JP2010040481A - Device for determining whether terminal crimping state is good or not, device for processing terminal crimping, method of determining whether terminal crimping state is good or not, and program for determining whether terminal crimping state is good or not - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To determine whether crimping is good or not as properly as possible, even if there is a deviation in a time base direction between a pressure waveform and a reference waveform. <P>SOLUTION: This device is to determine whether a terminal crimping state is good or not. A physical value corresponding to the rate of pressure change is found based on the pressure waveform detected as a terminal is crimped to determine whether crimping is good or not based on the physical value. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a technique for determining pass / fail of a terminal crimping state when a terminal is crimped to an electric wire.

  As a method for detecting a defect in the terminal crimping state, there is a method disclosed in Patent Document 1. In Patent Document 1, an output waveform from a pressure sensor at the time of pressure bonding is compared with a reference waveform, and when the difference exceeds a predetermined tolerance, it is determined that there is a pressure bonding failure.

JP 2005-135820 A

  However, in the technique disclosed in Patent Document 1, if the output waveform from the pressure sensor and the reference waveform are shifted in the time axis direction, the accuracy of the pressure-bonding determination is deteriorated.

  In view of the above, an object of the present invention is to appropriately determine whether or not the pressure bonding is good even if there is a deviation in the time axis direction between the pressure waveform and the reference waveform.

  In order to solve the above-described problem, the terminal crimping state pass / fail judgment device according to the first aspect is a terminal crimping state pass / fail judgment device for performing terminal crimping pass / fail judgment, and a pressure waveform detected along with terminal crimping is input. And a pass / fail judgment unit that obtains a physical quantity corresponding to the pressure change speed based on the pressure waveform and judges the crimping pass / fail based on the physical quantity.

  A second aspect is a terminal crimping state pass / fail discrimination device according to the first aspect, wherein the pass / fail discrimination unit is obtained as a value according to a pressure change rate in a predetermined pressure range based on a predetermined reference waveform. By comparing the reference physical quantity with the physical quantity obtained as a value corresponding to the pressure change rate in the predetermined pressure range based on the pressure waveform, the good / bad pressure determination is performed.

  A third aspect is a terminal crimping state pass / fail discrimination device according to the first or second aspect, wherein the crimping pass / fail judgment unit has a correlation degree between the pressure waveform and a predetermined reference waveform in a predetermined initial crimping period. Is determined on the basis of the pressure, and is determined based on the degree of correlation between the pressure waveform and the predetermined reference waveform in a predetermined crimping end period.

  A 4th aspect is a terminal crimping | compression-bonding quality determination apparatus which concerns on a 1st aspect, Comprising: The said crimping | crimping quality determination part is based on the correlation degree of the said pressure waveform and a predetermined | prescribed reference waveform in the predetermined crimping | bonding initial period. Crimping pass / fail judgment is performed, and crimping pass / fail judgment is made based on the degree of correlation between the pressure waveform and a predetermined reference waveform in a predetermined crimping end period, and further, the pressure range of the reference waveform in the predetermined crimping initial period and the A reference physical quantity obtained as a value corresponding to a pressure change speed in a predetermined pressure range between the pressure range of the reference waveform in a predetermined crimping end period, and a pressure change in the predetermined pressure range based on the pressure waveform By comparing the physical quantity obtained as a value corresponding to the speed, the quality determination of the crimping is performed.

  A terminal crimping processing apparatus according to a fifth aspect is provided in a pair of crimping molds for performing terminal crimping, a crimp driving unit that relatively moves the pair of crimping molds closer to and away from each other, and the pair of crimping molds, The pressure detection part which detects the pressure waveform accompanying terminal crimping, and the terminal crimping state quality determination apparatus in any one of the 1st-4th are provided.

  The terminal crimping state pass / fail judgment method according to the sixth aspect is a terminal crimping state pass / fail judgment method for performing terminal crimping pass / fail judgment, and (a) Pressure change rate based on a pressure waveform detected along with terminal crimping. And (b) determining whether or not the crimping is good based on the physical quantity.

  A terminal crimping state pass / fail judgment program according to a seventh aspect is a terminal crimping state pass / fail judgment program for performing terminal crimping pass / fail judgment based on a pressure waveform detected at the time of terminal crimping. Terminal crimping condition pass / failure state for realizing a process for obtaining a physical quantity corresponding to the pressure change rate based on a pressure waveform detected along with terminal crimping, and (b) a process for determining crimping pass / fail based on the physical quantity. It is a discrimination program.

  According to the first aspect, since the crimping quality determination is performed based on the physical quantity corresponding to the pressure change rate, the bonding quality determination is appropriately performed as much as possible even if there is a deviation in the time axis direction between the pressure waveform and the reference waveform. be able to.

  According to the second aspect, the physical quantity corresponding to the pressure change rate can be compared between the reference waveform and the pressure waveform in the same pressure range, and the crimping quality determination can be performed with higher accuracy.

  Usually, the pressure change is relatively small in the initial and final stages of crimping. For this reason, the influence by the shift | offset | difference of the time-axis direction of a pressure waveform and a reference waveform is small. Therefore, as in the third aspect, in the initial crimping period and the final crimping period, it is possible to perform more appropriate crimping determination based on the degree of correlation between the pressure waveform and the predetermined reference waveform.

  In general, the pressure change is relatively small at the initial and final stages of pressure bonding, and the pressure change is relatively large between the initial pressure bonding period and the final pressure bonding period. Therefore, as in the fourth aspect, in the initial crimping period and the final crimping period, it is possible to perform more appropriate crimping determination based on the degree of correlation between the pressure waveform and the predetermined reference waveform. Further, a reference obtained as a value according to a pressure change rate in a predetermined pressure range between the pressure range of the reference waveform in the predetermined crimping initial period and the pressure range of the reference waveform in the predetermined crimping final period. By comparing the physical quantity with the physical quantity obtained as a value corresponding to the pressure change rate in the predetermined pressure range based on the pressure waveform, even if there is a time axis direction deviation between the pressure waveform and the reference waveform The physical quantity corresponding to the pressure change rate can be compared within the same pressure range, and the crimping quality can be determined with higher accuracy.

  In addition, according to the fifth to seventh aspects, since the crimping quality determination is performed based on the physical quantity corresponding to the pressure change rate, even if there is a time axis direction deviation between the pressure waveform and the reference waveform, it is as appropriate as possible. Crimping quality can be determined.

  Hereinafter, the terminal crimping apparatus according to the embodiment will be described.

  FIG. 1 is a schematic front view showing a terminal crimping apparatus 10, and FIG. 2 is a schematic side view showing a terminal crimping mechanism apparatus 20.

  The terminal crimping apparatus 10 includes a terminal crimping mechanism device 20 and a terminal crimping state pass / fail discrimination device 30. The terminal crimping mechanism device 20 is a device that performs a terminal crimping process for crimping the terminal 14 to the end portion of the electric wire 12, and the terminal crimping state pass / fail judgment device 30 is a device that performs terminal crimping pass / fail judgment.

<1. Terminal crimping mechanism device>
The terminal crimping mechanism device 20 includes a substantially U-shaped support member 21 that is turned sideways, a pair of crimping dies 22 and 25, a crimping drive unit 26, and a pressure detection unit 24.

  The pair of crimping dies 22, 25 has a lower crimping die 22 and an upper crimping die 25, and the terminal 14 can be crimped between them.

  The lower crimping die 22 is mounted on the lower base portion 21 a of the support member 21 so as to protrude upward. A support base 22a is attached to the lower base portion 21a so as to be adjacent to the lower crimping die 22. And while the crimping | compression-bonding part 14a of the terminal 14 is mounted on the lower crimping | compression-bonding type | mold 22, the terminal 14 can be supported in mounting state in the state which mounted the other part of the terminal 14 on the support stand 22a. It is configured.

  In addition, a pressure transmission member 23 is disposed in the lower base portion 21 a and below the lower crimping die 22 in contact with the lower crimping die 22. A pressure detection unit 24 is disposed below the pressure transmission member 23 in contact with the pressure transmission member 23. And it is comprised so that the pressure which acts on the crimping | compression-bonding type | mold 22 of the lower side at the time of terminal crimping may be transmitted to the pressure detection part 24 via the pressure transmission member 23. FIG. The pressure detection unit 24 includes a sensor that outputs an electrical signal corresponding to pressure, such as a strain gauge, a piezoelectric element, or an optical fiber pressure sensor. When the pressure generated during terminal crimping is transmitted to the pressure detection unit 24 via the pressure transmission member 23, the pressure detection unit 24 is configured to output a pressure waveform corresponding to the pressure change as an electrical signal. Yes.

  The pressure detector 24 may be incorporated on the upper crimping die 25 side or on both sides of the pair of crimping die 22 and 25. In the latter case, a crimping pass / fail discrimination process described later may be performed on each of the pressure waveforms detected in each, or a crimp pass / fail discrimination process described later may be performed on the average waveform of each detected waveform. .

  The crimp driving unit 26 includes a toggle link mechanism, an air cylinder, a hydraulic cylinder, and the like, and is provided on the upper support portion 21 b of the support member 21. An upper crimping die 25 is supported on the crimping drive unit 26 so as to be lifted and lowered in a hanging posture. The upper crimping die 25 is moved toward and away from the lower crimping die 22 by driving the crimping drive unit 26. In addition, the crimping | compression-bonding drive part 26 should just be the structure which moves a pair of crimping | die crimping | die 22 and 25 relatively and apart.

  Further, the terminal crimping mechanism device 20 includes a terminal supply mechanism unit 28 that continuously supplies the plurality of terminals 14 to the lower crimping die 22, and the electric wire 12 is cut into a predetermined length, and ends thereof An electric wire processing mechanism 29 for continuously performing the process of peeling the part and disposing it in the crimping part 14a of the terminal 14 is incorporated. And it is comprised so that the terminal crimping process which crimps | bonds the terminal 14 to the electric wire 12 can be performed continuously. Since various configurations including known configurations can be applied to the terminal supply mechanism section 28 and the wire processing mechanism section 29, detailed description thereof will be omitted.

<2. Terminal crimping condition pass / fail judgment device>
FIG. 3 is a block diagram showing a hardware configuration of the terminal crimping state pass / fail discrimination device 30. The terminal crimping state pass / fail discrimination device 30 is electrically connected to the pressure detection unit 24 so that the pressure waveform detected by the pressure detection unit 24 can be input, and the terminal crimping pass / fail judgment is made based on the pressure waveform. Configured to do.

  More specifically, the terminal crimping state pass / fail judgment device 30 is configured by a general computer in which a CPU 32, an internal storage device 34, an external storage device 35, and the like are interconnected via a bus line 31. The internal storage device 34 includes a ROM that stores basic programs and the like, and a RAM that temporarily stores data, and the external storage device 35 is configured by a nonvolatile storage device such as a flash memory or a hard disk device. Yes. The external storage device 35 stores a discrimination program 35a for performing a crimping pass / fail discrimination process described later. The CPU 32 as the main control unit performs arithmetic processing in accordance with the determination program 35a, so that various functions such as a pass / fail determination unit for determining the pass / fail determination of the terminal 14 as described later are realized. The discrimination program 35a is normally stored in advance in the external storage device 35, but is provided in a state of being recorded on a recording medium such as a CD-ROM, DVD-ROM, flash memory, or the like. It may be provided by downloading from an external server through the Internet, and may be stored in the external storage device 35 in addition or exchange.

  Further, the external storage device 35 stores a reference waveform 35b, a determination range setting parameter 35c used for a determination range setting process based on the reference waveform 35b, and a determination threshold parameter 35d used for a determination process. .

  In the terminal crimping state pass / fail discrimination device 30, the pressure waveform input circuit unit 36, the signal output circuit unit 37, the input unit 38 and the display unit 39 are also connected to the bus line 31.

  The pressure waveform input circuit unit 36 is configured by an AD conversion circuit or the like. When the pressure waveform detected by the pressure detection unit 24 is input as an analog signal, the pressure waveform input circuit unit 36 is configured to convert the pressure waveform into a digital signal. . The pressure waveform converted into a digital signal by the pressure waveform input circuit unit 36 is sequentially stored in the internal storage device 34 or the external storage device 35, and is used for reference waveform setting and determination range setting processing and crimping pass / fail determination processing described later. Is done.

  The signal output circuit unit 37 is an output circuit that outputs a control signal and the like to other devices under the control of the CPU 32. Here, as will be described later, an error stop signal or the like for the terminal crimping mechanism device 20 is output via the signal output circuit unit 37 and given to the terminal crimping mechanism device 20.

  The input unit 38 includes various switches, a touch panel, and the like, and is configured to receive various instructions for the terminal crimping state pass / fail judgment device 30 such as a reference waveform processing start instruction and a crimping pass / fail judgment start instruction.

  The display unit 39 includes a liquid crystal display device, a lamp, and the like, and is configured to be able to display various information such as a result of determining whether or not the terminal is crimped and a pressure waveform under the control of the CPU 32.

  FIG. 4 is a functional block diagram of the terminal crimping state pass / fail discrimination device 30. As shown in the figure, the terminal crimping state pass / fail judgment device 30 includes a signal pre-processing unit 32a, a crimp waveform acquisition unit 32b, a reference waveform processing unit 32c, and a crimp pass / fail judgment unit 32d. The determination unit 32d includes a first determination processing unit 32d1, a second determination processing unit 32d2, and a third determination processing unit 32d3. Each of these functions is realized by the CPU 32 performing predetermined arithmetic processing according to the determination program 35a as described above.

  The signal preprocessing unit 32a includes an offset process for removing a DC component and a filter for removing a predetermined frequency component from the pressure waveform input as a digital signal from the pressure detection unit 24 via the pressure waveform input circuit unit 36. It is configured to perform processing and the like.

  The crimp waveform acquisition unit 32b is configured to sample a pressure waveform for one crimp based on the pressure waveform preprocessed as described above. Below, the pressure waveform part for one press-bonding among pressure waveforms may be called a press-fit waveform.

  The crimping waveform sampled and acquired by the crimping waveform acquisition unit 32b is provided to the reference waveform processing unit 32c or the crimping quality determination unit 32d.

  The reference waveform processing unit 32 c sets the reference waveform and the discrimination range setting parameter 35 c based on the crimp waveform provided from the crimp waveform acquisition unit 32 b and stores the reference waveform and the discrimination range setting parameter 35 c in the external storage device 35.

  The crimping determination unit 32d includes a first determination processing unit 32d1 and a second determination processing unit 32d1 based on the reference waveform 35b, the determination range setting parameter 35c, the determination threshold parameter 35d, and the compression waveform provided by the compression waveform acquisition unit 32b. Each of the determination processing unit 32d2 and the third determination processing unit 32d3 is configured to execute the crimping quality determination processing. The first discrimination processing unit 32d1 performs the pass / fail judgment based on the difference indicating the degree of correlation between the crimping waveform and the reference waveform 35b in the initial crimping period, and the second discrimination processing unit 32d2 responds to the pressure change rate during the crimping intermediate period. The third discrimination processing unit 32d3 is configured to perform the crimping quality determination based on the correlation coefficient indicating the degree of correlation between the crimping waveform and the predetermined waveform 35b in the final crimping period. ing.

  Then, the crimping quality determination unit 32d performs display control of the display unit 39 based on the determination results of the first determination processing unit 32d1, the second determination processing unit 32d2, and the third determination processing unit 32d3. It is configured to perform error stop control and the like.

  Note that some or all of the functions performed by the terminal crimping state pass / fail judgment device 30 may be realized by hardware using a dedicated logic circuit or the like.

<3. Processing of terminal crimping state pass / fail judgment device>
A reference waveform setting and discrimination range setting process and a terminal crimping quality determination process by the terminal crimping state pass / fail determination apparatus 30 will be described.

<3.1. Reference waveform processing>
FIG. 5 is a flowchart showing the reference waveform setting and discrimination range setting processing.

  First, a user or the like of this apparatus gives a terminal crimping start instruction to the terminal crimping mechanism apparatus 20 and gives a reference waveform processing start instruction to the terminal crimping state pass / fail judgment apparatus 30. Then, the pressure waveform detected by the pressure detection unit 24 is input through the pressure waveform input circuit unit 36 as pressure waveform information indicating the passage of time t and the change in the pressure P. As shown in FIG. 6, the crimping waveform PWS at this time is observed as a waveform in which upward convex waveforms exhibiting a relatively large pressure are connected after a relatively small pressure portion. In addition, when the crimping is performed a plurality of times, the crimping waveform PWS is observed as a continuous waveform with an interval. In addition, since the said crimping waveform changes with kinds etc. of the terminal 14, it is not necessarily observed as a waveform shape as mentioned above.

  Upon receiving the reference waveform processing start instruction, the terminal crimping state pass / fail discrimination device 30 acquires the reference waveform 35b in step S1.

  The reference waveform 35b may be obtained by setting the acquired crimp waveform PWS for one-time crimping as the reference waveform 35b as it is, or an average waveform of the acquired multiple-time crimp waveforms PWS is used as the reference waveform 35b. It may be set as

  In addition, acquisition of the crimping waveform PWS with respect to the pressure waveform input from the pressure detection unit 24 is performed as follows, for example. That is, the presence / absence of the crimp waveform PWS is determined based on whether or not the pressure P is equal to or higher than a preset sampling trigger pressure value Ps (or whether or not it is greater than the sampling trigger pressure value Ps). As the predetermined sampling trigger pressure value Ps, for example, a value determined as a value of several tens of percent with respect to the pressure peak value of the crimping waveform based on a past trial result can be used. Further, the sampling period TS is set as a period TS defined by the preceding period TSa and the subsequent period TSb, for example, the time ta when the pressure P becomes a predetermined sampling trigger pressure value Ps as the sampling reference time ta. can do. For the previous period TSa and the subsequent period TSb, values determined experimentally or empirically as periods in which a crimping waveform effective for the judgment of crimping quality can be used with reference to the sampling reference time ta. Hereinafter, the time when the sampling period TS is started may be referred to as a sampling start time t0. However, the presence / absence of the pressure waveform and the setting of the sampling period are not limited to the above example. For example, sampling may be performed within a certain pressure range, or sampling may be performed within a predetermined period in conjunction with the crimping operation in the terminal crimping mechanism device 20. However, by performing sampling according to the change in the pressure waveform, sampling can be performed without receiving an operation signal from the terminal crimping mechanism device 20, and the configuration can be simplified.

  After setting the reference waveform 35b as described above, the process proceeds from step S1 to step S2. In step S2, the terminal crimping state pass / fail discrimination device 30 obtains the pressure peak value Ymax in the reference waveform 35b, calculates the pressure segments Ya and Yb based on the pressure peak value Ymax, and determines the calculated pressure segments Ya and Yb in the discrimination range. The setting parameter 35c is stored in the external storage device 35.

  FIG. 7 shows a reference waveform. As shown in the figure, the pressure peak value Ymax is obtained as the maximum pressure value in the reference waveform 35b. In addition, the pressure peak value Ymax may be obtained as the maximum pressure value in the crimping waveform PWS for a plurality of times. The section pressures Ya and Yb are calculated, for example, as values obtained by multiplying the pressure peak value Ymax by a predetermined ratio value set in advance through the input unit 38 or the like. The section pressures Ya and Yb are set so as to include a pressure range corresponding to an intermediate period in which the pressure change is large in the crimping waveform PWS. For example, the section pressure Ya is calculated by multiplying the pressure peak value Ymax by 0.7. The segment pressure Yb is calculated by multiplying the peak value Ymax by 0.3. As a result, even when a plurality of types of terminal crimping are performed, even if the pressure categories Ya and Yb are not set for each type, a ratio value is generated in the obtained pressure peak value Ymax, and appropriate segment pressures Ya and Yb are set. be able to. However, the section pressures Ya and Yb may be values directly input and set by a user or the like.

  After step S2, the process proceeds to step S3. In step S3, the terminal crimping state pass / fail discriminating device 30 obtains the reference time Xa based on the reference waveform 35b and the section pressure Ya, and stores the obtained reference time Xa in the external storage device 35 as the discriminating range setting parameter 35c. The reference time Xa is the time Xa when the reference waveform 35b reaches the segment pressure Ya, that is, when the reference waveform 35b is superimposed on the XY coordinates with the X axis as time and the Y axis as pressure, the reference waveform 35b and Y = Ya This is a time Xa indicating the X coordinate of the intersection.

  After step S3 ends, the process proceeds to step S4. In step S4, the terminal crimping state pass / fail discrimination device 30 obtains the reference time Xb based on the reference waveform 35b and the segment pressure Yb, and stores the obtained reference time Xb in the external storage device 35 as the discrimination range setting parameter 35c. The reference time Xb is the time Xb when the reference waveform 35b reaches the segment pressure Yb, that is, when the reference waveform 35b is superimposed on the XY coordinates with the X axis as time and the Y axis as pressure, the reference waveform 35b and Y = Yb It is time Xb which shows the X coordinate of the intersection of these.

  After step S4 ends, the process proceeds to step S5, where the terminal crimping state pass / fail determination device 30 determines the determination end time Xe based on the pressure peak value Ymax in the reference waveform 35b and a predetermined set value Xc preset through the input unit 38 or the like. This determination end time Xe is stored in the external storage device 35 as the determination range setting parameter 35c. More specifically, the determination end time Xe is obtained by adding a predetermined set value Xc to the time when the pressure peak value Ymax is exhibited in the reference waveform 35b.

  Thus, the setting of the reference waveform 35b and the determination range setting process are completed. After the end of this process, the reference waveform 35b, the discrimination range setting parameter 35c including the pressure classifications Ya and Yb, the reference times Xa and Xb, and the determination end time Xe are set and stored in the external storage device 35.

  The discriminating range setting parameter 35c including the reference waveform 35b, the pressure classifications Ya and Yb, the reference times Xa and Xb, and the judgment end time Xe corresponds to the terminal processing conditions specified by the type of the terminal 14 and the type of the electric wire 12. It is preferable to be used as a criterion for determining whether or not pressure bonding is acceptable. For this reason, when terminal processing conditions, such as the kind of terminal 14 and the kind of electric wire 12, change, it is preferable to newly set another reference waveform 35b and the discrimination range setting parameter 35c. However, if the change in the type of the terminal 14 and the type of the electric wire 12 is such a change that does not affect the pressure waveform to be detected or does not affect the pressure waveform to be detected, the same reference waveform 35b and the discrimination range setting are set. The parameter 35c may be used.

  Further, the setting process of the reference waveform 35b and the setting process of the discrimination range are not necessarily performed every time the terminal 14 is crimped. For example, when the reference waveform 35b and the discrimination range setting parameter 35c have already been obtained for the specific terminal 14 and the specific electric wire 12 by the processing already performed, the reference waveform 35b and the discrimination range setting parameter 35c are set to It may be used to determine whether the terminal 14 is in a crimped state, which will be described later.

<3.2. Terminal crimping judgment process>
The terminal crimping state pass / fail judgment device 30 performs the crimping pass / fail judgment based on the crimping waveform detected during the crimping operation of each terminal 14. Here, the crimping waveform PW and the reference in the initial crimping period of the crimping waveform PW are used. Crimping quality determination is performed based on the difference indicating the degree of correlation with the waveform 35b (first pressing quality determination process), and a correlation coefficient indicating the degree of correlation between the crimping waveform PW and the reference waveform 35b in the crimping final period of the crimping waveform PW. Is determined based on the pressure (third pressure bonding determination process), and is determined based on a physical quantity corresponding to the pressure change rate in an intermediate period assumed between these (second pressure determination determination) processing).

  The crimping pass / fail discrimination process will be described more specifically with reference to the flowchart shown in FIG.

  That is, a user or the like gives a terminal crimping start instruction to the terminal crimping mechanism device 20 and also gives a crimping pass / fail judgment processing start instruction to the terminal crimping state pass / fail judgment device 30. Then, the pressure waveform detected by the pressure detection unit 24 is input through the pressure waveform input circuit unit 36. When the terminal crimping state pass / fail judgment device 30 receives the crimping pass / fail judgment start instruction, the crimping waveform PW is sampled as shown in step S10. The crimping waveform PW may be sampled at the same reference time ta and period TS as sampled when the reference waveform 35b is acquired.

  FIG. 9 is a diagram showing an example of the crimp waveform PW detected at the time of crimping with the reference waveform 35b on the XY coordinates where the X axis is time and the Y axis is pressure. The reference waveform 35b and the crimp waveform PW are overlapped so that the respective sampling start times t0 are aligned with each other. For convenience of explanation, it is assumed that the sampling start time t0 = 0. In the following process description, description will be made with reference to FIG. 9 as necessary.

  Subsequent to step S10, the terminal crimping state pass / fail judgment device 30 performs first crimping pass / fail judgment processing (steps S11 to S15) and second crimping pass / fail judgment processing (steps S16 to S21) for the sampled crimp waveform PW. The third pressure bonding quality determination process (steps S22 to S25) is executed in parallel. Each process does not necessarily have to be executed in parallel by distributed processing or time-division processing, and may be performed sequentially. In short, the above three processes may be performed for one terminal crimping.

  Each process will be described in turn.

  The first crimping quality determination process is a process of determining the crimping quality based on the difference between the crimping waveform PW and the reference waveform 35b in the initial crimping period T1 (0 to Xb).

  That is, in step S11, the terminal crimping state pass / fail discrimination device 30 calculates the correlation coefficient (Cor) between the crimping waveform PW and the reference waveform 35b in the initial crimping period (0 to Xb) based on the following equation.

  When the correlation coefficient (Cor) is calculated in step S11, the process proceeds to step S12. In step S12, it is determined whether or not the correlation coefficient (Cor) is smaller than a predetermined correlation coefficient threshold value (S (Cor)). The correlation coefficient threshold value (S (Cor)) is a value that is input and set in advance through the input unit 38 or the like as one type of the discrimination threshold parameter 35d and stored in the external storage device 35. As a result of the determination, the correlation coefficient (Cor) is not smaller than the predetermined correlation coefficient threshold value (S (Cor)), that is, the crimping waveform PW and the reference waveform 35b in the initial crimping period (0 to Xb). If it is determined that the degree of correlation is high, the first crimping pass / fail discrimination process is terminated by determining that the crimping is satisfactory. On the other hand, the correlation coefficient (Cor) is smaller than a predetermined correlation coefficient threshold value (S (Cor)), that is, the correlation degree between the crimping waveform PW and the reference waveform 35b in the crimping initial period (0 to Xb). If it is determined to be low, it is determined that there is a crimping failure and the process proceeds to step S13.

  In step S11, when the correlation coefficient (Cor) is the same as the predetermined correlation coefficient threshold value (S (Cor)), it may be determined whether the pressure bonding is good or the pressure bonding is bad.

  In step S <b> 13, the display unit 39 displays a failure display, and gives a signal to the terminal crimping mechanism device 20 to stop the terminal crimping error. Thereby, the crimping process of the terminal 14 by the terminal crimping mechanism apparatus 20 is stopped temporarily. Thereafter, the process proceeds to step S14.

  In step S14, it is determined whether or not a confirmation reset instruction is input through the input unit 38 or the like. If it is determined that there is no input, the process in step S14 is repeated. If it is determined that there is an input, the process proceeds to step S15. That is, when the user recognizes a defect in crimping of the terminal 14, removes the defective product, checks the state of the terminal crimping mechanism device 20, etc., and inputs a confirmation reset instruction, the process proceeds from step S 14 to step S 15. move on.

  In step S15, the error display on the display unit 39 is canceled and the signal to stop the error is canceled. As a result, the terminal 14 can be continuously crimped by the terminal crimping mechanism device 20, and the first crimping pass / fail discrimination process ends.

  The second crimping quality determination process is a process for determining the crimping quality based on a physical quantity corresponding to the pressure change speed. More specifically, in the second pressure bonding quality determination process, in a predetermined pressure range (Yb to Ya), a reference physical quantity (Sr) corresponding to the pressure change rate is obtained based on the reference waveform 35b, and the pressure range ( Yb-Ya) is a process of determining the bonding quality by determining the physical quantity (Sd) corresponding to the pressure change speed based on the crimping waveform PW and comparing the reference physical quantity (Sr) and the physical quantity (Sd).

  That is, in step S16, the terminal crimping state pass / fail discrimination device 30 uses the pressure change rate (Sr = (Ya−Yb) / (Xb) in the pressure range (Yb to Ya) as a physical quantity corresponding to the pressure change rate in the reference waveform 35b. -Xa)) is calculated (see the slope of the straight line shown by the one-dot chain line in FIG. 9). The pressure range (Yb−Ya) is a pressure range (segment pressure Yb or less) of the reference waveform 35b in the initial crimping period (0 to Xb) and a pressure range (segment pressure) of the reference waveform 35b in the final crimping period (Xa to Xe). Ya or more) is a range set as a pressure range (Yb to Ya). As the values Xa, Xb, Ya, and Yb, values obtained in advance as the determination range setting parameter 35c can be used. Thereafter, the process proceeds to step S17.

  In step S17, the pressure change rate (Sd = (Ya−Yb) / (Xd1−Xd2)) in the same pressure range (Yb to Ya) as described above is calculated as a physical quantity corresponding to the pressure change rate in the crimping waveform PW ( (See the slope of the straight line shown by the two-dot chain line in FIG. 9). The time Xd1 is the time when the pressure becomes Ya in the crimping waveform PW, and the time Xd2 is the time when the pressure becomes Yb in the crimping waveform PW. Thereafter, the process proceeds to step S18.

  In step S18, the pressure change speeds Sr and Sd are compared to determine whether or not the pressure bonding is good. That is, the values of the pressure change rates Sr and Sd calculated above are substituted into an expression represented by the pressure change evaluation value (VP) = | (Sr / Sd) −1 | × 100, and the pressure change evaluation is performed. The value (VP) is calculated. Then, it is determined whether or not the pressure change evaluation value (VP) is larger than a predetermined pressure change threshold value (S (VP)). The pressure change threshold value (S (VP)) is a value that is input and set in advance through the input unit 38 or the like as one type of the discrimination threshold parameter 35d and stored in the external storage device 35. As a result of the determination, when it is determined that the pressure change evaluation value (VP) is not larger than the predetermined pressure change threshold value (S (VP)), that is, it is determined that the pressure change speeds Sr and Sd are relatively approximate. In this case, the second crimping pass / fail discrimination process is terminated because the crimping is good. On the other hand, when it is determined that the pressure change evaluation value (VP) is larger than the predetermined pressure change threshold value (S (VP)), that is, the pressure change speeds Sr and Sd are relatively different, the pressure bonding is performed. The processing proceeds to step S19 as being defective.

  In step S18, when the pressure change evaluation value (VP) and the pressure change threshold value (S (VP)) are the same, it may be determined whether the pressure bonding is good or the pressure bonding is poor.

  Further, in step S18, it may be determined whether or not the pressure bonding is good by comparing the difference between the pressure change rates Sr and Sd with a predetermined threshold value. However, as described above, by performing the crimping quality determination based on the ratio of the pressure change rates Sr and Sd, even when a plurality of types of terminal crimping are performed, the pressure change rates Sr and Sd can be unified regardless of the magnitude. There is an advantage that it is possible to determine whether the crimping is good or not by reference.

  In step S19, the display unit 39 displays a failure indication and gives a signal to the terminal crimping mechanism device 20 to stop the terminal crimping error. Thereby, the crimping process of the terminal 14 by the terminal crimping mechanism apparatus 20 is stopped temporarily. Thereafter, the process proceeds to step S20.

  In step S20, it is determined whether or not a confirmation reset instruction is input through the input unit 38 or the like. If it is determined that there is no input, the process in step S20 is repeated, and if it is determined that there is an input, the process proceeds to step S21. That is, when the user recognizes a defect in crimping of the terminal 14, removes the defective product, checks the state of the terminal crimping mechanism device 20, etc., and then inputs a confirmation reset instruction, the process proceeds from step S 20 to step S 21. move on.

  In step S21, the error display on the display unit 39 is canceled and the signal to stop the error is canceled. As a result, the terminal 14 can be continuously crimped by the terminal crimping mechanism device 20, and the second crimping determination process is terminated.

  The third crimping pass / fail judgment process is a process for judging the crimping pass / fail based on the correlation coefficient between the crimping waveform PW and the reference waveform 35b in the crimping final period T3 (Xa to Xe).

  That is, in step S22, the terminal crimping state pass / fail discrimination device 30 determines the absolute value of the difference between the pressure detection value in the crimping waveform PW and the pressure reference value in the reference waveform 35b at each time in the initial crimping period (Xa to Xe). VA) is obtained, and it is determined whether or not the absolute value (VA) relating to all the times in the initial pressure bonding period (Xa to Xe) is larger than the pressure difference threshold value (S (VA)). The pressure difference threshold value (S (VA)) is a value that is input and set in advance through the input unit 38 or the like as a kind of the discrimination threshold parameter 35d and stored in the external storage device 35. As a result of the determination, the absolute value (VA) at all times in the initial crimping period (Xa to Xe) is not larger than the pressure difference threshold value (S (VA)), that is, in the final crimping period T3 (Xa to Xe). When it is determined that the difference between the crimping waveform PW and the reference waveform 35b is relatively small, the third crimping pass / fail discrimination process is terminated as the crimping is good. On the other hand, the absolute value (VA) of any time in the initial crimping period (Xa to Xe) is larger than the pressure difference threshold value (S (VA)), that is, the crimping waveform in the final crimping period T3 (Xa to Xe). If it is determined that the difference between the PW and the reference waveform 35b is relatively large, it is determined that there is a crimping failure and the process proceeds to step S23.

  In step S22, when the absolute value (VA) becomes larger than the pressure difference threshold value (S (VA)) at a plurality of time points, it may be determined that there is a pressing failure. Moreover, when the absolute value (VA) of each time is the same as a pressure difference threshold value (S (VA)), it may be discriminated as either good crimping or poor crimping.

  In step S23, the display unit 39 displays a failure indication and gives a signal to the terminal crimping mechanism device 20 to stop the terminal crimping error. Thereby, the crimping process of the terminal 14 by the terminal crimping mechanism apparatus 20 is stopped temporarily. Thereafter, the process proceeds to step S24.

  In step S24, it is determined whether or not a confirmation reset instruction is input through the input unit 38 or the like. If it is determined that there is no input, the process of step S24 is repeated. If it is determined that there is an input, the process proceeds to step S25. That is, after the user recognizes the crimping failure of the terminal 14 and eliminates the defective product, confirms the state of the terminal crimping mechanism device 20, etc., and inputs a confirmation reset instruction, the process proceeds from step S24 to step S25. move on.

  In step S25, the error display on the display unit 39 is canceled and the signal for stopping the error is canceled. As a result, the terminal 14 can be continuously crimped by the terminal crimping mechanism device 20, and the third crimping pass / fail discrimination process is terminated.

  In each of the first pressure bonding quality determination process (steps S11 to S15), the second pressure bonding quality determination process (steps S16 to S21), and the third pressure bonding quality determination process (steps S22 to S25), it is determined that the pressure bonding is good. Alternatively, after the error stop is canceled after the determination of the crimping failure, and the determination process is completed, the terminal 14 can be continuously crimped as shown in step S26. Then, the terminal 14 is crimped again, and the first crimping quality determination process, the second crimping quality determination process, and the third crimping quality determination process are repeated based on the crimping waveform PW acquired along with the crimping. As a result, whether the crimping is successful or not is successively performed on the terminals 14 that are continuously crimped.

  According to the terminal crimping state pass / fail judgment device, terminal crimping processing device, terminal crimping state pass / fail judgment method and terminal crimping state pass / fail judgment program configured as described above, the physical quantity corresponding to the pressure change rate is obtained based on the crimping waveform PW. Since the crimping quality determination is performed based on this physical quantity, it is possible to appropriately determine the crimping quality as much as possible even if there is a deviation in the time axis direction between the reference waveform 35b and the crimping waveform PW.

  In particular, since the physical quantity corresponding to the pressure change speed is compared between the reference waveform 35b and the crimping waveform PW in the same pressure range (Yb to Ya), the deviation in the time axis direction between the reference waveform 35b and the crimping waveform PW. Regardless of whether or not, it is possible to determine whether or not the crimping is good.

  By the way, normally, the pressure change becomes small in the initial stage and the final stage of the crimping. For this reason, the influence by the shift | offset | difference of the time-axis direction of the reference | standard waveform 35b and the crimping | compression-bonding waveform PW is small. Therefore, in the initial crimping period (0 to Xb) and the final crimping period (Xa to Xe), it is possible to determine whether the crimping is more appropriate by performing the crimping quality determination based on the degree of correlation between the reference waveform 35b and the crimping waveform PW. It can be carried out.

  In this case, as the crimping quality determination process based on the correlation degree between the reference waveform 35b and the crimping waveform PW, the discrimination using various values such as the comparison with respect to the pressure difference itself or the comparison with respect to the correlation coefficient as described above is adopted. Can do.

  In general, the pressure change is relatively large between the initial crimping period (0 to Xb) and the final crimping period (Xa to Xe). For this reason, as the pressure range for comparing the pressure change speed as described above, the pressure range (Yb to Ya) between the initial crimping period (0 to Xb) and the final crimping period (Xa to Xe) in the reference waveform 35b. It is preferable to set to.

{Modifications}
In addition, the said embodiment is an illustration and this invention is not limited to the said embodiment, A various deformation | transformation is possible.

  For example, in the above-described embodiment, the first pressure bonding quality determination process, the second pressure bonding quality determination process, and the third pressure bonding quality determination process are performed, but at least the first pressure bonding quality determination process and the third pressure bonding quality determination process are performed. One may be omitted.

  In the above embodiment, values Sr and Sd obtained by dividing the pressure change amount by the time change amount are used as the physical quantities according to the pressure change rate in each of the reference waveform 35b and the crimp waveform PW. Examples of physical quantities are not limited to such examples. For example, the time itself required for pressure change within a certain range may be adopted as a physical quantity corresponding to the pressure change speed. Further, in each of the reference waveform 35b and the crimping waveform PW, a physical quantity corresponding to the pressure change rate within a predetermined time range may be obtained. In short, any physical quantity that varies depending on the pressure change rate may be used.

  In addition, each structure demonstrated by each said embodiment and each modification can be suitably combined unless it mutually contradicts.

It is a schematic front view which shows a terminal crimping processing apparatus. It is a schematic side view which shows a terminal crimping mechanism apparatus. It is a block diagram which shows the hardware constitutions of a terminal crimping state quality determination apparatus. It is a functional block diagram of a terminal crimping state pass / fail discrimination device. It is a flowchart which shows the setting process of the setting of a reference waveform and a discrimination range. It is a figure which shows the example of a crimping waveform. It is a figure which shows the example of a reference waveform. It is a flowchart which shows a crimping | compression-bonding quality determination process. It is a figure which shows the relationship between the example of a reference waveform, and the example of a crimping | compression-bonding waveform.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Terminal crimping processing apparatus 12 Electric wire 14 Terminal 20 Terminal crimping mechanism apparatus 22, 25 Crimp type | mold 24 Pressure detection part 26 Crimp drive part 30 Terminal crimping state quality determination apparatus 32c Reference | standard waveform processing part 32d Crimp quality determination part 32d1 1st determination process part 32d2 Second discrimination processing unit 32d3 Third discrimination processing unit 35 External storage device 35a Discrimination program 35b Reference waveform 35c Discrimination range setting parameter 35d Discrimination threshold parameter 36 Pressure waveform input circuit unit PW Crimping waveform Sr, Sd Pressure change rate T1 Crimping Initial period T3 Crimp final period Xa, Xb Reference time Xe Judgment end time Ya, Yb Pressure classification

Claims (7)

A terminal crimping state pass / fail discrimination device that performs terminal crimping pass / fail discrimination,
A pressure waveform input unit to which a pressure waveform detected along with terminal crimping is input;
A physical quantity corresponding to a pressure change rate is obtained based on the pressure waveform, and a pass / fail judgment unit that performs crimping quality judgment based on the physical quantity;
A terminal crimping state pass / fail discrimination device comprising: The terminal crimping state quality determination device according to claim 1,
The pass / fail judgment unit responds to a reference physical quantity obtained as a value corresponding to a pressure change rate in a predetermined pressure range based on a predetermined reference waveform and a pressure change rate in the predetermined pressure range based on the pressure waveform. A terminal crimping state pass / fail discrimination device that performs crimping pass / fail judgment by comparing the physical quantity obtained as a measured value. The terminal crimping state pass / fail discrimination device according to claim 1 or 2,
The crimping pass / fail judgment unit performs crimping pass / fail judgment based on a degree of correlation between the pressure waveform and a predetermined reference waveform in a predetermined initial crimping period, and between the pressure waveform and the predetermined reference waveform in a predetermined crimping final period. A terminal crimping state pass / fail discrimination device that performs crimping pass / fail discrimination based on the degree of correlation. The terminal crimping state quality determination device according to claim 1,
The crimping pass / fail judgment part is
Crimping quality determination is performed based on the degree of correlation between the pressure waveform and a predetermined reference waveform in a predetermined crimping initial period, and crimping quality is determined based on the degree of correlation between the pressure waveform and a predetermined reference waveform in a predetermined crimping end period. Further, as a value according to the pressure change rate in a predetermined pressure range between the pressure range of the reference waveform in the predetermined crimping initial period and the pressure range of the reference waveform in the predetermined crimping final period The terminal crimping state determination is performed by comparing the obtained reference physical quantity with the physical quantity obtained as a value corresponding to the pressure change speed in the predetermined pressure range based on the pressure waveform. apparatus. A pair of crimping dies for terminal crimping;
A crimp driving unit that relatively moves the pair of crimping molds closer to and away from each other; and
A pressure detector provided in the pair of crimping molds to detect a pressure waveform associated with terminal crimping;
The terminal crimping state pass / fail discrimination device according to any one of claims 1 to 4,
A terminal crimping apparatus comprising: A method for determining whether or not a terminal is crimped to determine whether or not the terminal is crimped.
(A) obtaining a physical quantity according to the pressure change rate based on a pressure waveform detected along with terminal crimping;
(B) a step of performing the crimping quality determination based on the physical quantity;
A terminal crimping state quality determination method comprising: A terminal crimping state pass / fail determination program for determining whether or not a terminal is crimped based on a pressure waveform detected at the time of terminal crimping.
(A) a process for obtaining a physical quantity according to the pressure change speed based on a pressure waveform detected along with terminal crimping;
(B) a process of determining whether the crimping is good or bad based on the physical quantity;
Terminal crimping condition pass / fail judgment program for realizing

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