JP2010064085A - Gold brazing filler metal for jewelry - Google Patents
Gold brazing filler metal for jewelry Download PDFInfo
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- JP2010064085A JP2010064085A JP2008230519A JP2008230519A JP2010064085A JP 2010064085 A JP2010064085 A JP 2010064085A JP 2008230519 A JP2008230519 A JP 2008230519A JP 2008230519 A JP2008230519 A JP 2008230519A JP 2010064085 A JP2010064085 A JP 2010064085A
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Abstract
Description
本発明は、宝飾又は装飾用金合金のろう付に使用される金ろうの技術分野に属する。 The present invention belongs to the technical field of gold brazing used for brazing jewelry or decorative gold alloys.
宝飾又は装飾用の部材を作製する過程において、接合を要する場合はろう付けが一般的に行われる。近時、様々な色調を有する宝飾又は装飾品が出されているが、特にピンク色を有するK18合金などでは、その色調が重要視され、色調に違和感を与えないようなろう材が要望されている。
また、これらピンク色のK18合金は、金と銅をベースとしており融点が比較的低いものとなっており、適用されるろう材の融点も低いものが望まれている。
In the process of producing a jewelery or decorative member, brazing is generally performed when joining is required. Recently, jewelry or ornaments with various color tones have been put out, but especially for the K18 alloy with pink color, the color tone is regarded as important, and a brazing material that does not give a sense of incongruity to the color tone is desired. Yes.
Further, these pink K18 alloys are based on gold and copper and have a relatively low melting point, and it is desired that the melting point of the brazing material to be applied is low.
一方、金合金用のろう材としては、特許文献１，２に開示されたものなどが提案されている。しかしながら、これらのろう材は、広範な種類の金合金や白色の金合金に使用することを意図しているため、特定の金合金（特にピンク色を帯びたK18合金）に使用する場合には、色調や融点に関して満足できるものではなかった。
上述先行技術に基づく問題および顧客要望に鑑み、本発明の目的は、ピンク色を帯びた金合金からなる母材との色差が少なく、しかも、ろう付け時に母材を溶かさない融点を有する宝飾用金ろうを提供することにある。 In view of the problems and customer requests based on the above-mentioned prior art, the object of the present invention is for jewelry having a small color difference with a base material made of a gold alloy with a pink color and having a melting point that does not dissolve the base material during brazing. To provide gold brazing.
上述した目的は、Auを75〜77mass%、Inを1〜7mass%、Znを1〜5mass%、残部 Cuと不可避不純物からなる宝飾用金ろうによって達成される。 The above-mentioned object is achieved by a gold brazing gold for jewelry made of 75 to 77 mass% Au, 1 to 7 mass% In, 1 to 5 mass% Zn, and the balance Cu and inevitable impurities.
本発明によれば、融点が860℃未満の宝飾用金ろうを提供できる。したがって、例えばK18ピンクゴールド（固相点 910℃程度）からなる母材のろう付けに用いても、母材との融点差が50℃以上あるため、ろう付け時に母材を溶かす虞がない。
また、ろう材の色調が、K18ピンクゴールドなどの金合金とほぼ同じか、或いは、色差が目立たない程度にピンク色を帯びているため、ろう付け後の接合箇所が目立つことがない。したがって、ろう付けによって、宝飾品や装飾品の美観を損ねることがない。
According to the present invention, it is possible to provide a jewelery gold solder having a melting point of less than 860 ° C. Therefore, even when used for brazing a base material made of, for example, K18 pink gold (solid phase point of about 910 ° C.), there is no risk of melting the base material during brazing because the melting point difference from the base material is 50 ° C. or more.
In addition, since the color tone of the brazing material is almost the same as that of a gold alloy such as K18 pink gold, or since the color difference is inconspicuous, the joint portion after brazing does not stand out. Therefore, brazing does not impair the beauty of jewelry and ornaments.
本発明に係る宝飾用金ろうは、Auを75〜77mass%、Inを1〜7mass%、Znを1〜5mass%、残部 Cuと不可避不純物からなる金合金である。
この場合、母材の色調や融点によっては（特にピンク色を帯びたK18合金を母材として用いる場合には）、Auを75〜77mass%、Inを2〜6mass%、Znを2〜4mass%、残部 Cuとすることが好ましい。さらに、InとZnの添加量の和を、5〜8mass%とすることがより好ましい。
The gold brazing for jewelry according to the present invention is a gold alloy composed of 75 to 77 mass% of Au, 1 to 7 mass% of In, 1 to 5 mass% of Zn, the balance Cu and inevitable impurities.
In this case, depending on the color and melting point of the base material (especially when a pinkish K18 alloy is used as the base material), Au is 75 to 77 mass%, In is 2 to 6 mass%, Zn is 2 to 4 mass% The balance is preferably Cu. Furthermore, it is more preferable that the sum of the added amounts of In and Zn is 5 to 8 mass%.
Inは、金ろうの融点を下げる効果があるが、過度に添加すると脆くなって加工性を低下させるため、上限を7mass%とした。
Znも、金ろうの融点を下げる効果があるが、過度に添加すると脆くなって加工性を低下させるため、上限を5mass%とした。
残部のCuには、ろう材の色調を調整する効果があるため、母材の色調に応じて含有率を調整することが好ましい。
In has an effect of lowering the melting point of gold brazing, but if added excessively, it becomes brittle and lowers workability, so the upper limit was made 7 mass%.
Zn also has the effect of lowering the melting point of gold brazing, but if added excessively, it becomes brittle and lowers workability, so the upper limit was made 5 mass%.
Since the remaining Cu has an effect of adjusting the color tone of the brazing material, the content is preferably adjusted according to the color tone of the base material.
以下、本発明の具体的実施例を示す。 Specific examples of the present invention will be described below.
表１に示す金属元素からなる金ろうを用意し、実施例１〜８、比較例１〜３の各金ろうについて、融点、色調、加工性の評価を行った。 Gold brazing composed of the metal elements shown in Table 1 was prepared, and the melting point, color tone, and workability of each of the gold brazing of Examples 1 to 8 and Comparative Examples 1 to 3 were evaluated.
融点と色調の評価にあたっては、母材としてK18ピンクゴールドを用いる場合を想定して評価を行った。評価基準としたK18ピンクゴールドは、ピンク色（淡赤黄色）を有し、その融点（固相点）は910℃であった。 In the evaluation of the melting point and the color tone, the evaluation was performed on the assumption that K18 pink gold was used as a base material. K18 pink gold used as an evaluation standard had a pink color (light red yellow), and its melting point (solid phase point) was 910 ° C.
（金ろうの融点の評価）
実施例１〜８、比較例１〜３のそれぞれについて、融点を確認した結果、表１に示すとおりであった。
この実験結果より、実施例１〜８の金ろうは、母材との間に50℃以上の融点差が確保されることが確認できた。
一方、比較例１，３の金ろうは、母材との間の融点差が50℃未満となり、K18ピンクゴールド用のろう材としては不向きであることが確認された。
(Evaluation of melting point of gold solder)
As a result of confirming melting | fusing point about each of Examples 1-8 and Comparative Examples 1-3, it was as showing in Table 1.
From the experimental results, it was confirmed that the gold solders of Examples 1 to 8 ensure a melting point difference of 50 ° C. or more between the base metal.
On the other hand, the gold solder of Comparative Examples 1 and 3 had a melting point difference from the base metal of less than 50 ° C., and it was confirmed that it was not suitable as a brazing material for K18 pink gold.
（金ろうの色調の評価）
実施例１〜８、比較例１〜３のそれぞれについて、色調を確認した結果、表１に示すとおりであった。
この実験結果より、実施例１〜８の金ろうは、母材のK18ピンクゴールド（淡赤黄色）とほぼ同じ色調か、又は極めて近い色調であることが確認できた。
一方、比較例２，３の金ろうは、赤味がなくなり黄色の色調が強かったため、母材に対する色差が目立つことが確認された。
(Evaluation of color of gold wax)
As a result of confirming the color tone for each of Examples 1 to 8 and Comparative Examples 1 to 3, the results were as shown in Table 1.
From the experimental results, it was confirmed that the gold waxes of Examples 1 to 8 had almost the same or very close color tone as the base material of K18 pink gold (light red yellow).
On the other hand, it was confirmed that the color difference with respect to the base material was conspicuous because the gold waxes of Comparative Examples 2 and 3 had no redness and had a strong yellow color tone.
（金ろうの加工性の評価）
実施例１〜８、比較例１〜３の各金ろうに対し、圧延加工を施して加工性を確認した結果、表１に示すとおりであった。
この実験結果より、実施例１〜８の金ろうは、割れることなく50%以上の圧延が可能であり、問題なく板材等に加工できることが確認された。
一方、比較例２，３の金ろうは、加工率50%未満で割れが発生し、加工性に問題があることが確認された。
(Evaluation of processability of gold brazing)
As a result of carrying out the rolling process and confirming the workability for each of the gold solders of Examples 1 to 8 and Comparative Examples 1 to 3, the results were as shown in Table 1.
From this experimental result, it was confirmed that the gold brazing of Examples 1 to 8 can be rolled at 50% or more without cracking and can be processed into a plate material or the like without any problem.
On the other hand, it was confirmed that the gold solders of Comparative Examples 2 and 3 had a problem in workability because cracks occurred at a processing rate of less than 50%.
以上の実験結果より、Auを75〜77mass%、Inを1〜7mass%、Znを1〜5mass%、残部 Cuと不可避不純物からなることを特徴とする本発明によれば、融点が860℃未満であって、K18ピンクゴールドに対し50℃以上の融点差があり、かつ、K18ピンクゴールドに対し色差が目立つことのない金ろうを提供できる。 From the above experimental results, according to the present invention, which consists of 75 to 77 mass% Au, 1 to 7 mass% In, 1 to 5 mass% Zn, the balance Cu and inevitable impurities, the melting point is less than 860 ° C. However, it is possible to provide a gold solder that has a melting point difference of 50 ° C. or more with respect to K18 pink gold and that does not show a color difference with respect to K18 pink gold.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008230519A JP2010064085A (en) | 2008-09-09 | 2008-09-09 | Gold brazing filler metal for jewelry |
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| JP2008230519A JP2010064085A (en) | 2008-09-09 | 2008-09-09 | Gold brazing filler metal for jewelry |
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| JP2010064085A true JP2010064085A (en) | 2010-03-25 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108941973A (en) * | 2018-08-15 | 2018-12-07 | 深圳市荟艺珠宝实业有限公司 | A kind of gold solder and its preparation method and application |
| JP2021145942A (en) * | 2020-03-19 | 2021-09-27 | 京セラ株式会社 | Annular ornament and manufacturing method of the same |
-
2008
- 2008-09-09 JP JP2008230519A patent/JP2010064085A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108941973A (en) * | 2018-08-15 | 2018-12-07 | 深圳市荟艺珠宝实业有限公司 | A kind of gold solder and its preparation method and application |
| JP2021145942A (en) * | 2020-03-19 | 2021-09-27 | 京セラ株式会社 | Annular ornament and manufacturing method of the same |
| JP7461186B2 (en) | 2020-03-19 | 2024-04-03 | 京セラ株式会社 | Ring-shaped ornament and its manufacturing method |
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