JP2010040934A - Rigid flex circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-reliability rigid flex circuit board having a flexible part with excellent flexibility, reduced in thickness of the circuit board, and balancing high flexibility with reduction of the thickness. <P>SOLUTION: In this rigid flex circuit board 800 including the flexible part 801 and a rigid part 802, a first insulation layer 200a and a second insulation layer 200b are formed in contact with one-side surface side of a first base material 110 of the rigid part 802 and in contact with the other-side surface thereof, respectively; and a rigid part-side end face 105 of a first coating layer is located on the rigid part 802 side relative to a flexible part-side end face 107 of the second insulation layer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a rigid flex circuit board.

With recent increases in the density of electronic devices, multilayers, thinning, and densification of flexible circuit boards and the like used for these have been advanced.
As for the flexible circuit board, a rigid flex circuit board, which is a composite board having both a flexible part and a rigid part, is often used (for example, Patent Documents 1 and 2).

  The amount of information and the amount of signal required for rigid flex circuit boards is increasing year by year, and the signal itself transmitted from the inside of the board and from external devices is also increasing in speed and frequency. Under such circumstances, the rigid flex circuit board is in a situation where a plurality of high-speed signal lines must be laid on a small substrate in response to demands for high-speed and high-density signals. The influence of can no longer be ignored. For this reason, the wiring design of the signal circuit is also restricted, and high-density wiring is difficult.

On the other hand, portable devices such as mobile phones have hinge bent portions such as a folding structure and a slide structure, and demands for high bending characteristics are increasing from each portable device manufacturer for flexible circuit boards used in the hinge bent portions.
And, with the convenience of mobile devices, higher functionality has progressed, and further miniaturization, thinness, and weight reduction are required. In addition, the components to be mounted are further downsized and the pitch is narrowed, and there is a demand for reduction in size, thickness, and weight of the substrate on which the components are mounted.

Japanese Patent Laid-Open No. 2001-024297 Japanese Patent Laid-Open No. 06-021653

  The present invention has been made in view of the above circumstances, and has a highly flexible rigid flex circuit board that is excellent in flexibility of a flexible portion, has a thin circuit board, and has both high flexibility and thinning. Is to provide.

  The rigid flex circuit board by this invention is a rigid flex circuit board provided with a flexible part and a rigid part, Comprising: The said flexible part is provided in one surface side of a 1st base material and a said 1st base material. A first covering layer covering the first conductor circuit is provided, and the other surface side has a configuration in which the first base material is exposed in the flexible portion. The first base material extends from the flexible part to the rigid part to form a rigid part, and the first base material of the rigid part is in contact with one surface side and is first The second insulating layer is provided in contact with the other surface side, and the rigid portion side end surface of the first covering layer is more than the flexible portion side end surface of the second insulating layer. , Characterized by being located on the rigid part side That.

  In the rigid flex circuit board according to the present invention, the first base material is exposed in the flexible portion on the other surface side where the first covering layer is not provided. Moreover, the rigid part side end surface of the 1st coating layer is located in the rigid part side compared with the flexible part side end surface of said 2nd insulating layer. Thereby, since the flexible circuit extended from the rigid flex circuit board has the conductor circuit and the covering layer laminated on only one side, the thickness of the flexible part is reduced and the bending reliability is excellent. Moreover, the rigid part side end surface of the first coating layer is positioned so as to enter the rigid part side as compared with the flexible side end surface of the second insulating layer. Thereby, when the flexible portion performs a bending motion, the bent region is covered with the first covering layer by being laminated and bonded, so that the first conductor circuit is less likely to break due to fatigue. Moreover, since the flexible part side end surface of the second insulating layer is covered with the first covering layer, a sharp bend occurs at the boundary between the flexible part and the rigid part, which is the boundary part of the second insulating layer. As a result, breakage of the conductor circuit due to the notch action can be prevented.

  Moreover, the rigid part side end surface of said 1st coating layer and the flexible part side end surface of said 1st insulating layer may space apart, and may comprise the spacing part. Thereby, since the first insulating layer does not ride on the first coating layer, a rigid flex circuit board in which the thickness does not fluctuate locally can be provided.

  The first coating layer is composed of an adhesive layer provided on the first base material and a resin film provided on the adhesive layer. The insulating layer is formed by laminating a first interlayer adhesive layer, a first conductor layer, and a first protective layer in this order on the one surface of the first base material. The second insulating layer is formed by laminating a second interlayer adhesive layer, a second conductor layer, and a second protective layer in this order with respect to the other surface of the first base material. It may be arranged. Further, the resin component of the resin constituting the adhesive layer and the resin component of the resin constituting the first and second interlayer adhesive layers may be different resin components.

  The first protective layer may be formed so as to embed the separation portion and cover a part of the first covering layer.

  According to the present invention, it is possible to provide a highly reliable rigid flex circuit board that is excellent in flexibility of the flexible portion, has a thin circuit board, and achieves both high flexibility and thinning.

  Hereinafter, preferred embodiments of the present invention will be described. FIG. 1 is a cross-sectional view showing a schematic configuration of a rigid flex circuit board 800 according to the present embodiment.

  The rigid flex circuit board 800 includes a flexible part 801 and a rigid part 802. The flexible part 801 includes a first base 110, a first conductor circuit 140 provided on one surface side of the first base 110, and a first covering layer 150 that covers the first conductor circuit 140. Is provided. The other surface side is configured such that the first base 110 is exposed in the flexible portion 801. Thereby, the flexible part 801 has a single-sided circuit board configuration in which the first conductor circuit 140 and the first coating layer 150 are formed only on one side, so that the flexible part is excellent in flexibility and flexibility. The rigid flex circuit board 800 can be provided.

  The first base material 110 extends from the flexible portion 801 to the rigid portion 802 to form a rigid portion 802. The first base 110 of the rigid portion 802 is provided with a first insulating layer 200a in contact with one surface side, and a second insulating layer 200b in contact with the other surface side. The rigid part side end surface 105 of the coating layer enters the rigid part 802 side as compared to the flexible part 801 side end face 107 of the second insulating layer. Thereby, when the flexible portion 801 performs a bending motion, the bent region is laminated and covered with the first covering layer 150, so that the first conductor circuit 140 is less likely to break due to fatigue. In addition, since the flexible part side end face 107 of the second insulating layer is covered with the first covering layer 150, even if a sudden bending occurs at the boundary part of the second insulating layer 200b, the conductor circuit due to the notch action. Can be prevented from breaking.

  Further, the rigid portion side end surface 105 of the first coating layer and the flexible portion side end surface 103 of the first insulating layer may be separated from each other to provide a separation portion 209. Due to the separation, the first insulating layer 200a does not run on the first covering layer 150. When the first insulating layer 200a rides on the first covering layer 150, the thickness of the raised portion becomes thicker than the surrounding area, and a molding pressure is applied to the raised portion in the multilayer molding of the rigid flex circuit board. become. As a result, it becomes a cause of deformation or wrinkles to the riding part. Since the separation portion 209 is provided between the rigid portion side end surface 105 of the first coating layer and the flexible portion side end surface 103 of the first insulating layer, the pressure non-uniformity is eliminated during the above-described molding and deformation is performed. And a rigid flex circuit board without wrinkles. Here, the rigid portion side end surface 105 of the first coating layer and the flexible portion side end surface 103 of the first insulating layer are bonded within a range in which the first insulating layer 200a does not ride on the first coating layer 150. You may contact without being.

  The first coating layer 150 may include an adhesive layer 155 provided on the first base 110 and a resin film 153 provided on the adhesive layer 155. In addition, the first insulating layer 200a includes the first interlayer adhesive layer 203a, the first conductor layer 205a, and the first protective layer 207a on one surface of the first base 110. The second insulating layer 200b is laminated in order, and the second insulating layer 200b has a second interlayer adhesive layer 203b, a second conductor layer 205b, and the other surface of the first base 110. The second protective layer 207b is laminated in this order.

  The resin component of the resin constituting the adhesive layer 155 and the resin component of the resin constituting the first and second interlayer adhesive layers 203a, 203b may be different resin components. The first protective layer 207a may be formed so as to embed the separating portion 209 and cover a part of the first covering layer 150.

  Hereinafter, each part which comprises the rigid flex circuit board 800 is demonstrated.

  Examples of the material constituting the first substrate 110 include a resin film base material. Examples of the resin film substrate include polyimide resin films such as polyimide resin films, polyetherimide resin films, polyamideimide resin films, polyamide resin films such as polyamide resin films, and polyester resin films such as polyester resin films. It is done. Of these, a polyimide resin film is particularly preferably used from the viewpoint of improving the elastic modulus and heat resistance.

  Although the thickness of the 1st board | substrate 110 is not specifically limited, 5-50 micrometers is preferable and 9-25 micrometers is especially preferable. When the thickness is within this range, the flexibility is particularly excellent.

  The first conductor circuit 140 is an adhesive such as one obtained by laminating a metal foil directly on both surfaces of the first substrate 110 via an adhesive, or a film obtained by applying a resin varnish to a copper foil. What is called a two-layer material that is bonded to a conductor without using an adhesive, or what is called a three-layer material that is bonded to a conductor layer using an epoxy adhesive or the like is used. Among these, it is preferable to use a two-layer material excellent in heat resistance and flexibility. The metal foil 120 forming the first conductor circuit 140 is preferably a metal-based thin foil or alloy foil that conducts electricity, preferably copper, and the type is not particularly limited. It is preferable because of its excellent flexibility. The thickness may be in the range of 3 μm to 35 μm, but 9 μm to 18 μm is particularly preferable from the viewpoint of flexibility and workability. The metal foil 120 is etched to form a desired first conductor circuit 140.

  The first coating layer 150 includes a resin film 153 and an adhesive layer 155. The resin film 153 to be configured is, for example, a polyimide resin system such as a polyimide resin film, a polyetherimide resin film, or a polyamideimide resin film. Examples thereof include a polyester resin film such as a film, a polyamide resin film such as a polyamide resin film, and a polyester resin film. Of these, a polyimide resin film is particularly preferably used from the viewpoint of improving the elastic modulus and heat resistance. Although film thickness is not specifically limited, 5-50 micrometers is preferable and especially 9-25 micrometers is preferable. The material constituting the adhesive layer 155 is not particularly limited, but a thermosetting adhesive or pressure-sensitive adhesive is used, and the thermosetting adhesive is preferably used because it has excellent heat resistance and flexibility. In particular, an epoxy adhesive or a polyimide adhesive is preferable. The thickness is preferably 5 μm to 35 μm in order to embed the first conductor circuit 140, but is preferably 10 μm to 25 μm from the viewpoint of flexibility and suppression of bleeding of the adhesive.

  Further, the first covering layer 150 may be formed by thermally laminating a photosensitive resin film instead of the cover lay film constituted by the resin film 153 and the adhesive layer 155, and forming an opening by exposure. A photosensitive coverlay that can be used may be used.

  Next, the first and second insulating layers 200a and 200b will be described.

  The first and second insulating layers 200a and 200b include first and second interlayer adhesive layers 203a and 203b, first and second conductor layers 205a and 205b, first and second protective layers 207a, 207b. Although not shown, the first and second insulating layers 200a and 200b may be composed of the first and second interlayer adhesive layers 203a and 203b and the first and second circuit boards. Good. The circuit board is composed of a base material, a conductor circuit, and a protective layer.

  As a material constituting the first and second interlayer adhesive layers 203a and 203b, for example, a glass fiber substrate such as a glass fabric or a glass fabric, or an inorganic material such as a fabric or a fabric comprising an inorganic compound other than glass as a component. A prepreg obtained by impregnating and drying an organic fiber base material composed of an organic fiber such as a fiber base material, aromatic polyamide resin, polyamide resin, aromatic polyester resin, polyester resin, polyimide resin, or fluororesin is used. . Examples of the resin film include polyimide resin films such as polyimide resin films, polyetherimide resin films and polyamideimide resin films, polyamide resin films such as polyamide resin films, and polyester resin films such as polyester resin films. It is done. When using a resin film, a liquid or sheet-like adhesive (interlayer adhesive) may be used. Among these, from the viewpoint of the elastic modulus, a glass fiber substrate typified by a glass woven fabric is preferably used.

  The lamination adhesion of the first and second interlayer adhesive layers 203a and 203b is not particularly limited, but it is preferable to use a hot press or a vacuum hot press.

  Examples of the material constituting the base material of the circuit board include glass fiber base materials such as glass fiber cloth and glass non-woven cloth, or inorganic fiber base materials such as fiber cloth and non-fiber cloth containing inorganic compounds other than glass, and aromatic polyamides. A laminate obtained by impregnating an organic fiber base material composed of organic fibers such as a resin, a polyamide resin, an aromatic polyester resin, a polyester resin, a polyimide resin, and a fluororesin with an adhesive and heat curing is used. Examples of the resin film include polyimide resin films such as polyimide resin films, polyetherimide resin films and polyamideimide resin films, polyamide resin films such as polyamide resin films, and polyester resin films such as polyester resin films. It is done.

  The conductor circuit can be formed by etching a metal foil. As the metal foil, metal-based thin foils and alloy foils that conduct electricity are preferable, and copper is particularly preferable, and the type is not particularly limited, but rolled foils are preferable because they are more flexible than electrolytic foils. The thickness may be in the range of 3 μm to 35 μm, but 9 μm to 18 μm is particularly preferable from the viewpoint of flexibility and workability.

  The protective layer may be a cover lay film composed of a resin film and an adhesive layer, or a photosensitive cover that is capable of thermally laminating a photosensitive resin film and forming an opening by exposure. Rays may be used.

  As described above, each configuration has been described. For example, the first and second interlayer adhesive layers 203a constituting the first and second insulating layers 200a and 200b formed on both surfaces of the first base 110 are described. , 203b may be the same material or different. Moreover, the material which comprises the 1st and 2nd protective layers 207a and 207b may be the same material, respectively, and may differ. The circuit patterns formed on the first and second conductor layers 205a and 205b may be the same or different.

  Next, a method for manufacturing the rigid flex circuit board 800 will be described.

i) Step (a)
In step (a), the flexible circuit board 100 which constitutes the flexible part 801 and becomes the core is created (FIG. 2).
First, a double-sided metal-clad laminate 101 in which a metal foil 120 is applied to a first substrate 110 is prepared (FIG. 2 (a)). The metal foil 120 is processed by etching or the like to form the first conductor circuit 140. At this time, in the flexible part 801, circuit formation is performed only on one side of the first base 110, and all the metal foil on the other side is removed by etching or the like (FIG. 2B). Next, the 1st coating layer 150 is formed so that the flexible part 801 of the 1st conductor circuit 140 may be covered. At this time, the flexible part side end surface 105 of the first coating layer 150 is disposed so as to enter the rigid part 802 side with respect to the boundary line of the flexible part 801, and further, the first part that forms the rigid part 802 in a subsequent process. It arrange | positions in the position which closely_contact | adheres or spaces apart from the flexible part side end surface 103 of the insulating layer 200a. The separation dimension is not particularly limited, but is preferably 1 mm or less, and more preferably 0.2 mm or less.
Next, thermocompression bonding is performed in a state where the first covering layer 150 is laminated (FIG. 2C).

  The conditions for thermocompression bonding are preferably integrally molded by a hot press molding apparatus having a temperature of 110 to 220 ° C. and a pressure of 0.2 to 10 MPa.

(Ii) Step (b)
As shown in FIGS. 3 and 4, in step (b), a four-layer rigid flex circuit board 800 is formed. First, the first and second interlayer adhesive layers 203a and 203b and the metal foil 230 are respectively sandwiched between the first base material on both sides of the rigid portion 802 formation place, or the first base material is not shown. The second interlayer adhesives 203a and 203b and the single area layer plate are disposed (FIG. 3A). Next, the intermediate body 250 is obtained by laminating and bonding (FIG. 3B). At this time, as described above, the first interlayer adhesive layer 203a and the metal foil 230 are arranged so as to be separated from each other or in close contact so as not to cover the rigid part side end face 105 of the first coating layer. Mold.

  Vias 260 are formed in the first and second insulating layers of the obtained laminate 250 by laser processing, and are further electrically connected to the first conductor circuit 140 by copper plating 270 (FIG. 3C). .

  Next, the first and second conductor layers 205a and 205b are formed by the subtractive method (FIG. 4A), and the first and second protective layers 207a and 207b are provided to protect the circuit. Insulating layers 200a and 200b are formed (FIG. 4B). At this time, the first protective layer 207a covers so as to cover a part of the first covering layer 150 and to embed the separation portion 209. If necessary, a surface treatment is performed on the mounting portion for mounting the component and the opening 220 connected to another circuit, and external processing is performed to obtain the rigid flex circuit board 800 (FIG. 4B).

  The formation of vias for electrically connecting the first and second conductor layers 205a and 205b and the first conductor circuit 140 and the conduction process will be described. First, the via 260 is formed by laser processing. At this time, the laser is processed using a carbon dioxide laser, UV laser, excimer laser, etc., but if the substrate contains glass, processing with a carbon dioxide laser is desirable. It is desirable to process using a UV laser or an excimer laser. Thereafter, the via 260 removes the organic carbide by a desmear process. Furthermore, the first conductor circuit 140 is electrically connected by the copper plating 270. Although electrical connection is made by electroless copper plating and electrolytic copper plating, conduction may be obtained by filling the vias 260 with a conductive paste.

  Subsequently, the first and second conductor layers 205a and 205b are formed by etching the metal foil 230 and the copper plating 270 by a subtractive method.

  Next, the first and second protective layers 207a and 207b will be described. The first and second protective layers 207a and 207b may be either liquid or film sheet. A liquid material forms a protective layer by printing, but forms an opening 220 for connecting to a mounting portion for mounting components and other circuits during printing. In addition, a material having photosensitivity is preferable because an opening 220 for connecting to a mounting portion for mounting components and other circuits by exposure can be easily formed.

  As described above, the four-layer rigid flex circuit board in which the insulating layers are formed on both sides of the first base 110 has been described as a preferred embodiment of the rigid flex circuit board 800 of the present invention.

  As another embodiment, an example in which a plurality of insulating layers are configured will be described. 5 and 6 show six layers of rigid flex circuit boards 803, 805. FIG.

  Two insulating layers are provided on both sides of the first base 110 of the rigid portion 802. Similar to the four-layer rigid flex circuit board 800 described above, the second insulating layer flexible portion side end surface 107 of the second insulating layer provided in contact with the other surface of the rigid portion 802 of the first base 110 is A rigid portion side end surface 105 of the first covering layer provided on one surface side of the flexible portion 801 of the first insulating layer 200a provided in contact with one surface of the rigid portion 802 of the substrate 110 of It is located on the rigid part 802 side. The third and fourth insulating layers 210a and 210b built up in the respective layers are laminated in the same shape (FIG. 5). Even when the number of layers increases, it has the same cross-sectional shape.

  On the other hand, as shown in FIG. 6, among the fifth and fourth insulating layers 215a and 210b built up in the respective insulating layers, the end surface of the fifth insulating layer 215a on the flexible part side is the first. Compared with the flexible part side end surface 103 of the insulating layer, the structure is located on the flexible part 801 side. Even if it is located on the flexible part 801 side, since the first insulating layer 200a in contact with the first base 110 exists, the fifth insulating layer 215a is not bonded to the first covering layer 150, A region having a locally non-uniform thickness does not occur. However, when the fifth insulating layer 215a is in contact with the first covering layer 150 depending on the thickness configuration of the insulating layer to be used, the number of insulating layers may be appropriately stacked in the arrangement as in the first insulating layer 200a. Good.

  Next, effects of the rigid flex circuit boards 800, 803, and 805 will be described.

  The effect of the rigid flex circuit board 800 according to the present embodiment will be described in comparison with a conventional example. FIG. 7 shows a conventional example, which is a rigid flex circuit board 807 including a flexible portion 801 and a rigid portion 802. And the flexible part 801 is provided with the conductor circuit 141 on both surfaces of the 1st base material 110 and the 1st base material 110, and also the coating layer 151 is provided on both surfaces so that the conductor circuit 141 may be covered. Thereby, the flexible part 801 is thicker than the flexible part 801 of the present embodiment, and at the same time, the conductor circuits 141 are formed on both surfaces of the first base 110. When the flexible portion 801 is thick, the radius of curvature increases when bent, and the elongation of the conductor circuit 141 located outside increases, and when the bending is repeated, the conductor circuit 141 is easily broken due to metal fatigue or the like.

  In addition, when the first and second insulating layers 200a and 200b run on the covering layer 151 and form the riding-up portion 211, a region having a locally uneven thickness appears. When the circuit board 807 is laminated, the molding pressure at the time of molding tends to concentrate on the boundary of the flexible part 801, so that the boundary of the flexible part 801 is likely to be deformed and wrinkled. It may be a factor to decrease.

  On the other hand, in one embodiment of the present invention shown in FIG. 1, the first base 110 is exposed in the flexible portion 801 on the other surface side where the first covering layer 150 is not provided, Circuit formation and coating are formed only on one side of the substrate 110. In addition, the rigid portion side end surface 105 of the first coating layer is positioned on the rigid portion 802 side as compared with the flexible portion side end surface 107 of the second insulating layer. As a result, the flexible portion 801 extending from the rigid flex circuit board 800 has the first conductor circuit 140 and the first covering layer 150 laminated on only one side. Excellent reliability.

  Next, FIG. 8 shows another conventional example. Unlike the conventional example of FIG. 7, the riding-up portion 211 is not provided at the boundary between the flexible portion 801 and the rigid portion 802, and the separating portions 209 are provided on both sides of the boundary between the flexible portion 801 and the rigid portion 802. If the separation portions 209 are provided on both surfaces, when the flexible portion 801 of the rigid flex circuit board 809 is repeatedly bent, depending on the bending state, the boundary portion between the flexible portion 801 and the rigid portion 802 (separation portion 209). ) Is repeatedly bent around the center. When the separation portion 209 is repeatedly bent around the separation portion 209, the separation portion 209 is not covered with the coating layer 151. Therefore, when bent, the bending operation is performed around the separation portion 209. Since the conductor circuit 141 is not covered with the covering layer 151, the separation portion 209 is easily broken when the conductor circuit 141 is subjected to a bending stress when it is bent. Furthermore, when the flexible part 801 is bent at an acute angle, the conductor circuit 141 of the separation part 209 is easily broken by the notch effect.

On the other hand, as shown in FIG. 1, the rigid portion side end surface 105 of the first coating layer is positioned so as to enter the rigid portion 802 side as compared with the flexible side end surface 107 of the second insulating layer. Thereby, when the flexible portion 801 performs a bending motion, the bent region is laminated and covered with the first covering layer 150, so that the first conductor circuit 140 is less likely to break due to fatigue. Moreover, since the upper surface A (FIG. 1) of the flexible part side end surface 107 of the second insulating layer is covered with the first covering layer 150, an acute bend occurs at the boundary part of the second insulating layer 200b. However, the breakage of the first conductor circuit 140 due to the notch effect can be prevented.
Further, the rigid portion side end surface 105 of the first coating layer and the flexible portion side end surface 103 of the first insulating layer may be separated from each other to provide a separation portion 209. Due to the separation, the first insulating layer 200a does not run on the first covering layer 150. When the first insulating layer 200a rides on the first coating layer 150, the thickness of the raised portion becomes thicker than the surrounding area, and a molding pressure is applied to the raised portion in the multilayer molding of the rigid flex circuit board. become. As a result, deformation to the riding-up part or generation of wrinkles is caused. Since the separation portion 209 is provided between the rigid portion side end surface 105 of the first coating layer and the flexible portion side end surface 103 of the first insulating layer, the pressure non-uniformity is eliminated during the above-described molding and deformation is performed. And a rigid flex circuit board without wrinkles. Here, the rigid portion side end surface 105 of the first coating layer and the flexible portion side end surface 103 of the first insulating layer are bonded within a range in which the first insulating layer 200a does not ride on the first coating layer 150. You may contact without being done.

It is sectional drawing of the 4 layer rigid flex circuit board which shows embodiment of this invention. It is sectional drawing which shows the manufacturing method of the 4 layer rigid flex circuit board of embodiment of this invention. It is sectional drawing which shows the manufacturing method of the 4 layer rigid flex circuit board of embodiment of this invention. It is sectional drawing which shows the manufacturing method of the 4 layer rigid flex circuit board of embodiment of this invention. It is sectional drawing of the 6-layer rigid flex circuit board which shows other embodiment of this invention. It is sectional drawing of the 6-layer rigid flex circuit board which shows other embodiment of this invention. It is sectional drawing which shows the rigid flex circuit board of a prior art example. It is sectional drawing which shows the rigid flex circuit board of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Flexible circuit board 101 Double-sided metal-clad laminated board 103 The flexible part side end surface 105 of the 1st insulating layer The rigid part side end surface 107 of the 1st coating layer The flexible part side end surface 110 of the 2nd insulating layer The 1st base material 120 Metal foil 140 First conductor circuit 141 Conductor circuit 150 First covering layer 151 Covering layer 153 Resin film 155 Adhesive layers 200a and 200b First insulating layer, second insulating layers 203a and 203b First interlayer adhesive layer, Second interlayer adhesive layer 205a, 205b First conductor layer, second conductor layer 207a, 207b First protective layer, second protective layer 209 Separating portion 210a, 210b Third insulating layer, fourth insulating layer Layer 211 Riding part 215a Fifth insulating layer 220 Opening part 230 Metal foil 250 Intermediate body 260 Via 270 Copper plating 800, 803, 805, 8 7,809 top surface of the flexible portion side end surface of the rigid-flex circuit board 801 flexible portion 802 the rigid portion A second insulating layer

Claims (6)

A rigid flex circuit board comprising a flexible part and a rigid part,
The flexible part is provided with a first base material, a first conductor circuit provided on one surface side of the first base material, and a first coating layer covering the first conductor circuit. ,
The other surface side has a configuration in which the first base material is exposed in the flexible portion,
The first base material extends from the flexible part to the rigid part to constitute the rigid part,
The first base of the rigid portion is provided with a first insulating layer in contact with one surface side, and a second insulating layer in contact with the other surface side, respectively.
The rigid-flex circuit board according to claim 1, wherein a rigid-part-side end surface of the first coating layer is positioned on a rigid-part side with respect to a flexible-part-side end surface of the second insulating layer.   2. The rigid flex circuit board according to claim 1, wherein a rigid portion side end surface of the first covering layer and a flexible portion side end surface of the first insulating layer are separated from each other and a separation portion is provided.   3. The rigid according to claim 1, wherein the first covering layer includes an adhesive layer provided on the first base material and a resin film provided on the adhesive layer. Flex circuit board. The first insulating layer has a first interlayer adhesive layer, a first conductor layer, and a first protective layer stacked in this order on the one surface of the first base material. It has been
In the second insulating layer, a second interlayer adhesive layer, a second conductor layer, and a second protective layer are laminated in this order with respect to the other surface of the first base material. 4. The rigid flex circuit board according to claim 1, wherein the rigid flex circuit board is formed.   The rigid flex circuit board according to claim 4, wherein the resin component of the resin constituting the adhesive layer and the resin component of the resin constituting the first and second interlayer adhesive layers are different resin components.   6. The rigid flex circuit board according to claim 4, wherein the first protective layer is formed so as to embed the separation portion and cover a part of the first coating layer. 7.

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