JP2010050338A5 - - Google Patents

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JP2010050338A5
JP2010050338A5 JP2008214172A JP2008214172A JP2010050338A5 JP 2010050338 A5 JP2010050338 A5 JP 2010050338A5 JP 2008214172 A JP2008214172 A JP 2008214172A JP 2008214172 A JP2008214172 A JP 2008214172A JP 2010050338 A5 JP2010050338 A5 JP 2010050338A5
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unit
component
component storage
imaging
imaging unit
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JP2008214172A
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JP4834703B2 (en
JP2010050338A (en
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Claims (9)

部品供給装置から送り出される部品供給テープに所定の間隔で形成され、それぞれ部品を収納する複数の部品収納部を撮像する撮像部と、
前記撮像部により撮像された前記部品収納部の画像に基づいて前記所定の間隔を取得する制御部とを備え、
前記制御部は、前記撮像部により撮像される前記部品収納部の大きさに応じて前記部品収納部の撮像条件を変更するように構成されている、表面実装機。 An imaging unit that images a plurality of component storage units that are formed at predetermined intervals on a component supply tape that is sent out from the component supply device, and stores each of the components,
A control unit that acquires the predetermined interval based on an image of the component storage unit imaged by the imaging unit ;
The surface mounter, wherein the control unit is configured to change an imaging condition of the component storage unit according to a size of the component storage unit imaged by the imaging unit . 前記制御部は、前記部品収納部の大きさと、前記撮像部の視野の大きさとを比較して、前記部品収納部の大きさに応じて前記撮像部による前記部品収納部の撮像位置および撮像回数の少なくとも一方を変更するように構成されている、請求項１に記載の表面実装機。 The control unit compares the size of the component storage unit with the size of the field of view of the imaging unit, and according to the size of the component storage unit, the imaging position and the number of times of imaging of the component storage unit by the imaging unit The surface mounter according to claim 1, wherein the surface mounter is configured to change at least one of the two. 前記制御部は、前記部品収納部の大きさと、前記撮像部の視野の大きさとを比較して、前記撮像部の視野内に複数の前記部品収納部が収まる場合には、前記複数の部品収納部が前記撮像部の視野内に収まる撮像位置で前記撮像部により一度に複数の前記部品収納部を撮像するとともに、撮像した前記複数の部品収納部の画像に基づいて前記所定の間隔を取得するように構成されている、請求項１または２に記載の表面実装機。 The control unit compares the size of the component storage unit with the size of the field of view of the imaging unit, and when the plurality of component storage units fit within the field of view of the imaging unit, the plurality of component storage units The imaging unit captures the plurality of component storage units at a time at an imaging position where the unit is within the field of view of the imaging unit, and acquires the predetermined interval based on the captured images of the plurality of component storage units It is configured as a surface mounting apparatus according to claim 1 or 2. 前記制御部は、前記部品収納部の大きさと、前記撮像部の視野の大きさとを比較して、前記撮像部の視野内に１つの前記部品収納部が収まる場合には、１つの前記部品収納部の全体が前記撮像部の視野内に収まる撮像位置で前記撮像部により複数の前記部品収納部をそれぞれ撮像するとともに、撮像したそれぞれの前記部品収納部の画像に基づいて前記所定の間隔を取得するように構成されている、請求項１〜３のいずれか１項に記載の表面実装機。 The control unit compares the size of the component storage unit with the size of the field of view of the imaging unit, and when one component storage unit fits within the field of view of the imaging unit, The plurality of component storage units are respectively imaged by the imaging unit at an imaging position where the entire unit is within the field of view of the imaging unit, and the predetermined interval is acquired based on the captured images of the component storage units The surface mounter according to any one of claims 1 to 3 , wherein the surface mounter is configured to perform. 前記制御部は、前記部品収納部の大きさと、前記撮像部の視野の大きさとを比較して、前記撮像部の視野内に前記部品収納部が収まらない場合には、前記撮像部により複数の前記部品収納部の各々に対して複数回に分けて撮像するとともに、複数回に分けて撮像した各々の前記部品収納部の画像に基づいて前記所定の間隔を取得するように構成されている、請求項１〜４のいずれか１項に記載の表面実装機。 The control unit compares the size of the component storage unit with the size of the field of view of the imaging unit, and if the component storage unit does not fit within the field of view of the imaging unit, the control unit The component storage unit is configured to capture the plurality of times and to acquire the predetermined interval based on the images of the component storage units captured in multiple times. The surface mounting machine of any one of Claims 1-4 . 前記制御部は、前記部品供給テープが継ぎ足された場合に、継ぎ足された前記部品供給テープに形成された前記部品収納部の前記所定の間隔を取得するとともに、前記継ぎ足された部品供給テープが送り出される送りピッチを前記所定の間隔に一致させるように構成されている、請求項１〜５のいずれか１項に記載の表面実装機。 When the component supply tape is added, the control unit obtains the predetermined interval of the component storage portion formed on the added component supply tape, and the added component supply tape is sent out. The surface mounter according to any one of claims 1 to 5 , wherein the surface mounter is configured to make a feeding pitch to be matched with the predetermined interval. 前記撮像部が設けられるとともに、前記部品供給テープに形成された前記部品収納部から前記部品を取り出して前記基板に前記部品を搭載するための移動可能なヘッドユニットをさらに備え、
前記撮像部は、所定の撮像位置において、前記部品供給テープの幅に応じた前記部品供給装置の最小のピッチと等しいピッチで移動しながら前記部品収納部の撮像を行うように構成されている、請求項１〜６のいずれか１項に記載の表面実装機。 The image pickup unit is provided, and further includes a movable head unit for taking out the component from the component storage unit formed on the component supply tape and mounting the component on the substrate,
The imaging unit in the imaging position of Jo Tokoro, and is configured to perform imaging of the component housing section while moving with a minimum pitch equal to the pitch of the corresponding to the width of the component supply tape the component supplying device The surface mounter according to any one of claims 1 to 6 . 前記部品が搭載される基板の位置を検出するための基板撮像部をさらに備え、
前記基板撮像部は、前記部品供給テープに形成された前記部品収納部を撮像する撮像部としても機能するように構成されている、請求項１〜７のいずれか１項に記載の表面実装機。 A board imaging unit for detecting the position of the board on which the component is mounted;
The surface mounter according to any one of claims 1 to 7, wherein the board imaging unit is configured to function also as an imaging unit that images the component storage unit formed on the component supply tape. . 前記制御部は、前記部品供給テープに形成された前記部品収納部の前記所定の間隔が指定されていない場合に、前記所定の間隔を取得するとともに前記部品供給装置により送り出される前記部品供給テープの送りピッチを前記所定の間隔に一致させるように構成されている、請求項１〜８のいずれか１項に記載の表面実装機。 The control unit acquires the predetermined interval of the component supply tape that is sent out by the component supply device when the predetermined interval of the component storage unit formed on the component supply tape is not specified. and the feed pitch is configured to match the predetermined intervals, the surface mounting apparatus according to any one of claims 1-8.
JP2008214172A 2008-08-22 2008-08-22 Surface mount machine Active JP4834703B2 (en)

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JP2010050338A JP2010050338A (en) 2010-03-04
JP2010050338A5 true JP2010050338A5 (en) 2011-07-28
JP4834703B2 JP4834703B2 (en) 2011-12-14

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JP5214478B2 (en) * 2009-01-22 2013-06-19 株式会社日立ハイテクインスツルメンツ Electronic component mounting method and electronic component mounting apparatus
JP5755935B2 (en) * 2011-05-13 2015-07-29 富士機械製造株式会社 Component pitch measuring apparatus and component pitch measuring method
JP6322811B2 (en) 2014-07-28 2018-05-16 パナソニックＩｐマネジメント株式会社 Component mounting apparatus and component mounting method
US10784129B2 (en) * 2015-03-23 2020-09-22 Fuji Corporation Mounting device and mounting method
JP6768296B2 (en) * 2016-01-12 2020-10-14 株式会社Ｆｕｊｉ Electronic component mounting machine
JP6647049B2 (en) * 2016-01-18 2020-02-14 ヤマハ発動機株式会社 Pitch measuring device, pitch measuring method and component mounting device
JP2017157653A (en) * 2016-03-01 2017-09-07 パナソニックＩｐマネジメント株式会社 Component mounting apparatus and component mounting method
JP6940588B2 (en) * 2017-03-03 2021-09-29 株式会社Ｆｕｊｉ Working machine and mounting method
JP2019036015A (en) * 2017-08-10 2019-03-07 ヤマハ発動機株式会社 Surface mounting machine
US11382247B2 (en) 2017-12-19 2022-07-05 Fuji Corporation Mounting device, detection device, and detection method
JP7256614B2 (en) * 2018-07-25 2023-04-12 日本車輌製造株式会社 How to generate standing processing data
JP2020181868A (en) * 2019-04-24 2020-11-05 パナソニックＩｐマネジメント株式会社 Component mounting device and automatic pitch detection method

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JP4172728B2 (en) * 1997-05-22 2008-10-29 Ｊｕｋｉ株式会社 Image processing method
JP2002176290A (en) * 2000-12-08 2002-06-21 Matsushita Electric Ind Co Ltd Part supply device, part supply method, and part mounting device
JP4271393B2 (en) * 2001-10-16 2009-06-03 パナソニック株式会社 Electronic component mounting apparatus and electronic component mounting method
JP3935342B2 (en) * 2001-11-30 2007-06-20 松下電器産業株式会社 Component mounting method and component mounting apparatus
JP4077228B2 (en) * 2002-03-29 2008-04-16 株式会社日立ハイテクインスツルメンツ Electronic component mounting device
JP4587745B2 (en) * 2003-09-01 2010-11-24 Ｊｕｋｉ株式会社 Electronic component suction position correction device for electronic component mounting machine
JP4490786B2 (en) * 2004-10-27 2010-06-30 日本電産トーソク株式会社 Bonding equipment
JP4789711B2 (en) * 2006-06-14 2011-10-12 富士機械製造株式会社 Component supply device with splicing detection device
JP4829031B2 (en) * 2006-08-08 2011-11-30 ヤマハ発動機株式会社 Feeder data setting device for tape feeder

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