に予備半田を行うことが、困難であるという問題もあった。
特開平８−１６７７７２号公報 However, such a method requires two steps of soldering and removing the pre-solder at the solder joint portion, resulting in an increase in the mounting cost of the high-frequency component. Further, when this preliminary soldering is performed, the high-frequency component is heated, and this becomes a thermal stress, which increases the failure rate of the high-frequency electronic component. Furthermore, due to the wettability of the solder, it is difficult to selectively perform preliminary soldering on a part of the metallized portion of the high-frequency electronic component.
JP-A-8-167772

本発明は、上述のような、高周波部品の実装コストの増加や、故障率の増加など従来の高周波部品の問題点に鑑みてなされたもので、高周波部品を加熱しないので熱ストレスを加えることなく低コストで高周波部品を加工する加工方法、その加工装置及びその方法により製造される高周波部品を提供することを目的とする。   The present invention has been made in view of the problems of conventional high-frequency components such as an increase in the mounting cost of high-frequency components and an increase in failure rate, as described above, and does not heat the high-frequency components without applying thermal stress. It is an object of the present invention to provide a processing method, a processing apparatus for processing a high-frequency component at a low cost, and a high-frequency component manufactured by the method.

本発明の請求項１によれば、金メッキされたリード線を有する高周波部品の型状に凹部を設けられた部品固定冶具に前記高周波部品を嵌め込むステップと、このステップにより嵌め込まれた前記高周波部品の前記リード線の位置に貫通孔を設けられたマスキング冶具を前記高周波部品に当接するステップと、このマスキング冶具の表面に平行に移動可能である研磨剤吹き付けノズルにより前記マスキング冶具の前記貫通孔に研磨剤を吹き付けるステップと、を有することを特徴とする、高周波部品の加工方法を提供する。   According to claim 1 of the present invention, the step of fitting the high-frequency component into a component fixing jig provided with a concave portion in the shape of a high-frequency component having a gold-plated lead wire, and the high-frequency component fitted by this step A step of contacting a masking jig provided with a through hole at the position of the lead wire to the high-frequency component, and an abrasive spray nozzle that is movable parallel to the surface of the masking jig to the through hole of the masking jig. And a step of spraying an abrasive. A method for processing a high-frequency component is provided.

本発明によれば、高周波部品を加熱しないので熱ストレスを加えることなく低コストで高周波部品を加工する加工方法、その加工装置及びその方法により製造される高周波部品が得られる効果がある。   According to the present invention, since the high frequency component is not heated, there is an effect that the high frequency component manufactured by the processing method, the processing apparatus, and the method for processing the high frequency component at low cost without applying thermal stress can be obtained.

以下、本発明の実施形態について図面を用いて説明する。図１は本発明一実施形態の加工方法を示す図である。高周波部品１１は、電子回路が内蔵されている部品本体１１ａと、それらの回路に接続され外部に導き出され、金メッキされたリード線１１ｂから成っている。リード線１１ｂ上の金メッキは、通常、１μｍ以上１０μｍ以下程度の厚さを有する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a processing method according to an embodiment of the present invention. The high-frequency component 11 includes a component main body 11a in which an electronic circuit is built, and lead wires 11b that are connected to those circuits and led to the outside and plated with gold. The gold plating on the lead wire 11b usually has a thickness of about 1 μm to 10 μm.

部品本体１１ａの裏面の一部１１ｃは金メッキでメタライズされており地導体として機能する。 A part 11c on the back surface of the component main body 11a is metallized by gold plating and functions as a ground conductor.

この実施形態の高周波部品の加工方法は、上記高周波部品１１の型状に合わせて凹形状になるように製造された部品固定用冶具１３と、マスキング冶具１４とを用いる。マスキング冶具１４は、例えばステンレス合金でできた厚さ１００μｍ以下のメタルマスクである。   The high-frequency component processing method of this embodiment uses a component fixing jig 13 and a masking jig 14 that are manufactured to have a concave shape in accordance with the shape of the high-frequency component 11. The masking jig 14 is a metal mask made of, for example, a stainless alloy and having a thickness of 100 μm or less.

マスキング冶具１４は、部品固定用冶具１３に上記高周波部品１１を嵌め込んだとき高周波部品１１に当接され、高周波部品１１のメタライズされた部分のうち、半田接合するリード線に対応する位置に、各々貫通孔１５を有する。   The masking jig 14 is brought into contact with the high-frequency component 11 when the high-frequency component 11 is fitted into the component fixing jig 13, and the metallized portion of the high-frequency component 11 is positioned at a position corresponding to the lead wire to be soldered. Each has a through hole 15.

これらの貫通孔１５に向けて、研磨剤吹き付けノズル１６が上下左右移動可能に設けられており、この研磨剤吹き付けノズル１６から微細研磨剤１７を吐出可能な構造を有している。研磨剤吹き付けノズル１６には、圧縮空気が封入された圧縮空気ボンベ１８と、微細研磨剤１７が入れられた容器１９が接続されており、圧縮空気ボンベ１８内の圧縮空気をノズル１６に導く過程で微細研磨剤１７も研磨剤吹き付けノズル１６に導かれる。なお、微細研磨剤１７は例えば１０μｍ以下の金属製の粒子である。   An abrasive spray nozzle 16 is provided so as to be movable up and down and left and right toward the through holes 15, and has a structure capable of discharging a fine abrasive 17 from the abrasive spray nozzle 16. The abrasive spray nozzle 16 is connected to a compressed air cylinder 18 filled with compressed air and a container 19 containing a fine abrasive 17, and the process of guiding the compressed air in the compressed air cylinder 18 to the nozzle 16. Thus, the fine abrasive 17 is also guided to the abrasive spray nozzle 16. The fine abrasive 17 is, for example, metal particles having a size of 10 μm or less.

次の本発明のこの実施形態の動作を説明する。まず、リード線１１ｂが部品固定用冶具１３の凹部に嵌るように、高周波部品１１を部品固定用冶具１３に嵌め込む。次に、貫通孔１５が高周波部品１１のリード線１１ｂに当たる位置関係で、マスキング冶具１４を高周波部品１１及び部品固定用冶具１３に当接し、固定する。   The operation of this embodiment of the invention will now be described. First, the high-frequency component 11 is fitted into the component fixing jig 13 so that the lead wire 11 b fits into the recess of the component fixing jig 13. Next, the masking jig 14 is brought into contact with and fixed to the high frequency component 11 and the component fixing jig 13 in a positional relationship where the through hole 15 hits the lead wire 11 b of the high frequency component 11.

そして、研磨剤吹き付けノズル１６をマスキング冶具１４から一定の距離離して、このマスキング冶具１４の面と平行に上下左右方向に移動させる。研磨剤吹き付けノズル１６がマスキング冶具１４の貫通孔１５に向けられた位置において、圧縮空気ボンベ１８から圧縮空気を導き、微細研磨剤１７の含まれた圧縮空気を吐出させる。   Then, the abrasive spray nozzle 16 is moved away from the masking jig 14 by a certain distance and moved in the vertical and horizontal directions parallel to the surface of the masking jig 14. At a position where the abrasive spray nozzle 16 is directed to the through hole 15 of the masking jig 14, the compressed air is guided from the compressed air cylinder 18, and the compressed air containing the fine abrasive 17 is discharged.

研磨剤吹き付けノズル１６により、マスキング冶具１４のすべての貫通孔１５に、微細研磨剤１７を含む圧縮空気の吹き付けが終了すれば高周波部品１１のすべてのリード線１１ｂの金メッキの除去がなされたことになる。   When the blowing of the compressed air containing the fine abrasive 17 is finished to all the through holes 15 of the masking jig 14 by the abrasive blowing nozzle 16, the gold plating of all the lead wires 11b of the high-frequency component 11 has been removed. Become.

マスキング冶具１４と研磨剤吹き付けノズル１６の距離、研磨剤吹き付けノズル１６の移動速度、微細研磨剤の流速、微細研磨剤の種類は適宜選択する。   The distance between the masking jig 14 and the abrasive spray nozzle 16, the moving speed of the abrasive spray nozzle 16, the flow rate of the fine abrasive, and the type of the fine abrasive are appropriately selected.

上記実施形態によれば、高周波部品１１のリード線の片面の金メッキを微細研磨剤１７の吹き付けにより除去することができる。   According to the embodiment, the gold plating on one side of the lead wire of the high-frequency component 11 can be removed by spraying the fine abrasive 17.

上記実施形態では、高周波部品１１のリード線１１ｂにのみ微細研磨剤１７を吹きつけて、金メッキを除去していた。しかし、高周波部品１１の裏面１１ｃのメタライズされている部分の金メッキも同時に除去することが可能である。   In the above embodiment, the fine abrasive 17 is sprayed only on the lead wire 11b of the high-frequency component 11 to remove the gold plating. However, the gold plating on the metallized portion of the back surface 11c of the high-frequency component 11 can be removed at the same time.

図２はこの種の実施形態であり、マスキング冶具２４は、高周波部品１１のメタライズされている裏面１１ｃに対応する部分にも、この部分の大きさの貫通孔２１を有する。   FIG. 2 shows an embodiment of this type, and the masking jig 24 also has a through-hole 21 having the size of this portion in a portion corresponding to the metallized back surface 11 c of the high-frequency component 11.

したがって、この実施形態ではこのマスキング冶具２４を用いる。すなわち、高周波部品１１を部品固定用冶具１３にはめ込む。マスキング冶具２４の貫通孔１５が高周波部品１１のリード線１１ｂに、また貫通孔２１が高周波部品１１の裏面１１ｃに当接するように、高周波部品１１の上にマスキング冶具２４を固定する。   Therefore, this masking jig 24 is used in this embodiment. That is, the high-frequency component 11 is fitted into the component fixing jig 13. The masking jig 24 is fixed on the high frequency component 11 so that the through hole 15 of the masking jig 24 contacts the lead wire 11b of the high frequency component 11 and the through hole 21 contacts the back surface 11c of the high frequency component 11.

この状態で、圧縮空気ボンベ１８に入っている圧縮空気を及び容器１９に入っている微細研磨剤１７を研磨剤吹き付けノズル１６からマスキング冶具２４に向けて吹き付ける。これにより、上記実施形態と同様に高周波部品１１のリード線１１ｂの金メッキを除去するとともに、高周波部品１１の裏面１１ｃのメタライズ部分の金メッキも除去することができる。なお、研磨剤は微細研磨剤に限られない。   In this state, the compressed air contained in the compressed air cylinder 18 and the fine abrasive 17 contained in the container 19 are sprayed from the abrasive spray nozzle 16 toward the masking jig 24. As a result, the gold plating on the lead wire 11b of the high-frequency component 11 can be removed and the gold plating on the metallized portion of the back surface 11c of the high-frequency component 11 can be removed as in the above embodiment. The abrasive is not limited to a fine abrasive.

本発明は上記実施形態に限られず種々変形して実施可能であり本発明の技術思想の範囲で本発明に含まれる。   The present invention is not limited to the above-described embodiment and can be implemented with various modifications, and is included in the scope of the technical idea of the present invention.

本発明一実施形態の高周波部品の加工方法を説明するための図。The figure for demonstrating the processing method of the high frequency component of one Embodiment of this invention. 本発明の他の実施形態の高周波部品の加工方法を説明するための図。The figure for demonstrating the processing method of the high frequency component of other embodiment of this invention.

符号の説明Explanation of symbols

１１・・・高周波部品、
１１ａ・・・部品本体、
１１ｂ・・・リード線、
１３・・・部品固定用冶具、
１４，２４・・・マスキング冶具、
１５，２１・・・貫通孔、
１６・・・研磨剤吹き付けノズル、
１７・・・微細研磨剤、
１８・・・圧縮空気ボンベ、
１９・・・容器。 11 ... high frequency components,
11a... Part main body,
11b ... Lead wire,
13 ... Jig for fixing parts,
14, 24 ... Masking jig,
15, 21 ... through-hole,
16 ... abrasive spray nozzle,
17 ... Fine abrasive,
18 ... compressed air cylinder,
19: Container.

Claims (3)

金メッキされたリード線を有する高周波部品の型状に凹部を設けられた部品固定冶具に前記高周波部品を嵌め込むステップと、
このステップにより嵌め込まれた前記高周波部品の前記リード線の位置に貫通孔を設けられたマスキング冶具を前記高周波部品に当接するステップと、
このマスキング冶具の表面に平行に移動可能である研磨剤吹き付けノズルにより前記マスキング冶具の前記貫通孔に研磨剤を吹き付けるステップと、
を有することを特徴とする、高周波部品の加工方法。 Fitting the high frequency component into a component fixing jig provided with a recess in the shape of a high frequency component having a gold-plated lead wire; and
Contacting the high-frequency component with a masking jig provided with a through hole at the position of the lead wire of the high-frequency component fitted in this step;
Spraying an abrasive on the through hole of the masking jig by an abrasive blowing nozzle movable parallel to the surface of the masking jig;
A method for processing a high-frequency component, comprising: 金メッキされたリード線を有する高周波部品の型状に凹部を設けられた部品固定冶具と、
この部品固定冶具に嵌め込まれた前記高周波部品の前記リード線の位置に貫通孔を設けられ、前記高周波部品に当接されるマスキング冶具と、
このマスキング冶具の表面に平行に移動可能であって、前記マスキング冶具の前記貫通孔に研磨剤を吹き付ける研磨剤吹き付けノズルと、
を有することを特徴とする、高周波部品の加工装置。 A component fixing jig provided with a recess in the shape of a high-frequency component having a gold-plated lead wire,
A masking jig provided with a through hole at the position of the lead wire of the high-frequency component fitted in the component fixing jig, and in contact with the high-frequency component;
An abrasive spray nozzle that is movable parallel to the surface of the masking jig and sprays an abrasive onto the through-hole of the masking jig;
An apparatus for processing a high-frequency component, comprising: 金メッキされたリード線の前記メッキを除去される高周波部品であって、
所定の型状に凹部を設けられた部品固定冶具に嵌め込まれた後、前記リード線の位置に貫通孔を設けられたマスキング冶具を当接され、
このマスキング冶具の表面に平行に移動可能である研磨剤吹き付けノズルにより前記マスキング冶具の前記貫通孔に研磨剤を吹き付けることにより前記金メッキを除去されることを特徴とする、高周波部品。 A high-frequency component from which the plating of the gold-plated lead wire is removed,
After being fitted into a component fixing jig provided with a recess in a predetermined shape, a masking jig provided with a through hole at the position of the lead wire is contacted,
A high-frequency component, wherein the gold plating is removed by spraying an abrasive to the through hole of the masking jig by an abrasive blowing nozzle that is movable in parallel to the surface of the masking jig.
JP2008246174A 2008-09-25 2008-09-25 High-frequency component, and method and apparatus for processing the same Abandoned JP2010080616A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10135259A (en) * 1996-11-01 1998-05-22 Makoo Kk Method of forming leads of ic
JPH10256450A (en) * 1997-03-12 1998-09-25 Mitsubishi Electric Corp Device and method for machining lead frame
JP2003234442A (en) * 2002-02-06 2003-08-22 Hitachi Ltd Semiconductor device and method of manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10135259A (en) * 1996-11-01 1998-05-22 Makoo Kk Method of forming leads of ic
JPH10256450A (en) * 1997-03-12 1998-09-25 Mitsubishi Electric Corp Device and method for machining lead frame
JP2003234442A (en) * 2002-02-06 2003-08-22 Hitachi Ltd Semiconductor device and method of manufacturing the same

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