JP2010074722A - Heat dissipation structure of imaging device, and camera - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an imaging device for efficiently dissipating the heat of the imaging device mounted in a camera shake correction unit without applying a load to an actuator of the camera shake correction unit as possible, and to provide a camera. <P>SOLUTION: The heat dissipation structure of the imaging device includes: a metallic mounting plate 6 for mounting an imaging device (image sensor 5) to a camera shake correction unit 2; a metallic heat dissipation member 7 provided near the camera shake correction unit 2; and heat-conductive flexible members 8a-8d connecting the mounting plate 6 and the heat dissipation member 7. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a heat dissipation structure for an image sensor, and more particularly to a heat dissipation structure for an image sensor and a camera when camera shake correction is performed by a sensor shift method.

  In recent digital cameras, the amount of image data has become large with the increase in the number of pixels of an image sensor (image sensor) to be mounted. In order to further improve the image processing speed, high-speed data transfer from the image sensor is required. As a result, the temperature rise of the sensor itself tends to increase rapidly, and a structure for radiating heat from the sensor unit is required.

  In addition, with the increase in the number of pixels in an image sensor, the need for camera shake correction is increasing. One of the optical image stabilization methods is a sensor shift method. In this sensor shift method, when a camera shake occurs, the image sensor is moved (swinged) in a direction perpendicular to the optical axis of the lens in accordance with the camera shake. ).

As a heat dissipation structure of the image sensor when the camera shake correction is performed by the sensor shift method, for example, a cooling element and a small heat dissipation member are disposed on the image sensor side, and a fixed large heat dissipation member is disposed on the housing side. More specifically, by thermally connecting the two with a heat transfer member, more specifically, a heat radiating sheet is provided on the mutually opposing surfaces of the small heat radiating member on the image sensor side and the large heat radiating member on the housing side, or the image sensor There is a technique for radiating heat from an imaging element by providing thermally conductive grease between a small heat radiating member on the side and a large heat radiating member on the housing side (see, for example, Patent Document 1).
JP 2006-174226 A

However, when performing camera shake correction by the sensor shift method, it is important to reduce the weight of the swinging part (moving body part) of the camera shake correction unit. The additional arrangement of a cooling element and a small heat dissipation member increases the weight of the oscillating part of the image stabilization unit and increases the driving load of the actuator that drives the oscillating part. There is a problem that the driving force capacity is increased.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a heat dissipation structure for an image sensor and a camera that can efficiently dissipate the heat of the image sensor without imposing a load on the actuator as much as possible. Yes.

In order to solve the above problems, the invention of claim 1 is a heat dissipation structure for an image sensor mounted on a camera shake correction unit,
A heat dissipating member is provided in the vicinity of the camera shake correction unit, and a metal member located in the vicinity of the imaging element in the camera shake correction unit and the heat dissipating member are connected by a flexible member having thermal conductivity. Features.

According to a second aspect of the present invention, in the heat dissipation structure for an image pickup device according to the first aspect,
The metal member and the heat radiating member are each connected by a flexible member at a position facing each other with the image pickup element interposed therebetween.

The invention of claim 3 is the heat dissipation structure for an image sensor according to claim 1 or 2,
The metal member is an attachment plate for attaching and fixing the image sensor to the camera shake correction unit.

The invention of claim 4 is the heat dissipation structure for an image sensor according to claim 3,
The attachment plate has an attachment piece for a flexible member, and the attachment piece extends in a direction opposite to the imaging surface side of the imaging element.

The invention of claim 5 is a camera,
The heat dissipation structure according to any one of claims 1 to 4 is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the heat | fever of an image pick-up element can be thermally radiated efficiently, without applying a load to an actuator as much as possible.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, although various technically preferable limitations for implementing the present invention are given to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

  FIG. 1 is a perspective view of a digital camera 100 to which a heat dissipation structure for an image sensor according to the present invention is applied. FIG. 2 is a perspective view of a lens unit portion, a camera shake correction unit portion, and a heat dissipation structure portion in the digital camera 100 shown in FIG. FIG. 3 is a perspective view showing the lens unit portion, camera shake correction unit portion, and heat dissipation structure portion of the digital camera 100, and FIG. 4 is a rear view of the camera shake correction unit portion and the heat dissipation structure portion. FIG. 5 is a cross-sectional view taken along the line VV in FIG. 4 when the camera shake correction unit and the heat dissipation structure are cut along the cutting line VV in FIG. .

  In the digital camera 100 of the present embodiment, the front surface side of the housing 101 protrudes forward, the lens unit 1 is disposed in the protruding portion, and an image sensor (imaging device) is disposed behind (behind) the camera shake correction unit 2. ) 5 is arranged, and a finder unit 102, a display unit (monitor unit) 103, a power button 104, and the like are provided on the back side of the housing 101, and an operation mode of the camera is set on the top side. A mode setting dial 105, a control value setting dial 106 for setting camera control values in each operation mode, a release button 107 as an operation member for photographing, and the like are provided.

  The lens unit 1 is provided in the housing 101 and forms a skeleton of the housing 101. The lens unit 1 is fixed to a frame (not shown) formed of metal or the like, and is an image sensor configured by a solid-state imaging device such as a CCD or a CMOS. 5 is arranged on the optical axis of the lens unit 1. Although not shown, a circuit unit, a battery unit, a memory card unit, and the like are provided inside the housing 101.

The camera shake correction unit 2 includes a base plate 21 that serves as a base, a first stage 31 that is attached to the base plate 21 and is movable in a first direction within a plane parallel to the base plate 21, and the first stage 31. The image sensor 5 includes a second stage 41 and the like that are movable in a second direction perpendicular to the first direction within a plane parallel to the base plate 21. It is attached and fixed to the second stage 41.
In the present embodiment, the base plate 21 is attached to the rear end surface of the lens barrel 11 of the lens unit 1, and the first stage 31 moves in the Y direction (up and down direction in FIG. 3), The second stage 41 moves in the X direction (left and right direction in FIG. 3).

The mechanism for moving the Y stage 31 is provided integrally with the first actuator 32, the first guide rail 33 and the second guide rail 34 attached to the base plate 21, and the first stage 31. A first guided member 35 that is inserted through the guide rail 33 and moves the Y stage 31 in the Y direction along the first guide rail 33, and is provided integrally with the Y stage 31 and the second guide rail 34 and a second guided member 36 that moves the Y stage 31 in the Y direction along the second guide rail 34.
The first guide rail 33 extends in the vertical direction (Y direction) on the right side of the X stage 41 in FIGS. 3 and 4, and the second guide rail 34 extends on the left side of the X stage 41 in FIGS. It extends in the direction (Y direction), and the first and second guide rails 33 and 34 are parallel to each other.
The Y stage 31 has a concave portion 31a having a rectangular shape in plan view at the center, and the X stage 41 is arranged in the concave portion 31a.

The mechanism for moving the X stage 41 includes a second actuator 42 attached to the Y stage 31 and a first actuator (not shown) arranged in parallel with the shaft (third guide rail) 43 of the second actuator 42. Four guide rails and a third guided member 44 provided integrally with the X stage 41 and inserted through the shaft 43 of the second actuator 42 to move the X stage 41 in the X direction along the shaft 43. And a fourth guided member (not shown) that is provided integrally with the X stage 41 and is inserted through the fourth guide rail to move the X stage 41 in the X direction along the fourth guide rail; It consists of
The shaft 43 of the second actuator 42 extends in the left-right direction (X direction) below the X stage 41 in FIGS.
The X stage 41 has a box shape with an opening on the surface side to which the PCB substrate 51 on which the image sensor 5 is mounted is mounted, and a transparent plate 45 is provided on the surface on the lens unit side.

A PCB substrate 51 on which the image sensor 5 is mounted is attached to the X stage 41 via an attachment plate 6. The mounting plate 6 constitutes a part of the heat dissipation structure of the image sensor in the present embodiment.
6 is an enlarged perspective view showing the assembled state of the mounting plate 6, the heat radiating member 7 and the flexible members 8a to 8d constituting the heat radiating structure of the image sensor (image sensor 5), and FIG. FIG.

The mounting plate 6 is made of a metal plate, has a rectangular plate shape, and has an opening 6a in which the image sensor 5 is disposed at the center.
The PCB substrate 51 on which the image sensor 5 is mounted is aligned so that the image sensor 5 fits into the opening 6a, and in this state, is attached to the X stage 41 with screws N1, N1,. Thereby, the imaging surface of the image sensor 5 faces the lens unit 1 side, and a subject image by the lens unit 1 can be formed on the imaging surface.

Further, convex portions 61a, 61b, 61c, 61d projecting outward are formed on the upper, lower, left, and right side surfaces (outer periphery) of the mounting plate 6, respectively. These four convex portions 61 a to 61 d are arranged at equal intervals on the outer peripheral side surface of the mounting plate 6.
The left and right convex portions 61a and 61b are arranged on the X axis line that is parallel to the X direction and passes through the center of gravity of the image sensor 5, and the upper and lower convex portions 61c and 61d are on the Y axis line that is parallel to the Y direction and passes through the center of gravity of the image sensor 5. (See FIG. 7).

  Each of the convex portions 61 a to 61 d is formed by being bent 90 degrees so that the tip portion thereof faces in the direction opposite to the imaging surface side of the image sensor 5. Screw holes 62, 62,... Are formed in the bent tip portion, and one end portions of flexible members 8a to 8d described later are sandwiched between the tip portions of the reinforcing plates 92a to 92d and the convex portions 61a to 61d to be screwed N2. It is fastened by N2,. That is, each convex part 61a-61d comprises the attachment piece to which flexible member 8a-8d is attached, respectively.

  Further, as shown in FIG. 6, a ring-shaped heat radiating member 7 is provided on the side of the mounting plate 6 where the convex portions 61 a to 61 d are bent so as to surround the mounting plate 6. The heat radiating member 7 is made of a metal such as aluminum, copper, or SUS. A plurality of extending portions 71, 71,... Extending perpendicularly to the main body flat plate portion of the heat radiating member 7 are provided at predetermined intervals on the outer peripheral edge of the heat radiating member 7. Are fixed to a lens barrel 11 of the lens unit 1 or a frame provided in the camera casing 101.

  Moreover, the other end part of flexible member 8a-8d is being fixed to the front surface of the heat radiating member 7 via the reinforcement board 91a, 91b, 91c, 91d. The four reinforcing plates 91a to 91d are arranged at equal intervals on the front surface of the heat radiating member 7, the left and right reinforcing plates 91a and 91b are arranged on the above-mentioned X axis, and the upper and lower reinforcing plates 91c and 91d are on the above Y axis. Is arranged.

  The flexible members 8a to 8d are made of, for example, a resin film coated with a metal such as aluminum or copper, or a plurality of thin wires made of metal such as aluminum or copper bundled in a flat shape at both ends. Have thermal conductivity. One end of each of the flexible members 8a to 8d is sandwiched between the convex portions 61a to 61d of the mounting plate 6 and the reinforcing plates 92a to 92d and fixed by screws N2, N2,. It is sandwiched between the plates 91a to 91d and fixed by screws N3, N3,. The flexible members 8a to 8d are connected so as to overlap in the vertical direction (that is, the front-rear direction) with respect to the X axis and the Y axis. That is, the left and right flexible members 8a and 8b are arranged on the X axis in a plan view, and the upper and lower flexible members 8c and 8d are arranged on the Y axis in a plan view. Moreover, each flexible member 8a-8d is connected to the heat radiating member 7 and the attachment plate 6 in a relaxed state where the flexible members 8a to 8d are folded back by 180 °.

In the digital camera 100 configured as described above, the heat generated by the image sensor 5 is transmitted to the mounting plate 6 directly or via the PCB substrate 51, and the flexible members 8 a to 8 d are further transmitted from the mounting plate 6. The heat is dissipated by being transmitted to the heat radiating member 7 through the heat dissipating member 7.
The flexible members 8a to 8d that connect the mounting plate 6 and the heat radiating member 7 are mounted so as to overlap in the vertical direction with respect to the X axis and the Y axis, and are mounted in a slack state folded back by 180 °. Therefore, the flexible members 8 a to 8 d do not become a large driving load for the first actuator 32 that moves the Y stage 31 and the second actuator 42 that moves the X stage 41.

The plurality of flexible members 8a to 8d are arranged in line symmetry with respect to the X axis parallel to the X direction and passing through the center of gravity of the image sensor 5 or the Y axis parallel to the Y direction and passing through the center of gravity of the image sensor 5. Thus, the loads on the heat radiation member 7 and the flexible members 8a to 8d applied to the first and second actuators 32 and 42 can be made uniform, and there is no need to individually set the actuator control.
Moreover, the some convex part 411a-411d extended in the reverse direction to the imaging surface side of the image sensor 5 is formed in the outer periphery of the attachment board 6, and each flexible member 8a- is formed in these some convex part 411a-411d. Since 8d is connected, by adjusting the lengths of the convex portions 411a to 411d, the load on the heat radiating member 7 and the flexible members 8a to 8d is reduced, and the heat radiating structure of the ideal imaging device with good heat radiating efficiency is achieved. It can be.

In addition, this invention is not limited to the said embodiment, In the range which does not deviate from the summary, it can change suitably.
For example, the shape of the mounting plate 6 is not limited to the shape shown in FIG. 7, and may have a shape in which convex portions 61 </ b> Aa to 61 </ b> Ad are provided at each corner as in the mounting plate 6 </ b> A shown in FIG. 8. Absent.
Moreover, although the said heat radiating member 7 was being fixed to the lens-barrel part 11 of the lens unit 1 by the extension part 71,71, ... provided in the outer periphery, it is not restricted to this, For example, as shown in FIG. The ends of the extension portions 71B, 71B,... Are bent so as to be parallel to the main body flat plate portion of the heat radiating member 7B, and are fixed to a frame (not shown) provided inside the housing 101. Also good. In addition, in FIG. 9, it is the structure similar to FIG. 1 except the heat radiating member 7B.
The shape of the heat dissipation member is not limited to the ring shape, and may be an arbitrary shape such as a frame shape.
Furthermore, although the number of the flexible members 8a to 8d is four, this may be changed as appropriate.

In the above embodiment, the camera shake correction unit 2 is attached to the lens barrel 11 of the lens unit 1, but may be attached to a frame provided in the camera housing 101. In this way, an existing lens can be used as it is in an interchangeable lens camera such as a single-lens reflex camera.
Furthermore, the camera in the present invention is not limited to a digital camera, and any camera such as a digital video camera, a camera-equipped mobile phone, or the like that has an imaging function and has an imaging device mounted on a camera shake correction unit may be used.

1 is a perspective view of a digital camera 100 to which an image sensor heat dissipation structure of the present invention is applied. FIG. 4 is a perspective view showing the arrangement positions of a lens unit portion, a camera shake correction unit portion, and a heat dissipation structure portion in the digital camera 100. FIG. 3 is a diagram showing a lens unit portion, a camera shake correction unit portion, and a heat dissipation structure portion of the digital camera 100 taken out. It is a top view at the time of seeing a camera shake correction unit part and a heat dissipation structure from the back side. It is arrow sectional drawing at the time of cut | disconnecting a camera shake correction unit part and a thermal radiation structure part along the cutting line VV of FIG. It is a perspective view which expands and shows the assembly state of the attachment board 6, the heat radiating member 7, and flexible member 8a-8d which comprise the heat radiating structure of an image pick-up element (image sensor 5). It is a perspective view of the attachment plate 6. FIG. It is a perspective view of the mounting plate A which is a modification. It is a perspective view of the digital camera which uses the heat radiating member 7B which is a modification.

Explanation of symbols

1 Lens unit 2 Camera shake correction unit 5 Image sensor (imaging device)
6 Mounting plate 7 Heat radiation member 8a-8d Flexible member 31 Y stage 41 X stage 61a-61d Convex part 100 Digital camera

Claims (5)

It is a heat dissipation structure for the image sensor mounted on the image stabilization unit,
A heat dissipating member is provided in the vicinity of the camera shake correction unit, and a metal member located in the vicinity of the imaging element in the camera shake correction unit and the heat dissipating member are connected by a flexible member having thermal conductivity. A heat radiating structure of an image pickup device as a feature.   2. The heat dissipation structure for an image sensor according to claim 1, wherein the metal member and the heat dissipating member are connected by flexible members at positions facing each other with the image sensor interposed therebetween.   The heat dissipation structure for an image sensor according to claim 1, wherein the metal member is an attachment plate for attaching and fixing the image sensor to the camera shake correction unit.   4. The heat dissipation structure for an image sensor according to claim 3, wherein the attachment plate has an attachment piece for a flexible member, and the attachment piece extends in a direction opposite to an image pickup surface side of the image pickup element. .   A camera comprising the heat dissipation structure according to any one of claims 1 to 4.

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