JP2010070426A - Lead-free low melting point glass - Google Patents
Lead-free low melting point glass Download PDFInfo
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- JP2010070426A JP2010070426A JP2008241148A JP2008241148A JP2010070426A JP 2010070426 A JP2010070426 A JP 2010070426A JP 2008241148 A JP2008241148 A JP 2008241148A JP 2008241148 A JP2008241148 A JP 2008241148A JP 2010070426 A JP2010070426 A JP 2010070426A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/14—Silica-free oxide glass compositions containing boron
- C03C3/145—Silica-free oxide glass compositions containing boron containing aluminium or beryllium
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
Abstract
Description
本発明は、プラズマディスプレイパネル、液晶表示パネル、エレクトロルミネッセンスパネル、蛍光表示パネル、エレクトロクロミック表示パネル、発光ダイオード表示パネル、ガス放電式表示パネル等に代表される電子材料基板用の絶縁性被膜材料及び封着材料及び、光学フィルタの周辺部(光遮光部)用のカラーセラミック材料として用いられる低融点ガラスに関する。 The present invention relates to an insulating coating material for an electronic material substrate represented by a plasma display panel, a liquid crystal display panel, an electroluminescence panel, a fluorescent display panel, an electrochromic display panel, a light emitting diode display panel, a gas discharge display panel, and the like. The present invention relates to a sealing material and a low-melting glass used as a color ceramic material for a peripheral portion (light shielding portion) of an optical filter.
従来から電子部品の接着や封着材料として、或いは電子部品に形成された電極や抵抗体の保護や絶縁のための被服材料としてガラスが用いられている。特に近年の電子部品の発達に伴い、プラズマディスプレイパネル、液晶表示パネル、エレクトロルミネッセンスパネル、蛍光表示パネル、エレクトロクロミック表示パネル、発光ダイオード表示パネル、ガス放電式表示パネル等、多くの種類の表示パネルが開発され、中でも、プラズマディスプレイパネル（以下、ＰＤＰと略す）が薄型かつ大型の平板型カラー表示装置として注目を集めている。 Conventionally, glass has been used as a bonding material or sealing material for electronic components, or as a clothing material for protecting and insulating electrodes and resistors formed on electronic components. With the recent development of electronic components, many types of display panels such as plasma display panels, liquid crystal display panels, electroluminescence panels, fluorescent display panels, electrochromic display panels, light-emitting diode display panels, gas discharge display panels, etc. In particular, plasma display panels (hereinafter abbreviated as PDPs) are attracting attention as thin and large flat color display devices.
そしてこれらに用いられるガラスは、その用途に応じて化学耐久性、機械的強度、流動性、電気絶縁性等種々の特性が要求されるが、それゆえ何れの用途においてもガラスの融点を下げる効果が極めて大きいＰｂＯを多量に含有した低融点ガラスが広く用いられている(例えば、特許文献１参照)。 The glass used in these materials is required to have various properties such as chemical durability, mechanical strength, fluidity, and electrical insulation depending on the application. Therefore, the effect of lowering the melting point of the glass in any application. A low-melting glass containing a large amount of PbO having a very large value is widely used (see, for example, Patent Document 1).
しかしながらＰｂＯは、人体や環境に与える弊害が大きく、近年その採用を避ける趨勢にあり、ＰＤＰを始めとする電子材料では無鉛化が検討されている（例えば、特許文献２、特許文献３参照）。
従来、低融点ガラス、例えば電子部品の接着や封着材料として、或いは電子部品に形成された電極や抵抗体の保護や絶縁のための被服材料としてのガラスには鉛系のガラスが採用されてきた。鉛成分はガラスを低融点とするうえで重要な成分ではあるものの、人体や環境に与える弊害が大きく、近年その採用を避ける趨勢にあり、ＰＤＰを始めとする電子材料では無鉛ガラスが求められている。 Conventionally, lead-based glass has been employed as a low melting glass, for example, as a material for bonding or sealing electronic parts, or as a material for protecting or insulating electrodes and resistors formed on electronic parts. It was. Although the lead component is an important component for making the glass have a low melting point, it has a great detrimental effect on the human body and the environment. In recent years, there is a tendency to avoid its use, and lead-free glass is required for electronic materials such as PDP. Yes.
ＰｂＯ系に替わる無鉛組成では、不安定なガラスが多く、高温で処理された場合、焼成途中で結晶化し、その機能が十分発揮されない。 In the lead-free composition replacing the PbO system, there are many unstable glasses, and when processed at a high temperature, it is crystallized during firing and its function is not fully exhibited.
すなわち、特開２００１−５２６２１号公報は、低融点ガラスとしての効果は認められるが、鉛を含んでいるという基本的な問題がある。 That is, Japanese Patent Application Laid-Open No. 2001-52621 has a basic problem of containing lead, although the effect as a low melting point glass is recognized.
さらに、特開２０００−２１９５３６号公報及び特開平９−２２７２１４号公報は、鉛を含んでいないが、不安定なガラスであり、高温で処理された場合、焼成途中で結晶化し、その機能が十分発揮されない。 Furthermore, Japanese Patent Application Laid-Open Nos. 2000-219536 and 9-227214 do not contain lead, but are unstable glass, and when processed at high temperature, they crystallize during firing and have sufficient functions. It is not demonstrated.
本発明は、透明絶縁性の無鉛低融点ガラスにおいて、質量％でＢ２Ｏ３を４〜１２、Ｂｉ２Ｏ３を８３〜９３、Ｒ２Ｏ（Ｌｉ２Ｏ，Ｎａ２Ｏ，Ｋ２Ｏより選択される一種類以上の合計）を０．１〜６、Ａｌ２Ｏ３を０．１〜５含むことを特徴とするＢ２Ｏ３−Ｂｉ２Ｏ３−Ｒ２Ｏ−Ａｌ２Ｏ３系無鉛低融点ガラスである。 The present invention is a transparent insulating lead-free low-melting glass, in which B 2 O 3 is 4 to 12, Bi 2 O 3 is 83 to 93, R 2 O (Li 2 O, Na 2 O, K 2 O) in mass%. B 2 O 3 —Bi 2 O 3 —R 2 O—Al 2 O containing 0.1 to 6 and a total of 0.1 to 5 Al 2 O 3 It is a 3 series lead-free low melting glass.
また、質量％で、ＳｉＯ２を０〜８、ＺｎＯを０〜１０、ＲＯ（ＭｇＯ，ＣａＯ，ＳｒＯ，ＢａＯより選択される一種類以上の合計）を０〜１０、ＣｕＯを０〜５含むことを特徴とする上記の無鉛低融点ガラスである。 Moreover, in mass%, the SiO 2 0 to 8, 0 to ZnO, RO (MgO, CaO, SrO, the sum of one or more selected from BaO) 0-10, that the CuO containing 0-5 The above lead-free low melting point glass.
また、３０℃〜３００℃における熱膨張係数が（１１０〜１４５）×１０−７／℃、軟化点が３００℃以上４２０℃以下であることを特徴とする上記の無鉛低融点ガラスである。 Moreover, it is said lead-free low melting glass characterized by the thermal expansion coefficient in 30-300 degreeC being (110-145) * 10 < -7 > / degreeC, and a softening point being 300 degreeC or more and 420 degrees C or less.
さらに、上記の無鉛低融点ガラスを使用していることを特徴とする電子材料用基板である。 Further, the present invention is an electronic material substrate characterized by using the above lead-free low melting point glass.
さらにまた、上記の無鉛低融点ガラスを使用していることを特徴とするディスプレイ用パネルである。 Furthermore, the present invention is a display panel characterized by using the above lead-free low melting point glass.
さらにまた、上記の無鉛低融点ガラスを使用していることを特徴とするディスプレイ用カバーフィルタである。 Furthermore, the present invention is a display cover filter characterized by using the above lead-free low-melting glass.
本発明により、プラズマディスプレイパネルに代表される電子基板材料において、高温時に結晶しにくく安定な無鉛低融点ガラス組成物を得ることが出来る。 According to the present invention, in an electronic substrate material typified by a plasma display panel, it is possible to obtain a stable lead-free low-melting glass composition that is difficult to crystallize at high temperatures.
本発明は、透明絶縁性の無鉛低融点ガラスにおいて、質量％でＢ２Ｏ３を４〜１２、Ｂｉ２Ｏ３を８３〜９３、Ｒ２Ｏ（Ｌｉ２Ｏ，Ｎａ２Ｏ，Ｋ２Ｏより選択される一種類以上の合計）を０．１〜６、Ａｌ２Ｏ３を０．１〜５含むことを特徴とするＢ２Ｏ３−Ｂｉ２Ｏ３−Ｒ２Ｏ−Ａｌ２Ｏ３系無鉛低融点ガラスである。 The present invention is a transparent insulating lead-free low-melting glass, in which B 2 O 3 is 4 to 12, Bi 2 O 3 is 83 to 93, R 2 O (Li 2 O, Na 2 O, K 2 O) in mass%. B 2 O 3 —Bi 2 O 3 —R 2 O—Al 2 O containing 0.1 to 6 and a total of 0.1 to 5 Al 2 O 3 It is a 3 series lead-free low melting glass.
Ｂ２Ｏ３はガラス形成成分であり、ガラス溶融を容易とし、ガラスの熱膨張係数において過度の上昇を抑え、かつ、焼付け時にガラスに適度の流動性を与え、ガラスの誘電率を低下させるものである。ガラス中に４〜１２％（質量％、以下においても同様である）の範囲で含有させるのが好ましい。４％未満ではガラスの流動性が不充分となり、焼結性が損なわれる。他方１２％を越えるとガラスの軟化点が上昇し、成形性、作業性が困難となる。より好ましくは６〜１０％の範囲である。 B 2 O 3 is a glass-forming component, facilitates glass melting, suppresses an excessive increase in the coefficient of thermal expansion of glass, gives moderate fluidity to glass during baking, and lowers the dielectric constant of glass It is. It is preferable to make it contain in 4 to 12% (mass%, it is the same also in the following) in glass. If it is less than 4%, the fluidity of the glass becomes insufficient, and the sinterability is impaired. On the other hand, if it exceeds 12%, the softening point of the glass rises, and the moldability and workability become difficult. More preferably, it is 6 to 10% of range.
Ｂｉ２Ｏ３はガラスの軟化点を下げ、適度に流動性を与え、熱膨張係数を適宜範囲に調整するもので、８３〜９３％の範囲で含有させることが望ましい。８３％未満では上記作用を発揮しえず、９３％を超えると熱膨張係数が高くなり過ぎる。より好ましくは８５〜９１％の範囲である。 Bi 2 O 3 lowers the softening point of the glass, imparts moderate fluidity, and adjusts the thermal expansion coefficient to an appropriate range, and is desirably contained in the range of 83 to 93%. If it is less than 83%, the above effect cannot be exhibited, and if it exceeds 93%, the thermal expansion coefficient becomes too high. More preferably, it is 85 to 91% of range.
Ｒ２Ｏ（Ｌｉ２Ｏ，Ｎａ２Ｏ，Ｋ２Ｏより選択される一種類以上）はガラスの軟化点を下げ、適度に流動性を与え、熱膨張係数を適宜範囲に調整するもので、合計で０．１〜６％の範囲で含有させることが望ましい。中でもＬｉ２Ｏは特に上記作用を発揮し、含有させることが望ましい。０．１％未満では上記作用を発揮しえず、６％を超えると熱膨張係数が高くなり過ぎる。より好ましくは０．５〜４％の範囲である。 R 2 O (one or more selected from Li 2 O, Na 2 O, K 2 O) lowers the softening point of the glass, imparts moderate fluidity, and adjusts the thermal expansion coefficient to an appropriate range. It is desirable to contain in the range of 0.1 to 6% in total. Among these, Li 2 O exhibits the above action and is desirably contained. If it is less than 0.1%, the above effect cannot be exhibited, and if it exceeds 6%, the thermal expansion coefficient becomes too high. More preferably, it is 0.5 to 4% of range.
Ａｌ２Ｏ３はガラスを安定化させるもので、０．１〜５％の範囲で含有させることが好ましい。０．１未満では上記作用を発揮しえず、５％を超えるとガラスが不安定となる。より好ましくは０．１〜３％の範囲である。 Al 2 O 3 stabilizes the glass and is preferably contained in the range of 0.1 to 5%. If it is less than 0.1, the above effect cannot be exhibited, and if it exceeds 5%, the glass becomes unstable. More preferably, it is 0.1 to 3% of range.
ＳｉＯ２はガラス形成成分であり、別のガラス形成成分であるＢ２Ｏ３と共存させることにより、安定したガラスを形成することができるもので、０〜８％の範囲で含有させる。８％を越えると、ガラスの軟化点が上昇し、成形性、作業性が困難となる。より好ましくは、０〜５％の範囲である。 SiO 2 is a glass forming component, and can coexist with B 2 O 3 , which is another glass forming component, to form a stable glass, and is contained in the range of 0 to 8%. If it exceeds 8%, the softening point of the glass will increase, making the formability and workability difficult. More preferably, it is 0 to 5% of range.
ＺｎＯはガラスの軟化点を下げ、熱膨張係数を適宜範囲に調整するもので、ガラス中に０〜１０％の範囲で含有させる。１０％を越えるとガラスが不安定となり失透を生じ易い。より好ましくは０〜８％の範囲である。 ZnO lowers the softening point of the glass and adjusts the thermal expansion coefficient to an appropriate range, and is contained in the glass in a range of 0 to 10%. If it exceeds 10%, the glass becomes unstable and devitrification tends to occur. More preferably, it is 0 to 8% of range.
ＲＯ（ＭｇＯ，ＣａＯ，ＳｒＯ，ＢａＯより選択される一種類以上）はガラスの軟化点を下げ、適度に流動性を与え、熱膨張係数を適宜範囲に調整するもので、合計で０〜１０％の範囲で含有させる。１０％を超えると熱膨張係数が高くなり過ぎる。より好ましくは０〜８％の範囲である。 RO (one or more types selected from MgO, CaO, SrO, BaO) lowers the softening point of glass, imparts moderate fluidity, and adjusts the thermal expansion coefficient to an appropriate range. In the range of. If it exceeds 10%, the thermal expansion coefficient becomes too high. More preferably, it is 0 to 8% of range.
ＣｕＯはガラスの溶融時或いは焼成時の失透を抑制するもので、０〜５％の範囲で含有させる。５％を超えるとガラスの安定性を低下させる。より好ましくは、０〜３％の範囲である。 CuO suppresses devitrification when the glass is melted or fired, and is contained in the range of 0 to 5%. If it exceeds 5%, the stability of the glass is lowered. More preferably, it is 0 to 3% of range.
この他にも、一般的な酸化物で表すＩｎ２Ｏ３、ＴｉＯ２、ＳｎＯ２、ＴｅＯ２などを上記性質を損なわない範囲で１％まで加えてもよい。 In addition, In 2 O 3 , TiO 2 , SnO 2 , TeO 2 or the like represented by a general oxide may be added up to 1% within a range not impairing the above properties.
実質的にＰｂＯを含まないことにより、人体や環境に与える影響を皆無とすることができる。ここで、実質的にＰｂＯを含まないとは、ＰｂＯがガラス原料中に不純物として混入する程度の量を意味する。例えば、低融点ガラス中における０．３質量％以下の範囲であれば、先述した弊害、すなわち人体、環境に対する影響、絶縁特性等に与える影響は殆どなく、実質的にＰｂＯの影響を受けないことになる。 By substantially not containing PbO, it is possible to eliminate the influence on the human body and the environment. Here, “substantially free of PbO” means an amount of PbO mixed as an impurity in the glass raw material. For example, if it is in the range of 0.3% by mass or less in the low-melting glass, there is almost no adverse effect on the human body, environment, insulation characteristics, etc., and there is substantially no influence of PbO. become.
また、３０℃〜３００℃における熱膨張係数が（１１０〜１４５）×１０−７／℃、軟化点が３００℃以上４２０℃以下である上記の無鉛低融点ガラスである。熱膨張係数が（１１０〜１４５）×１０−７／℃を外れると厚膜形成時及び接着、封着時に剥離、基板の反り等の問題が発生する。好ましくは、（１１５〜１４０）×１０−７／℃の範囲である。また、軟化点が４２０℃を越えると基板の軟化変形などの問題が発生する。好ましくは、３２０℃以上４１０℃以下である。 Moreover, it is said lead-free low melting glass whose thermal expansion coefficient in 30 to 300 degreeC is (110-145) * 10 < -7 > / degreeC, and a softening point is 300 degreeC or more and 420 degrees C or less. If the thermal expansion coefficient is outside (110 to 145) × 10 −7 / ° C., problems such as peeling and warping of the substrate occur during thick film formation, adhesion and sealing. Preferably, it is the range of (115-140) * 10 < -7 > / (degreeC). Further, when the softening point exceeds 420 ° C., problems such as softening deformation of the substrate occur. Preferably, it is 320 degreeC or more and 410 degrees C or less.
本発明の無鉛低融点ガラスは、電子材料用基板、ディスプレイ用パネル、ディスプレイ用カバーフィルタに対して好適に使用出来る。 The lead-free low-melting glass of the present invention can be suitably used for electronic material substrates, display panels, and display cover filters.
本発明の無鉛低融点ガラスは、粉末化して使用されることが多い。この粉末化されたガラスは、必要に応じてムライトやアルミナに代表される低膨張セラミックスフィラー、耐熱顔料等と混合され、次に有機オイルと混練してペースト化されるのが一般的である。 The lead-free low melting point glass of the present invention is often used after being powdered. This powdered glass is generally mixed with a low expansion ceramic filler typified by mullite or alumina, a heat-resistant pigment or the like, if necessary, and then kneaded with an organic oil to form a paste.
ガラス基板としては透明なガラス基板、特にソーダ石灰シリカ系ガラス、または、それに類似するガラス(高歪点ガラス)、あるいは、アルカリ分の少ない（又は殆ど無い）アルミノ石灰ホウ珪酸系ガラスが多用されている。 As the glass substrate, a transparent glass substrate, particularly soda-lime-silica glass, glass similar to the glass (high strain point glass), or alumino-lime borosilicate glass with little (or almost no) alkali is often used. Yes.
以下、実施例に基づき、説明する。 Hereinafter, a description will be given based on examples.
（低融点ガラス混合ペーストの作製）
Ｂ２Ｏ３源としてほう酸を、Ｂｉ２Ｏ３源として酸化ビスマスを、Ｌｉ２Ｏ源として炭酸リチウムを、Ｎａ２Ｏ源として炭酸ナトリウムを、Ｋ２Ｏ源として炭酸カリウムを、Ａｌ２Ｏ３源として酸化アルミニウムを、ＳｉＯ２源として微粉珪砂を、ＺｎＯ源として亜鉛華を、ＭｇＯ源として炭酸マグネシウムを、ＣａＯ源として炭酸カルシウムを、ＳｒＯ源として炭酸ストロンチウムを、ＢａＯ源として炭酸バリウムを、ＣｕＯ源として酸化第二銅を使用した。これらを所望の低融点ガラス組成となるべく調合したうえで、白金ルツボに投入し、電気加熱炉内で１０００〜１３００℃、１〜２時間で加熱溶融して表１の実施例１〜６、表２の比較例１〜４に示す組成のガラスを得た。
(Production of low melting point glass mixed paste)
Boric acid as the B 2 O 3 source, bismuth oxide as the Bi 2 O 3 source, lithium carbonate as the Li 2 O source, sodium carbonate as the Na 2 O source, potassium carbonate as the K 2 O source, Al 2 O 3 Aluminum oxide as a source, fine silica sand as a SiO 2 source, zinc white as a ZnO source, magnesium carbonate as a MgO source, calcium carbonate as a CaO source, strontium carbonate as a SrO source, barium carbonate as a BaO source, CuO Cupric oxide was used as the source. After preparing these as a desired low melting-point glass composition, it puts into a platinum crucible, heat-melts in 1000-1300 degreeC and 1-2 hours in an electric heating furnace, Examples 1-6 of Table 1, Table 1 The glass of the composition shown in 2 comparative examples 1-4 was obtained.
ガラスの一部は型に流し込み、ブロック状にして熱物性(熱膨張係数、軟化点)測定用に供した。残余のガラスは急冷双ロール成形機にてフレーク状とし、粉砕装置で平均粒径１〜３μｍ、最大粒径１０μｍ未満の粉末状に整粒した。 A part of the glass was poured into a mold, made into a block shape, and used for measurement of thermal properties (thermal expansion coefficient, softening point). The remaining glass was formed into flakes with a rapid cooling twin roll molding machine and sized with a pulverizer into a powder having an average particle size of 1 to 3 μm and a maximum particle size of less than 10 μm.
次いで、αテルピネオールとブチルカルビトールアセテートからなるペーストオイルにバインダーとしてのエチルセルロースと上記ガラス粉を混合し、粘度、３００±５０ポイズ程度のペーストを調製した。 Next, paste oil composed of α-terpineol and butyl carbitol acetate was mixed with ethyl cellulose as a binder and the above glass powder to prepare a paste having a viscosity of about 300 ± 50 poise.
次いで、厚さ１mm程度となるように上記ペーストをガラス基板に塗布し、電気炉で(軟化点＋３０)℃まで焼成及び３０分保持し、その後取りだし結晶化が顕著なものを不良、その他を良好とした。 Next, the paste is applied to a glass substrate so as to have a thickness of about 1 mm, fired to (softening point + 30) ° C. and held for 30 minutes in an electric furnace, and then the one with remarkable crystallization is defective and the others are good It was.
なお、軟化点は、リトルトン粘度計を用い、粘度係数η＝107.6 に達したときの温度とした。また、熱膨張係数は、熱膨張計を用い、５℃/分で昇温したときの３０〜３００℃での伸び量から求めた。 The softening point was the temperature when the viscosity coefficient η = 10 7.6 was reached using a Littleton viscometer. Moreover, the thermal expansion coefficient was calculated | required from the amount of elongation at 30-300 degreeC when it heated up at 5 degree-C / min using the thermal dilatometer.
（結果） 低融点ガラス組成および、各種試験結果を表に示す。 (Results) The low melting point glass composition and various test results are shown in the table.
表１における実施例１〜６に示すように、本発明の組成範囲内においては、軟化点が３００℃〜４２０℃であり、好適な熱膨張係数（１１０〜１４５）×１０−７／℃を有しており、更には高温での結晶化が顕著ではなく、電子材料基板用の絶縁性被膜材料及び封着材料、及びカラーセラミック材料用のガラスとして好適である。 As shown in Examples 1 to 6 in Table 1, within the composition range of the present invention, the softening point is 300 ° C. to 420 ° C., and a suitable thermal expansion coefficient (110 to 145) × 10 −7 / ° C. Furthermore, crystallization at high temperature is not remarkable, and it is suitable as an insulating coating material and sealing material for an electronic material substrate, and glass for a color ceramic material.
他方、本発明の組成範囲を外れる表２における比較例１〜４は、高温での結晶化が顕著である、又は好ましい物性値を示さず、絶縁性被膜材料及び封着材料、及びカラーセラミック材料用のガラスとしては適用し得ない。 On the other hand, Comparative Examples 1 to 4 in Table 2 outside the composition range of the present invention show remarkable crystallization at high temperature or do not show preferable physical property values, and insulating coating materials and sealing materials, and color ceramic materials It cannot be applied as a glass.
Claims (6)
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003034550A (en) * | 2001-07-24 | 2003-02-07 | Asahi Glass Co Ltd | Lead-free glass, glass frit, glass paste, electronic circuit part and electronic circuit |
| JP2004142982A (en) * | 2002-10-23 | 2004-05-20 | Matsushita Electric Ind Co Ltd | Magnetic recording head and gap-bonding glass for the same |
| JP2004238273A (en) * | 2002-03-29 | 2004-08-26 | Matsushita Electric Ind Co Ltd | Bismuth-based glass composition, and magnetic head and plasma display panel using it as sealing member |
| JP2006137637A (en) * | 2004-11-12 | 2006-06-01 | Asahi Techno Glass Corp | Low melting glass, sealing composition and sealing paste |
| JP2006169047A (en) * | 2004-12-16 | 2006-06-29 | Central Glass Co Ltd | Lead-free low melting point glass |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003034550A (en) * | 2001-07-24 | 2003-02-07 | Asahi Glass Co Ltd | Lead-free glass, glass frit, glass paste, electronic circuit part and electronic circuit |
| JP2004238273A (en) * | 2002-03-29 | 2004-08-26 | Matsushita Electric Ind Co Ltd | Bismuth-based glass composition, and magnetic head and plasma display panel using it as sealing member |
| JP2004142982A (en) * | 2002-10-23 | 2004-05-20 | Matsushita Electric Ind Co Ltd | Magnetic recording head and gap-bonding glass for the same |
| JP2006137637A (en) * | 2004-11-12 | 2006-06-01 | Asahi Techno Glass Corp | Low melting glass, sealing composition and sealing paste |
| JP2006169047A (en) * | 2004-12-16 | 2006-06-29 | Central Glass Co Ltd | Lead-free low melting point glass |
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