JP2010073836A - Power circuit device - Google Patents

Power circuit device Download PDF

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Publication number
JP2010073836A
JP2010073836A JP2008238772A JP2008238772A JP2010073836A JP 2010073836 A JP2010073836 A JP 2010073836A JP 2008238772 A JP2008238772 A JP 2008238772A JP 2008238772 A JP2008238772 A JP 2008238772A JP 2010073836 A JP2010073836 A JP 2010073836A
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wiring member
metal plate
circuit device
current
power circuit
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Takao Mitsui
貴夫 三井
Yasushi Hisaoka
靖 久岡
Masao Kikuchi
正雄 菊池
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Dc-Dc Converters (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power circuit device for inhibiting loss due to eddy current if a large current of high frequency flows, and capable of keeping heat dissipation. <P>SOLUTION: A wiring member 2 in which a large current of high frequency flows is mounted on a metal plate 1 via an insulative magnetic layer 5, and in addition, an electronic component 3 and a switching element 4 are mounted on the wiring member 2. Thus, a magnetic flux generated by the current flowing in the wiring member 2 flows to the magnetic layer 5 with a small magnetic resistance and does not reach the metal plate 1. By making such a shield, generation of eddy current on the metal plate 1 can be inhibited and heat dissipation can be secured by the plate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、高周波の大電流が流れる電力用回路装置に関するものであり、特に高周波の大電流により発生する磁束によって近傍の金属基板や配線部材等に発生する渦電流による損失を低減するとともに、放熱性を確保することのできる電力用回路装置に関するものである。   The present invention relates to a power circuit device through which a high-frequency large current flows, and in particular, reduces loss due to eddy currents generated in a nearby metal substrate or wiring member by magnetic flux generated by a high-frequency large current and dissipates heat. It is related with the circuit device for electric power which can ensure property.

従来、高周波電流の流れる回路装置では、高周波電流が流れる配線部材において電流の周波数が高くなるほど、電流が作る磁束により表皮効果が大きくなり、即ち高周波電流が配線部材を流れる時、電流密度が配線部材の表面で高く、表面から離れると低くなり、特定の部分に集中的に電流が流れてしまい、配線損失が増大してしまう。そのため、単に配線部材の厚みを増しても配線部材の表面に集中的に電流が流れるので、配線損失を低減することができない。   Conventionally, in a circuit device in which a high-frequency current flows, the skin effect increases due to the magnetic flux generated by the current as the current frequency increases in the wiring member in which the high-frequency current flows. That is, when the high-frequency current flows through the wiring member, the current density is It becomes high at the surface of the metal and becomes low when it is away from the surface, and current flows intensively to a specific portion, resulting in an increase in wiring loss. Therefore, even if the thickness of the wiring member is simply increased, a current flows intensively on the surface of the wiring member, so that the wiring loss cannot be reduced.

そこで従来においては、表皮効果による配線損失の増大を低減させるため、配線用導体の表面には配線用導体を流れる高周波電流の流れ方向に沿って導体を形成し、これにより配線用導体と導体とから高周波電流を流すための配線を構成し、その高周波電流を流すための配線の表皮面積を増大させるようなプリント配線板があった。これにより配線用導体および導体からなる配線に高周波電流を流した際に、表皮効果による配線の電気抵抗の増大が抑制され、その結果配線の発熱が抑制されると共に信号の遅延が防止されるものである（特許文献１参照）。   Therefore, in the past, in order to reduce the increase in wiring loss due to the skin effect, a conductor was formed on the surface of the wiring conductor along the flow direction of the high-frequency current flowing through the wiring conductor. There is a printed wiring board in which a wiring for flowing a high-frequency current is configured to increase the skin area of the wiring for flowing the high-frequency current. As a result, when a high-frequency current is passed through the wiring conductor and the wiring made of the conductor, an increase in the electrical resistance of the wiring due to the skin effect is suppressed, and as a result, the heat generation of the wiring is suppressed and the signal delay is prevented. (See Patent Document 1).

特開２０００−１２４５６１号公報JP 2000-124561 A

ＤＣ−ＤＣコンバータのようにスイッチング素子によって高周波の大電流を制御し、配線部材や電子部品の損失による発熱量が大きい電力用回路装置に上記特許文献１を適用する場合、配線部材や電子部品で発生する熱を放熱する必要があるので、金属板上に上記特許文献１に示されたプリント配線板を載置することとなる。   When the above-mentioned Patent Document 1 is applied to a power circuit device that controls a large high-frequency current using a switching element such as a DC-DC converter and generates a large amount of heat due to loss of the wiring member or electronic component, the wiring member or electronic component Since it is necessary to dissipate the generated heat, the printed wiring board disclosed in Patent Document 1 is placed on the metal plate.

しかしこのように構成した場合、表皮効果による配線損失を減少させることはできるが、高周波の大電流が流れることによって配線部材に交番磁界が発生し、これにより金属板に渦電流が発生するので渦電流損が増加してしまう。したがって、電力用回路装置の効率が著しく低下してしまうことになる。また、金属板に渦電流が発生して発熱するため、プリント配線板上の電子部品の温度が上昇してしまい、電子部品の機能が損なわれるおそれもある。   However, when configured in this way, the wiring loss due to the skin effect can be reduced, but an alternating magnetic field is generated in the wiring member due to the flow of a large high-frequency current, which generates an eddy current in the metal plate. Current loss will increase. Therefore, the efficiency of the power circuit device is significantly reduced. Moreover, since an eddy current is generated in the metal plate and generates heat, the temperature of the electronic component on the printed wiring board rises, and the function of the electronic component may be impaired.

この発明は上記のような課題を解決するためになされたものであり、高周波の大電流が流れても、渦電流による損失を抑えるとともに、放熱性を維持することのできる電力用回路装置を提供することを目的とする。   The present invention has been made to solve the above-described problems, and provides a power circuit device capable of suppressing loss due to eddy current and maintaining heat dissipation even when a high-frequency large current flows. The purpose is to do.

この発明に係る電力用回路装置は、金属板上に高周波大電流が流れる配線部材を取り付けるとともに、配線部材上にスイッチング素子及び電子部品を取り付けたものであって、金属板と配線部材との間に絶縁性の磁性体層を設けたものである。   A power circuit device according to the present invention includes a wiring member on which a high-frequency high current flows on a metal plate, and a switching element and an electronic component mounted on the wiring member, and is provided between the metal plate and the wiring member. Is provided with an insulating magnetic layer.

この発明に係る電力用回路装置は、金属板上に高周波大電流が流れる配線部材を取り付けるとともに、配線部材上にスイッチング素子及び電子部品を取り付けたものであって、金属板と配線部材との間に絶縁性の磁性体層を設けたので、金属板に発生する渦電流を減少させることができ、金属板の発熱を抑制することができる。その結果金属板上に実装された電子部品等の温度上昇を抑制させることができる。また同時に渦電流を減少させることができるので、渦電流損を低減できる。   A power circuit device according to the present invention includes a wiring member on which a high-frequency high current flows on a metal plate, and a switching element and an electronic component mounted on the wiring member, and is provided between the metal plate and the wiring member. Since the insulating magnetic layer is provided on the metal plate, eddy currents generated in the metal plate can be reduced, and heat generation of the metal plate can be suppressed. As a result, it is possible to suppress the temperature rise of the electronic component mounted on the metal plate. At the same time, since eddy current can be reduced, eddy current loss can be reduced.

実施の形態１．
以下この発明の一実施形態を図に基づいて説明する。図１はこの発明の実施の形態１による電力用回路装置を示す断面図である。図において、金属板１上に薄い絶縁性の磁性体層５を設け、その上に配線部材２を設ける。この絶縁性の磁性体層５によって金属板１と配線部材２を電気的に絶縁するとともに、磁性体層５は導電性を有さないので磁性体層５自体にも渦電流は発生しない。更に配線部材２上にはんだ付、もしくは銀ペーストなどの導電性接着剤を介して電子部品３やスイッチング素子４等を取り付ける。 Embodiment 1 FIG.
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 is a cross-sectional view showing a power circuit device according to Embodiment 1 of the present invention. In the figure, a thin insulating magnetic layer 5 is provided on a metal plate 1 and a wiring member 2 is provided thereon. The insulating magnetic material layer 5 electrically insulates the metal plate 1 and the wiring member 2 and the magnetic material layer 5 does not have conductivity, so no eddy current is generated in the magnetic material layer 5 itself. Furthermore, the electronic component 3 and the switching element 4 are attached to the wiring member 2 via a solder or a conductive adhesive such as silver paste.

配線部材２を流れる電流により発生する磁束は磁気抵抗の小さな絶縁性の磁性体層５に流れ、金属板１には磁束が届かないように遮蔽することで、金属板１における渦電流の発生を抑え、電力用回路装置における渦電流損を低減することができる。また、金属板１に発生する渦電流を低減できるため、金属板１上を流れる渦電流によって発生する発熱を抑制し、金属板１上に取り付けられた電子部品３やスイッチング素子４等の温度上昇を低減できる。   Magnetic flux generated by the current flowing through the wiring member 2 flows through the insulating magnetic layer 5 having a small magnetic resistance and shields the metal plate 1 from reaching the magnetic flux, thereby preventing eddy currents from being generated in the metal plate 1. It is possible to suppress the eddy current loss in the power circuit device. Moreover, since the eddy current generated on the metal plate 1 can be reduced, the heat generated by the eddy current flowing on the metal plate 1 is suppressed, and the temperature of the electronic component 3 and the switching element 4 mounted on the metal plate 1 is increased. Can be reduced.

更に金属板１における渦電流の発生を抑えることにより、配線部材２に流れる電流が金属板１側に引き寄せられることを防ぐことができ、従って配線部材２のインピーダンスが増加することを防いで電気的損失を低減させることができる。即ち配線部材２に交流電流が流れると配線部材２は交番磁界を発生させ、金属板１にこの交番磁界が交錯するような場合金属板１に渦電流が発生することとなる。この渦電流は配線部材２において発生した交番磁界を打ち消すような交番磁界を発生させるため、渦電流によって発生した磁界の影響を受けて配線部材２に流れる電流に力が作用し電流の偏りが発生するためインピーダンスが増加する。そしてこの電流の偏りは表皮効果以上のものとなる。   Further, by suppressing the generation of eddy currents in the metal plate 1, it is possible to prevent the current flowing through the wiring member 2 from being drawn toward the metal plate 1, thereby preventing an increase in the impedance of the wiring member 2 and preventing the electric current from flowing. Loss can be reduced. That is, when an alternating current flows through the wiring member 2, the wiring member 2 generates an alternating magnetic field. When this alternating magnetic field intersects the metal plate 1, an eddy current is generated in the metal plate 1. Since this eddy current generates an alternating magnetic field that cancels the alternating magnetic field generated in the wiring member 2, a force acts on the current flowing in the wiring member 2 due to the influence of the magnetic field generated by the eddy current, and current bias occurs. Impedance increases. This current bias is more than the skin effect.

そこで本発明においては、配線部材２において発生する交番磁界が金属板１と交錯しないように絶縁性の磁性体層５でシールドすることにより、金属板１には渦電流が発生せず、配線部材２において発生する電流の偏りは表皮効果によるもののみとなる。従って配線部材２に流れる電流が金属板１側に引き寄せられることを防ぐことができるようになる。また配線部材２内の電流の偏りが緩和されるため、電流の流れる断面積が増加し、従って配線部材２のインピーダンスが増加することを防ぐことができる。   Therefore, in the present invention, by shielding the alternating magnetic field generated in the wiring member 2 with the insulating magnetic layer 5 so as not to cross the metal plate 1, no eddy current is generated in the metal plate 1, and the wiring member The current bias generated in 2 is only due to the skin effect. Therefore, the current flowing through the wiring member 2 can be prevented from being drawn toward the metal plate 1 side. Further, since the current bias in the wiring member 2 is alleviated, the cross-sectional area through which the current flows increases, and accordingly, the impedance of the wiring member 2 can be prevented from increasing.

絶縁性の磁性体は、金属板１上に形成することが容易であり、低温、高温が繰り返されても強度を保つことができるように、磁性体層５として、例えば絶縁性の樹脂に磁性体の粉末を含ませたものを使用することが好ましい。更に適している磁性体としては、Ni系フェライトもしくはMｎ系フェライトであれば周波数が数十〜百kHzにおいて特性（透磁率、飽和磁束密度、絶縁性）及び価格において優れていると考えられる。   The insulating magnetic body can be easily formed on the metal plate 1, and the magnetic layer 5 is made of, for example, an insulating resin so that the strength can be maintained even when the low temperature and the high temperature are repeated. It is preferable to use a body powder. As a more suitable magnetic material, Ni-based ferrite or Mn-based ferrite is considered to be excellent in characteristics (permeability, saturation magnetic flux density, insulation) and price at a frequency of several tens to hundreds of kHz.

磁性体層５の選定条件としては、使用環境がキュリー温度以下であり、透磁率が５０以上、磁性体層５の厚さｔは配線部材２の幅ｗの１/１０程度で、かつ磁性体層５を通る磁束が飽和磁束密度以下であれば十分効果が得られるものである。図２は配線部材２と磁性体層５部分を示す拡大断面図、図３は、磁性体層５の厚さｔ/配線部材２の幅ｗと、漏洩磁界/遮蔽磁界との関係を示したグラフである。   As selection conditions for the magnetic layer 5, the usage environment is the Curie temperature or lower, the magnetic permeability is 50 or more, the thickness t of the magnetic layer 5 is about 1/10 of the width w of the wiring member 2, and the magnetic body A sufficient effect can be obtained if the magnetic flux passing through the layer 5 is equal to or lower than the saturation magnetic flux density. FIG. 2 is an enlarged cross-sectional view showing the wiring member 2 and the magnetic layer 5 portion, and FIG. 3 shows the relationship between the thickness t of the magnetic layer 5 / the width w of the wiring member 2 and the leakage magnetic field / shielding magnetic field. It is a graph.

図３において、電力用回路装置の使用環境がキュリー温度以下であり、電力用回路装置において動作する電流の周波数、電流量に対して透磁率μが５０以上、かつ磁性体層５を通る磁束が飽和磁束密度以下であれば、磁性体層５の厚みｔが配線部材２の幅ｗの約１/１０のとき漏洩磁界は遮蔽磁界の２割以下となる。そこで周波数が数十〜百kHz、電流量が数十Aで動作する電力用回路装置に適応させるため、電力用回路装置の動作環境において透磁率μが５０以上、かつ磁性体層５を通る磁束が飽和磁束密度以下であるような磁性体を磁性体層５として使用すれば良く、磁性体層５の厚みｔは配線部材２の幅ｗの１/１０程度あれば良いこととなる。また、磁性体層５の厚さｔを薄くして漏洩磁界を少なくするためには、透磁率μの高い磁性体を用いれば良い。   In FIG. 3, the usage environment of the power circuit device is equal to or lower than the Curie temperature, the magnetic permeability μ is 50 or more with respect to the frequency and current amount of the current operating in the power circuit device, and the magnetic flux passing through the magnetic layer 5 is If the magnetic flux density is equal to or less than the saturation magnetic flux density, the leakage magnetic field is 20% or less of the shielding magnetic field when the thickness t of the magnetic layer 5 is about 1/10 of the width w of the wiring member 2. Therefore, in order to adapt to a power circuit device that operates at a frequency of several tens to hundreds of kHz and a current amount of several tens of A, the magnetic flux μ passes through the magnetic layer 5 in the operating environment of the power circuit device with a permeability μ of 50 or more. A magnetic material having a magnetic flux density equal to or lower than the saturation magnetic flux density may be used as the magnetic material layer 5, and the thickness t of the magnetic material layer 5 may be about 1/10 of the width w of the wiring member 2. In order to reduce the leakage magnetic field by reducing the thickness t of the magnetic layer 5, a magnetic material having a high magnetic permeability μ may be used.

以上のように構成することにより、配線部材２に高周波の大電流が流れても、金属板１に発生する渦電流損を低減させることができるとともに、金属板１を設置しているので、放熱効果は維持できる。このように渦電流損を低減させ、又放熱効果は維持できるので、装置全体の長寿命化を図ることができるとともに、無駄なエネルギー消費を省くことができるので、環境保全性においても優れたものが得られることになる。   With the configuration described above, even when a high-frequency large current flows through the wiring member 2, eddy current loss generated in the metal plate 1 can be reduced, and the metal plate 1 is installed, so that heat is dissipated. The effect can be maintained. In this way, the eddy current loss can be reduced and the heat dissipation effect can be maintained, so that the life of the entire device can be extended and wasteful energy consumption can be saved, so that it is also excellent in environmental conservation. Will be obtained.

実施の形態２．
図４はこの発明の実施の形態２による電力用回路装置を示す断面図、図５は磁性体層で被覆された配線部材２を示す断面図である。絶縁性のエポキシ樹脂にフェライトの粉末を配合したものを配線部材２に塗布し、更に加熱することで樹脂を硬化させることにより磁性体層５ａを形成する。 Embodiment 2. FIG.
4 is a cross-sectional view showing a power circuit device according to Embodiment 2 of the present invention, and FIG. 5 is a cross-sectional view showing a wiring member 2 covered with a magnetic layer. An insulating epoxy resin blended with ferrite powder is applied to the wiring member 2 and further heated to cure the resin, thereby forming the magnetic layer 5a.

あるいは配線部材２に対して粉末のフェライトを焼結させることにより被覆して磁性体層５ａを形成する。その際、図５に示すように、スイッチング素子３や電子部品４を取り付ける部分にマスク６を施し、磁性体層５ａによって被覆されないようにする。磁性体層５ａにより被覆された配線部材２は、高熱伝導接着剤を介して金属板１に固着させ、電子部品３及びスイッチング素子４等をはんだ付、もしくは銀ペースト等の導電性接着剤を介して配線部材２に取り付ける。   Alternatively, the magnetic layer 5a is formed by covering the wiring member 2 by sintering powdered ferrite. At that time, as shown in FIG. 5, a mask 6 is applied to a portion to which the switching element 3 and the electronic component 4 are attached so as not to be covered with the magnetic layer 5a. The wiring member 2 covered with the magnetic layer 5a is fixed to the metal plate 1 via a high thermal conductive adhesive, and the electronic component 3 and the switching element 4 are soldered, or via a conductive adhesive such as silver paste. To the wiring member 2.

このように配線部材２を電子部品３及びスイッチング素子４等が取り付けられる部分を除いて磁性体層５ａによって被覆することにより、配線部材２で発生する磁束は、配線部材２を被覆している磁性体層５ａを集中的に流れることになり、金属板１には届かないので、金属板１で発生する渦電流を低減することができる。更には配線部材２が磁性体層５ａによって覆われているので、配線部材２の近傍に存在する電子部品３、スイッチング素子４及び導体への磁気的影響を低減でき、これらの部分に渦電流が発生することを防止するだけでなくノイズが発生することも防ぐことができる。   Thus, by covering the wiring member 2 with the magnetic layer 5a except for the portion where the electronic component 3 and the switching element 4 and the like are attached, the magnetic flux generated in the wiring member 2 is magnetized to cover the wiring member 2. Since it flows through the body layer 5a in a concentrated manner and does not reach the metal plate 1, eddy currents generated in the metal plate 1 can be reduced. Further, since the wiring member 2 is covered with the magnetic layer 5a, the magnetic influence on the electronic component 3, the switching element 4 and the conductor existing in the vicinity of the wiring member 2 can be reduced, and eddy currents are generated in these portions. Not only can it be prevented from occurring, but it can also be prevented from generating noise.

上記実施の形態１、２で示した構造は、コンバータやインバータなどのスイッチング素子を用いて数十ｋHz以上の高周波電流を発生させる回路装置において有効であり、特に高周波電流を流すことが可能なMOSFET(Metal-Oxide-Semiconductor Field-Effect Transistor)や、高周波大電流を流すことが可能なSiC(炭化珪素)素子を用いた回路装置において有効であるといえる。   The structures shown in the first and second embodiments are effective in a circuit device that generates a high-frequency current of several tens of kHz or more using a switching element such as a converter or an inverter. It can be said that it is effective in (Metal-Oxide-Semiconductor Field-Effect Transistor) and circuit devices using SiC (silicon carbide) elements capable of flowing high-frequency and high-current.

従来電気損失が大きくなりすぎるような場合、効率性及び放熱性を低減させないために高周波電流を流すことができなかった回路装置であっても、本発明に示すような構造を採用することにより、高周波電流を流すことができるようになる。更に本発明による電力用回路装置によれば、高周波電流を流しても損失が小さいので、１回のスイッチング（１回のＯＮ、ＯＦＦ）当たりの電力が小さくても、周波数を高くすることで１回のスイッチング当たりの電力が大きい電力用回路装置と同じ電力を取り出すことができる。そして１回のスイッチング当たりの電力が小さければコンデンサとリアクトルの容量が小さくてすみ、そのためリアクトルやコンデンサを小型化することが可能になり、結果的に電力用回路装置を小型化することができ、効率性が高くかつ小型の電力用回路装置を提供することができる。   Conventionally, in the case where the electrical loss is too large, even if it is a circuit device in which high-frequency current could not flow because it does not reduce efficiency and heat dissipation, by adopting the structure as shown in the present invention, A high frequency current can be passed. Furthermore, according to the power circuit device of the present invention, since the loss is small even when a high-frequency current is passed, even if the power per switching (one ON / OFF) is small, the frequency is increased by 1 The same power as that of the power circuit device having a large power per switching can be taken out. And if the electric power per switching is small, the capacity | capacitance of a capacitor | condenser and a reactor will be small, Therefore It becomes possible to miniaturize a reactor and a capacitor | condenser, As a result, the circuit apparatus for electric power can be miniaturized, A highly efficient and small power circuit device can be provided.

この発明の実施の形態１による電力用回路装置を示す断面図である。It is sectional drawing which shows the circuit device for electric power by Embodiment 1 of this invention. 配線部材と磁性体層部分を示す拡大断面図である。It is an expanded sectional view which shows a wiring member and a magnetic body layer part. 磁性体層の厚さｔ/配線部材の幅ｗと、漏洩磁界/遮蔽磁界との関係を示したグラフである。It is the graph which showed the relationship between the thickness t of a magnetic body layer / width w of a wiring member, and a leakage magnetic field / shielding magnetic field. この発明の実施の形態２による電力用回路装置を示す断面図である。It is sectional drawing which shows the circuit device for electric power by Embodiment 2 of this invention. 磁性体層で被覆された配線部材を示す断面図である。It is sectional drawing which shows the wiring member coat | covered with the magnetic body layer.

符号の説明Explanation of symbols

１ 金属板、２ 配線部材、３ スイッチング素子、４ 電子部品、
５，５ａ 磁性体層。 1 metal plate, 2 wiring member, 3 switching element, 4 electronic components,
5,5a Magnetic layer.

Claims (5)

金属板上に高周波大電流が流れる配線部材を載置するとともに、上記配線部材上にスイッチング素子及び電子部品を取り付けた電力用回路装置において、上記金属板と上記配線部材との間に絶縁性の磁性体層を設けたことを特徴とした電力用回路装置。   In a power circuit device in which a wiring member through which a high-frequency high current flows is placed on a metal plate, and a switching element and an electronic component are mounted on the wiring member, an insulating property is provided between the metal plate and the wiring member. A power circuit device comprising a magnetic layer. 上記スイッチング素子及び上記電子部品の取付部分を除いて上記配線部材が上記磁性体層により覆われていることを特徴とする請求項１記載の電力用回路装置。   2. The power circuit device according to claim 1, wherein the wiring member is covered with the magnetic layer except for a portion where the switching element and the electronic component are attached. 3. 上記磁性体層は絶縁性の樹脂に磁性体の粉末を含ませたものから構成されていることを特徴とする請求項１又は請求項２記載の電力用回路装置。   3. The power circuit device according to claim 1, wherein the magnetic layer is made of an insulating resin containing a magnetic powder. 上記スイッチング素子は、MOSFETであることを特徴とする請求項１から請求項３のいずれか１項に記載の電力用回路装置。   4. The power circuit device according to claim 1, wherein the switching element is a MOSFET. 5. 上記スイッチング素子は、SiC素子であることを特徴とする請求項１から請求項３のいずれか１項に記載の電力用回路装置。   The power circuit device according to any one of claims 1 to 3, wherein the switching element is a SiC element.
JP2008238772A 2008-09-18 2008-09-18 Power circuit device Pending JP2010073836A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9812411B2 (en) 2015-09-11 2017-11-07 Kabushiki Kaisha Toshiba Semiconductor device, inverter circuit, and drive device
CN113411945A (en) * 2020-03-16 2021-09-17 苏州佳世达电通有限公司 Electronic device and method for reducing leakage current

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JP2000077831A (en) * 1998-08-28 2000-03-14 Hitachi Ltd Protecting circuit device and secondary battery using the device
JP2001144250A (en) * 1999-11-12 2001-05-25 Mitsubishi Electric Corp Power module
JP2003046211A (en) * 2001-08-01 2003-02-14 Omron Corp Electronic component mounting structure
JP2004289935A (en) * 2003-03-20 2004-10-14 Sumitomo Electric Ind Ltd Inverter

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077831A (en) * 1998-08-28 2000-03-14 Hitachi Ltd Protecting circuit device and secondary battery using the device
JP2001144250A (en) * 1999-11-12 2001-05-25 Mitsubishi Electric Corp Power module
JP2003046211A (en) * 2001-08-01 2003-02-14 Omron Corp Electronic component mounting structure
JP2004289935A (en) * 2003-03-20 2004-10-14 Sumitomo Electric Ind Ltd Inverter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9812411B2 (en) 2015-09-11 2017-11-07 Kabushiki Kaisha Toshiba Semiconductor device, inverter circuit, and drive device
CN113411945A (en) * 2020-03-16 2021-09-17 苏州佳世达电通有限公司 Electronic device and method for reducing leakage current

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