JP2010067640A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method capable of efficiently removing unnecessary thin films and other undesired substances formed in a substrate without damaging any substrate. <P>SOLUTION: The substrate processing apparatus is equipped with: a substrate holding part 30 which holds a substrate 50; an injection portion 15 which spouts blended mist obtained by blending abrasive and mist; and a positioning control portion 23 which relatively moves the injection portion 15 and the substrate 50, wherein the unnecessary thin films and the other undesired substances formed in the substrate 50 are removed, by injecting the blended mist containing the abrasive to a processing object of the substrate 50 (by injecting mist liquid together with the abrasive in a foggy state). <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for removing a thin film or other unnecessary material formed on a substrate such as a wafer or other semiconductor substrate, a liquid crystal panel substrate, or a semiconductor mask.

  In recent years, with the miniaturization of semiconductor elements and the speeding up of semiconductor devices, the management of contaminants such as particles has become increasingly important. One of the problems in managing the particles and the like is a thin film formed on the edge portion or bevel portion of the semiconductor substrate during the manufacturing process of the semiconductor device. Here, the bevel portion means a portion having a curvature at the end portion of the semiconductor substrate, and the edge portion means a flat surface and back surface of about several mm from the bevel portion toward the inner peripheral side of the semiconductor substrate. It means that part.

  In the manufacturing process of a semiconductor device or the like, partial removal by various thin film formation or etching is repeated. In such a thin film production process, the thin film may be produced by wrapping around the edge portion, bevel portion and back surface of the wafer. Such a thin film or the like causes particles and contamination and should be removed.

As an apparatus for removing such a thin film and dust, in addition to a device that removes by etching, a device that removes a thin film or the like by polishing (Patent Documents 1 and 2), or a reactive gas or a stripping solution is discharged to remove the thin film. There are a thing (patent documents 3 and 4), a thing (patent documents 5) etc. which spray high temperature steam and a blast material from a jet nozzle.
JP 2007-245256 A JP 2005-305586 A JP 2006-287169 A JP 2003-109896 A JP 2006-229057 A

  However, the method of removing a thin film by polishing in Patent Documents 1 and 2 and the method of removing a thin film by using a reaction gas or a stripping solution according to Patent Documents 3 and 4 make the apparatus larger and complicated and require complicated control. . Further, these methods cannot remove thin films other than the edge portion and the bevel portion.

  In the method described in Patent Document 5, high temperature steam gas or blast material is ejected and ejected to remove the thin film. This apparatus can remove a thin film over a wide range with a relatively simple structure, but requires a high-temperature steam generator. Further, since the blast material is jetted as it is and directly jetted onto the substrate, there is a risk of damaging the substrate. Further, since the blast material (particles) is directly sprayed on the substrate, it strikes the substrate and is reflected and scattered in various directions. Therefore, high-pressure air is blown from the center of the substrate so that the blast material does not enter the substrate, but since the blast material is sprayed at a relatively high pressure, the scattered blast material does not enter the center of the substrate. In order to achieve this, it is necessary to blow out relatively high-pressure air, which is difficult to control.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art, and to provide a substrate processing apparatus and a substrate processing method with a simpler structure, less risk of substrate damage, and capable of suppressing scattering of an abrasive. And

  The present invention solves the above-mentioned problem by removing an unnecessary thin film and the like by injecting an abrasive with a mist to a processing target portion of a substrate at a predetermined pressure. In addition, after removing the unnecessary thin film and the like by spraying a mist mixed with an abrasive and a mist, only the mist such as pure water or a cleaning liquid can be sprayed to clean the processing portion.

  A substrate processing apparatus according to claim 1 of the present invention is a substrate processing apparatus that removes a thin film and other unnecessary materials formed on a substrate to be processed, and includes a substrate holding unit that holds the substrate, an abrasive, and a mist. An ejection unit that ejects mixed mist and a position control unit that relatively moves the ejection nozzle and the substrate are provided. As the abrasive, an appropriate material can be selected according to the thin film to be removed. Mist refers to a mist of liquid. Even if the liquid to be mist is pure water, an appropriate chemical solution can be selected and used according to the thin film to be removed. In the present invention, since the mixed mist in which the fine particle abrasive and the mist are mixed is sprayed, the abrasive is wet, and the mixed mist becomes a barrier to the scattering of the fine abrasive. Compared to the case of spraying alone, there is an effect of suppressing scattering due to reflection after the abrasive hits the substrate.

  The substrate processing apparatus according to claim 2, wherein the substrate holding unit rotatably holds the substrate, the position control unit rotates a substrate, and the jetting unit is a portion to be processed of the substrate. It is characterized by comprising a drive unit that is moved to the position. In this way, it is possible to efficiently remove the thin film at the edge portion and the bevel portion by spraying the mixed mist while rotating the substrate.

  The substrate processing apparatus according to a third aspect of the present invention is characterized in that a particle size of the abrasive is in a range of 0.5 μm to 3.0 μm. If the particle size of the abrasive is large, the possibility of damage to the substrate increases, and if it is too small, it becomes difficult to peel off the substrate.

  According to a fourth aspect of the present invention, there is provided a substrate processing apparatus comprising a plurality of the injection units. By providing a plurality of injection units, it is possible to shorten the peeling time.

  The substrate processing apparatus according to claim 5 of the present invention is characterized in that the injection unit can selectively eject the mixed mist or pure water mist. By allowing only the mist to be ejected in addition to the mixed mist, the substrate can be cleaned by, for example, pressurizing and spraying pure water as a mist.

  The substrate processing apparatus according to claim 6 of the present invention is further characterized by further comprising intrusion prevention means for restricting the intrusion area of the mixed mist. As a means for preventing intrusion of the mixed mist, in addition to physically covering the area other than the injection area of the mixed mist with a protective member, when the protective area is in the direction of the center of the substrate, a high-pressure gas (from the center of the substrate to the outside) For example, clean air or an inert gas such as nitrogen gas) can be sprayed to increase the pressure at the central portion of the substrate and lower the pressure at the outside. In the present invention, since the thin film is removed by spraying the mixed mist, scattering of the abrasive is suppressed. Therefore, it becomes easier to prevent the abrasive from entering, compared to the case where the abrasive is directly sprayed.

  The substrate processing apparatus according to claim 7 of the present invention is a sequence control that removes the thin film and other unnecessary materials on the substrate by the mixed mist by controlling the injection unit and the position control unit according to a predetermined procedure. It comprises a part. By providing such a sequence control function, it is possible to remove the thin film and other unnecessary materials more accurately and at high speed.

  A substrate processing method according to an eighth aspect of the present invention is a substrate processing method for removing a thin film or other unnecessary material formed on a substrate to be processed, wherein the thin film or the like on the substrate is rotated while the substrate is rotated. By spraying a mixed mist obtained by mixing an abrasive and mist at a predetermined pressure with respect to the unwanted matter, and peeling and removing the thin film and other unwanted matter, and washing the substrate, And a washing step of washing away unnecessary substances that have been peeled and removed.

  Mist refers to a mist of liquid. Even if the liquid to be mist is pure water, an appropriate chemical solution can be selected and used according to the thin film to be removed. By spraying a mixed mist that is a mixture of fine-grain abrasive and mist, the abrasive is wet, and the mixed mist becomes a barrier, so the abrasive is less than when only the abrasive is sprayed alone. Scattering due to reflection after hitting the substrate can be suppressed.

  The substrate processing method according to claim 9 of the present invention is characterized in that the cleaning step cleans the substrate by pressurizing and spraying pure water mist. In particular, by configuring so that the pure water mist can be ejected from the ejection portion that ejects the mixed mist or other ejection portions provided in the vicinity thereof, after the unnecessary thin film peeling step by the mixed mist, continuously The cleaning process can be performed immediately, and the apparatus cost can be reduced and the processing speed can be improved.

  According to the present invention, the risk of substrate damage is reduced and the scattering of the abrasive is reduced by a simple configuration in which the abrasive is sprayed onto the processing target portion of the substrate with a mist while controlling the position of the injection portion. It is possible to provide a substrate processing apparatus and a substrate processing method that can be suppressed.

  Embodiments of a substrate processing apparatus and a substrate processing method according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view schematically showing an example of a substrate processing apparatus according to the present invention. FIG. 2 is a cross-sectional view illustrating an embodiment of the mist generating unit 14 including an injection unit, a mixed mist liquid supply unit, and a high-pressure gas supply unit.

  The substrate processing apparatus 10 includes a high-pressure gas supply unit 11 such as a compressor and a mixed mist liquid supply unit 12. The high-pressure gas supplied from the high-pressure gas supply unit 11 is controlled by opening / closing the electromagnetic valve 13 and supplied to the injection unit 15. The high-pressure gas supplied is preferably clean air or an inert gas such as nitrogen. Further, a mixed mist liquid 28 (see FIG. 2) obtained by mixing the abrasive and the mist liquid is supplied to the injection unit 15 from the mixed mist liquid supply unit 12. As the mist solution, pure water or a chemical solution suitable for removing the thin film as required can be used.

  A fine abrasive is used as the abrasive. In addition, Si-based fine particles, Al inclusions, ceramics, diamond, and the like can be used depending on the type and process of the substrate, but it is desirable to use in consideration of the following points.

That is, it is necessary to use an appropriate abrasive according to the object to be polished so that the abrasive to be used does not adversely affect the object to be polished. Examples of generally usable abrasives include Sic, SiO ₂ , Al ₂ O ₃ , CeO ₂ , Mn ₂ O ₃ and diamond.

  In addition, if the polishing agent has a low purity, it may adversely affect subsequent wafer processes such as metal contamination due to impurities. Therefore, it is preferable to select a polishing agent that can increase the purity. Furthermore, the fine particles of the abrasive are preferably as close to spherical as possible from the viewpoint of uniformly removing the thin film. Moreover, it is preferable that a particle size exists in the range of 0.5 micrometer-3.0 micrometers.

  In FIG. 1, a substrate 50 such as a wafer is supported below the injection unit 15. The substrate 50 is preferably supported rotatably. In this embodiment, the substrate 50 is supported by sucking the central portion of the back surface by the support portion 30, and the support portion 30 can be rotated by the motor 31.

  The ejection unit 15 is supported by a carrier 26 that is driven along a moving rail 25 provided in parallel to the surface of the substrate 50. The carrier 26 is driven along the moving rail 26 by, for example, a belt or a drive screw (not shown). Thereby, the injection unit 15 is movable so as to cross the central portion from the end of the substrate 50, and the mixed mist is injected from the injection unit 15 over the entire surface of the substrate by rotating the substrate by the motor 31. It becomes possible. In addition to the parallel movement of the spray unit 15 along the surface of the substrate 50, the substrate end (edge portion and bell portion) can be configured to be movable in the vertical direction. It can also be configured to move in parallel along the back surface of the substrate.

  An embodiment of the mist generation unit 14 will be described with reference to FIG. In the embodiment shown in FIG. 2, an example in which the injection unit 15, the electromagnetic valve 13, and the mixed mist liquid supply unit 12 are integrally configured is shown. However, a configuration as shown in FIG. 1, that is, a configuration in which only the injection unit 15 is mounted on the movable carrier 26 and high-pressure gas and mixed mist are supplied to the injection unit 15 by piping.

  The high pressure gas passes through the electromagnetic valve 13, passes through the gas supply pipe, the coupling gap 16, and the narrow passage 17, and is guided to the open space 18. On the other hand, a mist liquid supply pipe 19 extending from the mixed mist liquid supply section 12 is provided inside the coupling gap 16 and the narrow passage 17, and one end of the supply pipe is immersed in the mixed mist liquid supply section 12. The other end is opened in a state of slightly protruding into the open space.

  The supply of the high-pressure gas is controlled by opening and closing the electromagnetic valve 13. The high-pressure gas supplied by opening the electromagnetic valve 13 passes through the gas supply pipe 14 and the coupling gap 16, passes through the narrow passage 17 that is a narrow space, and is released at once in the open space portion 18. As a result, a negative pressure is generated at the distal end portion of the mist supply pipe 19 provided in the narrow passage 17, and the mixed mist liquid 28 is sucked up by this negative pressure and becomes a mist, and together with the high-pressure gas, the mist liquid Injected forward of the open end of the supply pipe 19. Accordingly, the mist supply pipe 19 and the tip of the narrow passage 17 constitute the injection nozzle 20, and the electromagnetic valve 13 controls the injection of the mixed mist from the injection nozzle. “Mixed mist” refers to a mist that is atomized and mixed with a fine abrasive, and “mixed mist is sprayed” refers to a mist that is atomized and finely ground. The state where it is ejected by the high-pressure gas in a state of being mixed with the agent.

  The injection direction of the injected mixed mist is regulated by the injection guide 21. The injection guide 21 does not spread in a trumpet shape but has a cylindrical shape. As a result, it is possible to more accurately limit the injection position of the mixed mist to a certain range, and it is possible to suppress the mixed mist from being scattered outside the thin film removal range.

  Further, when the unnecessary film to be removed is limited to the edge portion, bevel portion, or substrate back surface portion of the substrate, the central portion of the substrate is formed by irradiating high-pressure gas from the central portion of the front surface portion to the edge portion direction. By making the pressure higher than the outside, it is possible to prevent the mixed mist from entering the central portion of the substrate that does not need to be removed. In the present invention in which the mixed mist is injected, scattering due to the reflection of the mixed mist is suppressed. Therefore, the method of setting the inner side to a higher pressure than the outer side is more effective than the method in which the abrasive is directly injected.

  The position of the injection unit 15 is controlled by the position control unit 23. The position controller 23 drives the carrier 26 with a stepping motor or the like (not shown) to move it to a desired position. Further, the control unit 24 controls each part such as the magnetic valve 13, the position control unit 23, and the motor 31, and controls the thin film removal sequence.

  The injection pressure of the mixed mist is desirably 0.3 MPa or less. When jetting more strongly than this, there is a high possibility that the substrate is damaged or the mist reflected from the substrate is scattered and spread. If the jet power is too weak, the thin film cannot be removed sufficiently.

FIG. 3 shows another embodiment of the mist generating unit.
3 includes a pure water supply unit 40 in addition to the injection unit 15 and the mixed mist liquid supply unit 12, and further includes a switching electromagnetic valve 43. The mist generation unit 14-2 illustrated in FIG. Pure water 41 is stored in the pure water supply unit 40. By switching the switching electromagnetic valve 43 to the pure water supply unit 40, the pure water 41 is mist from the pure water supply unit 40 via the pure water supply pipe. It is possible to supply pure water mist by supplying the liquid supply pipe 19.

  Thus, by ejecting pure water as mist, the substrate can be cleaned with pure water mist after removing the thin film and the like.

  In the above description, only the substrate processing apparatus including one injection unit 15 is shown, but a substrate processing apparatus including a plurality of injection units 15 may be used. In this case, a plurality of nozzles may be continuously provided while being jetted in consideration of the spread of the mixed mist, or may be arranged scattered at regular intervals. Moreover, you may make it arrange | position to the surface part of a board | substrate, a bevel part, and a back surface part. As described above, by arranging a plurality of unnecessary objects at a plurality of locations at the same time and reducing the time required for the movement of the injection unit, it is possible to improve the substrate processing speed. Become.

It is a perspective view which shows typically an example of the substrate processing apparatus by this invention. It is sectional drawing which shows one Embodiment of a mist production | generation part provided with an injection part, a high pressure gas supply part, and a mixed mist liquid supply part. It is sectional drawing which shows other embodiment of a mist production | generation part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 11 High pressure gas supply part 12 Mixed mist liquid supply part 13 Electromagnetic valve 14, 14-2 Mist production | generation part 15 Injection part 16 Coupling space | gap 17 Narrow passage 18 Open space part 19 Mist liquid supply pipe 20 Injection nozzle 21 Injection guide 23 Position control unit 24 Control unit 25 Moving rail 26 Carrier 28 Mixed mist liquid 30 Support unit 31 Motor 40 Pure water supply unit 41 Pure water 42 Pure water supply pipe 43 Switching electromagnetic valve 50 Substrate

Claims (9)

A substrate processing apparatus for removing a thin film or other unnecessary material formed on a substrate to be processed,
A substrate holder for holding the substrate;
An injection unit for ejecting mixed mist obtained by mixing abrasive and mist;
A position controller that relatively moves the spray nozzle and the substrate;
A substrate processing apparatus comprising: The substrate holding unit rotatably holds the substrate,
The substrate processing apparatus according to claim 1, wherein the position control unit includes a rotation driving unit that rotates the substrate and a driving unit that moves the ejection unit to a processing target portion of the substrate.   The substrate processing apparatus according to claim 1, wherein the abrasive has a particle size in a range of 0.5 μm to 3.0 μm.   The substrate processing apparatus according to claim 1, comprising a plurality of the injection units.   The substrate processing apparatus according to claim 1, wherein the spray unit is capable of selectively ejecting the mixed mist or pure water mist.   The substrate processing apparatus according to claim 1, further comprising an intrusion prevention unit that regulates an intrusion area of the mixed mist.   2. The apparatus according to claim 1, further comprising a sequence control unit that removes the thin film and other unnecessary materials on the substrate by the mixed mist by controlling the injection unit and the position control unit according to a predetermined procedure. 2. The substrate processing apparatus according to 1. A substrate processing method for removing a thin film or other unnecessary material formed on a substrate to be processed,
While rotating the substrate, spray a mixed mist mixed with abrasive and mist on the thin film and other unnecessary materials on the substrate at a predetermined pressure, and peel off and remove the thin film and other unnecessary materials. A peeling and removing step,
A washing step of washing away the unnecessary substances removed by removing the substrate by washing the substrate;
A substrate processing method comprising: 9. The substrate processing method according to claim 8, wherein in the cleaning step, the substrate is cleaned by pressurizing and spraying pure water mist.

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