JP2010059502A - Treatment method and device for copper etching waste solution - Google Patents
Treatment method and device for copper etching waste solution Download PDFInfo
- Publication number
- JP2010059502A JP2010059502A JP2008227233A JP2008227233A JP2010059502A JP 2010059502 A JP2010059502 A JP 2010059502A JP 2008227233 A JP2008227233 A JP 2008227233A JP 2008227233 A JP2008227233 A JP 2008227233A JP 2010059502 A JP2010059502 A JP 2010059502A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- waste liquid
- sulfuric acid
- hydrogen peroxide
- etching waste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- ing And Chemical Polishing (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Description
この発明は、硫酸銅、過酸化水素及び硫酸を含む銅エッチング廃液から硫酸及び銅を回収し、廃液を処理する技術に関するものである。 The present invention relates to a technique for recovering sulfuric acid and copper from a copper etching waste liquid containing copper sulfate, hydrogen peroxide and sulfuric acid, and treating the waste liquid.
プリント配線板の製造工程において不要部分の銅箔を除去するために銅エッチングが行われるが、エッチング処理によってエッチング液に銅が硫酸銅として溶け込み、同濃度が高まるとエッチング液の能力が低下する。そのために、エッチング液を交換するか、エッチング液中の銅を除去することが必要になる。 Although copper etching is performed in order to remove unnecessary copper foil in the manufacturing process of the printed wiring board, copper is dissolved in the etching solution as copper sulfate by the etching process, and when the concentration is increased, the ability of the etching solution is reduced. Therefore, it is necessary to replace the etching solution or remove copper in the etching solution.
従来、銅エッチング廃液から金属銅を回収する方法としては、電解による方法が提案されている。例えば、特開2003−13274号はバレル電解装置を用いるものであり、特開2003−73878号は隔膜を備えた電解槽を用いるものであり、特開2005−187865号は電極の素材並びに電圧を変えて2段階の電気分解を行うものである。
上記従来の技術は金属銅の回収を目的とするものであって、硫酸の回収を行うことはできない。また、廃液の全量を対象として電解するものであるから電力消費量が多くまた処理に要する時間も長い。 The above conventional technique is intended to recover metallic copper, and cannot recover sulfuric acid. Further, since the entire amount of waste liquid is electrolyzed, the power consumption is large and the time required for the treatment is also long.
この発明は、硫酸を精製分離して再利用可能とすると共に廃液の排出をなくすこと、そして処理効率を向上させることを課題とするものである。 An object of the present invention is to purify and separate sulfuric acid so that it can be reused, to eliminate waste liquid discharge, and to improve processing efficiency.
この発明の銅エッチング廃液の処理方法は、硫酸銅、過酸化水素及び硫酸を含む銅エッチング廃液中の過酸化水素を分解除去した後、圧力透析法によって水及び硫酸を精製、分離すると共に硫酸銅を濃縮し、次いで前記濃縮した硫酸銅溶液中の銅イオンを電解採取法により金属銅として回収することを特徴とするものである。
前記電解採取において、硫酸銅の濃度は30〜60g/L(リットル)程度が好ましい。また、金属銅を析出する陰極には、銅板を用いるほか、バレル電解槽を使用することもできる。
前記工程に次いで、銅イオン濃度が低減した電解液を圧力透析法によって再濃縮することにより、銅の回収率を一層向上させることができる。
前記過酸化水素の分解は、電力消費量の少ない交流電解により行うことが好ましいが、加熱処理その他公知の手法により行うことができる。また、圧力透析は、スパイラル型荷電膜を備えた装置により行うことが好ましい。
請求項5の発明はこの発明を実施するための装置であって、硫酸銅、過酸化水素及び硫酸を含む銅エッチング廃液中の過酸化水素を分解除去するための電解槽等の過酸化酸素分離装置と、過酸化水素が除去された廃液から水及び硫酸を精製、分離すると共に硫酸銅を濃縮する圧力透析装置と、前記濃縮した硫酸銅溶液中の銅イオンを金属銅として採取する電解採取装置とで構成し、必要により前記電解採取装置と圧力透析装置とをパイプで連結して、電解採取装置で金属銅の多くが除去されて銅イオン濃度が低減した廃液を再度圧力透析装置で濃縮できるように構成する。
The method for treating a copper etching waste liquid according to the present invention is a method of decomposing and removing hydrogen peroxide in a copper etching waste liquid containing copper sulfate, hydrogen peroxide and sulfuric acid, and then purifying and separating water and sulfuric acid by a pressure dialysis method. Then, the copper ions in the concentrated copper sulfate solution are recovered as metallic copper by an electrolytic collection method.
In the electrolytic collection, the concentration of copper sulfate is preferably about 30 to 60 g / L (liter). Moreover, a barrel electrolytic cell can also be used for the cathode which deposits metallic copper besides a copper plate.
Subsequent to the above step, the copper recovery can be further improved by re-concentrating the electrolytic solution having a reduced copper ion concentration by pressure dialysis.
The decomposition of the hydrogen peroxide is preferably performed by AC electrolysis with low power consumption, but can be performed by heat treatment or other known methods. Moreover, it is preferable to perform pressure dialysis with the apparatus provided with the spiral charged membrane.
The invention according to claim 5 is an apparatus for carrying out the present invention, and is for separating oxygen peroxide in an electrolytic cell or the like for decomposing and removing hydrogen peroxide in a copper etching waste solution containing copper sulfate, hydrogen peroxide and sulfuric acid. Apparatus, pressure dialysis apparatus for purifying and separating water and sulfuric acid from waste liquid from which hydrogen peroxide has been removed and concentrating copper sulfate, and electrowinning apparatus for collecting copper ions in the concentrated copper sulfate solution as metallic copper If necessary, the electrowinning device and the pressure dialysis device are connected by a pipe, and the waste liquid whose copper ion concentration is reduced by removing most of the copper metal by the electrowinning device can be concentrated again by the pressure dialysis device. Configure as follows.
この発明は、過酸化水素が除去された廃液を圧力透析することにより水及び硫酸が分離されるので、この水及び硫酸はエッチング液に戻して再利用することができる。そして、これらが分離されて銅イオンの濃度が高い廃液のみに対して電解採取を行うので、銅イオン及び硫酸イオンを一定の適切な濃度に保つことにより、最適条件で銅を採取することができる。
すなわち、この発明によれば硫酸の回収、再利用が図られると共に、金属銅を効率よく採取することができ、かつ廃液の排出もなくすことができる。
In the present invention, since water and sulfuric acid are separated by pressure dialysis of the waste liquid from which hydrogen peroxide has been removed, the water and sulfuric acid can be returned to the etching solution and reused. And since these are separated and electrowinning is performed only for the waste liquid having a high copper ion concentration, copper can be collected under optimum conditions by keeping the copper ions and sulfate ions at a certain appropriate concentration. .
That is, according to the present invention, recovery and reuse of sulfuric acid can be achieved, metallic copper can be efficiently collected, and waste liquid can be prevented from being discharged.
図1はこの発明を実施するための装置の一例を示すものである。銅エッチング廃液中の過酸化酸素分離装置1で過酸化水素が分離除去された処理液が、圧力透析装置2へ供給される。圧力透析装置2において処理液は濃縮されで電解採取装置3へ供給されると共に、分離された水と硫酸は回収されて再利用されるようにしてある。
前記電解採取装置3において陰極に金属銅が析出する。金属銅が析出された濃縮液は再度前記圧力透析装置に供給されるようにしてある。
以下この発明の実施例を説明する。
FIG. 1 shows an example of an apparatus for carrying out the present invention. The treatment liquid from which hydrogen peroxide has been separated and removed by the oxygen
In the
Examples of the present invention will be described below.
硫酸5%、過酸化水素3%、銅25g/Lを含むエッチング廃液1Lを過酸化酸素分離装置1で加熱処理し、過酸化水素を分離除去した。この処理液を圧力透析装置2にかけ約2倍に濃縮し、銅50g/Lの硫酸銅溶液500mLを得た。この銅濃縮液を不溶性陽極と銅板からなる陰極で構成された電解採取装置3に導き2A/dm2の電流密度で5,5時間運転し、陰極板上に金属銅10gを得た。また、前記圧力透析装置2で得られた硫酸を含む分離水500mLは、回収し、再利用した。
1 L of etching waste liquid containing 5% sulfuric acid, 3% hydrogen peroxide, and 25 g / L of copper was heat-treated with the
硫酸5%、過酸化水素3%、銅25g/Lを含むエッチング廃液1Lを、過酸化酸素分離装置1で交流電解し、過酸化水素を分離除去した。電解条件は、周波数50Hz,実効電流密度5A/dm2で8時間運転し過酸化水素を1/100以下に分解除去した。
以後実施例1と同様にこの処理液を圧力透析にかけ約2倍に濃縮し、この銅濃縮液を電解採取装置において2A/dm2の電流密度で5.5時間電解し、陰極板上に金属銅10gを得た。
次いで、金属銅が分離された処理液を再度圧力透析装置2に供給して圧力透析を行ない、銅50g/Lの硫酸銅溶液300mLを得た。この硫酸銅溶液を前記と同様の条件で電解し、銅6gを得た。
処理液を2度に亘り圧力透析と電解を繰り返すことにより、90%以上の金属銅を回収することができた。
An etching waste liquid 1 L containing 5% sulfuric acid, 3% hydrogen peroxide, and 25 g / L of copper was subjected to alternating current electrolysis using the
Thereafter, the treated solution was subjected to pressure dialysis in the same manner as in Example 1 and concentrated about twice, and this copper concentrate was electrolyzed in an electrowinning apparatus at a current density of 2 A /
Next, the treatment liquid from which the metallic copper was separated was supplied again to the
By repeating pressure dialysis and electrolysis of the treatment solution twice, 90% or more of metallic copper could be recovered.
硫酸5%、過酸化水素3%、銅25g/Lをふくむエッチング廃液1Lを、実施例2と同様の条件で過酸化酸素分離装置1で交流電解し、過酸化水素を分離除去した。
以後この処理液を濃縮せずそのまま電解採取装置において電解し、陰極板上に金属銅を析出させた。電解の進展に伴い銅イオン濃度は低下し、銅イオン濃度が数g/L以下では、限界電流密度低下のため、電流密度は半分以下に低下させる必要があった。また陰極板上に析出する金属銅は表面が粗く突起状になりやすく、長時間の運転継続は不可であった。 銅イオン濃度の低下を解消するために蒸留により銅イオンを再濃縮することも考えられるが、経済性に乏しく硫酸濃度が上昇するため完全に回収できず現実的でない。
このように、処理液を濃縮せずに電解処理する場合は、廃液中の銅イオン濃度が排水するためには未だ高い状態で処理を停止せざるを得ない。工場の一般廃水と一緒に下水に排水するためには 0.01g/l以下にする必要があるので、上記の廃液を下水に排水するためには、予め銅イオンを沈殿凝集等での分離処理を必要とした。
An etching waste liquid 1L containing 5% sulfuric acid, 3% hydrogen peroxide, and 25 g / L of copper was subjected to AC electrolysis using the oxygen
Thereafter, this treatment solution was not concentrated but electrolyzed as it was in an electrowinning device, and metallic copper was deposited on the cathode plate. With the progress of electrolysis, the copper ion concentration decreased. When the copper ion concentration was several g / L or less, the current density had to be reduced to half or less because of the limit current density reduction. Further, the copper metal deposited on the cathode plate was rough and easily formed into protrusions, and it was impossible to continue operation for a long time. In order to eliminate the decrease in the copper ion concentration, it may be possible to re-concentrate the copper ion by distillation. However, since the sulfuric acid concentration increases due to poor economic efficiency, it cannot be completely recovered and is not realistic.
As described above, when the electrolytic treatment is performed without concentrating the treatment liquid, the treatment must be stopped in a state where the copper ion concentration in the waste liquid is still high in order to drain. In order to drain into the sewage together with the general waste water of the factory, it is necessary to make it 0.01 g / l or less. Therefore, in order to drain the above waste liquid into the sewage, the copper ions are separated in advance by precipitation aggregation or the like. Needed.
この発明によれば、銅エッチング廃液の硫酸の回収、再利用が図られると共に、金属銅を効率よく採取することができ、かつ廃液の排出もなくすことができるものであり、産業上有効に利用されるものである。 According to the present invention, the recovery and reuse of sulfuric acid in the copper etching waste liquid can be achieved, the metallic copper can be efficiently collected, and the waste liquid can be prevented from being discharged. It is what is done.
1 過酸化酸素分離装置
2 圧力透析装置
3 電解採取装置
1 Oxygen
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008227233A JP2010059502A (en) | 2008-09-04 | 2008-09-04 | Treatment method and device for copper etching waste solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008227233A JP2010059502A (en) | 2008-09-04 | 2008-09-04 | Treatment method and device for copper etching waste solution |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010059502A true JP2010059502A (en) | 2010-03-18 |
Family
ID=42186618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008227233A Pending JP2010059502A (en) | 2008-09-04 | 2008-09-04 | Treatment method and device for copper etching waste solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2010059502A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011005570A1 (en) | 2010-03-16 | 2011-09-22 | Hitachi Automotive Systems, Ltd. | Electronic device |
CN103265094A (en) * | 2013-06-01 | 2013-08-28 | 山东天维膜技术有限公司 | Method for recycling nitric acid and copper from waste water generated in production of printed circuit board |
CN103451675A (en) * | 2012-06-01 | 2013-12-18 | 库特勒自动化系统(苏州)有限公司 | System and method for treating printing plate etching waste liquid |
CN103628092A (en) * | 2012-08-28 | 2014-03-12 | 库特勒自动化系统(苏州)有限公司 | Printing plate etching waste liquid treatment system and method |
CN103789769A (en) * | 2014-01-14 | 2014-05-14 | 无锡市瑞思科环保科技有限公司 | Method for recycling and regenerating PCB (Printed Circuit Board) acidic and alkaline etching waste liquid |
CN110983375A (en) * | 2019-12-24 | 2020-04-10 | 广东臻鼎环境科技有限公司 | Method for depositing copper by using waste etching solution of electrolytic printed circuit board |
CN113816558A (en) * | 2021-10-27 | 2021-12-21 | 迈玺(深圳)智能动力有限公司 | Method and device for refining copper heavy metal in acid pickling copper wastewater |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6220838A (en) * | 1985-07-18 | 1987-01-29 | Nippon Mining Co Ltd | Installation for treating waste pickling liquid and solid residue |
JPH0572160A (en) * | 1991-09-12 | 1993-03-23 | Hitachi Ltd | Measuring method for concentration of hydrogen peroxide and device thereof |
JP2002320824A (en) * | 2001-04-27 | 2002-11-05 | Nippon Parkerizing Co Ltd | Method for recovering acid in waste acid solution |
JP2003013274A (en) * | 2001-06-28 | 2003-01-15 | Nittetsu Mining Co Ltd | Treatment method for waste copper sulfate liquid with barrel electrolysis device |
JP2003144858A (en) * | 2001-11-15 | 2003-05-20 | Nippon Parkerizing Co Ltd | Method for recovering acid from waste acid solution |
JP2004263272A (en) * | 2003-03-04 | 2004-09-24 | Hideo Hayakawa | Hydrogen generator and preservation method for material to be preserved |
JP2006527067A (en) * | 2003-04-30 | 2006-11-30 | 株式会社荏原製作所 | Wastewater treatment method and apparatus |
-
2008
- 2008-09-04 JP JP2008227233A patent/JP2010059502A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6220838A (en) * | 1985-07-18 | 1987-01-29 | Nippon Mining Co Ltd | Installation for treating waste pickling liquid and solid residue |
JPH0572160A (en) * | 1991-09-12 | 1993-03-23 | Hitachi Ltd | Measuring method for concentration of hydrogen peroxide and device thereof |
JP2002320824A (en) * | 2001-04-27 | 2002-11-05 | Nippon Parkerizing Co Ltd | Method for recovering acid in waste acid solution |
JP2003013274A (en) * | 2001-06-28 | 2003-01-15 | Nittetsu Mining Co Ltd | Treatment method for waste copper sulfate liquid with barrel electrolysis device |
JP2003144858A (en) * | 2001-11-15 | 2003-05-20 | Nippon Parkerizing Co Ltd | Method for recovering acid from waste acid solution |
JP2004263272A (en) * | 2003-03-04 | 2004-09-24 | Hideo Hayakawa | Hydrogen generator and preservation method for material to be preserved |
JP2006527067A (en) * | 2003-04-30 | 2006-11-30 | 株式会社荏原製作所 | Wastewater treatment method and apparatus |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011005570A1 (en) | 2010-03-16 | 2011-09-22 | Hitachi Automotive Systems, Ltd. | Electronic device |
CN103451675A (en) * | 2012-06-01 | 2013-12-18 | 库特勒自动化系统(苏州)有限公司 | System and method for treating printing plate etching waste liquid |
CN103451675B (en) * | 2012-06-01 | 2016-06-22 | 库特勒自动化系统(苏州)有限公司 | Printed circuit board etching waste liquid processes system and method |
CN103628092A (en) * | 2012-08-28 | 2014-03-12 | 库特勒自动化系统(苏州)有限公司 | Printing plate etching waste liquid treatment system and method |
CN103628092B (en) * | 2012-08-28 | 2016-03-02 | 陶克(苏州)机械设备有限公司 | Printed circuit board etching waste liquid treatment system and method |
CN103265094A (en) * | 2013-06-01 | 2013-08-28 | 山东天维膜技术有限公司 | Method for recycling nitric acid and copper from waste water generated in production of printed circuit board |
CN103789769A (en) * | 2014-01-14 | 2014-05-14 | 无锡市瑞思科环保科技有限公司 | Method for recycling and regenerating PCB (Printed Circuit Board) acidic and alkaline etching waste liquid |
CN110983375A (en) * | 2019-12-24 | 2020-04-10 | 广东臻鼎环境科技有限公司 | Method for depositing copper by using waste etching solution of electrolytic printed circuit board |
CN113816558A (en) * | 2021-10-27 | 2021-12-21 | 迈玺(深圳)智能动力有限公司 | Method and device for refining copper heavy metal in acid pickling copper wastewater |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2010059502A (en) | Treatment method and device for copper etching waste solution | |
CN104152905A (en) | Acidic copper chloride etching liquid electrolytic regeneration recycling and copper plate recovery device and method | |
CN101381074A (en) | Heavy metal collection system and heavy metal collection method | |
JP2007297662A (en) | Method for producing high purity electrolytic copper from ammonia-based copper etching waste liquid | |
CN110387560A (en) | A kind of method that once electrolytic prepares 5N high purity copper | |
CN103741143A (en) | Circulating treatment system and method for etching solution | |
JP4819032B2 (en) | Processing equipment for copper etching waste liquid containing hydrogen peroxide | |
RU2742864C2 (en) | Method of treating solid carbonaceous material containing aluminum, fluorides and sodium ions | |
CN106637215B (en) | Method for recycling electrolytic oxidant of circuit board acidic etching waste liquid resource | |
CN100341801C (en) | Method for recovering nickel and removing impurity from nickel-plated wastewater | |
US9493880B2 (en) | Process and apparatus for precipitating cationic metal hydroxides and the recovery of sulfuric acid from acidic solutions | |
JP5844558B2 (en) | Recycling method for waste liquid containing tetraalkylammonium hydroxide | |
CN112110532A (en) | Method for treating chloride ions in chlorine-containing solution by using copper powder | |
CN111020633A (en) | Treatment method of acidic etching waste liquid | |
JP2006176353A (en) | Method for recovering hydrochloric acid and copper from copper etching waste liquid | |
CN114016034A (en) | Recycling treatment method of etching waste liquid mixed acid | |
JP2011125812A (en) | Method for treating wastewater containing fluorine and silicon, method for producing calcium fluoride, and apparatus for treating fluorine-containing wastewater | |
JP3803858B2 (en) | Electrochemical recovery of heavy metals from fly ash | |
CN205710923U (en) | HDI plate etching liquid electrolytic regeneration device | |
RU2765894C1 (en) | Method for processing the solution for etching printed circuit boards | |
JP2002327288A (en) | Method for collecting hydrochloric acid and copper from copper chloride solution | |
JPH08276187A (en) | Method for electrochemical processing of sulfite-containing solution | |
JPS61133192A (en) | Treatment of waste copper liquid containing hydrochloric acid | |
JP2012092447A (en) | Electrolytic extracting method of cobalt | |
JP2001207276A (en) | Regeneration of etching waste solution and metal recovering equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110425 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120330 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121030 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130312 |